TWM445759U - Probe holding structure and its optical inspection device - Google Patents
Probe holding structure and its optical inspection device Download PDFInfo
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- TWM445759U TWM445759U TW101214087U TW101214087U TWM445759U TW M445759 U TWM445759 U TW M445759U TW 101214087 U TW101214087 U TW 101214087U TW 101214087 U TW101214087 U TW 101214087U TW M445759 U TWM445759 U TW M445759U
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Description
本創作係為一種探針固持的技術,尤其是指一種利用組合式之探針固持結構及其光學檢測裝置。This creation is a technique for holding a probe, especially a combination of a probe holding structure and an optical detecting device thereof.
半導體晶片完成之前,必須經過多道檢測程序以確保品質。其中之一檢測項目即是為了驗證半導體晶片內部之各精密電子元件間的電性連接是否確實以及功能是否符合驗收規格。Before the semiconductor wafer is completed, multiple inspection procedures must be performed to ensure quality. One of the test items is to verify whether the electrical connection between the precision electronic components inside the semiconductor wafer is true and whether the function meets the acceptance specifications.
一般而言,半導體晶片進行測試時,測試機必須透過一探針卡(probe card)接觸待測物(device under test,DUT),例如:晶片,並藉由訊號傳輸以及電性訊號分析,以獲得待測物的測試結果。探針卡通常包含若干個尺寸精密的探針相互排列而成,每一個探針通常會對應晶片上特定的電性接點,當探針接觸待測物上的對應電性接點時,可以確實傳遞來自測試機的測試訊號;同時,配合探針卡及測試機之控制與分析程序,達到量測待測物之電性特徵的目的。Generally, when testing a semiconductor wafer, the test machine must contact a device under test (DUT), such as a wafer, through a probe card, and by signal transmission and electrical signal analysis. Obtain test results of the test object. The probe card usually comprises a plurality of precision probes arranged in a mutual arrangement, and each probe generally corresponds to a specific electrical contact on the wafer, and when the probe contacts the corresponding electrical contact on the object to be tested, It does pass the test signal from the test machine; at the same time, with the control and analysis program of the probe card and the test machine, the purpose of measuring the electrical characteristics of the test object is achieved.
請參閱第1A與第1B圖所示,該圖係為習用技術之探針卡結構底視以及剖面示意圖。該探針卡1具有一導引板10,其上具有一通孔11,通孔周圍具有複數排探針12,13以及14。由於在導引板10上有複數排的探針12,13以及14,再加上導引板10的面積很小,因此在製作探針卡1時,在進行第一排探針12之插針動作時,第二排與第三排探針13與14之插針動作就無法同步進行,因而會降低探針卡1 的製作效率。此外,由於在習用技術中,探針是直接插置在導引板10上,因此當製作品質有問題時或者是在使用上探針接觸有異常時,並無法針對有問題的探針,個別進行更換,而必須將探針連同導引板一起報廢,如此必然增加探針卡之成本。Please refer to FIGS. 1A and 1B, which are bottom and cross-sectional views of a probe card structure of a conventional technique. The probe card 1 has a guide plate 10 having a through hole 11 therearound, and a plurality of rows of probes 12, 13 and 14 around the through hole. Since there are a plurality of rows of probes 12, 13 and 14 on the guide plate 10, and the area of the guide plate 10 is small, when the probe card 1 is manufactured, the insertion of the first row of probes 12 is performed. When the needle is actuated, the pin movements of the second and third rows of probes 13 and 14 cannot be synchronized, thereby reducing the probe card 1 Production efficiency. In addition, since the probe is directly inserted into the guide plate 10 in the conventional technique, when there is a problem in the manufacturing quality or when there is an abnormality in the probe contact, the problematic probe cannot be individually used. The replacement is made, and the probe must be scrapped together with the guide plate, which inevitably increases the cost of the probe card.
綜合上述,因此亟需一種探針固持結構及其光學檢測裝置來解決習用技術所產生之問題。In summary, there is a need for a probe holding structure and an optical detecting device to solve the problems caused by conventional techniques.
本創作之一目的在提供一種探針固持結構其光學檢測裝置,在該探針固持結構中,其係將探針模組化而與導引板相接,增加探針與導引板組合的彈性以提升製作探針卡的效率,而且也可以容易對有問題的探針進行更換,使得維護更方便,進而降低探針卡之成本。One of the aims of the present invention is to provide an optical detecting device for a probe holding structure in which a probe is modularized to be connected to a guiding plate, and a probe and a guiding plate are combined. Elasticity improves the efficiency of making probe cards, and it is also easy to replace problematic probes, making maintenance easier and reducing the cost of probe cards.
