TWM467020U - Light emitting diode (LED) lamp - Google Patents
Light emitting diode (LED) lamp Download PDFInfo
- Publication number
- TWM467020U TWM467020U TW102211500U TW102211500U TWM467020U TW M467020 U TWM467020 U TW M467020U TW 102211500 U TW102211500 U TW 102211500U TW 102211500 U TW102211500 U TW 102211500U TW M467020 U TWM467020 U TW M467020U
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- Prior art keywords
- lamp
- lamp housing
- heat
- light
- emitting diode
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
本創作涉及一種發光二極體(LED)燈之晶片於燈殼上(Chip on Lamp Housing)之結構。 The present invention relates to a structure of a chip of a light-emitting diode (LED) lamp on a lamp on a lamp housing.
隨著LED照明的需求日趨迫切，高功率LED的散熱問題益發受到重視，因為過高的溫度會導致LED發光效率衰減；LED運作所產生的熱若無法有效散出，則會直接對LED的壽命造成致命性的影響，因此近年來高功率LED散熱問題的解決成為許多相關業者的研發標的，現階段SMD的封裝已無法符合照明市場的需求，業界陸續開發出晶片直接封裝(Chip on Board)及面光源燈珠封裝等方法都是為了解決散熱及燈源發光效率及燈源壽命的問題，以上的封裝方式已大幅提升了散熱效率但仍需將LED晶片封裝於載體上並接上導通線路形成燈源，再將燈源焊接於PCB板或直接將燈源黏接固定於燈殼散熱部件上，這些方法仍有較多的熱阻，而減緩了散熱的途徑與減緩發光效率進而影響燈源的壽命。 With the increasing demand for LED lighting, the heat dissipation problem of high-power LEDs has attracted much attention, because too high temperature will cause the LED luminous efficiency to decay; if the heat generated by LED operation cannot be effectively dissipated, it will directly affect the life of the LED. This has caused a fatal impact. Therefore, in recent years, the resolution of high-power LED heat dissipation has become the subject of research and development by many related companies. At present, SMD packaging has been unable to meet the needs of the lighting market, and the industry has successively developed chip on board and The method of surface light source lamp bead packaging is to solve the problem of heat dissipation and light source luminous efficiency and lamp source life. The above packaging method has greatly improved the heat dissipation efficiency, but it is still necessary to package the LED chip on the carrier and connect the conduction line. The light source, then soldering the light source to the PCB board or directly fixing the light source to the heat sink of the lamp housing, these methods still have more thermal resistance, which slows down the way of heat dissipation and slows down the luminous efficiency and thus affects the light source. Life expectancy.
現今LED燈業者所致力的任務是研發高品質的熱傳導及降低熱阻的解決方案，以使LED光效提升及將LED壽 命發揮到極致。如果熱也封在LED的封裝體內，無法有效率的排出外界，LED的光效及壽命將會折損。 Nowadays, the task of the LED lamp industry is to develop high-quality heat conduction and reduce thermal resistance solutions to improve LED light efficiency and LED life. Life is to the limit. If the heat is also sealed in the LED package, it cannot be efficiently discharged to the outside world, and the LED efficacy and life will be damaged.
LED燈的組成包括LED燈源，PCB板，驅動電源及燈殼(散熱部件)及燈罩。 The composition of the LED lamp includes an LED light source, a PCB board, a driving power source and a lamp housing (heat dissipating component), and a lampshade.
散熱部件的材料為鋁、鋁合金、銅、導熱塑膠或陶瓷；散熱部件上可有散熱條增加散熱面積；燈罩為塑膠或玻璃材質。散熱部件朝向所屬燈罩的一面製作有PCB板，所述PCB板上安裝有LED燈源。 The material of the heat dissipating component is aluminum, aluminum alloy, copper, heat conductive plastic or ceramic; the heat dissipating component may have a heat dissipating strip to increase the heat dissipating area; the lampshade is made of plastic or glass. The heat dissipating member is formed with a PCB board facing one side of the lamp cover, and the LED board is mounted on the PCB board.
