TWM484694U - Self radiation heat dispersion structure - Google Patents

Description

Self-radiation heat dissipation structure

The invention relates to a self-radiation heat dissipation structure, in particular to a self-radiation heat dissipation structure which is provided outside the heat source and has a radiation heat dissipation layer which enhances or enhances the heat radiation efficiency of the heat source itself.

According to the current mobile device (such as thin notebook, tablet, smart phone, etc.), the faster the calculation rate, the heat generated by the internal computing unit semiconductor wafer is relatively increased, and it is also convenient for carrying. In view of the above, the devices are thinner and thinner; in addition, the mobile device prevents foreign matter and moisture from entering the interior, and the mobile device has few open holes except for the hole of the earphone hole or the connector. The mouth forms convection with the outside air. Therefore, due to the congenital factors of thinning, the heat generated by the calculation execution unit and the battery cannot be quickly discharged to the outside, and the inside of the mobile device is difficult to be sealed. The convection heat dissipation is generated, which is easy to cause heat accumulation or heat accumulation inside the mobile device, which seriously affects the working efficiency or heat generation of the mobile device, and seriously causes the semiconductor chip or the battery to accumulate heat and affect the working performance of the mobile device or is serious. Produce heat when things happen.

Furthermore, due to the above problems, there is also a need to provide passive heat dissipating components inside the mobile devices: passive heat dissipating components such as hot plates, temperature equalizing plates, heat sinks, etc., to deheat the computing cell, but still due to the mobile device The reason for the thinning of the design is required, so that the space inside the device is limited and narrow, and the heat dissipating component disposed in the space is inevitably reduced to an ultra-thin size and thickness, and can be disposed in a narrow and limited internal space. However, with the hot plate and the uniform temperature plate whose size is limited, the internal capillary structure and the steam passage are also limited by the requirement of being set to be ultra-thin, so that the hot plates and the uniform temperature plates are integrated. The work efficiency of heat conduction is greatly reduced, and the heat dissipation performance cannot be effectively improved. Therefore, when the internal calculation unit power of the mobile device is too high, the conventional hot plate and the temperature equalization plate cannot effectively dissipate heat or dissipate heat, so How to propose an effective antipyretic method in a narrow confined space is the first technology to be improved by the industry.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a self-radiating heat dissipation layer for improving the heat dissipation performance of the heat source by disposing a radiation heat dissipation layer having an improved self-radiation heat dissipation performance outside the heat source. structure.

In order to achieve the above object, the present invention provides a self-radiation heat dissipation structure comprising: a heat source; a radiation heat dissipation layer is formed on at least one side of the heat source, and the creation is mainly through at least one external surface of the heat source. The side is provided with a radiation heat dissipation layer which improves the heat dissipation performance of the self-radiation, so that the radiation heat dissipation layer has high efficiency radiation heat dissipation efficiency, and the heat source can still have the effect of natural radiation convection heat dissipation even though it is disposed in the sealed accommodation space. Thereby, the overall heat dissipation performance of the heat source is greatly increased.

1‧‧‧Self-radiation heat dissipation structure

11‧‧‧heat source

12‧‧‧radiation heat sink

1 is a perspective view of a first embodiment of the self-radiation heat dissipation structure of the present invention; FIG. 2 is a combined sectional view of the first embodiment of the self-radiation heat dissipation structure of the present invention; A combined cross-sectional view of a second embodiment of the autoradiative heat dissipation structure;

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

1 and 2 are a perspective view and a combined cross-sectional view of a first embodiment of the self-heating structure of the present invention. As shown in the figure, the self-heating structure 1 of the present invention comprises: a heat source 11; The heat generating source 11 is formed on at least one side of the heat generating source 11 as a radiation heat dissipating layer 12, and the heat generating source 11 is a battery or a semiconductor element or an IC chip. In this embodiment, a battery is used as an illustrative embodiment, but It can of course be applied to any heat source that generates heat by itself, and the external material of the heat source is made of ceramic material or metal material.