為了達到上述之目的,本創作提供一種探針固持結構,包括:一基板以及複數個固持模組。該基板,其係具有一通孔以及複數個設置在該通孔之周圍的槽體。該複數個固持模組,其係分別與該複數個槽體相連接,每一個固持模組更具有一固定件以及複數個探針,該固定件係與對應之槽體相連接。該複數個探針係連接於該固定件上,且通過對應之槽體。In order to achieve the above purpose, the present invention provides a probe holding structure, comprising: a substrate and a plurality of holding modules. The substrate has a through hole and a plurality of grooves disposed around the through hole. The plurality of holding modules are respectively connected to the plurality of slots, and each of the holding modules further has a fixing member and a plurality of probes, and the fixing members are connected to the corresponding slots. The plurality of probes are attached to the fixture and pass through the corresponding slots.
為了達到上述之目的,本創作更提供一種光學檢測裝置,包括:一座體、至少一鏡頭容置座以及至少一探針固持結構。該座體,其係具有至少一第一通孔。該至少一鏡頭容置座,其係分別容置於該至少一第一通孔內,每一鏡 頭容置座內具有一鏡頭。該至少一探針固持結構,其係設置於該座體之表面上,每一探針固持結構其係包括有一基板以及複數個固持模組。該基板,其係具有一通孔以及複數個設置在該通孔之周圍的槽體。該複數個固持模組,其係分別與該複數個槽體相連接,每一個固持模組更具有一固定件以及複數個探針,該固定件係與對應之槽體相連接。該複數個探針係連接於該固定件上,且通過對應之槽體。In order to achieve the above object, the present invention further provides an optical detecting device, comprising: a body, at least one lens receiving seat and at least one probe holding structure. The base body has at least one first through hole. The at least one lens receiving seat is respectively received in the at least one first through hole, each mirror There is a lens inside the headrest. The at least one probe holding structure is disposed on a surface of the base body, and each of the probe holding structures includes a substrate and a plurality of holding modules. The substrate has a through hole and a plurality of grooves disposed around the through hole. The plurality of holding modules are respectively connected to the plurality of slots, and each of the holding modules further has a fixing member and a plurality of probes, and the fixing members are connected to the corresponding slots. The plurality of probes are attached to the fixture and pass through the corresponding slots.
請參閱第2圖所示,該圖係為本創作探針固持結構之實施例立體示意圖。在本實施例中,該探針固持結構2包括有一基板20以及複數個固持模組21。請參閱第3A圖所示,該圖係為本創作之基板第一實施例結構示意圖。在本實施例中,該基板20具有一通孔200以及複數個設置在該通孔之周圍的槽體201。在本實施例中,該複數個槽體201係為貫通該基板20。該複數個槽體201可以呈現類似ㄇ字形或者是口字形的排列,本實施例為類似ㄇ字形的排列,亦即在該通孔200之三側上形成有槽體201。另外,在另一實施例中,如第3B圖所示,該基板20上所具有的槽體並非如第3A圖為貫穿基板20之結構,而是分別具有一底面203,然後在該底面203上形成複數個貫穿基板20的第一貫穿孔204。該基板20之材質可以為工程塑膠、電木等或者是陶瓷材料所構成。在本實施例中,該基板20係為陶瓷板。此外,在第3A圖與第3B圖中,基板20上具有沉孔205。沉孔205之數量與 開設位置係根據基板20之尺寸與構形而定,並不以圖中基板20之四個角落為限制。沉孔205的目的在於利用鎖固元件,例如:螺絲,將基板20固鎖在基座上時,可以讓固鎖元件沉入孔內,而不會凸出基板20表面,進而可以避免傷到待測晶片。Please refer to FIG. 2, which is a perspective view of an embodiment of the creative probe holding structure. In the embodiment, the probe holding structure 2 includes a substrate 20 and a plurality of holding modules 21 . Please refer to FIG. 3A, which is a schematic structural view of a first embodiment of the substrate of the present invention. In the embodiment, the substrate 20 has a through hole 200 and a plurality of grooves 201 disposed around the through hole. In the present embodiment, the plurality of slots 201 are penetrated through the substrate 20. The plurality of troughs 201 may have a U-shaped or a square-shaped arrangement. In this embodiment, the U-shaped arrangement is similar, that is, the trough 201 is formed on three sides of the through hole 200. In addition, in another embodiment, as shown in FIG. 3B, the groove body on the substrate 20 is not a structure penetrating the substrate 20 as shown in FIG. 3A, but has a bottom surface 203 respectively, and then the bottom surface 203. A plurality of first through holes 204 penetrating the substrate 20 are formed on the upper surface. The material of the substrate 20 may be made of engineering plastics, bakelite, or the like. In the present embodiment, the substrate 20 is a ceramic plate. Further, in FIGS. 3A and 3B, the substrate 20 has a counterbore 205. The number of counterbore 205 and The opening position is determined according to the size and configuration of the substrate 20, and is not limited to the four corners of the substrate 20 in the drawing. The purpose of the counterbore 205 is to use a locking component, such as a screw, to lock the substrate 20 to the base, so that the locking component can be sunk into the hole without protruding the surface of the substrate 20, thereby avoiding injury. The wafer to be tested.