現有Chip on Board LED燈製作流程：晶片固晶打線及封裝==》燈源==》焊接於PCB板==》黏貼於燈殼散熱部==》組裝電源==》組裝燈罩==》成品。 Existing Chip on Board LED lamp production process: wafer solid crystal wire and package == "light source ==" soldered on PCB board ==" adhered to the lamp housing heat sink == "assembly power == "assembly lampshade ==" finished product .
本創作所要解決的技術問題是提供一種使LED晶片的熱量直接由燈殼散出以提高燈源發光效率減少晶片與燈殼散熱部間的連接介面及熱阻以增加燈源壽命的問題及降低LED燈的生產成本。 The technical problem to be solved by the present invention is to provide a problem that the heat of the LED chip is directly emitted from the lamp housing to improve the luminous efficiency of the light source, reduce the connection interface between the wafer and the heat dissipation portion of the lamp housing, and increase the life of the lamp source. The production cost of LED lamps.
本創作解決上述技術問題的技術方案如下：一種LED燈，包括燈殼散熱部，其特徵在於，所述燈殼散熱部上有PCB導體線路(即印刷線路)印刷製作於所述燈殼散熱部上且LED晶片(chip)直接固晶黏貼於燈殼散熱部上並和導體線路(印刷電路)相連接。 The technical solution for solving the above technical problem is as follows: an LED lamp comprising a lamp housing heat dissipating portion, wherein the lamp housing heat dissipation portion has a PCB conductor line (ie, a printed circuit) printed on the lamp housing heat dissipation portion. The LED chip is directly bonded to the heat sink of the lamp housing and connected to the conductor line (printed circuit).
本創作的有益效果是：使LED晶片的熱量直接由燈 殼散出以提高燈源發光效率減少晶片與燈殼散熱部間的連接介面及熱阻以增加燈源壽命的問題及降低LED燈的生產成本。 The beneficial effect of this creation is to make the heat of the LED chip directly from the lamp The shell is vented to improve the luminous efficiency of the light source, reduce the connection interface between the wafer and the heat sink of the lamp housing, and the thermal resistance to increase the life of the light source and reduce the production cost of the LED lamp.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，所述燈殼散熱部為散熱材料製成。 Further, the lamp housing heat dissipation portion is made of a heat dissipation material.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，燈殼散熱部為金屬銅、銅合金或鋁、鋁合金或銅鋁合金。 Further, the heat dissipation portion of the lamp housing is metal copper, copper alloy or aluminum, aluminum alloy or copper aluminum alloy.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，所述燈殼散熱部上設置有絕緣層並且印刷有驅動電源電路。 Further, the lamp housing heat dissipating portion is provided with an insulating layer and printed with a driving power supply circuit.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，所述燈殼散熱部為導熱塑膠或散熱塑膠或陶瓷。 Further, the heat dissipation part of the lamp housing is a heat conductive plastic or a heat dissipation plastic or ceramic.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，所述燈殼散熱部上黏貼有線路。 Further, a line is adhered to the heat dissipation portion of the lamp housing.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，所述燈殼散熱部上焊接有驅動電源電子元件。 Further, a driving power supply electronic component is soldered to the heat dissipation portion of the lamp housing.
在上述技術方案的基礎上，本創作還可以做如下改進。 Based on the above technical solutions, the creation can also be improved as follows.
進一步，所述燈殼散熱部上黏貼LED晶片後，在所述燈殼散熱部上設置有金線，瑩光粉，並灌膠封裝。 Further, after the LED chip is pasted on the heat dissipation portion of the lamp housing, a gold wire, a phosphor powder, and a glue package are disposed on the heat dissipation portion of the lamp housing.
