TWI669177B - Wheel-to-wheel rolling welding equipment - Google Patents

Abstract

The rolling welding apparatus of the wheel-to-wheel of the present invention includes a conveying stage, a rolling conveying device, and an exposure heating device. The transport stage is used to set and transport the target substrate. The target substrate has a plurality of pads. The rolling conveyor conveys a plurality of micro components to the plurality of pads through a rolling program to form an electrical connection with the plurality of pads. The exposure heating device heats the plurality of pads of the target substrate through the light beam. Wherein, the plurality of micro-components are close to the corresponding plurality of pads, and the corresponding plurality of pads are heated by the exposure heating device, so that the corresponding plurality of pad surfaces are in a molten state, and the plurality of micro-components are in contact with the corresponding plurality of pads. In the case of the pad, the plurality of micro-elements are removed from the rolling conveyor and welded to the corresponding plurality of pads. In this way, the rolling welding equipment of the wheel-to-wheel can accomplish the purpose of massive transfer and welding.

Description

Wheel-to-wheel rolling welding equipment

The present invention relates to an electronic circuit manufacturing method, and more particularly to a rolling welding apparatus for a wheel-to-wheel.

Conventional electronic components are usually soldered by point-to-point or face-to-face soldering. However, with the increasing popularity of micro-semiconductor components, traditional soldering methods have been unable to meet efficient production processes.

Because point-to-point refers to the soldering method of a micro-semiconductor component corresponding to a solder pad, indicating that the micro-semiconductor component needs to be soldered to the solder pad of the circuit board, so when faced with a matrix (large amount) of solder pads, it is often required It takes a lot of time to complete the soldering of a board.

In addition, face-to-face refers to the process of soldering micro-semiconductor components to a circuit board in a batch manner after first arranging the micro-semiconductor components in a pad pattern corresponding to the circuit board. However, in this way, although the point-to-point method saves time, the pre-arranged arrangement usually takes a lot of time and requires corresponding equipment. Furthermore, batch transfer welding is not an easy technique to maintain a large amount of pads in a molten state, except that the batch is difficult to heat the pads.

In view of the above-mentioned deficiencies, it is an object of the present invention to provide a rolling welding apparatus for wheel-to-wheels for efficiently transferring and welding micro-components to corresponding welding positions in an efficient manner to meet the purpose of massive transfer and welding of micro-components.

To achieve the above object, the rolling welding apparatus of the wheel-to-wheel of the present invention includes a conveying stage, a rolling conveying device, and an exposure heating device. The transport stage is used to set and transport the target substrate. The target substrate has a plurality of pads. The rolling conveyor conveys a plurality of micro components to the plurality of pads through a rolling program to form an electrical connection with the plurality of pads. Exposure heating device transmits light beam to target The plurality of pads of the substrate are heated. Wherein, the plurality of micro-components are close to the corresponding plurality of pads, and the corresponding plurality of pads are heated by the exposure heating device, so that the corresponding plurality of pad surfaces are in a molten state, and the plurality of micro-components are in contact with the corresponding plurality of pads. In the case of the pad, the plurality of micro-elements are removed from the rolling conveyor and welded to the corresponding plurality of pads.

The rolling welding device of the wheel-to-wheel of the present invention is used for conveying a micro-component through a continuous rolling process to transfer the micro-component to a corresponding welding position and forming a welding with the welding pad, so that the rolling-welding device of the wheel-to-wheel can complete the giant The purpose of volume transfer and welding.

The detailed construction, features, assembly or use of the rolling-welding apparatus for the wheel-to-wheel provided by the present invention will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

10‧‧‧Rolling welding equipment

11‧‧‧Transporting platform

13‧‧‧Rolling conveyor

131‧‧‧Drive wheel

133‧‧‧ driven wheel

135‧‧‧ conveyor belt

15‧‧‧Exposure heating device

151‧‧‧Exposure module

153‧‧‧ scan module

155, 157‧‧ ‧beam

30‧‧‧ Target substrate

31‧‧‧ solder pads

50‧‧‧Micro components

51‧‧‧Loading substrate

Figure 1 is a schematic view of a rolling welding apparatus for a wheel set wheel of the present invention.

2a-2c is a schematic view showing the process of welding the rolling welding apparatus of the wheel-to-wheel of the present invention.