請同時參閱第2圖與第3B圖所示,本實施例的基板20係為第3B圖所示的基板實施例,該複數個固持模組21分別容置於該複數個槽體202內,且分別與該複數個槽體202相連接,每一個固持模組21更具有一固定件210以及複數個探針211。在本實施例中,每一個固定件210係為一長條柱體。該固定件210之材質可以為工程塑膠、電木等或者是陶瓷材料所構成。在本實施例中,該固定件210為陶瓷材料所構成。請參閱第4A圖所示,該圖係為本創作第2圖所示的探針固持結構剖面示意圖。首先說明本創作之固持模組21與對應槽體201連接的方式,在本實施例中,每一個探針211係藉由膠材22,例如:黑膠(epoxy),先黏著於固定件210上,形成單一的固持模組21。每一個探針211被彎折成具有一延伸部2110、一懸臂部2111以及一偵測部2112的N型針結構。該延伸部2110,其係抵靠於該固定件210之一側面上。本實施例中,該延伸部2110大致與基板20之表面相垂直。該懸臂部2111,其係與該延伸部2110相連接,與該延伸部2110間具有一第一夾角θ1。為了讓探針211黏固於該固定件210上,該懸臂部2111與該固定件210間透過膠材22來進行連接。該偵測部2112,其係與該懸臂部2111相連接,且與該懸臂部2111間具有一第二夾角θ2。第一夾角θ1與第二夾 角θ2之大小並無特定之限制,可以根據需要彎折至所需的角度。Referring to FIG. 2 and FIG. 3B , the substrate 20 of the embodiment is the substrate embodiment shown in FIG. 3B , and the plurality of holding modules 21 are respectively received in the plurality of slots 202 . Each of the holding modules 21 further has a fixing member 210 and a plurality of probes 211. In this embodiment, each of the fixing members 210 is an elongated cylinder. The material of the fixing member 210 can be made of engineering plastics, bakelite, or the like. In this embodiment, the fixing member 210 is made of a ceramic material. Please refer to FIG. 4A, which is a schematic cross-sectional view of the probe holding structure shown in FIG. 2 of the present invention. First, the manner in which the holding module 21 of the present invention is connected to the corresponding slot 201 is described. In this embodiment, each of the probes 211 is adhered to the fixing member 210 by a glue 22 such as epoxy. A single holding module 21 is formed. Each of the probes 211 is bent into an N-shaped needle structure having an extending portion 2110, a cantilever portion 2111, and a detecting portion 2112. The extension portion 2110 is abutted against one side of the fixing member 210. In this embodiment, the extending portion 2110 is substantially perpendicular to the surface of the substrate 20. The cantilever portion 2111 is connected to the extending portion 2110 and has a first angle θ1 between the extending portion 2110. In order to adhere the probe 211 to the fixing member 210, the cantilever portion 2111 and the fixing member 210 are connected through the adhesive material 22. The detecting unit 2112 is connected to the cantilever portion 2111 and has a second angle θ2 with the cantilever portion 2111. First angle θ1 and second clip The size of the angle θ2 is not particularly limited and can be bent to a desired angle as needed.
該固定件210與該探針211接觸之表面除了為平面之外,更可以為如第4B圖所示,為了讓每一探針211可以容易的放置在該固定件210上,在該固定件210上之至少一側面上可以設置有凹槽2100或2101。其中,凹槽2101提供容置對應該延伸部2110。而凹槽2100的設置,則是有利於彎折探針211之用,其位置係設置於該固定件210對應該懸臂部2111的壁面上。要說明的是,雖然在第4B圖所示的固定件210同時俱有凹槽2100與2101,不過這兩個凹槽2100與2101並不一定要同時具有,使用者可以根據需要而設置其中之一或兩者。The surface of the fixing member 210 in contact with the probe 211 may be, as shown in FIG. 4B, in addition to being planar, in order to allow each probe 211 to be easily placed on the fixing member 210, the fixing member A groove 2100 or 2101 may be provided on at least one side of the 210. Wherein, the groove 2101 provides a receiving corresponding to the extension 2110. The arrangement of the groove 2100 is advantageous for bending the probe 211, and the position is disposed on the wall surface of the fixing member 210 corresponding to the cantilever portion 2111. It should be noted that although the fixing member 210 shown in FIG. 4B has both the grooves 2100 and 2101, the two grooves 2100 and 2101 do not have to be simultaneously provided, and the user can set the grooves as needed. One or both.