1‧‧‧燈殼散熱部 1‧‧‧Light shell heat sink
2‧‧‧PCB導體線路 2‧‧‧PCB conductor lines
3‧‧‧LED晶片 3‧‧‧LED chip
4‧‧‧金線 4‧‧‧ Gold wire
圖1是目前市面所生產LED燈具結構剖視圖；圖2是本創作燈具結構剖視圖；圖3是本創作燈具結構視圖；圖4是本創作於螺紋球泡燈剖視圖；圖5是本創作於T5,T6,T7,T8,T10日光燈可由不同長度所組成的剖視圖；圖6是本創作於平板日光燈可由不同長度或寬度所組成的剖視圖；及圖7是本創作於路燈具有多發光角度的剖視圖。 1 is a cross-sectional view of the structure of the LED lamp currently produced in the market; FIG. 2 is a cross-sectional view of the structure of the lamp; FIG. 3 is a structural view of the lamp; FIG. 4 is a cross-sectional view of the threaded bulb; The T6, T7, T8, T10 fluorescent lamps can be divided into different lengths; FIG. 6 is a cross-sectional view of the flat fluorescent lamp which can be composed of different lengths or widths; and FIG. 7 is a cross-sectional view of the street lamp having multiple illumination angles.
以下結合附圖對本創作的原理和特徵進行描述，所舉實例只用於解釋本創作，並非用於限定本創作的範圍。 The principles and features of the present invention are described below in conjunction with the accompanying drawings, which are merely used to explain the present invention and are not intended to limit the scope of the present invention.
如圖2至7所示，包括燈殼散熱部1，並於燈殼上印刷塗布PCB導體線路2，若燈殼散熱部為導體時需於PCB與導 體間塗布一緣體以避免燈殼散熱部成為導通線路，若燈殼散熱部為非導體的散熱塑膠或陶瓷時可將PCB導體線路直接塗布在燈殼散熱部上，將LED晶片3黏貼於燈殼散熱部上1，打金線(wire Bounding process)4，灌膠封裝完成晶片於燈殼上之程序(Chip on Lamp Housing process)，這樣即完成燈源與燈殼散熱部的接合，再將驅動電源與燈罩進行組裝，即完成LED燈的組裝。 As shown in FIGS. 2 to 7, the lamp housing heat dissipation portion 1 is included, and the PCB conductor line 2 is printed and coated on the lamp housing. If the lamp housing heat dissipation portion is a conductor, it is required to be on the PCB and the guide. Applying a body between the bodies to prevent the heat dissipation portion of the lamp housing from becoming a conduction line. If the heat dissipation portion of the lamp housing is a non-conducting heat dissipation plastic or ceramic, the PCB conductor line can be directly coated on the heat dissipation portion of the lamp housing, and the LED chip 3 is adhered to On the heat sink of the lamp housing, a wire Bounding process 4 is completed, and the chip is printed on the chip on the lamp housing process, so that the light source and the heat sink of the lamp housing are completed. The driver is assembled with the lamp cover to complete the assembly of the LED lamp.
Chip on Lamp Housing晶片於LED燈殼上製作流程：燈殼散熱部==》製作導體線路於燈殼內側(固晶側)==》晶片打金線及封裝於燈殼上形成燈源==》組裝電源==》組裝燈罩==》成品。 Chip on Lamp Housing chip on LED lamp housing production process: lamp housing heat dissipation part == "made conductor line on the inside of the lamp housing (solid crystal side) ==" wafer gold wire and packaged on the lamp housing to form the light source == 》Assembly power == "Assembled lampshade ==" finished product.
在具體實施中，可以將散熱部件設置為半圓型的及圓柱狀或平板狀以適應球泡燈、吸頂燈、日光燈等應用。在實施中通過不同的外殼結構和封裝方式可以提供包括室內、戶外、商用及水底用LED燈具及各種長度規格的LED燈具。 In a specific implementation, the heat dissipating component can be arranged in a semicircular shape and a cylindrical shape or a flat shape to adapt to applications such as a bulb lamp, a ceiling lamp, and a fluorescent lamp. In the implementation, LED housings including indoor, outdoor, commercial and underwater LED lamps and various length specifications can be provided through different housing structures and packaging methods.
