CN202886007U

CN202886007U - Contact type temperature sensing device

Info

Publication number: CN202886007U
Application number: CN 201220482175
Authority: CN
Inventors: 邱崇琪
Original assignee: XINGQIN ELECTRONIC INDUSTRY Co Ltd
Current assignee: XINGQIN ELECTRONIC INDUSTRY Co Ltd; Thinking Electronic Industrial Co Ltd
Priority date: 2012-09-19
Filing date: 2012-09-19
Publication date: 2013-04-17
Anticipated expiration: 2022-09-19

Abstract

The utility model provides a contact type temperature sensing device comprising a thermal conductive substrate, a first electrode, a second electrode and a thermosensitive element. The thermal conductive substrate is provided with a heat receiving part, which is contacted with an object to be detected. The first electrode and the second electrode are disposed on the thermal conductive substrate, which is electrically connected with the first electrode and the second electrode. The heat energy generated by the object to be detected can be transmitted to the thermosensitive element by the thermal conductive substrate, therefore the thermosensitive element can be used to sense the temperature of the object to be detected.

Description

The contact temperature sensing apparatus

Technical field

The utility model is about a kind of temperature-sensing device, particularly finger touch temperature-sensing device.

Background technology

Control device is the core of an electronic product, and control device can be made of different circuit units such as microcontroller, power supply unit, signal sensing device or transport modules.In general, aforesaid circuit unit is arranged on the printed circuit board (PCB) and is electrically connected to each other.

Please refer to shown in Figure 11ly, when the control device start, various active member, passive device, microcontroller or the power component in the circuit unit etc. can produce heat energy, and the heat energy of its generation is concerning the task performance of those circuit units.For task performance and the situation of grasping circuit unit, the known practice is that the side at a measured electronic elements 70 arranges a thermistor 71, with the temperature of sensing measured electronic elements 70.

Yet, this thermistor 71 is direct contact measured electronic component 70, but the temperature that produces every this measured electronic elements 70 of empty sensing, because of the thermal conduction characteristic of air itself not good, so that the temperature misalignment that thermistor 71 is sensed causes the degree of accuracy of measuring temp to promote.

The utility model content

Fundamental purpose of the present utility model is to provide a kind of contact temperature sensing apparatus, this sensing apparatus is contact measured electronic component or wiring route, the heat that measured electronic elements produces can directly or by wiring route conduct to sensing apparatus of the present utility model, and then promotes the accuracy of temperature sensing.

Contact temperature sensing apparatus of the present utility model includes:

One heat-conducting substrate has a hot acceptance division, for contact one determinand;

One first electrode is formed on this heat-conducting substrate and with this hot joining receiving portions and separates;

One second electrode is formed on this heat-conducting substrate and with this hot acceptance division and this first electrode separation and opens; And

One thermal sensing element is arranged on this heat-conducting substrate, and this thermistor has one first contact and one second contact, is electrically connected respectively this first electrode and the second electrode.

The utility model sensing apparatus can be arranged on the printed circuit board (PCB), this determinand can be electronic component or wiring route, because the utility model is to utilize the direct contact measured thing of hot acceptance division, the heat energy of determinand is to conduct to thermal sensing element by heat-conducting substrate, heat-conducting substrate has good thermal conduction characteristic, therefore the degree of accuracy of the utility model sensing temperature improves relatively.

Description of drawings

Fig. 1 is the stereo appearance figure of the utility model preferred embodiment.

Fig. 2 is the use state reference map of the utility model preferred embodiment.

Fig. 3 is the stereo appearance figure of the utility model preferred embodiment.

Fig. 4 A, Fig. 4 B, Fig. 5 A, Fig. 5 B, Fig. 6 A, Fig. 6 B, Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B, Fig. 9 A to Fig. 9 B are the utility model preferred embodiment front and schematic rear view.

Figure 10 is the partial sectional view of the utility model preferred embodiment.

Figure 11 is the use state reference map of known thermistor.

Drawing reference numeral:

10 heat-conducting substrates, 100 breach

11 hot acceptance division 21 first electrodes

211 first connection lines, 22 second electrodes

221 second connection lines, 30 thermal sensing elements

31 first contacts, 32 second contacts

33 wires, 40 heat-conducting layers

50 protective seams, 51 openings

52 articulamentums, 60 measured electronic elements

61 wiring routes, 70 measured electronic elements

71 thermistors

Embodiment

Please refer to shown in Figure 1ly, the utility model temperature-sensing device includes a heat-conducting substrate 10, at least one hot acceptance division 11, one first electrode 21, one second electrode 22 and a thermal sensing element 30.

This heat-conducting substrate 10 can be the ceramic substrates such as aluminum oxide substrate or aluminium nitride substrate, or the printed circuit board (PCB)s such as glass mat, phenolics plate, epoxy resin board or composite metal film plate.

