TWM444590U - Thermistor component and circuit board - Google Patents

Abstract

A thermistor component and a circuit board are disclosed. The thermistor component includes a thermistor, a package shell and a heat conducting plate. The thermistor includes a thermal unit, and the first and the second outlet electrodes. The first and the second outlet electrodes are connected to the thermal unit. The first end of the heat conducting plate has a distance to the thermistor. The second end of the heat conducting plate is connected to an external heat source. The advantage of the utility model is that: the thermal of the external heat source can be transferred to the thermal unit of the thermistor; the second end of the heat conducting plate is directly connected to the external heat source, so it can accurate perceive the changes of outside temperature.

Description

Thermistor element and circuit board

This creation relates to the field of electronic components, and more particularly to a thermistor element capable of accurately sensing temperature and a circuit board on which the thermistor element is mounted.

It is a common technical method to place a thermistor in the product to obtain the temperature of a certain place and control the behavior of the electronic component. For example, a negative temperature coefficient thermistor (NTC) is used to control the operating voltage of a DC fan used to cool electronic products to achieve the purpose of operating the DC fan at a suitable speed. Therefore, in the application, the thermistor needs to work efficiently and agilely for precise control purposes.

1 is a schematic view showing a mounting method of a thermistor in the prior art. The transistor 11 is mounted on the back surface of the printed circuit board 10, and a patch heat is placed on the back side of the printed circuit board 10 near the transistor 11. The varistor 13 may be, for example, a negative temperature coefficient thermistor, and the thermistor 13 performs a related operation by changing the resistance value of the ambient temperature around the transistor 11.

In this configuration, the gradient of the temperature change of the environment induced by the thermistor 13 is not conspicuous, so that the gradient of the change in the resistance value of the thermistor 13 itself is not conspicuous and cannot be efficiently and fully operated.

Therefore, there is a need for a technical solution that allows the thermistor 13 to more directly sense the temperature of the transistor 11, so that the thermistor 13 can sense a temperature at which the gradient of change is significant, thereby allowing the thermistor 13 to provide more precise controllability. resistance.

The main object of the present invention is to provide a thermistor element capable of accurately sensing temperature and a circuit board on which the thermistor element is mounted.

In order to solve the above problems, the present invention provides a thermistor element, including a thermistor, a package housing, and a heat conductive sheet; the thermistor includes a heat sensitive portion and first and second extraction electrodes; The first and second extraction electrodes are electrically connected to the thermosensitive portion; the first end of the thermal conductive sheet has a distance from the thermistor, and the second end is in contact with an external heat source.

Optionally, the thermistor element further includes a package housing covering the heat sensitive portion of the thermistor, each of the first and second extraction electrodes having an exposure A lead end other than the package housing, the first end of the heat conducting sheet is wrapped by the package housing, and the second end is exposed outside the package housing.

Optionally, the material of the package casing is selected from one of ceramic, plastic and epoxy polymer.

Optionally, the first and second extraction electrodes are respectively disposed on opposite sides of the heat sensitive portion, and the first end of the thermal conductive sheet has a distance from the first extraction electrode, The first extraction electrode conducts external heat to the heat sensitive portion.

Optionally, the first and second extraction electrodes are disposed on the same side of the heat sensitive portion, and the first end of the heat conductive sheet has a distance from a side of the heat sensitive portion where no electrode is disposed. Directly transferring heat from the outside to the heat sensitive portion.

Optionally, the heat source is further a copper foil on an external circuit board or a pin of a heat generating transistor on the external circuit board, and the heat conductive sheet is further a metal piece.

Optionally, the thermal pad is further a copper foil embedded in an external circuit board.

Optionally, the material of the thermal conductive sheet is selected from the group consisting of silver, copper, aluminum, iron and alloys thereof.

The present invention further provides a circuit board including at least one of the above the thermistor elements, the second end of the thermally conductive sheet of the thermistor element and the circuit board The heat source contacts and conducts heat to the thermistor.

Optionally, the thermistor element further includes a package housing covering the heat sensitive portion of the thermistor, each of the first and second extraction electrodes having an exposure A lead end other than the package housing, the first end of the heat conducting sheet is wrapped by the package housing, and the second end is exposed outside the package housing.

Optionally, the first and second extraction electrodes are respectively disposed on opposite sides of the heat sensitive portion, and the first end of the thermal conductive sheet and the side of the thermosensitive portion not provided with an electrode have a The heat of the copper foil is conducted to the heat sensitive portion through the first extraction electrode.

