TWM445757U - Substrate clamping device - Google Patents

Substrate clamping device Download PDF

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Publication number
TWM445757U
TWM445757U TW101212575U TW101212575U TWM445757U TW M445757 U TWM445757 U TW M445757U TW 101212575 U TW101212575 U TW 101212575U TW 101212575 U TW101212575 U TW 101212575U TW M445757 U TWM445757 U TW M445757U
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Taiwan
Prior art keywords
frame
substrate
jig
magnetic member
magnetic
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TW101212575U
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Chinese (zh)
Inventor
Chih-Heng Lee
Shih-Yuan Lee
Chen-Lune Wang
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Unimicron Technology Corp
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Priority to TW101212575U priority Critical patent/TWM445757U/en
Publication of TWM445757U publication Critical patent/TWM445757U/en

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Abstract

Disclosed is a substrate clamping device, comprising first and second frame bodies wherein a plurality of first protruding magnetic members are formed on one surface of the first frame body and a plurality of second protruding magnetic members corresponding to the first protruding magnetic members are formed one surface of the second frame body such that the magnetic members can be attracted to each other by its magnetic force, thereby preventing substrates from becoming warped, scratched or damaged and polluted during the manufacturing process to thus increase good throughput and reduce costs as a result.

Description

用以夾持基板之治具Fixture for holding a substrate

  本創作係有關一種治具,尤指一種用以夾持基板之治具。This creation is related to a fixture, especially a fixture for holding a substrate.

  由於電子產品愈趨輕量化、薄型化、小型化與多功能化等需求,同時帶動半導體晶片封裝技術的發展,進而促使晶片封裝朝向多腳化、薄型化、及引腳微細化,甚至無引腳構裝等技術。As electronic products become lighter, thinner, smaller, and more versatile, they also drive the development of semiconductor chip packaging technology, which in turn drives the chip package to be multi-legged, thinner, and pin-thinned, even without Foot construction and other technologies.

  而為了因應輕薄短小的趨勢,目前用以製造電路板或封裝基板之基板的總板厚已經小於0.1毫米(mm),此種薄型基板的剛性已經遠不如傳統的基板,因此在製程中容易因為化學藥液的噴壓,導致基板彎翹等問題,進而造成基板被製程設備卡住,而必須報廢,以致於增加整體製造成本。In order to cope with the trend of thinness and shortness, the total thickness of the substrate for manufacturing the circuit board or the package substrate is less than 0.1 millimeters (mm). The rigidity of the thin substrate is far less than that of the conventional substrate, so it is easy in the process because The spray of the chemical liquid causes problems such as the bending of the substrate, which in turn causes the substrate to be stuck by the process equipment, and must be scrapped, so as to increase the overall manufacturing cost.

  如第1A圖所示,基板10於藉由滾輪11以帶動移向噴嘴桿12時,該基板10之一端彎曲變形,而捲入滾輪11與噴嘴桿(nozzle bar)12(或其他傳動部件)之間,造成卡板問題,除了使得基板10損壞之外,還讓產線停擺而降低產能,嚴重的話還可能造成製程設備受損。As shown in FIG. 1A, when the substrate 10 is moved toward the nozzle rod 12 by the roller 11, the one end of the substrate 10 is bent and deformed, and the roller 11 and the nozzle bar 12 (or other transmission members) are wound. Between the two, the board problem is caused, in addition to the damage of the substrate 10, the production line is stopped and the production capacity is reduced, and in serious cases, the process equipment may be damaged.

  此外,如第1B圖所示,由於基板10係藉由滾輪11與基板10表面之間的摩擦力來帶動,即基板10係與滾輪11直接接觸,因此也容易使得基板10表面受到過度磨擦而形成刮傷、凹陷、或從滾輪11上沾黏異物,進而造成基板10良率的損失。In addition, as shown in FIG. 1B, since the substrate 10 is driven by the frictional force between the roller 11 and the surface of the substrate 10, that is, the substrate 10 is in direct contact with the roller 11, the surface of the substrate 10 is easily excessively rubbed. Scratches, depressions, or foreign matter sticking from the roller 11 are formed, thereby causing a loss in yield of the substrate 10.

