KR101357143B1 - Apparatus and Method for transferring integrated circuit device - Google Patents

Abstract

In the transfer device and method of an integrated circuit device, a first transfer part for transferring a handling substrate with a flexible integrated circuit device in a first direction, and rotated in the second direction from the first direction and transferred in the first direction. A body disposed to contact the flexible integrated circuit device of the handling substrate in a first region, wherein the flexible integrated circuit device is detached from the handling substrate and attached to the body by contacting the flexible integrated circuit device of the handling substrate. The rotary part and the flexible substrate are transferred in the second direction, and the flexible substrate conveyed in the second direction is disposed to contact the body and the second region, and the flexible integrated part is brought into contact with the flexible integrated circuit device of the rotating part. A second transfer portion for removing a circuit element from the body and attaching it to the flexible substrate do.

Description

Apparatus and method for transferring integrated circuit device for integrated circuit device package fabrication

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device and method for an integrated circuit device, and more particularly, to a transfer device and method for a flexible integrated circuit device for manufacturing a flexible integrated circuit device package that can be flexed and unfolded freely.

Currently, the electronics industry is broadening its application range. Accordingly, packaging technology for integrated circuit devices such as semiconductor memories is increasingly demanded for high capacity, thinning, miniaturization and the like, and various solutions for solving the problems are being developed. In particular, in recent years, flexible integrated circuit devices capable of bending have been developed, and further, flexible flexible integrated circuit device packages having the aforementioned integrated circuit devices have been developed. An example of a flexible integrated circuit device package capable of flexing is disclosed in Korean Patent No. 643,756.

In the manufacturing of the flexible integrated circuit device package, a process of transferring the flexible integrated circuit device from the handling substrate to the flexible substrate must be performed. However, the technology related to the transfer of the flexible integrated circuit device for manufacturing the flexible integrated circuit device package is in the development stage.

It is an object of the present invention to provide a transfer device and method for a flexible integrated circuit device for manufacturing a flexible integrated circuit device package that can be applied to bent or curved.

In accordance with an aspect of the present invention, there is provided a transfer apparatus for an integrated circuit device, which includes: a first transfer unit configured to transfer a handling substrate to which a flexible integrated circuit device is attached in a first direction; And a body arranged to contact the flexible integrated circuit element of the handling substrate rotated in the first direction and the flexible integrated circuit element of the handling substrate, the flexible integrated circuit element of the handling substrate, A rotary part for detaching the flexible integrated circuit device from the handling substrate by contact and attaching the flexible integrated circuit device to the body; And transferring the flexible substrate in a second direction, and the flexible substrate conveyed in the second direction is in contact with the body in the second region, and is in contact with the flexible integrated circuit element of the rotating unit. And a second transfer part detaching from the body to attach to the flexible substrate.

In the apparatus for transferring an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, the flexible integrated circuit device is attached to the handling substrate with a first attachment force, and the second attachment force to the flexible substrate. When attached, the attachment film having a third attachment force greater than the first attachment force and less than the second attachment force may be provided to surround the body of the rotating part.

In the transfer device of an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, the rotating unit may be provided to rotate in place.

In the transfer apparatus for an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, each of the first transfer unit, the rotating unit and the second transfer unit is a first speed, a second speed and a third speed Alignment with respect to the flexible integrated circuit device, which is provided to have each and is attached to the flexible substrate from the handling substrate by controlling the first speed, the second speed, and the third speed, can be achieved.

According to an aspect of the present invention, there is provided a method of transferring an integrated circuit device for manufacturing an integrated circuit device package, the method including transferring a handling substrate to which a flexible integrated circuit device is attached in a first direction; A body that rotates from the first direction to the second direction, the body is in contact with the flexible integrated circuit device transferring the first direction in the first region, and the flexible integrated circuit device is detached from the handling substrate. Attaching to the body; And detaching the flexible integrated circuit device from the body and attaching the flexible substrate to the flexible substrate by contacting the flexible substrate conveyed in the second direction with the body in a second region.