Optionally, the first and second extraction electrodes are disposed on the same side of the heat sensitive portion, and the first end of the heat conductive sheet has a distance from a side of the heat sensitive portion where no electrode is disposed. The heat of the copper foil is directly conducted to the heat sensitive portion.

Optionally, the heat source on the circuit board is further a copper foil on the circuit board or a pin of the heat generating transistor on the circuit board, and the heat conductive sheet is further a metal piece.

Optionally, the thermal pad is further a copper foil on a circuit board.

Optionally, the material of the thermal conductive sheet is one selected from the group consisting of silver, copper, aluminum, iron, and alloys thereof.

The advantage of the present invention is that the heat external to the thermistor element can be conducted to the heat sensitive portion inside the thermistor element through the heat conductive sheet, and the heat conductive sheet is exposed to the second end of the outside to directly contact the heat source, so that the heat can be accurately sensed. The temperature of the outside world changes.

The specific embodiments of the thermistor element and the circuit board provided by the present invention will be described in detail below with reference to the accompanying drawings.

First, a first embodiment of the thermistor element of the present invention will be given with reference to the accompanying drawings.

FIG. 2A is a schematic view showing the internal structure of the thermistor element, including a thermistor 21 and a heat conducting sheet 23. The thermistor 21 includes a heat sensitive portion 210 and a first extraction electrode 211 and a second extraction electrode 212. The material of the heat conductive sheet 23 is selected from one of silver, copper, aluminum, iron and alloys thereof, and the material is a material with high thermal conductivity, or may be ceramic, high temperature resistant synthetic material with high thermal conductivity. .

In this embodiment, the first extraction electrode 211 and the second extraction electrode 212 are respectively disposed on opposite sides of the heat sensitive portion 210, and the first end of the thermal conductive sheet 23 and the first end The extraction electrode 211 is attached. The distance between the first end of the heat conducting sheet 23 and the thermistor 21 is such that the distance can ensure that the thermistor 21 can receive heat radiation from the first end of the heat conducting sheet 23, and the heat conducting sheet 23 The second end is in contact with an external heat source.

FIG. 2B is a schematic structural view after the structural molding of FIG. 2A, further including a package casing 25. The package housing 25 encloses the thermosensitive portion 210 of the thermistor 21, and each of the first extraction electrode 211 and the second extraction electrode 212 has a lead end exposed outside the package housing 25, A detection circuit for taking an electrical signal of the thermistor 21 to the outside. The first end of the heat conducting sheet 23 is wrapped by the package casing 25, and the second end is exposed outside the package casing 25. The material of the package casing 25 is selected from one of ceramic, plastic and epoxy polymer.

In the above structure, since the electrode is usually made of a metal material, external heat can be conducted to the heat sensitive portion 210 through the heat conductive sheet 23, the package housing 25, and the first extraction electrode 211. The second end of the heat conducting sheet 23 exposed to the outside is directly in contact with the heat source, so that the temperature change of the outside can be accurately sensed.

Next, a first embodiment of the circuit board of the present invention will be given with reference to the accompanying drawings.

Fig. 3 is a partial schematic view showing the circuit board, which includes a transistor 32, and a package shown in Fig. 2B. The package further includes a package housing 25 and a heat conductive sheet 23, a first extraction electrode 211, and a second extraction electrode 212. The transistor 32 is in contact with the copper foil in the circuit board to conduct heat to the copper foil, and the package outer casing 25 is exposed to the outer second end and is in contact with the copper foil, and the heat is transferred through the heat conductive sheet 23, the package outer casing 25, and the first extraction electrode 211. Conducted to the heat sensitive portion 210. Therefore, in the circuit board shown in FIG. 3, the thermistor 21 can accurately sense the temperature change of the transistor 32.

Next, a second embodiment of the thermistor element of the present invention will be given with reference to the accompanying drawings.

FIG. 4A is a schematic view showing the internal structure of the thermistor element, including a thermistor 41 and a heat conducting sheet 43. The thermistor 41 includes a heat sensitive portion 410 and a first extraction electrode 411 and a second extraction electrode 412.

In the embodiment, the first extraction electrode 411 and the second extraction electrode 412 are disposed on the same side of the heat sensitive portion 410, and the first end of the heat conductive sheet 43 and the heat sensitive portion 410 are The side where the electrode is not provided has a distance which can ensure that the thermistor 41 can receive the heat radiation from the first end of the heat conducting sheet 43, and the second end of the heat conducting sheet 43 is in contact with the external heat source, directly directly to the outside. The heat is conducted to the heat sensitive portion 410.