所述LED燈可以安裝1瓦至100瓦的螺紋球泡燈、3瓦至60瓦T5，T6，T7，T8,T10日光燈、3瓦至100瓦平板燈、3瓦至100瓦筒燈、2瓦至60瓦MR16嵌燈、3瓦至100瓦玉米燈、10瓦至500瓦路燈、3瓦至125瓦遂道燈、3瓦至125瓦投射燈、3瓦至60瓦枱燈。 The LED lamp can be installed with 1 watt to 100 watt thread bulb, 3 watt to 60 watt T5, T6, T7, T8, T10 fluorescent lamp, 3 watt to 100 watt panel light, 3 watt to 100 watt downlight, 2 Watt to 60 watt MR16 recessed light, 3 watt to 100 watt corn light, 10 watt to 500 watt street light, 3 watt to 125 watt ramp light, 3 watt to 125 watt spotlight, 3 watt to 60 watt table lamp.
當LED燈連接3瓦至60瓦T5，T6，T7，T8,T10 日光燈或3瓦至100瓦平板燈時，所述燈殼散熱部可以做成相應的大小。 When the LED light is connected 3W to 60W T5, T6, T7, T8, T10 When the fluorescent lamp or the 3 watt to 100 watt flat lamp is used, the heat dissipation portion of the lamp housing can be made to have a corresponding size.
LED燈具其特徵在於在燈殼上可依其燈源發光角度的需求而加工成不同平面於燈殼散熱基座上來增加燈光的發光角度。 The LED lamp is characterized in that the lamp housing can be processed into different planes on the heat dissipation base of the lamp housing according to the requirement of the illumination angle of the lamp source to increase the illumination angle of the lamp.
以上所述僅為本創作的較佳實施例，並不用以限制本創作，凡在本創作的精神和原則之內，所作的任何修改、等同替換、改進等，均應包含在本創作的保護範圍之內。 The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., which are made within the spirit and principles of this creation, shall be included in the protection of this creation. Within the scope.
1‧‧‧燈殼散熱部 1‧‧‧Light shell heat sink
2‧‧‧PCB導體線路 2‧‧‧PCB conductor lines
3‧‧‧LED晶片 3‧‧‧LED chip
4‧‧‧金線 4‧‧‧ Gold wire
Claims (15)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201058655U CN203131527U (en) | 2013-03-08 | 2013-03-08 | Light emitting diode (LED) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM467020U true TWM467020U (en) | 2013-12-01 |
Family
ID=48939503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102211500U TWM467020U (en) | 2013-03-08 | 2013-06-20 | Light emitting diode (LED) lamp |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN203131527U (en) |
| TW (1) | TWM467020U (en) |
| WO (1) | WO2014134936A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203131527U (en) * | 2013-03-08 | 2013-08-14 | 徐康哲 | Light emitting diode (LED) lamp |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201066099Y (en) * | 2007-06-14 | 2008-05-28 | 杭州艾欧易迪光能科技有限公司 | Integral large power LED bracket favorable to heat-conductive performance |
| CN201547699U (en) * | 2009-10-22 | 2010-08-11 | 深圳市同洲电子股份有限公司 | Led device |
| CN101922630B (en) * | 2010-06-23 | 2014-05-07 | 海洋王照明科技股份有限公司 | LED light source structure and lamp |
| CN201844235U (en) * | 2010-08-26 | 2011-05-25 | 深圳市元森林光电科技有限公司 | LED mining lamp |
| CN203131527U (en) * | 2013-03-08 | 2013-08-14 | 徐康哲 | Light emitting diode (LED) lamp |
-
2013
- 2013-03-08 CN CN2013201058655U patent/CN203131527U/en not_active Expired - Fee Related
- 2013-06-20 TW TW102211500U patent/TWM467020U/en not_active IP Right Cessation
- 2013-11-27 WO PCT/CN2013/087968 patent/WO2014134936A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN203131527U (en) | 2013-08-14 |
| WO2014134936A1 (en) | 2014-09-12 |
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