This hot acceptance division 11 is that definable is at arbitrary position of this heat-conducting substrate 10, this hot acceptance division 11 is used for contact one determinand, please refer to shown in Figure 2, in the present embodiment, this determinand is the wiring route 61 of a measured electronic elements 60, this hot acceptance division 11 is sides that are defined in this heat-conducting substrate 10, for the position that is arranged on contiguous determinand.

This first electrode 21 is formed in the upper surface of this heat-conducting substrate 10, and separates with this hot acceptance division 11.

This second electrode 22 is formed in the upper surface of this heat-conducting substrate 10, and separates with this hot acceptance division 11 and the first electrode 21 and do not contact.

This thermal sensing element 30 is arranged on the upper surface of this heat-conducting substrate 10, and then the temperature by heat-conducting substrate 10 sensing wiring routes 61, this thermistor 30 has one first contact 31 and one second contact 32, and these two

contacts

31,32 are electrically connected respectively this first electrode 21 and the second electrode 22.This thermal sensing element 30 can be negative temperature coefficient (NTC) thermistor or positive temperature coefficient (PTC) (PTC) thermistor.

Please refer to shown in Figure 1ly, this thermal sensing element 30 can be patch-type (SMD) thermistor, and its first,

second contact

31,32 is electrically connected respectively the one the

second electrodes

21,22 for laterally being oppositely arranged; Please refer to shown in Figure 3, this thermal sensing element 30 can be chip type (chip) thermistor, its

contact

31,32 is for being oppositely arranged up and down, and wherein the first contact 31 is arranged on the surface of the

first electrode

21, and 32 of the second contacts are connected to the second electrode 22 by a wire 33.

Refer again to shown in Figure 2, wiring route 61 is to be electrically connected this measured electronic elements 60 with the transmission medium as power supply or signal, wiring route 61 is generally copper foil circuit again, Copper Foil is originally as good thermal conductor, therefore the heat that measured electronic elements 60 produces is to be directly conducted to wiring route 61, the temperature of the wiring route 61 of close measured electronic elements 60 can represent the temperature of measured electronic elements 60.The heat energy that measured electronic elements 60 produces is directly to conduct to thermal sensing element 30 by wiring route 61 and heat-conducting substrate 10, wherein the resistance value of thermal sensing element 30 is to change along with the temperature of sensing, outside arithmetic unit can be electrically connected to this first electrode 21 and the second electrode 22, with according to the reference frame as measured electronic elements 60 temperature of the resistance value of this thermal sensing element 30.

Please refer to shown in Fig. 4 A and Fig. 4 B, be respectively front and the back side reference diagram of the second preferred embodiment, this hot acceptance division 11 is ends that are defined in this heat-conducting substrate 10, this first electrode 21 and the second electrode 22 are respectively formed at the relative side of this heat-conducting substrate 10, and can extend to lower surface from the upper surface of heat-conducting substrate 10.

The utility model temperature-sensing device can further include a heat-conducting layer 40, this heat-conducting layer 40 is formed on this hot acceptance division 11, and can extend to lower surface from the upper surface of hot acceptance division 11, this heat-conducting layer 40 can be the alloy-layer of the metal levels such as silver, nickel, chromium, copper, iron or aluminium or aforementioned metal, described alloy-layer is good heat conductor, more can with the thermal energy conduction of wiring route 61 to thermal sensing element 30, promote by this degree of accuracy of inspection sensing temperature.

Please refer to shown in Fig. 5 A and Fig. 5 B, be respectively front and the back side reference diagram of the 3rd preferred embodiment, this first electrode 21 and the second electrode 22 are arranged on the same side of this heat-conducting substrate 10, and the first contact 31 of this thermal sensing element 30 and the second contact 32 are to be electrically connected to this first electrode 21 and the second electrode 22 by first, second connection line 211,221 respectively.

Described heat-conducting substrate 10, hot acceptance division 11 and

electrode

21,22 structure can corresponding measured electronic elements 60 wiring route 61 positions or shape and be different aspects.Please refer to shown in Fig. 6 A, Fig. 6 B, Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B, Fig. 9 A to 9B, is front and the back side reference diagram of the heat-conducting substrate 10 of four kinds of aspects.

Please refer to shown in Fig. 6 A and Fig. 6 B, one side of this heat-conducting substrate 10 has a breach 100, this first electrode 21 and the second electrode 22 are arranged on this heat-conducting substrate 10 to have a side of breach 100 and is separated by this breach 100, and the first contact 31 of this thermal sensing element 30 and the second contact 32 are electrically connected to this first electrode 21 and the second electrode 22 by first, second connection line 211,221 respectively.

Please refer to shown in Fig. 7 A and Fig. 7 B, the both sides of this heat-conducting substrate 10 have respectively a breach 100.