In a method of transferring an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, the handling substrate is attached to the flexible integrated circuit device by using a first attachment film having a first attachment force. And the body attaches the flexible integrated circuit device using a third attachment film having a third attachment force greater than the first attachment force, and the flexible substrate has a second attachment film having a second attachment force greater than the third attachment force. It is possible to attach the flexible integrated circuit device using.

In the transfer method of an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention mentioned above, the body can rotate in place.

In a method of transferring an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, the handling substrate is transferred at a first speed, the body rotates at a second speed, and the flexible substrate. Can achieve alignment to the flexible integrated circuit device that is attached from the handling substrate to the flexible substrate by controlling the first speed, the second speed and the third speed when transported at a third speed. .

In the method of transferring an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, the flexible integrated circuit device attached to the handling substrate may include forming an integrated circuit device on one surface of a semiconductor substrate. ; Pre-cutting non-device regions between the integrated circuit device and the integrated circuit device to separate the integrated circuit devices separately; Attaching the handling substrate to one surface of the semiconductor substrate on which the integrated circuit devices are separately separated; Removing the other surface opposite to one surface of the semiconductor substrate until the integrated circuit device is exposed to obtain a result of the integrated circuit device being attached to the handling substrate; And heat treating or UV treating the resultant product so that the integrated circuit device attached to the handling substrate is formed of a flexible integrated circuit device.

In the transfer method of an integrated circuit device for manufacturing an integrated circuit device package according to an embodiment of the present invention, the flexible substrate may include a flexible printed circuit board.

According to the transfer apparatus and method of the integrated circuit element of the present invention, the flexible integrated circuit element can be easily transferred, i.e., attached to the flexible substrate from the handling substrate. Accordingly, the flexible integrated circuit device package may be more easily manufactured for the flexible substrate to which the flexible integrated circuit device is attached.

Therefore, the transfer device and method of the integrated circuit device of the present invention can be more actively applied to the manufacture of a flexible integrated circuit device package.

1 is a schematic diagram illustrating a transfer device of an integrated circuit device according to an exemplary embodiment of the present invention.
FIG. 2 illustrates a handling substrate to which the integrated circuit device of FIG. 1 is attached.
3 to 5 are diagrams for describing a method for manufacturing a handling substrate to which the integrated circuit device of FIG. 1 is attached.
6 is a schematic perspective view of FIG. 3.
7 is a schematic perspective view of FIG. 4.
8 and 9 are schematic perspective views illustrating a method for manufacturing a handling substrate to which the integrated circuit device of FIG. 5 is attached.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar components. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram illustrating a transfer device of an integrated circuit device according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a transfer device 100 (hereinafter, referred to as a “transfer device”) of an integrated circuit device includes a first transfer unit 10, a rotation unit 12, a second transfer unit 14, and the like.

The first transfer unit 10 transfers the handling substrate 20 with the flexible IC elements 30 in the first direction. In particular, the first transfer section 10 must be capable of continuously transferring the handling substrate 20 mentioned above. Accordingly, the first conveyance unit 10 may have a conveyor belt structure or the like.

The flexible integrated circuit element 30 may include a semiconductor element such as a memory element, a non-memory element, and the like. In addition, the flexible integrated circuit element 30 may include an active element, a passive element, and the like. In addition, the flexible IC device 30 may include a circuit pattern formed on a silicon substrate having a thin thickness. In particular, in the case of a silicon substrate having a thin thickness for use in the above-mentioned flexible IC device 30, it may be provided to have a thickness of about several to several tens of 탆, for example, a thickness of about 1.0 to 50 탆 And may preferably have a thickness of about 5.0 to 30.0 mu m. This is because the integrated circuit element 30 is not easily manufactured when the integrated circuit element 30 has a thickness of less than about 1.0 占 퐉 and the thickness of the integrated circuit element 30 This is because the warping is not easy.

FIG. 2 illustrates a handling substrate to which the integrated circuit device of FIG. 1 is attached.