再回到第4A圖所示,每一固持模組21再被嵌入到該基板20上對應的槽體202上,由於本實施例的基板20為第3B圖的實施例,因此每一個探針211的延伸部2110會通過對應的第一貫穿孔204而穿出該基板20。由於該第一貫穿孔204的設計,可以讓穿出基板20的延伸部2110得到更好的定位效果,以利後續電訊號的導引。為了讓固持模組21可以固定在基板20上,當該固持模組21容置於對應的槽體202內時,可以在利用膠材22充填於該固持模組21與該槽體202的縫隙,以強化固持模組21與該槽體202間的連接效果。另外,在另一實施例中,更可以在該探針211懸臂部2111與該基板20間以膠材22a來強化連接關係。此外,要說明的是,在另一實施例中,固定件210也可以不用被容置於槽體202內,而是直接連接在對應槽體202之表面上。此時,槽體202 為開口寬度小於固定件210寬度的貫穿槽,僅提供對應的探針通過。至於該固定件210連接於基板的方式可以利用黑膠來黏著固定。Returning to FIG. 4A, each of the holding modules 21 is embedded in the corresponding groove 202 on the substrate 20. Since the substrate 20 of the embodiment is the embodiment of FIG. 3B, each probe is used. The extension 2110 of the 211 will pass through the substrate 20 through the corresponding first through hole 204. Due to the design of the first through hole 204, the extending portion 2110 of the substrate 20 can be better positioned to facilitate the guiding of the subsequent electrical signals. In order to allow the holding module 21 to be fixed on the substrate 20, when the holding module 21 is received in the corresponding slot 202, the gap between the holding module 21 and the slot 202 can be filled with the adhesive 22 The effect of the connection between the holding module 21 and the trough body 202 is enhanced. In addition, in another embodiment, the connection relationship between the cantilever portion 2111 of the probe 211 and the substrate 20 is further enhanced by the glue 22a. In addition, it should be noted that in another embodiment, the fixing member 210 may not be accommodated in the groove body 202, but may be directly connected to the surface of the corresponding groove body 202. At this time, the tank 202 For a through slot having an opening width smaller than the width of the fixture 210, only the corresponding probe passes is provided. As for the manner in which the fixing member 210 is attached to the substrate, it can be adhered and fixed by using black glue.
請參閱第5A圖至第5C圖所示,該圖係為本創作之探針固持結構之實施例立體與剖面以及固持模組分解示意圖。在本實施例中,基本上的結構與第2圖類似,差異的是本實施例的固持模組21a中,固定件210a之結構與第2圖之固定件210不同。在本實施例中,如第5C圖所示,該固定件210a上具有複數個第二貫穿孔2102,其係分別對應有一探針211。每一個探針211的延伸部2110穿過該第二貫穿孔2102。如第5B圖所示,探針211固定在固定件210a上之後,可以藉由膠材22與22a將探針211固著於固定件210a上。要說明的是,膠材的塗佈位置可以根據需要而定,並不以圖示之位置為限制。接著再將整個固持模組21嵌入對應的基板20之凹槽。基板20的凹槽同樣可以選擇如第3A圖或第3B圖所示的槽體201或202之態樣,在本實施例中係使用第3B圖所示的槽體202的結構。當整個固持模組21嵌入到對應槽體202之後,為了加強固持模組21與基板20間的連接效果,在一實施例中,更可以在固持模組21與基板20之交界處塗上膠材22b。要說明的是,將該固持模組21透過膠材連接到基板20上的膠材塗佈位置,並不以本實施例所示之位置為限制,使用者可以根據需求選擇適當的交界面以膠材來強化連接關係。雖然前述的第一貫穿孔204為各自獨立的通孔,要說明的是,該複數個第一貫穿孔204的另一種變化為將其整合成相互連通的單一貫穿槽,以提供探針通過。Please refer to FIG. 5A to FIG. 5C , which are schematic exploded view of the embodiment of the probe holding structure of the present invention. In the present embodiment, the basic structure is similar to that of FIG. 2, and the difference is that in the holding module 21a of the present embodiment, the structure of the fixing member 210a is different from that of the fixing member 210 of FIG. In the embodiment, as shown in FIG. 5C, the fixing member 210a has a plurality of second through holes 2102 corresponding to a probe 211. An extension 2110 of each probe 211 passes through the second through hole 2102. As shown in FIG. 5B, after the probe 211 is fixed on the fixing member 210a, the probe 211 can be fixed to the fixing member 210a by the adhesive members 22 and 22a. It should be noted that the coating position of the rubber material can be determined as needed, and is not limited by the position shown. Then, the entire holding module 21 is embedded in the groove of the corresponding substrate 20. The groove of the substrate 20 can also be selected as in the case of the groove 201 or 202 shown in Fig. 3A or Fig. 3B. In the present embodiment, the structure of the groove 202 shown in Fig. 3B is used. After the entire holding module 21 is embedded in the corresponding slot body 202, in order to enhance the connection between the holding module 21 and the substrate 20, in an embodiment, the glue may be applied at the interface between the holding module 21 and the substrate 20. Material 22b. It should be noted that the position where the holding module 21 is connected to the adhesive material on the substrate 20 through the adhesive material is not limited by the position shown in this embodiment, and the user can select an appropriate interface according to the requirement. Glue to strengthen the connection. Although the aforementioned first through holes 204 are independent through holes, it is to be noted that another variation of the plurality of first through holes 204 is to integrate them into a single through groove that communicates with each other to provide probe passage.