  因此,如何克服上述習知技術中之基板變形與基板表面受滾輪直接影響之問題,實已成目前亟欲解決的課題。Therefore, how to overcome the problem that the deformation of the substrate in the above-mentioned prior art and the surface of the substrate are directly affected by the roller has become a problem to be solved at present.

  鑑於上述習知技術之種種缺失,本創作揭露一種用以夾持基板之治具,係包括:第一框體,其一表面設有突出之複數第一磁力件;以及第二框體,其一表面設有突出且對應該等第一磁力件的複數第二磁力件,該第一磁力件係藉由磁力而得以與第二磁力件彼此相吸。In view of the above-mentioned various deficiencies of the prior art, the present invention discloses a jig for holding a substrate, comprising: a first frame having a surface on which a plurality of first magnetic members are protruded; and a second frame; A surface is provided with a plurality of second magnetic members protruding and corresponding to the first magnetic member, the first magnetic members being attracted to each other by the magnetic force by the magnetic force.

  於本創作之治具中,該第一框體與第二框體在非厚度方向係分別具有往外突出的至少一第一突部與至少一第二突部,且該第一突部與第二突部之位置彼此錯開,又該第一框體與第二框體之框面係圍繞成矩形。In the jig of the present invention, the first frame and the second frame respectively have at least one first protrusion and at least one second protrusion protruding outward in the non-thickness direction, and the first protrusion and the first protrusion The positions of the two protrusions are staggered from each other, and the frame faces of the first frame and the second frame are rounded.

  依上述之用以夾持基板之治具,該第一框體與第二框體之表面係分別具有複數第一凹部與複數第二凹部,以分別嵌合該等第一磁力件與第二磁力件,該第一磁力件與第二磁力件之材質係為磁鐵,且該第一磁力件與第二磁力件之形狀係為圓柱形。According to the above-mentioned jig for holding the substrate, the surface of the first frame and the second frame respectively have a plurality of first recesses and a plurality of second recesses for respectively fitting the first magnetic members and the second The magnetic component, the first magnetic component and the second magnetic component are made of a magnet, and the first magnetic component and the second magnetic component are cylindrical in shape.

  又於所述之治具中,該第一磁力件與第二磁力件之表面係具有保護層,且該保護層之材質為鐵氟龍。In the jig, the surface of the first magnetic member and the second magnetic member has a protective layer, and the protective layer is made of Teflon.

  於本創作之實施例中,該第一框體與第二框體之材質係為高分子材料,且該基板係為電路板或封裝基板。In the embodiment of the present invention, the material of the first frame and the second frame is a polymer material, and the substrate is a circuit board or a package substrate.

  由上可知,本創作係利用磁性方式將基板夾持於一對硬質框式治具之間,再由滾輪進行搬運,此時,治具提供基板較大的剛性,而能避免習知薄型基板於生產設備的傳動機構(例如:滾輪或輸送帶等)之間捲曲、變形與翹曲等,進而可防止卡板問題。此外,本創作之治具係位於基板的外側,所以能保護基板免於與傳動機構(例如:滾輪或輸送帶等)直接接觸,進而可避免基板表面刮傷、異物沾附、及殘留化學藥液交叉汙染等問題,以提高基板的良率,並降低整體成本。It can be seen from the above that the present invention magnetically holds the substrate between a pair of rigid frame jigs and then carries them by rollers. At this time, the jig provides a large rigidity of the substrate, and can avoid the conventional thin substrate. Curl, deformation and warpage between the transmission mechanism of the production equipment (for example, rollers or conveyor belts, etc.), thereby preventing the problem of the card. In addition, the fixture of the present invention is located on the outer side of the substrate, so that the substrate can be protected from direct contact with the transmission mechanism (for example, a roller or a conveyor belt, etc.), thereby avoiding scratches on the surface of the substrate, foreign matter adhering, and residual chemicals. Problems such as liquid cross-contamination to increase the yield of the substrate and reduce the overall cost.