Referring to FIG. 2, the handling substrate 20 to which the flexible integrated circuit device 30 is attached is shown, whereby the plurality of flexible integrated circuit devices 30 may be attached to the handling substrate 20 so as to have a structure separated from each other. Can be. That is, the above-mentioned flexible IC elements 30 can have a structure in which the non-element regions between the flexible IC elements 30 are separately separated by pre-cutting. In particular, the flexible integrated circuit element 30 can be attached to the handling substrate 20 by the adhesive film 22, and the adhesive film 22 can have a first adhesive force. Examples of the above-mentioned adhesive film 22 include a double-sided tape having a first adhesive force. The above-mentioned adhesive film 22 will hereinafter be referred to as a first adhesive film. Further, the handling substrate 20 may be mainly composed of a dummy substrate.

The manufacturing of the handling substrate 20 to which the above-mentioned flexible IC elements 30 are attached will be described later.

Referring back to FIG. 1, the rotating part 12 may include a body 12a disposed to contact the flexible integrated circuit device 30 of the handling substrate 20 in the first region I. The rotation unit 12 may be provided to rotate in the second direction from the first direction. Since the first transferring unit 10 transfers the handling substrate 20 in the first direction and the second transferring unit 14 that will be described later transfers the flexible substrate 24 in the second direction, The flexible integrated circuit device 30 can not be transferred from the handling substrate 20 to the flexible substrate 24 as will be described later. Thus, the above-mentioned rotation unit 12 can be provided to rotate in place. As described above, the flexible IC device 30 of the handling substrate 20, which is transported in the first direction by the first transferring portion 10, as described above by rotating the rotary portion 12 in place, And can be transferred to the flexible substrate 24 that is transported in the second direction by the second transfer unit 14. The rotation unit 12 includes a body (not shown) arranged to contact the flexible integrated circuit element 30 of the handling board 20, which rotates in the second direction from the first direction and is transported in the first direction, 12a. Also, as will be described later, the body 12a of the rotary part 12 may be disposed in contact with the flexible substrate 24 transported in the second direction in the second area. In addition, the rotation unit 12 may be provided to rotate in place.

Accordingly, the rotating part 12 according to the present invention detaches the flexible integrated circuit device 30 from the handling substrate 20 by attaching to the body 12a by contacting the flexible integrated circuit device 30 of the handling substrate 20. It can be done. Here, since the flexible integrated circuit device 30 needs to be detached from the handling substrate 20 and attached to the body 12a, the above-mentioned rotating part 12 further includes an attachment film 12b provided to surround the body 12a. It can be provided. The above-mentioned attachment film 12b will hereinafter be referred to as a third attachment film. And the third attachment film 12b may have a third adhesive force. Examples of the third adhesive film 12b include a double-faced tape having a third adhesive force. In particular, as mentioned, the flexible integrated circuit device 30 must be detached from the handling substrate 20 and attached to the body 12a by contacting the flexible integrated circuit device 30 of the handling substrate 20. The third adhesive force of the adhesion film 12b should be greater than the first adhesion force of the first adhesion film 22. This is because if the third adhesive force of the third adhesive film 12b is smaller than the first adhesive force of the first adhesive film 22, the flexible IC device 30 can not be detached from the handling substrate 20. [

As mentioned above, the rotating part 12 includes the body 12a which rotates in the second direction from the first position in the place, and the third attachment film 12b which surrounds the body 12a and has the third attaching force, The flexible integrated circuit element 30 can be detached from the handling substrate 20 and brought into contact with the rotating portion 12 by contacting the flexible integrated circuit element 30 of the handling substrate 20 in the first region I.