根據前述本創作的探針固持結構的實施例,本創作的探針固持結構由於具有與基板分離的固持模組,使得排設探針形成探針的固持模組以及將固持模組裝設在基板上的動作變成可以獨立分開進行,因此可以增加組裝的效率,而且在探針維護上也可以獨立分拆裝,避免整個探針固持結構報廢而增加成本的問題。此外,前述之第2圖與第5A圖所示之實施例的固持模組21與21a中,各個固持模組21或21a所具有的固定件210或210a為長條柱體的獨立結構。但在另一實施例中,如第6A至第6D圖所示,多個固定件210可以相互連接而成為環狀的一體成形結構,例如:口字型或者是ㄇ字型的一體結構。其中,第6A圖為ㄇ字型的固定件210b,而第6B圖為口字型的固定件210c,第6A圖與第6B圖其係可以被用於第2圖之固持模組中的固定件。另外,在第6C圖所示的ㄇ字型的固定件210d與第6D圖所示的口字型的固定件210e中,都具有第二貫穿孔2102,其係可以被用於第5A圖之固持模組中的固定件。According to the embodiment of the probe holding structure of the present invention, the probe holding structure of the present invention has a holding module separated from the substrate, so that the mounting module for forming the probe and the fixing mold are assembled. The actions on the substrate can be independently separated, so that the assembly efficiency can be increased, and the probe maintenance can also be independently disassembled, thereby avoiding the problem that the entire probe holding structure is scrapped and the cost is increased. In addition, in the holding modules 21 and 21a of the embodiment shown in FIGS. 2 and 5A, the fixing members 210 or 210a of each of the holding modules 21 or 21a are independent structures of the elongated cylinders. However, in another embodiment, as shown in FIGS. 6A to 6D, the plurality of fixing members 210 may be connected to each other to form an annular integrally formed structure, for example, a mouth-shaped type or a U-shaped integral structure. 6A is a U-shaped fixing member 210b, and FIG. 6B is a mouth-shaped fixing member 210c, and FIGS. 6A and 6B can be used for fixing in the holding module of FIG. Pieces. Further, in the U-shaped fixing member 210d shown in Fig. 6C and the lip-shaped fixing member 210e shown in Fig. 6D, the second through hole 2102 is provided, which can be used in Fig. 5A. Hold the fixture in the module.
請參閱第6E圖所示,該圖係為以第6C圖的固定件210d所形成的固持模組21a與基板20b相結合的示意圖。該基板20b上具有通孔200、四個沉孔205以及複數個貫穿槽206。其中,該複數個貫穿槽206設置在通孔200之周圍,形成一纇似ㄇ字型的結構,每一個貫穿槽206係貫穿該基板20b。在本實施例中,該固定件210d上的每一個第二貫穿孔2102提供每一個探針211之延伸部2110通過。延伸部再進一步穿過對應的貫穿槽206。固定件210d可以直接放置在附件基板的表面,之後,再用黑膠固定。要說明的是,雖然第6E圖 的實施例中,所使用的為第6C圖之固定件210d,但根據前述之精神,固定件也可以採用第6A、6B以及6D的結構。此外,在另一實施例中,基板20b的結構可以增設限位槽之結構,以限制固定件210b,210c,210d或210e的位置,將其固定在基板20b的特定位置。在這實施例中,貫穿槽則開設於限位槽之底面,而固定件210b,210c,210d或210e則容置於該限位槽內,而抵靠在該底面上,固定件上的探針則通過貫穿槽。Referring to FIG. 6E, the figure is a schematic view of the holding module 21a formed by the fixing member 210d of FIG. 6C combined with the substrate 20b. The substrate 20b has a through hole 200, four counter holes 205, and a plurality of through grooves 206. The plurality of through grooves 206 are disposed around the through holes 200 to form a U-shaped structure, and each of the through grooves 206 penetrates the substrate 20b. In the present embodiment, each of the second through holes 2102 on the fixing member 210d provides an extension of the extension 2110 of each of the probes 211. The extension further passes through the corresponding through slot 206. The fixing member 210d can be directly placed on the surface of the accessory substrate, and then fixed with black glue. To be explained, although Figure 6E In the embodiment, the fixing member 210d of Fig. 6C is used, but according to the spirit of the foregoing, the fixing members may also adopt the structures of the sixth, sixth, and sixth embodiments. Further, in another embodiment, the structure of the substrate 20b may be provided with a structure of a limiting groove to limit the position of the fixing member 210b, 210c, 210d or 210e to be fixed at a specific position of the substrate 20b. In this embodiment, the through slot is formed on the bottom surface of the limiting slot, and the fixing member 210b, 210c, 210d or 210e is received in the limiting slot, and the base is fixed on the bottom surface. The needle passes through the slot.