  以下藉由特定的具體實施例說明本創作之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.

  須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「外」、「錯開」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本創作可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本創作可實施之範疇。It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "outside", "missing" and "one" as used in this specification are for convenience of description only, and are not intended to limit the scope of the creation of the creation, or the relative relationship may be changed or Adjustments, if there is no material change in the content of the technology, are also considered to be the scope of implementation of this creation.

  第2圖所示者,係為本創作之用以夾持基板之治具的立體爆炸圖。如第2圖所示,該治具係包括:第一框體21a,其一表面設有突出之複數第一磁力件22a;以及第二框體21b,其一表面設有突出且對應該等第一磁力件22a的複數第二磁力件22b,該第一磁力件22a係藉由磁力而得以與第二磁力件22b彼此相吸。The figure shown in Fig. 2 is a three-dimensional exploded view of the jig for clamping the substrate. As shown in FIG. 2, the fixture includes: a first frame 21a having a surface on which a plurality of first magnetic members 22a are protruded; and a second frame 21b having a surface provided with a protrusion and corresponding The plurality of second magnetic members 22b of the first magnetic member 22a are attracted to each other by the magnetic force and the second magnetic members 22b.

  於本實施例中,該第一框體21a與第二框體21b之表面係分別具有複數第一凹部210a與複數第二凹部210b,以分別嵌合該等第一磁力件22a與第二磁力件22b,且該第一磁力件22a與第二磁力件22b係例如為圓柱形之磁鐵,該第一磁力件22a與第二磁力件22b的數量與磁力大小係可依據實際應用的狀況而做不同的調整。In this embodiment, the surface of the first frame 21a and the second frame 21b respectively have a plurality of first recesses 210a and a plurality of second recesses 210b for respectively fitting the first magnetic members 22a and the second magnetic force. The second magnetic member 22a and the second magnetic member 22b are, for example, cylindrical magnets, and the number and magnetic force of the first magnetic member 22a and the second magnetic member 22b can be made according to actual conditions. Different adjustments.

  所述之該第一框體21a與第二框體21b之框面係圍繞成矩形,但是該第一框體21a與第二框體21b分別具有至少一第一突部211a與至少一第二突部211b,該至少一第一突部211a與至少一第二突部211b係在第一框體21a與第二框體21b之非厚度方向往外突出,且該第一突部211a與第二突部211b之位置彼此錯開,以便於自動化設備藉由該第一突部211a與第二突部211b將該第一框體21a與第二框體21b結合與分離。The frame faces of the first frame 21a and the second frame 21b are rounded, but the first frame 21a and the second frame 21b respectively have at least one first protrusion 211a and at least one second. The protrusion 211b, the at least one first protrusion 211a and the at least one second protrusion 211b protrude outward in a non-thickness direction of the first frame 21a and the second frame 21b, and the first protrusion 211a and the second protrusion The positions of the protrusions 211b are shifted from each other, so that the automation device can join and separate the first frame 21a and the second frame 21b by the first protrusion 211a and the second protrusion 211b.

  於前述之治具中,該第一磁力件22a與第二磁力件22b之表面係可具有保護層(未圖示),且該保護層之材質為鐵氟龍。In the foregoing jig, the surface of the first magnetic member 22a and the second magnetic member 22b may have a protective layer (not shown), and the protective layer is made of Teflon.

  於本創作之治具中,該第一框體21a與第二框體21b之材質可為高分子材料。In the jig of the present invention, the material of the first frame 21a and the second frame 21b may be a polymer material.

  接著,第3A與3B圖所示者,分別係本創作之用以夾持基板之治具之應用狀態的立體圖與前視圖。Next, the figures shown in FIGS. 3A and 3B are respectively a perspective view and a front view of the application state of the jig for holding the substrate.

