TWM498382U - Film and integrated circuit separation device - Google Patents

Description

Membrane body and integrated circuit separation device

The present invention is a membrane body and integrated circuit separation device which utilizes a negative pressure gas and a high pressure gas to separate the integrated circuit from the membrane body.

In the semiconductor process, the metal target is sputtered onto the surface of the integrated circuit by sputtering technology, and its main purpose is to shield electromagnetic interference (EMI) to improve the quality and yield of the integrated circuit. The integrated circuit referred to in this case generally refers to wafer, die, unpackaged die, packaged die, unsealed die or encapsulated die.

In the sputtering process, one side of the integrated circuit is attached to a film body, and the surface is closely attached to the film body, and the surface has a plurality of contacts, and the contacts are flat. The remaining faces of the integrated circuit, that is, the five sides of the integrated circuit, are subjected to a sputtering process.

However, the integrated circuit that completes the sputtering can only be separated by the membrane one by one manually and placed in the tray.

With the development of the electronic industry today, the requirements for the size and function of the integrated circuit target are increasing. Therefore, the unstacked side of the original integrated circuit is provided with a plurality of protruding contacts or passive components, and the protruding The contact or passive component is the side of the integrated circuit that should be closely attached to the film body, and cannot be closely attached, so that there is a gap between the surface and the film body, and the gap may cause overflow plating in the sputtering process. .

As described above, how to improve the overflow plating and reduce the labor utilization rate in separating the integrated circuit and the film body have become items discussed by various manufacturers.

In view of the above disadvantages, the purpose of the present invention is to provide a membrane body and integrated circuit separation device which utilizes a high pressure gas and a negative pressure gas to separate the membrane body from the integrated circuit to achieve an automated separation membrane. The effect of the body and integrated circuit. The pedestal has a groove and a through hole, and the groove is capable of accommodating a passive component of the integrated circuit or The contacts are protruded to avoid overflow plating when the integrated circuit is sputtered.

In order to achieve the above object, the technical means of the present invention is to provide a membrane body and an integrated circuit separating device, which is provided for a membrane body, and one side of the membrane body is attached with at least one integrated circuit, and the membrane body and the product are combined. The body circuit separating device has: a pedestal having at least one groove, the bottom end of each groove has a through hole; a blowing unit which is disposed below and below the pedestal; and a suction unit The lifting platform is disposed above the pedestal; wherein the other side of the film body is attached to the pedestal, and each integrated circuit is opposite to each groove; the blowing unit provides a high pressure gas to the bearing And the suction unit provides a negative pressure gas to the pick-up head, and separates the film body from the integrated circuit, so that the pick-up unit picks up the integrated circuit.

In summary, the integrated circuit pick-and-place device of the present invention has a suction unit and a blowing unit respectively providing a negative pressure gas and a high pressure gas to separate the integrated circuit from the membrane body, thereby achieving an automated separation membrane. The effect of the body and integrated circuit.

In addition, the present invention utilizes a socket having a groove and a perforated hole. When the integrated circuit is disposed on the elastic film body, the protruding contact or the passive component of the integrated circuit is located in the groove, so the product is accumulated. When the body circuit is sputtered, the protruding contacts or passive components cannot be covered by the metal film.

10‧‧‧membrane body

11‧‧‧Integrated circuit

12‧‧‧ Highlight joints or passive components

20‧‧ ‧ captain

200‧‧‧ grooves

201‧‧‧Perforation

21‧‧‧Blowing unit

210‧‧‧Blowing needle

211‧‧‧Air supply and lifting module

212‧‧‧Blow holes

22‧‧‧ suction unit

220‧‧‧Sucking head

221‧‧‧Negative pressure and lifting module

222‧‧‧ Cover

223‧‧ ‧ suction hole

Fig. 1 is a perspective view showing a film body to which an integrated circuit is attached.

Fig. 2 is a schematic view showing the operation of a membrane body and an integrated circuit separating device.

Fig. 3 is a schematic view showing another operation of the film body and integrated circuit separating device.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification.

Referring to FIG. 1 and FIG. 2, the present invention is a film body and integrated circuit separating device, which is applied to at least one film body 10, and at least one integrated circuit 11 is attached to one side of the film body 10. The film body 10 has elasticity, so that the integrated circuit 11 has a protruding contact or one side of the passive component 12 is closely attached to the film body 10, protruding the joint or being The movable element 12 is covered by the film body 10. Both sides of the film body 10 are respectively viscous.