請參閱第7圖所示,該圖係為本創作之光學檢測裝置立體分解示意圖。該光學檢測裝置3包括有一座體30、一鏡頭容置座31以及一探針固持結構2。該座體30係具有一通孔300,該通孔300之內壁具有第一螺牙301。在該座體30之一第一側面上開設有一容置槽302以提供容置該探針固持結構2。該通孔300貫通該容置槽302,使該通孔與對應之探針固持結構2所具有的通孔200相對應。該容置槽302之底面上開設複數個螺孔303,在本實施例中,該複數個螺孔303分別設置在容置槽302的四個角落,分別與探針固持結構2中的四個沉孔205相對應。此外,該容置槽302之底面上更形成有複數個槽口304,其係分別與複數個固持模組21相對應,每一個槽口304內具有複數個分別與固持模組21所具有的複數個探針211相對應的穿孔305。該穿孔305貫穿該座體30,使得每一個探針201之延伸部2110可以經由對應的穿孔305而與探針卡之電路板表面上的焊墊電性連接。Please refer to FIG. 7 , which is a perspective exploded view of the optical detecting device of the present invention. The optical detecting device 3 includes a body 30, a lens receiving seat 31 and a probe holding structure 2. The base body 30 has a through hole 300, and the inner wall of the through hole 300 has a first thread 301. A receiving groove 302 is defined in a first side of the body 30 to provide the probe holding structure 2 . The through hole 300 penetrates the accommodating groove 302 so that the through hole corresponds to the through hole 200 of the corresponding probe holding structure 2 . A plurality of screw holes 303 are defined in the bottom surface of the accommodating groove 302. In the embodiment, the plurality of screw holes 303 are respectively disposed at four corners of the accommodating groove 302, and four of the probe holding structures 2, respectively. The counterbore 205 corresponds. In addition, a plurality of notches 304 are formed on the bottom surface of the accommodating groove 302, respectively, corresponding to the plurality of holding modules 21, and each of the notches 304 has a plurality of respectively corresponding to the holding module 21 A plurality of probes 211 correspond to perforations 305. The through hole 305 extends through the base body 30 such that the extension portion 2110 of each probe 201 can be electrically connected to the solder pad on the surface of the circuit board of the probe card via the corresponding through hole 305.
該鏡頭容置座31,其係容置於該通孔300內,該鏡頭容置座31內具有一容置槽310,其內具有一鏡頭33。該鏡頭容 置座31之外部表面具有第二螺牙311可與該通孔300內的第一螺牙301相螺接。在一實施例中,該鏡頭33係藉由螺牙與該與該容置座內的螺牙312相螺接。此外,在該鏡頭容置座31之一端,具有複數個調整槽313與314,其係可以提供與一調整治具相偶接,藉由該調整治具來轉動該鏡頭容置座31,使得鏡頭容置座31可以透過第一螺牙301與第二螺牙311螺接而向上或向下移動。該調整治具可以為一字形治具或者是十字形治具,但不以此為限制。The lens housing 31 is disposed in the through hole 300. The lens housing 31 has a receiving slot 310 therein and a lens 33 therein. The lens capacity The outer surface of the seat 31 has a second thread 311 that can be screwed with the first thread 301 in the through hole 300. In one embodiment, the lens 33 is screwed to the screw 312 in the housing by a screw. In addition, at one end of the lens housing 31, there are a plurality of adjustment slots 313 and 314, which can be coupled to an adjustment fixture, and the lens holder 31 is rotated by the adjustment fixture. The lens housing 31 can be moved upward or downward through the first screw 301 and the second screw 311. The adjustment jig can be a one-shaped jig or a cross-shaped jig, but is not limited thereto.