  如第3A與3B圖所示,藉由該第一磁力件22a與第二磁力件22b之磁力相吸,而得以將基板30夾持於該第一磁力件22a與第二磁力件22b之間、及固定於該第一框體21a與第二框體21b之間,並使已夾持有該基板30的治具藉由H型滾輪31來帶動,其中,該基板30係為電路板或封裝基板,但不以此為限。As shown in FIGS. 3A and 3B, the substrate 30 is clamped between the first magnetic member 22a and the second magnetic member 22b by the magnetic force of the first magnetic member 22a and the second magnetic member 22b. And being fixed between the first frame 21a and the second frame 21b, and driving the fixture with the substrate 30 clamped by the H-shaped roller 31, wherein the substrate 30 is a circuit board or Package the substrate, but not limited to this.

  要注意的是,於使用本創作之用以夾持基板之治具時,僅該第一磁力件22a與第二磁力件22b接觸該基板30,因此總接觸面積極小,使得製程中之化學藥液有較多空間可洩流,不會有水池效應,進而提高化學藥液的置換率,且不易有殘留或烘乾不完全之問題。It should be noted that when the jig for clamping the substrate is used, only the first magnetic member 22a and the second magnetic member 22b are in contact with the substrate 30, so that the total contact surface is small, so that the chemical in the process The liquid has more space to vent, and there is no pool effect, thereby increasing the replacement rate of the chemical liquid, and it is not easy to have residual or incomplete drying problems.

  綜上所述,相較於習知技術,本創作係利用磁性方式將基板夾持於一對硬質框式治具之間,再由滾輪進行搬運,此時,治具提供基板較大的剛性,而能避免習知薄型基板於生產設備的傳動機構(例如:滾輪或輸送帶等)之間捲曲、變形與翹曲等,進而可防止卡板問題;此外,本創作之治具係位於基板的外側,所以能保護基板免於與傳動機構(例如:滾輪或輸送帶等)直接接觸,進而可避免基板表面刮傷、異物沾附、及殘留化學藥液交叉汙染等問題,以提高基板的良率,並降低整體成本。In summary, compared with the prior art, the present invention magnetically clamps the substrate between a pair of rigid frame jigs and then carries them by rollers. At this time, the jig provides a large rigidity of the substrate. Moreover, it is possible to prevent the thin substrate from being curled, deformed, warped, etc. between the transmission mechanism of the production equipment (for example, a roller or a conveyor belt, etc.), thereby preventing the problem of the card; in addition, the fixture of the present invention is located on the substrate. The outer side can protect the substrate from direct contact with the transmission mechanism (for example, roller or conveyor belt, etc.), thereby avoiding problems such as scratches on the substrate surface, foreign matter adhesion, and cross-contamination of residual chemical liquid to improve the substrate. Yield and lower overall costs.

  上述實施例係用以例示性說明本創作之原理及其功效,而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下,對上述實施例進行修改。因此本創作之權利保護範圍,應如後述之申請專利範圍所列。The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

10, 30‧‧‧基板10, 30‧‧‧ substrate

11‧‧‧滾輪11‧‧‧Roller

12‧‧‧噴嘴桿12‧‧‧Nozzle rod

21a‧‧‧第一框體21a‧‧‧ first frame

21b‧‧‧第二框體21b‧‧‧ second frame

210a‧‧‧第一凹部210a‧‧‧First recess

210b‧‧‧第二凹部210b‧‧‧Second recess

211a‧‧‧第一突部211a‧‧‧First protrusion

211b‧‧‧第二突部211b‧‧‧second protrusion

22a‧‧‧第一磁力件22a‧‧‧First magnetic parts

22b‧‧‧第二磁力件22b‧‧‧Second magnetic parts

31‧‧‧H型滾輪31‧‧‧H type roller

  第1A與1B圖係習知基板之運送狀態之立體圖;1A and 1B are perspective views of the transport state of a conventional substrate;

  第2圖係為本創作之用以夾持基板之治具的立體爆炸圖;以及Figure 2 is a perspective exploded view of the jig for clamping the substrate;

  第3A與3B圖分別係本創作之用以夾持基板之治具之應用狀態的立體圖與前視圖。3A and 3B are respectively a perspective view and a front view of the application state of the jig for holding the substrate.