The radiation heat dissipation layer 12 is a porous structure or a nanostructure or a porous ceramic structure or a porous graphite structure or a high-radiation ceramic structure or a high-hardness ceramic structure. Radiation heat dissipation layer through Micro Arc Oxidation (MAO) or Plasma Electrolytic Oxidation (PEO), Anodic Spark Deposition (ASD), Anodic Oxidation by Spark Deposition, Any of the ANOF) forms a porous structure on one side of the heat source; of course, the radiation heat dissipation layer 12 may be formed on the outer surface of the heat source 11 by any of the methods of coating, printing, and coating.

Referring to FIG. 3, it is a combined sectional view of a second embodiment of the self-radiation heat dissipation structure of the present invention. As shown in the figure, the embodiment is identical to the technical features of the first embodiment, and therefore will not be herein. Further, the difference between the present embodiment and the first embodiment described above is that the radiation heat dissipation layer 12 is a concave-convex structure generated by a bead shot.

In the foregoing first and second embodiments, the radiation heat dissipation layer 12 is in the form of black or sub-black or dark color.

This creation mainly uses the application of thermal heat radiation as a heat sink, and heat conduction and convection must rely on matter as a medium to propagate heat. Thermal radiation does not require a medium, that is, it can directly transmit thermal energy, so that heat can be transferred to the housing of the mobile device in the only small space in the confined space, and then exchange heat with the outside through the housing.

Thermal radiation means that matter propagates in the form of electromagnetic waves, but electromagnetic waves propagate at the speed of light, which requires the propagation of the medium. The object will continue to generate heat radiation and also absorb the heat radiation given by the outside. The ability of an object to emit heat is related to its surface temperature, color and roughness. Therefore, the radiation heat dissipation layer set by this creation is based on the relevant application principle to provide a radiation heat dissipation layer that can enhance the surface heat dissipation area and heat dissipation efficiency. The thermal radiation intensity of the surface, in addition to temperature, is also related to the characteristics of its surface. For example, objects on a black surface are easily absorbed, and heat radiation is easily emitted. Therefore, the radiation layer of the present invention is set to black or the surface thereof is black. It can further improve its heat radiation efficiency.

1‧‧‧Self-radiation heat dissipation structure

11‧‧‧heat source

12‧‧‧radiation heat sink

Claims (9)

A self-radiating heat dissipation structure includes: a heat source, and a radiation heat dissipation layer is formed on at least one side of the heat source. The self-radiation heat dissipation structure according to claim 1, wherein the external material of the heat source is a ceramic material or a metal material. The self-radiation heat dissipation structure according to claim 1, wherein the heat source is any one of a battery or a semiconductor element or an IC chip. The self-radiation heat dissipation structure according to claim 1, wherein the radiation heat dissipation layer is a porous structure or a nanostructure or a porous ceramic structure or a porous graphite structure. The self-radiation heat dissipation structure according to claim 1, wherein the radiation heat dissipation layer is subjected to Micro Arc Oxidation (MAO) or Plasma Electrolytic Oxidation (PEO), and anode spark deposition ( Anodic Spark Deposition (ASD), any of the Anodic Oxidation by Spark Deposition (ANOF) forms a porous structure on one side of the heat source. The self-radiation heat dissipation structure according to claim 1, wherein the radiation heat dissipation layer is a concave-convex structure generated by a bead shot. The self-radiation heat dissipation structure according to any one of claims 1 to 6, wherein the radiation heat dissipation layer is in the form of a black or sub-black or dark color. The self-radiation heat dissipation structure according to claim 1, wherein the radiation heat dissipation layer is any one of a high-radiation ceramic structure or a high-hardness ceramic structure. The self-radiation heat dissipation structure according to claim 1, wherein the radiation heat dissipation layer is formed on the surface of the heat source through the covering and printing and coating.