Hereinafter, the constituent members of the rolling welding device for the wheel-to-wheel of the present invention and the achievement of the effect will be described with reference to the preferred embodiments of the drawings. However, the components, dimensions, and appearance of the rolling-welding apparatus of the wheel-to-wheel are used to illustrate the technical features of the present invention, and are not intended to limit the present invention.

Wherein, the wheel set wheel refers to operation through at least two wheels, and therefore, the size, nature, appearance, configuration or quantity of the wheel are not particularly limited.

As shown in Fig. 1, this figure is a schematic view of the rolling welding apparatus 10 of the wheel-to-wheel of the present invention. The rolling welding device of the wheelset wheel includes a conveying stage 11, a rolling conveyor 13, and an exposure heating device 15.

The transport stage 11 is for arranging and transporting the target substrate 30, and the target substrate 30 has a circuit pattern formed by a plurality of pads 31. The transport stage 11 can carry the target substrate 30 through a belt, a roller or a robot arm, and transport the target substrate 30 to the working position.

The target substrate 30 may be a glass substrate or a printed circuit board, and the printed circuit board may be divided into a soft board, a hard board, or a soft-hard bonding board. The target substrate 30 usually has a circuit pattern on the inner layer or surface, and the pad 31 is an electrical connection circuit pattern. In other embodiments, the target substrate 30 may also be a circuit board of other materials or characteristics.

The rolling conveyor 13 transports the plurality of micro-elements 50 to the pads 31 through a rolling process to form electrical connections with the pads 31. The rolling conveyor 13 includes two large and small rollers and a conveyor belt 135. The conveyor belt 135 connects the two large and small rollers and is driven by the rollers and allows temporary attachment of the plurality of micro-components 50. In this embodiment, the two rollers are a driving wheel 131 and a driven wheel 133, respectively. The driving wheel 131 is normally driven directly or indirectly through a motor to rotate it, and drives the conveyor belt 135 and the driven wheel 133 to operate. In this embodiment, the small roller is close to the carrier substrate 51, the large roller is close to the target substrate 30, and the conveyor belt 135 removes the micro component 50 from the carrier substrate 51 so that the micro component 50 is temporarily attached to the conveyor belt 135. The micro-element 50 means that a certain size of itself is between 1 micrometer (μm) and 1 millimeter (mm). In other embodiments, the size of the micro-element 50 can also be larger or smaller.

In other embodiments, the roller may also adopt the driving wheel 131, or a combination of two or more driving wheels 131 or two or more driven wheels 133. Of course, a combination of a driving wheel 131 and a plurality of driven wheels 133 may be adopted. The number or configuration of the driving wheel 131 or the driven wheel 133 is not limited to the embodiment.

The manner in which the conveyor belt 135 attaches the micro-component 50 or the gripping force can capture the micro-component through van der Waals force, magnetic force, vacuum suction, suction cup or mechanical clamp, etc., therefore, the attachment method can pass through any of the micro-components 50 An element or component that produces a gripping force.

The exposure heating device 15 heats the pads 31 through the light beams 155 and 157, and includes an exposure module 151 and a scanning module 153. The exposure module 151 is used to generate light beams 155, 157. The scanning module 153 is connected to the exposure module 151 and is used for scanning the bonding pads 31 and irradiating the bonding pads 31 with the light beams 155 and 157. The light beams 155, 157 may be laser light or high energy pulse light, etc., high energy pulsed light such as light produced by a high energy halogen lamp.

The illumination angles of the light beams 155 and 157 can be any angle with respect to the pad 31, and the illumination angle is adjusted according to the position or arrangement of the circuit layer or the shielding layer of the target substrate 30, so that the light beams 155 and 157 can smoothly illuminate the pads. 31.

As shown in Figures 2a-2c, Figures 2a-2c are schematic views of the welding process, but the steps of preheating are omitted. In Fig. 2a, before the micro-element 50 approaches the corresponding pad 31 (or the target pad), the target pad 31 is heated by the exposure heating device 15 to have its surface in a molten state, and then, as shown in Fig. 2b, in the micro-element When the target pad 31 is in contact with the molten state, the micro-element 50 is removed from the rolling conveyor 13, and it is found that the micro-element 50 is not positioned. Finally, as shown in Fig. 2c, the target pad 31 and the micro-element 50 is formed into a weld, and the micro-component 50 is self-aligned through the molten state.