The second transfer part 14 transfers the flexible substrate 24 in the second direction. Here, the second direction can be understood as a direction opposite to the second direction mentioned above. Since the second transfer unit 14 is required to continuously supply the flexible substrate 24, the second transfer unit 14 may have a winder structure or the like. Particularly, the second transfer section 14 is configured such that the flexible substrate 24 transferred in the second direction by the second transfer section 14 contacts the flexible integrated circuit element 30 of the rotation section 12 in the second area II . This is because the flexible substrate 24 transported in the second direction by the second transfer unit 14 does not contact the flexible integrated circuit element 30 of the rotation unit 12 in the second area II, ) Of the flexible IC elements 30 can not be removed and attached to the flexible substrate 24. As described above, in the second area II, the flexible integrated circuit element 30 is detached from the rotary part 12 by contacting the flexible integrated circuit element 30 of the rotary part 12 and attached to the flexible substrate 24 The attaching film 26 having the second attaching force can be formed on the flexible substrate 24. The above-mentioned attachment film 26 is hereinafter referred to as a second attachment film. Examples of the second adhesive film 26 include a double-sided tape having a second adhesive force. In particular, since the flexible integrated circuit element 30 must be detached from the rotary part 12 and attached to the flexible substrate 24 by contacting the flexible integrated circuit element 30 of the rotary part 12 as mentioned above, The second adhesive force of the film 26 should be greater than the third adhesive force of the third adhesive film 12b. This is because if the second adhesive force of the second adhesive film 26 is smaller than the third adhesive force of the third adhesive film 12b, the flexible IC device 30 can not be detached from the rotary part 12.

Examples of the flexible substrate 24 include a flexible printed circuit board (FPCB) and the like. Although the first region I and the second region II mentioned above are shown as confronting regions, they may not be limited to specific regions when interference does not occur.

As mentioned, the transfer apparatus 100 of the present invention includes the first transfer unit 10, the rotary unit 12, the second transfer unit 14, and the like, thereby providing the flexible integrated circuit device 30 of the handling substrate 20. The flexible substrate 24 can be easily attached, i.e., transferred.

Each of the first transfer unit 10, the rotation unit 12, and the second transfer unit 14 may have a first speed, a second speed, and a third speed, respectively. By controlling the first speed of the first transfer section 10, the second speed of the rotation section 12, the third speed of the second transfer section 14, and the like, the flexible substrate 24 is transferred from the handling substrate 20, It is possible to easily achieve alignment with the flexible IC device 30 in which the attachment is performed. That is, when the pattern interval of the flexible integrated circuit element 30 on the handling substrate 20 is the same as the pattern interval of the flexible integrated circuit element 30 on the flexible substrate 24, It is possible to achieve alignment of the flexible integrated circuit element 30 in which the attachment is made from the handling substrate 20 to the flexible substrate 24 by adjusting the third speed and the third speed in the same manner, When the pattern interval of the FED 30 in the flexible substrate 24 is about twice as large as the pattern interval of the element 30, the first speed and the second speed are adjusted to be the same and the third speed is set to 2 It is possible to achieve alignment of the flexible integrated circuit element 30 in which the attachment is made from the handling substrate 20 to the flexible substrate 24 by adjusting the speed quickly.

Thus, the flexible integrated circuit device package can be manufactured from the flexible substrate 24 to which the flexible integrated circuit element 30 is attached.

Therefore, when the transfer device 100 of the present invention is used, the flexible substrate 24 to which the flexible integrated circuit device 30 is attached can be easily manufactured, and as a result, the flexible substrate to which the flexible integrated circuit device 30 is attached ( A flexible integrated circuit device package can be manufactured more easily for the target 24).

Hereinafter, a method of transferring the flexible integrated circuit device 30 by using the aforementioned transfer device 100 will be described.

First, the handling substrate 20 with the flexible IC elements 30 is transported in the first direction. That is, the handling substrate 20 with the flexible IC elements 30 is transported in the first direction by using the first transfer portion 10 mentioned above. In particular, the flexible IC device 30 can be attached to the handling substrate 20 by the first adhesive film 22 having the first adhesive force. Thus, the first attachment film 22 may be interposed between the handling substrate 20 and the flexible IC device 30. [

Hereinafter, a method of manufacturing the handling substrate 20 to which the above-described flexible IC device 30 is attached will be described.

3 to 5 are views for explaining a method for manufacturing a handling substrate to which the integrated circuit device of FIG. 1 is attached, FIG. 6 is a schematic perspective view of FIG. 3, and FIG. 7 is a schematic perspective view of FIG. 4. 8 and 9 are schematic perspective views illustrating a method for manufacturing a handling substrate to which the integrated circuit device of FIG. 5 is attached.