The film body and integrated circuit separating device has a cap 20, a blowing unit 21 and a suction unit 22.

The cap 20 has at least one recess 200, and each of the recesses 200 has a through hole 201 at its bottom end. The cap 20 is provided for the film body 10 described above, and one surface of the film body 10 is attached to the cap 20, and each of the perforations 201 is opposed to each of the integrated circuits 11.

The air blowing unit 21 is disposed below the platform 20, and the air blowing unit 21 has at least one blowing needle 210 and a gas supply and lifting module 211. The blowing needle 210 has a blowing hole 212, and one end of the blowing needle 210 is fast attached to the bottom end of the cap 20, and the blowing hole 212 is opposed to the through hole 201. The air supply and lifting module 211 is coupled to the other end of the blowing needle 210 so that the blowing needle 210 can be lifted and lowered relative to the platform 20, and the air supply and lifting module 211 provides a high pressure gas to the blowing hole 212.

The suction unit 22 is disposed above the cap 20 . The suction unit 22 has at least one suction head 220, a negative pressure and lifting module 221 and at least one cover 222. The suction head 220 is opposite to the perforation 201, and the suction head 220 has a suction hole 223. The negative pressure and lifting module 221 is coupled to one end of the suction head 220 to provide a negative pressure gas to the suction head 220, and the negative pressure and the lifting module 221 enable the suction head 220 to move up and down relative to the platform 20. The cover 222 is attached to the other end of the suction head 220.

As shown in FIG. 2, the one side of the integrated circuit 11 that is not sputtered has a protruding contact or passive element 12, and the integrated circuit 11 is attached to one side of the film body 10, so that the integrated circuit 11 and the film body 10 are provided. There are no gaps between them, and the protruding contacts or passive elements 12 are wrapped in the film body 10. Since the film body 10 is covered with the protruding contact or the passive component 12, part of the film body 10 is deformed and accommodated in the groove 200, thereby increasing the fit between the film body 10 and the integrated circuit 11. Degree, or the degree of fit between the film body 10 and the cap 20.

When the integrated circuit 11 is sputtered, since there is no gap between the film body 10 and the integrated circuit 11, the metal thin film cannot be plated on the protruding contact or the passive component 12 that is coated in the film body 10, so that Avoid protruding joints or passive elements 12 that are plated with a metal film.

Referring to FIG. 2 again, when the integrated circuit 11 and the film body 10 are to be separated from each other, the film body 10 is attached to the cap 20. Driven by the air supply and lifting module 211 The needle 210 is moved toward the through hole 11 and the end of the needle 210 is attached to the bottom of the cap 20. The gas supply and lifting module 211 provides a high pressure gas to the blowing needle 210, and the high pressure gas system is blown toward the integrated circuit 11 through the blowing hole 212, the through hole 201 and the groove 200.

When the end of the blowing needle 210 is attached to the bottom of the cap 20, the negative pressure and lifting module 221 also lowers the suction head 220 toward the integrated circuit 11 so that the cover 222 will absorb the product. The film body 10 around the body circuit 11 is pressed, and the edge of the cover 222 is attached to one side of the film body 10. The cover 222 is used to restrict the area where the high pressure gas and the negative pressure gas are blown.

As shown in FIG. 2, when the high-pressure gas is blown to the integrated circuit 11, the negative pressure and the lifting module 221 supply a negative pressure gas to the suction head 220, and the negative pressure gas system absorbs the integrated body through the suction hole 223. Circuit 12. The film body 10, which is subjected to a high-pressure gas, can float above the cap 20, and the film body 10 is deformed. At this time, the negative pressure gas acts on the film body 10 and the integrated circuit 11, and the film body 10 and the integrated circuit 11 are separated from each other, or part of the integrated circuit 11 is separated from the film body 10.

Referring to FIG. 3, the membrane body 10 is deformed by the action of both the high pressure gas and the negative pressure gas, and the integrated circuit 11 is separated from the membrane body 10 and sucked by the suction head 220. .

The suction head 220 adsorbs the integrated circuit 11, the negative pressure and the lifting module 221 raises the suction head 220, and moves the suction head 220 to a preset workstation. At the workstation, the suction head 220 can release the integrated circuit. 11, and then return to the original position to perform the operation of the next intake integrated circuit 11.