Please refer to shown in Fig. 8 A and Fig. 8 B, these heat-conducting substrate 10 1 sides have a breach 100, opposite side is to extend laterally and form this hot acceptance division 11, this first,

second electrode

21,22 is arranged on this heat-conducting substrate 10 to have a side of breach 100 and is separated by this breach 100, and the first contact 31 of this thermal sensing element 30 and the second contact 32 are electrically connected to this first electrode 21 and the second electrode 22 by first, second connection line 211,221 respectively.

Please refer to shown in Fig. 9 A and Fig. 9 B, the both sides of this heat-conducting substrate 10 extend laterally respectively and form two hot acceptance divisions 11, and the first contact 31 of this thermal sensing element 30 and the second contact 32 are electrically connected to this first electrode 21 and the second electrode 22 by first, second connection line 211,221 respectively.

The above heat-conducting substrate 10, hot acceptance division 11 and described

electrode

21,22 structure only are preferred embodiments of the present utility model, are not that the utility model is done any pro forma restriction.

Please refer to shown in Figure 10ly, the utility model temperature-sensing device further includes a protective seam 50 and two articulamentums 52.

This protective seam 50 can be glassy layer or polymer material layer, such as epoxy resin layer or phenolics layer etc.This protective seam 50 is formed on this heat-conducting substrate 10 and first,

second electrode

21,22 surface, and to should the first electrode 21 and the zone of the second electrode 22 have two openings 51.This two articulamentum 52 is respectively formed in this two opening 51 and is electrically connected respectively first,

second electrode

21,22, and wherein this articulamentum 52 can be soldering-tin layer or elargol layer.This thermal sensing element 30 is arranged on this protective seam 50, and its first,

second contact

31,32 connects respectively described articulamentum 52, and then is connected with first,

second electrode

21,22 formations.

In sum, this hot acceptance division 11 is for the position that is arranged on contiguous determinand, this heat-conducting substrate 10 has good thermal conductivity, and this heat-conducting substrate 10, wiring route 61 and thermal sensing element 30 contact with each other, therefore this heat-conducting substrate 10 can be effectively the heat of wiring route 61 is directly conducted to thermal sensing element 30, therefore the degree of accuracy of the utility model sensing temperature effectively promotes.

Claims

1. a contact temperature sensing apparatus is characterized in that, described contact temperature sensing apparatus includes:

One first electrode is formed on the described heat-conducting substrate and with described hot joining receiving portions and separates;

One second electrode is formed on the described heat-conducting substrate and with described hot acceptance division and described the first electrode separation and opens; And

One thermal sensing element is arranged on the described heat-conducting substrate, and described thermistor has one first contact and one second contact, is electrically connected respectively described the first electrode and the second electrode.

2. contact temperature sensing apparatus as claimed in claim 1 is characterized in that, includes a heat-conducting layer, and described heat-conducting layer is arranged on the hot acceptance division of described heat-conducting substrate.

3. contact temperature sensing apparatus as claimed in claim 2 is characterized in that, described contact temperature sensing apparatus includes:

One protective seam is formed on the surface of described heat-conducting substrate and first, second electrode, and the zone of corresponding described the first electrode and the second electrode has respectively two openings;

Two articulamentums are respectively formed in described two openings and are electrically connected respectively the one the second electrodes;

Described thermal sensing element is arranged on the described protective seam, and its first, second contact connects respectively described articulamentum.

4. contact temperature sensing apparatus as claimed in claim 3 is characterized in that, a side of described heat-conducting substrate is to extend laterally and form described hot acceptance division.

5. contact temperature sensing apparatus as claimed in claim 1 or 2 is characterized in that, first, second contact of described thermal sensing element is electrically connected respectively the one the second electrodes for laterally being oppositely arranged.

6. contact temperature sensing apparatus as claimed in claim 5 is characterized in that, the first contact of described thermal sensing element and the second contact are electrically connected to described the first electrode and the second electrode by one first connection line and one second connection line respectively.

7. contact temperature sensing apparatus as claimed in claim 1 or 2, it is characterized in that, first, second contact of described thermal sensing element is for being oppositely arranged up and down, and wherein said the first contact is arranged on the surface of the first electrode, and described the second contact is connected to described the second electrode by a wire.

8. such as each described contact temperature sensing apparatus in the claim 2 to 4, it is characterized in that,

Described heat-conducting layer is that the upper surface from described heat-conducting substrate extends to lower surface;

Described the first electrode and the second electrode are that the upper surface from described heat-conducting substrate extends to lower surface.

9. such as each described contact temperature sensing apparatus in the claim 1 to 4, it is characterized in that, described thermal sensing element is negative tempperature coefficient thermistor.

10. such as each described contact temperature sensing apparatus in the claim 1 to 4, it is characterized in that, described thermal sensing element is posistor.