3 and 6, an integrated circuit device 30a for forming as a flexible integrated circuit device 30 is formed on a semiconductor substrate 32. Thus, the integrated circuit elements 30a formed on the semiconductor substrate 32 are pre-cut so that they are separated from each other. That is, the integrated circuit element 30a formed on the semiconductor substrate 32 mentioned above is formed by pre-cutting the non-element regions of the integrated circuit element 30a and the integrated circuit element 30a so that each of the integrated circuit elements 30a is individually As shown in FIG.

Then, the integrated circuit elements 30a of the semiconductor substrate 32 and the handling substrate 20 face each other to face each other. That is, the integrated circuit elements 30a having a structure that is separately separated from the semiconductor substrate 32 are brought into contact with the handling substrate 20 so as to face each other. Since the first adhesive film 22 having the first adhesive force is disposed on the handling substrate 20 at this time, the integrated circuit element 30a of the semiconductor substrate 32 is bonded to the first adhesive film 22).

4 and 7, the other surface of the semiconductor substrate 32 is removed by performing a planarization process such as chemical mechanical polishing (CMP). That is, the other surface opposite to the one surface formed on the semiconductor substrate 32 is removed. At this time, the other surface of the semiconductor substrate 32 is removed until the integrated circuit element 30a formed on one surface of the semiconductor substrate 32 is exposed. And the reference numeral 40 may correspond to a polishing unit that can be used in a planarization process or the like to remove the other surface of the semiconductor substrate 32 mentioned above.

5, 8, and 9, as mentioned, the semiconductor substrate 32 is completely removed by performing a planarization process or the like until the integrated circuit device 30a is exposed, and as a result, the handling substrate 20 The integrated circuit element 30a is left on the first attachment film 22 of the < RTI ID = 0.0 > That is, an integrated circuit element 30a having a separately separated structure is left on the first attachment film 22 of the handling substrate 20.

The integrated circuit element 30a mentioned above is formed into a flexible integrated circuit element 30 by performing a stripping process such as heat treatment or ultraviolet treatment on the integrated circuit element 30a of the handling substrate 20 do.

As described above, the first transfer unit 10 uses the handling substrate 20 to which the flexible integrated circuit device 30 is formed by performing the processes of FIGS. 3 to 5 and 6 to 9. To transfer in the first direction.

The rotation unit 12 and the flexible IC elements 30 of the handling substrate 20 in the first region I are moved in the first direction by using the first transfer unit 10 to transfer the handling substrate 20 in the first direction Contact. Particularly, in the body 12a of the rotary part 12 to which the flexible IC device 30 contacts, the third adhesive film 12b having the third adhesive force larger than the first adhesive force of the first adhesive film 22 is wrapped And the flexible integrated circuit element 30 of the handling substrate 20 is fixed to the flexible substrate 12 by the flexible substrate 10 so that the flexible integrated circuit element 30 3 attachment film 12b.

The flexible integrated circuit element 30 attached to the rotation section 12 then rotates in the second direction from the first direction along the rotation section 12. [ And in the second direction (II) in the second direction. Here, the flexible substrate 24 is conveyed in the second direction by the second conveying unit 14 mentioned above. The flexible integrated circuit element 30 of the rotating portion 12 that contacts the flexible substrate 24 in the second region II can contact the second attachment film 26 of the flexible substrate 24 have. Here, the second attaching film 26 has a second attaching force which is larger than the third attaching force of the third attaching film 12b of the rotating portion 12. [ The flexible integrated circuit element 30 of the rotation section 12 is brought into contact with the second attachment film 26 of the flexible substrate 24 in the second region II to form the second attachment film 26 of the flexible substrate 24 26).

Thus, the above-mentioned flexible IC device 30 is attached to the flexible substrate 24 from the handling substrate 20, that is, transferred.

As described above, by controlling the first speed of the first transfer unit 10, the second speed of the rotation unit 12, the third speed of the second transfer unit 14, and the like, the flexible substrate 24 The flexible integrated circuit device 30 can be easily aligned.