FIG. 4B is a schematic structural view of the structure of FIG. 4A after plastic sealing, further including a package housing 45. The package housing 45 covers the heat sensitive portion 410 of the thermistor 41, and each of the first extraction electrode 411 and the second extraction electrode 412 has a lead end exposed outside the package housing 45. A detection circuit for taking an electrical signal of the thermistor 41 to the outside. The first end of the heat conducting sheet 43 is wrapped by the package casing 45, and the second end is exposed outside the package Outside the shell 45.

In the above structure, external heat can be directly conducted to the heat sensitive portion 410 through the heat conductive sheet 43 and the package outer casing 45. The second end of the heat conducting sheet 43 exposed to the outside is directly in contact with the heat source, so that the temperature change of the outside can be accurately sensed.

Next, a second embodiment of the circuit board of the present invention will be given with reference to the accompanying drawings.

Fig. 5 is a partial schematic view showing the circuit board, which includes a transistor 52, and a package shown in Fig. 4B. The package further includes a package housing 45 and a heat conductive sheet 43, a first extraction electrode 411, and a second extraction electrode 412. The transistor 52 is in contact with the copper foil to conduct heat to the copper foil, and the package outer casing 45 is exposed to the second end of the outer surface in contact with the copper foil, and heat is directly conducted to the heat sensitive portion 410 through the heat conductive sheet 43 and the package outer casing 25. Therefore, in the circuit board shown in FIG. 5, the thermistor 41 can accurately sense the temperature change of the transistor 52.

Next, a third embodiment of the circuit board of the present invention will be given with reference to the accompanying drawings.

FIG. 6 is a partial schematic view showing the circuit board. The thermistor element on the circuit board includes a heat conductive sheet 63, a heat sensitive portion 610, a first extraction electrode 611, and a second extraction electrode 612. The first extraction electrode 611 and the second extraction electrode 612 are disposed on opposite sides of the thermosensitive portion 610, and the first extraction electrode 611 and the second extraction electrode 612 are mounted on the circuit board, corresponding to the circuit board. Partial electrical connection. The first end of the heat conducting sheet 63 has a distance from the heat sensitive portion 610, which should ensure that the heat sensitive portion 610 can receive heat radiation from the first end of the heat conducting sheet 63, and the second end of the heat conducting sheet 63 further The heat of the transistor (directly on the other side of the circuit board, not shown) contacts the lead 67 of the circuit board, and the heat of the transistor is directly conducted to the heat sensitive portion 610 through the heat conductive sheet 63. Therefore, in the circuit board shown in Fig. 6, the thermosensitive portion 610 of the thermistor element can accurately perceive the temperature change of the transistor.

Next, a fourth embodiment of the circuit board of the present invention will be given with reference to the accompanying drawings.

FIG. 7 is a partial schematic view showing the circuit board, which includes a heat conductive sheet 73, a heat sensitive portion 710, a first extraction electrode 711, and a second extraction electrode 712. The first extraction electrode 711 and the second extraction electrode 712 are disposed on opposite sides of the thermosensitive portion 710, and the first extraction electrode 711 and the second extraction electrode 712 are mounted on the circuit board, corresponding to the circuit board. Partial electrical connection. In this embodiment, the heat conductive sheet 73 is further realized by a copper foil embedded in the circuit board. The first end of the heat conductive sheet 73 has a distance from the heat sensitive portion 710, and the distance should ensure heat. The sensitive portion 710 can receive heat radiation from the first end of the heat conducting sheet 73. The second end of the heat conducting sheet 73 is in contact with the lead 77 of the heat generating transistor (on the other side of the circuit board, not shown). The heat conductive sheet 73 directly conducts heat of the transistor to the heat sensitive portion 710. Therefore, in the circuit board shown in Fig. 7, the thermosensitive portion 710 can accurately perceive the temperature change of the transistor.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

10‧‧‧Printed circuit board

11‧‧‧Optoelectronics

13‧‧‧Thermistor

21‧‧‧Thermistor

210‧‧‧Thermal Department

211‧‧‧First lead electrode

212‧‧‧Second lead electrode

23‧‧‧ Thermal sheet

25‧‧‧Package

32‧‧‧Optoelectronics

41‧‧‧Thermistor

410‧‧‧Thermal Department

411‧‧‧first extraction electrode

412‧‧‧Second lead electrode

43‧‧‧ Thermal sheet

45‧‧‧Package enclosure

52‧‧‧Optoelectronics

610‧‧‧Thermal Department

611‧‧‧first extraction electrode

612‧‧‧Second lead electrode

63‧‧‧ Thermal sheet

67‧‧‧ pin

710‧‧‧Thermal Department

711‧‧‧first extraction electrode

712‧‧‧Secondary extraction electrode

73‧‧‧thermal sheet

77‧‧‧ pin

Fig. 1 is a schematic view showing the mounting manner of a thermistor in the prior art.