21a‧‧‧第一框體 21a‧‧‧ first frame

21b‧‧‧第二框體 21b‧‧‧ second frame

210a‧‧‧第一凹部 210a‧‧‧First recess

210b‧‧‧第二凹部 210b‧‧‧Second recess

211a‧‧‧第一突部 211a‧‧‧First protrusion

211b‧‧‧第二突部 211b‧‧‧second protrusion

22a‧‧‧第一磁力件 22a‧‧‧First magnetic parts

22b‧‧‧第二磁力件 22b‧‧‧Second magnetic parts

Claims (10)

一種用以夾持基板之治具,係包括:
  第一框體,其一表面設有突出之複數第一磁力件;以及
  第二框體,其一表面設有突出且對應該等第一磁力件的複數第二磁力件,該第一磁力件係藉由磁力而得以與第二磁力件彼此相吸。
A jig for holding a substrate, comprising:
a first frame body having a surface on which a plurality of first magnetic members are protruded; and a second frame body having a surface on which a plurality of second magnetic members protruding and corresponding to the first magnetic member are provided, the first magnetic member The second magnetic members are attracted to each other by magnetic force.
如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一框體與第二框體在非厚度方向係分別具有往外突出的至少一第一突部與至少一第二突部,且該第一突部與第二突部之位置彼此錯開。The jig for holding a substrate according to the first aspect of the invention, wherein the first frame and the second frame have at least one first protrusion and at least one protruding outward in a non-thickness direction. The second protrusion is located, and the positions of the first protrusion and the second protrusion are staggered from each other. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一框體與第二框體之框面係圍繞成矩形。The jig for clamping a substrate according to the first aspect of the invention, wherein the frame of the first frame and the second frame is surrounded by a rectangle. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一框體與第二框體之表面係分別具有複數第一凹部與複數第二凹部,以分別嵌合該等第一磁力件與第二磁力件。The jig for holding a substrate according to the first aspect of the invention, wherein the surface of the first frame and the second frame respectively have a plurality of first recesses and a plurality of second recesses for respectively fitting The first magnetic member and the second magnetic member. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一磁力件與第二磁力件之材質係為磁鐵。The jig for holding a substrate according to the first aspect of the invention, wherein the material of the first magnetic member and the second magnetic member is a magnet. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一磁力件與第二磁力件之形狀係為圓柱形。The jig for holding a substrate according to claim 1, wherein the first magnetic member and the second magnetic member are cylindrical in shape. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一磁力件與第二磁力件之表面係具有保護層。The jig for holding a substrate according to the first aspect of the invention, wherein the surface of the first magnetic member and the second magnetic member has a protective layer. 如申請專利範圍第7項所述之用以夾持基板之治具,其中,該保護層之材質為鐵氟龍。The jig for holding a substrate according to claim 7, wherein the protective layer is made of Teflon. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該第一框體與第二框體之材質係為高分子材料。The jig for holding a substrate according to the first aspect of the invention, wherein the material of the first frame and the second frame is a polymer material. 如申請專利範圍第1項所述之用以夾持基板之治具,其中,該基板係為電路板或封裝基板。The jig for clamping a substrate according to claim 1, wherein the substrate is a circuit board or a package substrate.
TW101212575U 2012-06-29 2012-06-29 Substrate clamping device TWM445757U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI625291B (en) * 2017-02-09 2018-06-01 南茂科技股份有限公司 Tape transmitting device and method for transmitting a tape
TWI717294B (en) * 2020-06-16 2021-01-21 聯策科技股份有限公司 Horizontal wet process method of a flexible substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI625291B (en) * 2017-02-09 2018-06-01 南茂科技股份有限公司 Tape transmitting device and method for transmitting a tape
TWI717294B (en) * 2020-06-16 2021-01-21 聯策科技股份有限公司 Horizontal wet process method of a flexible substrate

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