In other embodiments, the target pad 31 may also be heated to a molten state when in contact with the micro-component 50, and is not limited to this embodiment.

In particular, the hydrophobic or hydrophilic physical phenomenon in the molten state when the microcomponent is transferred to the target pad causes the microcomponent to self-align on the target pad to prevent the microcomponent from being accurately aligned with the target pad.

In other embodiments, the light beam generated by the exposure module includes a preheat beam and a welding beam. The energy of the preheating beam is lower than the energy of the welding beam. The solder pad can be preheated by the preheating beam to increase the temperature of the pad, and then, when the micro component approaches, the welding beam is irradiated to the target pad to form a molten state of the target pad to prepare. Or carry out welding operations.

The micro-components attached to the conveyor belt can grip the micro-components through the solder pads in the molten state, so that the micro-components are released on the conveyor belt, that is, separated from the conveyor belt.

In this embodiment, the conveyor belt is attached to the micro component by electrostatic force. When the welding force generated by the molten pad is greater than the electrostatic force of the micro component attached to the conveyor belt, the micro component can be combined with the conveyor belt. Separation. The amount of grabbing force generated by the pad is the viscosity of itself through the molten state, which is related to the temperature at which the pad is heated. In addition, the gripping force generated by the pad can also be the gripping force on the micro-component after the molten state is converted into a solid state, and therefore, the gripping force can be generated by the viscosity or state transition in the molten state. In other embodiments, the release of the micro-components may also be performed by other procedures, such as an active release procedure, that is, by the device or means to actively release the gripping force of the conveyor belt on the micro-components.

Although each of the figures of the embodiment shows that one micro-component is soldered to the target pad, in other embodiments, the present invention can simultaneously transfer and solder a plurality of micro-components without One is limited to one.

Thus, the rolling welding apparatus of the wheel-to-wheel of the present invention can efficiently transfer the micro-components to the corresponding welding positions, and can be continuously welded to meet the purpose of massive transfer and welding of the micro-components.

Finally, it is emphasized that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements are also covered by the scope of the patent application of the present application. .

Claims (4)

A rolling welding device for a wheel-to-wheel comprises: a conveying stage for arranging and conveying a target substrate, the target substrate having a plurality of pads; and a rolling conveying device for conveying a plurality of micro components through a rolling program The plurality of pads are electrically connected to the plurality of pads; and an exposure heating device is configured to heat the plurality of pads of the target substrate through the light beam, wherein the plurality of micro-components are adjacent to the corresponding ones The plurality of pads, the corresponding plurality of pads are heated by the exposure heating device, so that the corresponding plurality of pad surfaces are in a molten state, and when the plurality of micro-elements contact the corresponding plurality of pads, The plurality of micro-elements are removed from the rolling conveyor and soldered to the corresponding plurality of pads, wherein the rolling conveyor comprises a plurality of rollers and a conveyor belt, the plurality of rollers connecting the conveyor belt, And performing the rolling process to drive the conveyor belt, the plurality of rollers comprising a small roller and a large roller, the small roller is adjacent to a carrier substrate, and the carrier substrate carries the plurality of micro components, the large The target substrate closer to the wheel, the conveying belt is removed from the plurality of micro-elements on the carrier substrate, to temporarily attach the plurality of microelements. The rolling welding apparatus of the wheel-to-wheel according to claim 1, wherein the molten state of the soldering pad has a gripping force on the micro-component that is greater than a gripping force of the micro-component attached to the conveyor belt. The roll-welding device of the wheel-to-wheel according to the first aspect of the invention, wherein the exposure heating device comprises an exposure module and a scanning module, wherein the exposure module is configured to generate a light beam, and the scanning module is connected to the An exposure module is configured to scan the plurality of pads and illuminate the plurality of pads. The rolling welding device of the wheel-to-wheel according to claim 3, wherein the beam generated by the exposure module comprises a preheating beam and a welding beam, the energy of the preheating beam being lower than the energy of the welding beam, and The plurality of pads are preheated, and the welding beam heats the corresponding plurality of pads.