2A is a schematic view showing the internal structure of the thermistor element in the first embodiment of the thermistor element of the present invention.

Fig. 2B is a schematic view showing the structure after the structure of Fig. 2A is plastically sealed.

3 is a first embodiment of the circuit board of the present invention, the board of the board Schematic diagram of the structure.

4A is a schematic view showing the internal structure of the thermistor element in the second embodiment of the thermistor element of the present invention.

Fig. 4B is a schematic view showing the structure after the structure of Fig. 4A is plastically sealed.

FIG. 5 is a partial structural diagram of the circuit board in a second embodiment of the circuit board of the present invention.

FIG. 6 is a partial structural diagram of the circuit board in a third embodiment of the circuit board of the present invention.

Figure 7 is a partial structural view of the circuit board in a fourth embodiment of the circuit board of the present invention.

210‧‧‧Thermal Department

211‧‧‧First lead electrode

212‧‧‧Second lead electrode

23‧‧‧ Thermal sheet

Claims (15)

A thermistor element comprising a thermistor and a heat conducting sheet; the thermistor comprising a heat sensitive portion and first and second extraction electrodes; the first and second extraction electrodes being electrically connected to the heat sensitive portion The first end of the heat conducting sheet has a distance from the thermistor, and the second end is in contact with an external heat source. The thermistor element of claim 1, wherein the thermistor element further comprises a package housing, the package housing covering the heat sensitive portion of the thermistor, The first and second extraction electrodes each have a lead-out exposed outside the package housing, the first end of the thermally conductive sheet being wrapped by the package housing and the second end being exposed outside the package housing. The thermistor element of claim 2, wherein the material of the package casing is selected from the group consisting of ceramic, plastic and epoxy resin polymers. The thermistor element of claim 2, wherein the first and second extraction electrodes are respectively disposed on opposite sides of the heat sensitive portion, and the first end of the thermal conductive sheet is The first extraction electrode has a distance through which heat of the outside is conducted to the heat sensitive portion through the first extraction electrode and the package housing. The thermistor element of claim 2, wherein the first and second extraction electrodes are disposed on the same side of the heat sensitive portion, the first end of the thermally conductive sheet and the The side of the thermosensitive portion where the electrode is not provided has a distance through which the outside heat is conducted to the heat sensitive portion. The thermistor element of claim 1, wherein the heat source is further A copper foil on the external circuit board or a pin of the heat generating transistor on the external circuit board, the heat conductive sheet is further a metal piece. The thermistor element of claim 1, wherein the thermally conductive sheet is further a copper foil embedded in an external circuit board. The thermistor element of claim 1, wherein the material of the thermally conductive sheet is selected from the group consisting of silver, copper, aluminum, iron, and alloys thereof. A circuit board, wherein the circuit board includes at least one thermistor element according to claim 1, wherein the second end of the thermally conductive sheet of the thermistor element and the circuit board The upper heat source contacts and conducts heat to the thermistor. The circuit board of claim 9, wherein the thermistor element further comprises a package housing covering the heat sensitive portion of the thermistor, the first sum The second extraction electrodes each have a lead-out exposed outside the package housing, the first end of the thermally conductive sheet being wrapped by the package housing and the second end being exposed outside the package housing. The circuit board of claim 10, wherein the first and second extraction electrodes are respectively disposed on opposite sides of the heat sensitive portion, the first end of the thermal conductive sheet and the The side of the thermosensitive portion where the electrode is not provided has a distance through which the heat of the copper foil is conducted to the heat sensitive portion. The circuit board of claim 10, wherein the first and second extraction electrodes are disposed on the same side of the heat sensitive portion, the first end of the thermally conductive sheet and the thermal The side where the electrode is not provided has a distance through which the heat of the copper foil is conducted to the heat sensitive portion. The circuit board of claim 9, wherein the heat source on the circuit board is further a copper foil on the circuit board or a pin of a heat generating transistor on the circuit board, wherein the heat conductive sheet is further a metal piece. . The circuit board of claim 9, wherein the thermally conductive sheet is further a copper foil on a circuit board. The circuit board according to claim 9, wherein the material of the thermally conductive sheet is one selected from the group consisting of silver, copper, aluminum, iron, and alloys thereof.