When the suction head 220 is raised, the air supply and lifting module 211 lowers the blowing needle 210 to return the blowing needle 210 to the initial position and wait for the operation of the next vertical integrated circuit 11. The air supply and lift module 211 also stops supplying high pressure gas to the blow pin 210.

In summary, the cap 20 of the present invention has a recess 200 for receiving the membrane body 10. In addition to the membrane 10, the recess 200 can also be used for protruding contacts or passive components 12 and The film body 10 is housed to prevent the protruding contact or the passive component 12 from being covered by the metal film when the integrated circuit 11 is sputtered.

This film also uses a flexible film body 10, so that one side of the film body 10 can be packaged. The protruding contact or passive component 12 is covered, and the other side of the film body 10 is slightly deformed by the protruding contact or the passive component 12, and the deformed portion can be accommodated in the recess 200, thereby lifting the film body The degree of fit between the 10 and the integrated circuit 11, or the degree of fit between the film body 10 and the cap 20. If the protruding contact or passive component 12 has a large volume, a portion of the protruding contact or passive component 12 can be received in the recess 200 along with the membrane body 10 to provide a relationship between the membrane body 10 and the cap 20 The degree of fit or the degree of fit between the film body 10 and the integrated circuit 11 can be maintained.

In addition, when the cover 222 of the present invention is overlaid on the pre-extracted integrated circuit 10, and the edge of the cover 222 is attached to one side of the film body 10, the cover 222 is used to limit the high pressure gas and the negative pressure gas. The area to be blown.

Furthermore, the blowing unit 21 and the suction unit 22 of the present invention respectively supply a high-pressure gas and a negative pressure gas to the integrated circuit 11 to separate the integrated circuit 11 and the membrane body 10 from each other, thereby achieving an automated integration. The effect of the separation of the circuit 11 from the membrane body 10 is to save labor costs and reduce costs.

The specific embodiments described above are only used to illustrate the features and functions of the present invention, and are not intended to limit the scope of implementation of the present invention, without departing from the spirit and technical scope of the present invention. Equivalent changes and modifications made by the disclosure of the disclosure are still covered by the scope of the following patent application.

10‧‧‧membrane body

11‧‧‧Integrated circuit

12‧‧‧ Highlight joints or passive components

20‧‧ ‧ captain

200‧‧‧ grooves

201‧‧‧Perforation

21‧‧‧Blowing unit

210‧‧‧Blowing needle

211‧‧‧Air supply and lifting module

212‧‧‧Blow holes

22‧‧‧ suction unit

220‧‧‧Sucking head

221‧‧‧Negative pressure and lifting module

222‧‧‧ Cover

223‧‧ ‧ suction hole

Claims (6)

A film body and integrated circuit separating device is provided for a film body, one side of the film body is attached with at least one integrated circuit, and the film body and the integrated circuit separating device have: a cap having at least a groove having a perforation at a bottom end of each of the grooves; a blowing unit that is disposed below the pedestal for lifting and lowering; and a suction unit that is vertically disposed above the pedestal; The other side of the film body is attached to the pedestal, and each integrated circuit is opposite to each groove; the air blowing unit provides a high pressure gas to the pedestal to deform the film body, and the suction unit A negative pressure gas is supplied to the pick-up head, and the film body and the integrated circuit are separated from each other, so that the pick-up unit sucks the integrated circuit. The membrane body and integrated circuit separation device according to claim 1, wherein the air blowing unit has at least one blowing needle and a gas supply and lifting module, and one end of the blowing needle is attached to the socket The bottom end is opposite to the perforation, and the air supply and lifting module is coupled to the other end of the blowing needle. The membrane body and integrated circuit separation device according to claim 2, wherein the needle has a blow hole. The membrane body and integrated circuit separating device according to claim 1, wherein the suction unit has at least one suction head and a negative pressure and lifting module, the suction head is opposite to the perforation, and the negative pressure is The lifting module is coupled to one end of the suction head. The membrane body and integrated circuit separation device according to claim 4, wherein the suction head has a suction hole. The membrane body and integrated circuit separating device of claim 4, wherein the suction unit further has at least one cover attached to the other end of the suction head.