該探針固持結構2可以選擇為第2圖或者是第5A圖的實施態樣。該探針固持結構2係藉由複數個固鎖元件32,例如螺絲,通過對應沉孔205而與對應的螺孔303相螺接,進而將該探針固持結構2鎖固在座體30的容置槽302內。在進行晶片測試時,可以藉由外部光源將光投射到待測晶片上,使得待測晶片產生電訊號。與該待測晶片電性連接的複數個探針211接收電訊號後,經由延伸部2110將訊號傳遞至電路板上的焊墊。電路板接收該電訊號,並將該電訊號傳遞至測試機進行電訊號檢測。又鏡頭容置座31螺接在該通孔300內,而通孔300又與探針固持結構2的通孔200相對應,因此該鏡頭容置座31內的鏡頭33可以藉由該通孔200接收到光進而可以對待側物進行光學檢測。The probe holding structure 2 can be selected as the second embodiment or the embodiment of the fifth embodiment. The probe holding structure 2 is screwed to the corresponding screw hole 303 through a corresponding plurality of locking elements 32, such as screws, to lock the probe holding structure 2 to the body 30. The slot 302 is placed. When the wafer test is performed, light can be projected onto the wafer to be tested by an external light source, so that the wafer to be tested generates an electrical signal. After the plurality of probes 211 electrically connected to the chip to be tested receive the electrical signals, the signals are transmitted to the pads on the circuit board via the extensions 2110. The circuit board receives the electrical signal and transmits the electrical signal to the test machine for electrical signal detection. The lens housing 31 is screwed into the through hole 300, and the through hole 300 corresponds to the through hole 200 of the probe holding structure 2, so that the lens 33 in the lens housing 31 can pass through the through hole. 200 receives the light and can perform optical detection on the side object.
要說明的是,前述之座體30雖然為提供容置單一個探針固持結構2,在另一實施例中,如第8A與第8B圖所示,該圖為本創作之探針固持結構陣列示意圖。在第8A與第8B之實施例中,探針固持結構2以二維陣列的排列方式容置於座體30a內。每一個探針固持結構2係可對應耦接有一鏡頭 容置座。其中,在第8A的實施例中,每一基板20上具有複數個排列成單一個ㄇ字形的固持模組21;但是在第8B圖中,單一基板20a上具有複數個排列成複數個ㄇ字形的固持模組21,都是根據本創作之精神可以予以變化的實施態樣。It should be noted that although the foregoing body 30 is provided for accommodating a single probe holding structure 2, in another embodiment, as shown in Figs. 8A and 8B, the figure is a probe holding structure of the present invention. Schematic diagram of the array. In the 8A and 8B embodiments, the probe holding structure 2 is housed in the body 30a in a two-dimensional array arrangement. Each probe holding structure 2 can be coupled to a lens correspondingly Hold the seat. In the embodiment of the eighth embodiment, each of the substrates 20 has a plurality of holding modules 21 arranged in a single U shape; however, in FIG. 8B, the single substrate 20a has a plurality of U-shaped arrays. The holding module 21 is an embodiment that can be changed according to the spirit of the present creation.
惟以上所述之具體實施例,僅係用於例釋本創作之特點及功效,而非用於限定本創作之可實施範疇,於未脫離本創作上揭之精神與技術範疇下,任何運用本創作所揭示內容而完成之等效改變及修飾,均仍應為下述之申請專利範圍所涵蓋。However, the specific embodiments described above are only used to illustrate the features and functions of the present invention, and are not intended to limit the scope of implementation of the present invention, without departing from the spirit and technology of the present invention. The equivalent changes and modifications made by the present disclosure are still covered by the scope of the following patent application.
2‧‧‧探針固持結構2‧‧‧Probe holding structure
20,20a‧‧‧基板20,20a‧‧‧substrate
200‧‧‧通孔200‧‧‧through hole
201、202‧‧‧槽體201, 202‧‧‧
203‧‧‧底面203‧‧‧ bottom
204‧‧‧第一貫穿孔204‧‧‧First through hole
205‧‧‧沉孔205‧‧‧ counterbore
206‧‧‧貫穿槽206‧‧‧through slot
21,21a‧‧‧固持模組21, 21a‧‧‧ holding module
210,210a~210e‧‧‧固定件210,210a~210e‧‧‧Fixed parts
2100,2101‧‧‧凹槽2100, 2101‧‧‧ grooves
2102‧‧‧第二貫穿孔2102‧‧‧Second through hole
211‧‧‧探針211‧‧‧ probe
2110‧‧‧延伸部2110‧‧‧Extension
2111‧‧‧懸臂部2111‧‧‧Cantilever
2112‧‧‧偵測部2112‧‧‧Detection Department
22,22a,22b‧‧‧膠材22, 22a, 22b‧‧‧ glue
3‧‧‧光學檢測裝置3‧‧‧Optical inspection device
30,30a‧‧‧座體30, 30a‧‧‧ body
300‧‧‧通孔300‧‧‧through hole
301‧‧‧第一螺牙301‧‧‧First thread
302‧‧‧容置槽302‧‧‧ accommodating slots
303‧‧‧螺孔303‧‧‧ screw holes
304‧‧‧槽口304‧‧‧ notch
305‧‧‧穿孔305‧‧‧Perforation
31‧‧‧鏡頭容置座31‧‧‧ lens housing
310‧‧‧容置槽310‧‧‧ accommodating slots
311‧‧‧第二螺牙311‧‧‧Second thread
312‧‧‧螺牙312‧‧ ‧ thread
313,314‧‧‧調整槽313,314‧‧‧Adjustment slot
32‧‧‧固鎖元件32‧‧‧Locking components
33‧‧‧鏡頭33‧‧‧ lens
第1A與第1B圖係為習用技術之探針卡結構底視以及剖面示意圖。1A and 1B are bottom and cross-sectional views of a probe card structure of a conventional technique.