Accordingly, when the transfer method of the present invention is applied, a flexible integrated circuit device package can be manufactured from the flexible substrate 24 having the flexible integrated circuit element 30 attached thereto.

As mentioned, the transfer device and method of the flexible integrated circuit device of the present invention can be more actively applied to the manufacture of the flexible integrated circuit device package. Accordingly, the present invention can more actively cope with the manufacture of flexible integrated circuit device packages required in all industrial fields.

10: first transfer part 12: rotation part
12a: body 12b, 22, 26: adhesion film
14: second transfer unit 20: handling substrate
24: flexible substrate 30: flexible integrated circuit device
30a: integrated circuit device 32: semiconductor substrate
100: transfer device

Claims (10)

A first transfer part to transfer the handling substrate to which the flexible integrated circuit device is attached in a first direction;
And a body arranged to contact the flexible integrated circuit element of the handling substrate rotated in the first direction and the flexible integrated circuit element of the handling substrate, the flexible integrated circuit element of the handling substrate, A rotary part for detaching the flexible integrated circuit device from the handling substrate by contact and attaching the flexible integrated circuit device to the body; And
The flexible substrate is transferred in the second direction and the flexible substrate transferred in the second direction is in contact with the body in the second region, and the flexible integrated circuit device is brought into contact with the flexible integrated circuit device of the rotating unit. A second transfer part detached from the body and attached to the flexible substrate,
When the flexible integrated circuit device is attached to the handling substrate with a first adhesive force and attached to the flexible substrate with a second adhesive force, an adhesive film having a third adhesive force greater than the first adhesive force and smaller than the second adhesive force is the adhesive film. Apparatus for transferring the integrated circuit device, characterized in that provided to surround the body of the rotating portion . delete The apparatus of claim 1, wherein the rotating unit is provided to rotate in place. The method of claim 1, wherein each of the first conveying part, the rotating part, and the second conveying part is provided to have a first speed, a second speed, and a third speed, respectively, and the first speed, the second speed, and the third speed. And aligning the flexible integrated circuit device to which the flexible integrated circuit device is attached from the handling substrate to the flexible substrate. Transferring the handling substrate to which the flexible integrated circuit device is attached in a first direction;
A body that rotates from the first direction to the second direction, the body is in contact with the flexible integrated circuit device transferring in the first direction in the first region, and the flexible integrated circuit device is separated from the handling substrate and the Attaching to the body; And
Removing the flexible integrated circuit device from the body and attaching the flexible substrate to the flexible substrate by contacting the flexible substrate conveyed in the second direction with the body in a second region.
The handling substrate attaches the flexible integrated circuit device using a first attachment film having a first attachment force, and the body uses the flexible attachment circuit using a third attachment film having a third attachment force greater than the first attachment force. Attaching the device, and wherein the flexible substrate attaches the flexible integrated circuit device using a second attachment film having a second attachment force greater than the third attachment force . delete 6. The method of claim 5 wherein the body rotates in place. 6. The method of claim 5, wherein the handling substrate is transported at a first speed, the body is rotated at a second speed, and the flexible substrate is transported at a third speed. 3 A method for transferring an integrated circuit device, characterized by achieving speed alignment with the flexible integrated circuit device where attachment is made from the handling substrate to the flexible substrate by controlling the speed. The flexible integrated circuit device of claim 5, wherein the flexible integrated circuit device is attached to the handling substrate.
Forming an integrated circuit device on one surface of the semiconductor substrate;
Pre-cutting non-device regions between the integrated circuit device and the integrated circuit device to separate the integrated circuit devices separately;
Attaching the handling substrate to one surface of the semiconductor substrate on which the integrated circuit devices are separately separated;
Removing the other surface opposite to one surface of the semiconductor substrate until the integrated circuit device is exposed to obtain a result of the integrated circuit device being attached to the handling substrate; And
And subjecting the resultant to heat treatment or ultraviolet treatment so that the integrated circuit device attached to the handling substrate is formed into a flexible integrated circuit device. 6. The method of claim 5, wherein the flexible substrate comprises a flexible printed circuit board.

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