第2圖係為本創作探針固持結構之實施例立體示意圖。Fig. 2 is a perspective view showing an embodiment of the creative probe holding structure.
第3A與3B圖係為本創作之基板不同之實施例結構示意圖。3A and 3B are schematic structural views of different embodiments of the substrate of the present invention.
第4A圖係為本創作第2圖所示的探針固持結構剖面示意圖。Fig. 4A is a schematic cross-sectional view showing the probe holding structure shown in Fig. 2 of the creation.
第4B圖係為本創作之固定件另一實施例示意圖。Figure 4B is a schematic view of another embodiment of the fixture of the present invention.
第5A圖至第5C圖係為本創作之探針固持結構之實施例立體與剖面以及固持模組分解示意圖。5A to 5C are schematic exploded views of the embodiment of the probe holding structure of the present invention, the three-dimensional and cross-section and the holding module.
第6A至第6D圖係為本創作之一體結構的固定件不同實施例示意圖。6A to 6D are schematic views of different embodiments of the fixing member of the one-piece structure of the present invention.
第6E圖為本創作之探針固持結構另一實施例示意圖。Fig. 6E is a schematic view showing another embodiment of the probe holding structure of the present invention.
第7圖係為本創作之光學檢測裝置立體分解示意圖。Figure 7 is a perspective exploded view of the optical detecting device of the present invention.
第8A與第8B圖為本創作之探針固持結構陣列示意圖。8A and 8B are schematic views of the array of probe holding structures of the present invention.
2‧‧‧探針固持結構2‧‧‧Probe holding structure
20‧‧‧基板20‧‧‧Substrate
200‧‧‧通孔200‧‧‧through hole
205‧‧‧沉孔205‧‧‧ counterbore
21‧‧‧固持模組21‧‧‧Retaining module
210‧‧‧固定件210‧‧‧Fixed parts
211‧‧‧探針211‧‧‧ probe
22‧‧‧膠材22‧‧‧Stained materials
Claims (38)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101214087U TWM445759U (en) | 2012-07-20 | 2012-07-20 | Probe holding structure and its optical inspection device |
CN201310253453.0A CN103543304B (en) | 2012-07-13 | 2013-06-24 | High-frequency probe card |
CN201310253458.3A CN103543298B (en) | 2012-07-13 | 2013-06-24 | Probe holding structure and optical detection device thereof |
JP2013139824A JP5694451B2 (en) | 2012-07-13 | 2013-07-03 | High frequency probe card |
JP2013139847A JP5615409B2 (en) | 2012-07-13 | 2013-07-03 | Optical measuring device |
US13/940,870 US9244018B2 (en) | 2012-07-13 | 2013-07-12 | Probe holding structure and optical inspection device equipped with the same |
US13/941,210 US9201098B2 (en) | 2012-07-13 | 2013-07-12 | High frequency probe card |
JP2014182294A JP2015025813A (en) | 2012-07-13 | 2014-09-08 | Probe fixing structure and optical measuring device thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101214087U TWM445759U (en) | 2012-07-20 | 2012-07-20 | Probe holding structure and its optical inspection device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM445759U true TWM445759U (en) | 2013-01-21 |
Family
ID=48091421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101214087U TWM445759U (en) | 2012-07-13 | 2012-07-20 | Probe holding structure and its optical inspection device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM445759U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114966144A (en) * | 2022-07-22 | 2022-08-30 | 中科雷凌激光科技(山东)有限公司 | Adjustable probe |
-
2012
- 2012-07-20 TW TW101214087U patent/TWM445759U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114966144A (en) * | 2022-07-22 | 2022-08-30 | 中科雷凌激光科技(山东)有限公司 | Adjustable probe |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |