TWM436221U - Die selection device - Google Patents
Die selection device Download PDFInfo
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- TWM436221U TWM436221U TW101208285U TW101208285U TWM436221U TW M436221 U TWM436221 U TW M436221U TW 101208285 U TW101208285 U TW 101208285U TW 101208285 U TW101208285 U TW 101208285U TW M436221 U TWM436221 U TW M436221U
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- die
- film
- tik
- nozzle
- moving member
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- 230000007246 mechanism Effects 0.000 claims description 61
- 238000005192 partition Methods 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 239000002313 adhesive film Substances 0.000 description 11
- 238000000926 separation method Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 5
- 241000255925 Diptera Species 0.000 description 3
- 241000218691 Cupressaceae Species 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
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Description
更正曰期:中華民國tO^~r〇5月Qt-Q. 該第二黏貼膜7上的一晶粒10與該晶粒取放機構3接觸而吸 附於該晶粒取放機構3上,接著藉由該晶粒取放機構3轉鈿至 令吸附於其上的該晶粒10面對該第一黏貼膜4,再由該第一 抵頂6件抵頂該第一黏貼膜4,令該第一黏貼膜4與吸附於該 晶粒取放機構3上的該晶粒10接觸,將該晶粒1〇貼附於該第 一黏貼膜4上,而完成該晶粒10由該待分類晶粒存放平台2 挑楝至該已分類晶粒存放平台丨的分類挑揀作業。 上述的該分類挑棟機’當該晶粒取放機構3欲將該晶粒 10存放於該已分類晶粒存放平台丨時,必須由該第一平面移 動機構5調整該第-黏貼膜4上的一存放位置與該晶粒取放機 構3對位,再由該第—抵頂件6抵頂該第—黏貼膜4,令該晶 粒10與該第一黏貼臈4接觸而被貼附於該第一黏貼膜4的該 存放位置。 , 然而,於該已分類晶粒存放平台丨中,由於該第一平面移 動機構5與該第-抵頂件6連接設置,容易使得該已分類晶粒 存放平台1在結構上設計複雜,載重較重,而在對位移動的過 程中,產生疋位精準度較差的問題,故仍有改善的空間。 【新型内容】 本新型的主要目的’在於解決習知的分類挑揀機,於已分 類晶粒存放平台中,由於第—平面移動機構與第一抵頂件連接 設置’使得晶粒在對郷動的過財,產生定位鮮度較差的 問題。 101208285N01 1043156171-0 5 * · » ** . 盔 更正日期:中基民國:ΗΜ·^·〇γ: q m-p 曰為達上述目的,本新型提供—種晶粒挑楝裝置,包括有一 曰曰粒頂取天位麵、一晶粒分存定位機構、一晶粒挑揀臂、一 頂=膜分離機構以及-分存膜貼附機構。該晶粒頂取定位機構 故—第—平面移動構件、—與該第-平面移動構件連接而進 二平^移動的頂取膜組件,該頂取膜組件貼附一晶粒;該晶粒 分存定位機構_晶_蚊位機構械設置,並包含一第二 平面移動構件、—無帛二平轉動構件連接輯行平面移動 • 的分存膜組件;該晶粒挑楝臂設置於該晶粒頂取定位機構盘該 晶粒转定位機構之間轉動並與該晶粒相對,該晶粒挑棟臂包 含-旋轉構件以及—與該旋轉構件連接並進行轉動及取放該 晶^的吸嘴,該吸嘴包含-第-吸嘴以及一與該第一吸嘴背對 背^置的帛二贿;朗取齡_構無雜觀定位麵 分射置,且制賴鱗位於_賴分離機難該晶粒挑 棟臂之間;⑽騎麵_機構能晶粒转粒機構分離 ^ 設置,且該分存膜組件位於該分存膜貼附機構與該晶粒挑揀臂 之間。 其中該晶粒挑揀裝置具有一挑棟狀態以及—分存狀態,該 挑棟狀態由__分_構抵賴觀敵件而該晶粒離 開該頂取膜組件並崎於該晶粒挑揀臂,該分存狀態由該分存 膜貼附機構抵頂該分存膜组件而該晶粒離開該晶粒挑棟臂並 貼附於該分存膜組件。 藉由上述麟找’本咖職雜分錢倾構與該分 10120S285N01 1043156171-0 6 M436221 更正曰期:^ g p| Q1] j-j-Qi j 存膜貼附麟分離設置’不賴化結構上的設計,並使該晶粒 於對位移動的過程巾,令該晶粒分存定位機構無分存膜貼附 機構不互減重,蚊域準度提高,M績位速度。 【實施方式】 有關本新型的詳細說明及技術内容,現就配合圖式說明如 下: 請參閱『圖2』所示’為本新型一實施例的外觀立體示意 圖’本新型為一種晶粒挑楝裝置,包括有一晶粒頂取定位機構 10、一晶粒分存定位機構20、一晶粒挑楝臂30、一頂取膜分 離機構4〇以及-分存膜貼附機構%。該晶粒頂取定位機構ι〇 包含一第一平面移動構件U以及一頂取膜組件12,該第一平 面移動構件11包含兩個呈直線移動且移動方向相交的第一單 軸件111 ’在此實施例中,該第一單軸件lu為垂直相交且 該第一單軸件111其中之一個與該頂取膜組件12連接,令該 頂取膜組件12得以進行平面移動,該頂取膜組件12包含一頂 取膜121以及一頂取膜支撐座122,該頂取膜121上貼附有一 晶粒60,且該頂取膜121固定於該頂取膜支撐座122上透 過該頂取财舰122與該第-平面㈣構件11連接,在此 為連接於該第一單軸件111其中之一個。 該晶粒分存定位機構20與該晶粒頂取定位機構1〇相對設 置,並包含一第二平面移動構件21以及一分存膜組件22,該 第二平面移動構件21包含兩個呈直線移動且移動方向相交的 101208285N01 1043156171-0 M436221 ιο·ι ^ os n ora 211為垂直相 更正日期:中華民國 第二單軸件211,在此實施例中,該第二單軸件 父’且該第二單轴件211其中之一個與該分存膜組件22連接, 令該分存膜組件22得以進行平面移動,該分存膜組件22則包 6刀存膜221以及一分存膜支樓座222,該分存膜221固定 於該分存膜支撲座222上,用以分類存放該晶粒6〇,透過該 分存膜支撐座222與該第二平面移動構件21連接,在此為連 接於該第二單軸件211其中之一個。Correction period: Republic of China tO^~r〇 May Qt-Q. A die 10 on the second adhesive film 7 is in contact with the die pick-and-place mechanism 3 and is adsorbed on the die pick-and-place mechanism 3, Then, the die attaching and detaching mechanism 3 is turned to face the first adhesive film 4, and the first adhesive film 6 is pressed against the first adhesive film 4, The first adhesive film 4 is brought into contact with the die 10 adsorbed on the die pick-and-place mechanism 3, and the die 1 is attached to the first adhesive film 4, and the die 10 is completed. The classified grain storage platform 2 is provoked to the classified picking operation of the classified grain storage platform. The above-mentioned classification picker 'When the die pick-and-place mechanism 3 wants to store the die 10 on the classified die storage platform ,, the first adhesive film 4 must be adjusted by the first planar moving mechanism 5 The upper storage position is aligned with the die pick-and-place mechanism 3, and the first abutting member 6 abuts the first adhesive film 4, so that the die 10 is in contact with the first adhesive tape 4 and is pasted. Attached to the storage position of the first adhesive film 4. However, in the classified die storage platform, since the first planar moving mechanism 5 is connected to the first abutting member 6, the classified die storage platform 1 is easily complicated in structure design, and the load is heavy. It is heavier, and in the process of the alignment movement, there is a problem that the accuracy of the clamp is poor, so there is still room for improvement. [New content] The main purpose of the novel is to solve the conventional sorting picker. In the classified die storage platform, since the first-plane moving mechanism is connected with the first abutting member, the crystal grains are in the opposite direction. Over-the-counter, the problem of poor positioning is produced. 101208285N01 1043156171-0 5 * · » ** . Helmet correction date: Zhongji Minguo: ΗΜ·^·〇γ: q mp 曰 For the above purposes, the present invention provides a type of grain picking device, including a grain The topping surface, a die separation positioning mechanism, a die picking arm, a top = film separating mechanism, and a split film attaching mechanism. The die topping positioning mechanism, the first planar moving member, and the topping film assembly connected to the first planar moving member, the topping film component is attached with a die; the die The storage positioning mechanism _ crystal_ mosquito position mechanism is disposed, and comprises a second planar moving member, a non-twisting two-flat rotating member connecting the aligning plane movement; the dividing film assembly; a die top positioning mechanism disk rotates between the die turning positioning mechanism and is opposite to the die, the die picking arm includes a rotating member and - is connected to the rotating member and rotates and picks up the crystal a nozzle, the nozzle comprises a - the first nozzle and a second bribe with the first nozzle; the lang-aged structure has no miscellaneous positioning surface, and the squaring is located It is difficult for the die to pick up between the arms; (10) the riding surface _ mechanism can be separated by the grain sizing mechanism, and the split film assembly is located between the split film attaching mechanism and the die picking arm. Wherein the die picking device has a picking state and a state of being divided, the state of the picking is determined by the __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The dispensing state is caused by the split film attaching mechanism to abut the split film assembly, and the die exits the die picker arm and is attached to the split film assembly. With the above-mentioned Lin looking for 'this coffee job miscellaneous money dumping and the score 10120S285N01 1043156171-0 6 M436221 correction period: ^ gp| Q1] jj-Qi j film attached to the separation of the setting of the 'reliable structural design And the process of moving the die in the para-position, so that the die-dividing positioning mechanism does not separate the film attachment mechanism without weight loss, the mosquito level is improved, and the M performance speed. [Embodiment] The detailed description and technical contents of the present invention will now be described with reference to the following drawings: Please refer to the schematic view of the appearance of the present invention as shown in Fig. 2, which is a kind of crystal provocation. The device comprises a die top positioning mechanism 10, a die separation positioning mechanism 20, a die picking arm 30, a top film separating mechanism 4, and a split film attaching mechanism %. The die top positioning mechanism ι includes a first planar moving member U and a top filming assembly 12, and the first planar moving member 11 includes two first single-axis members 111' that move in a straight line and intersect in a moving direction. In this embodiment, the first single-axis member lu is perpendicularly intersected and one of the first single-axis members 111 is coupled to the top take-up film assembly 12 to enable the top film module 12 to move in a plane. The film taking assembly 12 includes a top film 121 and a top film support 122. The top film 121 is attached with a die 60, and the top film 121 is fixed on the top film support 122. The top-loading ship 122 is coupled to the first-plane (four) member 11, here to one of the first single-shaft members 111. The die-dividing positioning mechanism 20 is disposed opposite to the die-carrying positioning mechanism 1 , and includes a second planar moving member 21 and a split film assembly 22, wherein the second planar moving member 21 includes two straight lines Moving and moving directions intersecting 101208285N01 1043156171-0 M436221 ιο·ι ^ os n ora 211 is the vertical phase correction date: Republic of China second single shaft member 211, in this embodiment, the second single shaft member is 'and One of the second single-axis members 211 is connected to the divided film module 22, so that the divided film module 22 can be moved in a plane. The divided film module 22 includes a 6-film film 221 and a partition film branch. a partition 222, the partition film 221 is fixed on the partition film baffle 222, and is used for sorting and storing the die 6〇, and is connected to the second planar moving member 21 through the split film supporting seat 222. To be connected to one of the second single-shaft members 211.
該晶粒挑楝臂30設置於該晶粒頂取定位機構職該晶粒 分存定位機構2G之間,並包含-旋轉構件31以及—吸嘴32, 該吸嘴32與該旋轉構件31雜,而於該晶粒頂取定位機構 1〇與該晶粒分存定位機構2〇之_動,在此實關中該吸 嘴32包含背對背設置的—第一吸嘴321卩及一第二吸嘴您, 當該第-吸嘴32i面對該晶粒60與該頂取膜組件12時該第 二吸嘴322則面對該分存膜組件22,並隨著該旋轉構件μ的 作動,而交換彼此位置。 該頂取膜刀離機構4〇與該晶粒頂取定位機構⑴分離設 置’令該頂取膜組件12位於該頂取膜分離機構4〇與該晶粒挑 棟臂3〇之間,該頂取膜分離機構4〇包含一第一單轴移動構件 41以及-第-抵頂件42,該第_單轴移動構件與該第一抵 頂件42連接’提_第—抵頂件42進行—絲的往復活動, 使该第-抵頂件42抵頂該頂取臈組件12中的該頂取膜⑵。 該分存膜貼附機構50與該晶粒分存定位機構2〇分離設 8 101208285N01 1043156171-0 更正 a sb 5丄Γ ’該分存_機構%包含-第二單軸移動構件 頂件㈣1—抵_52 ’心物蝴祕51與該第二抵 使^第提觸:抵餅52進彳卜躲離復活動, 吏=-抵頂件52抵頂該分存臈組件2S中的該分存膜功。 明參閱『圖3A』及『圖3B』所示,分別為本新型一實施 :棟狀態以及分存狀態示意圖,當本新型進行-晶粒挑棟 作業時,具有-挑揀狀態以及一分存狀態,該挑棟狀態如『圖 3A』所示,此時,該晶粒60貼附於該頂取膜⑵上,並已藉 由該第-平面移動構件u進行平面移細與該第—吸嘴321 及該第一抵頂件42對準’且該第一抵頂件42則藉由該第一單 軸移動構件41進行直線移動而抵頂該頂取臈i2i,使該晶粒 卿開該頂取膜121,而與該第一吸嘴321接觸,由該第一吸 嘴321以真空吸取的方式吸附該晶粒6〇;該分存狀態則如『圖 3B』所示,此時’該第一吸嘴321透過該旋轉構件%已旋轉 至面對該分存膜221的位置,該分存膜2U職由該第二平面 移動構件21進行平面移動,將該分存膜221上的一存放位置 對準該晶粒60,該第二抵頂件52職由該第二單軸移動構件 51進行直線移動而抵頂該分存膜221,使該分存膜221上的該 存放位置與該晶粒60接觸,令該晶粒6〇離開該第一吸嘴321, 而貼附於該分存膜221的該存放位置上。 另外,在此要補充說明的是,由於在此實施例中,該第一 101208285N01 1043156171-0 9 _與該第二吸物為二 嘴321面對該頂取膜組件12進行該晶粒 及 吸嘴奶同時則可面對該分存膜組件22進行H該2 放,如此以節省該晶粒挑棟作業的作業時間。日日,立子The die picking arm 30 is disposed between the die picking and positioning mechanism and the die dividing and positioning mechanism 2G, and includes a rotating member 31 and a nozzle 32. The nozzle 32 is mismatched with the rotating member 31. And the die top positioning mechanism 1 〇 and the die-dividing positioning mechanism 2 , move, in the actual closing, the nozzle 32 includes a back-to-back arrangement - a first nozzle 321 卩 and a second suction The second nozzle 322 faces the partition membrane module 22 when the first nozzle 32i faces the die 60 and the top film assembly 12, and with the rotation of the rotating member μ, And exchange each other's position. The top film take-up mechanism is disposed separately from the die top positioning mechanism (1). The top film assembly 12 is disposed between the top film separation mechanism 4 and the die picking arm 3〇. The top film separation mechanism 4 includes a first uniaxial moving member 41 and a first abutting member 42. The first uniaxial moving member is coupled to the first abutting member 42. The reciprocating movement of the wire is performed such that the first abutting member 42 abuts against the top take-up film (2) in the top picking assembly 12. The split film attaching mechanism 50 and the die dividing and positioning mechanism 2 are separated from each other. 8 101208285N01 1043156171-0 Correction a sb 5 丄Γ 'The storage _ mechanism % contains - the second uniaxial moving member top piece (4) 1 - _ 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 Membrane work. Referring to "Figure 3A" and "Figure 3B", respectively, this is a new implementation: the state of the ridge and the state of the storage state. When the new type is carried out - the grain picking operation, there is a - picking state and a state of sharing The picking state is as shown in FIG. 3A. At this time, the die 60 is attached to the top take-up film (2), and has been planarly thinned by the first-plane moving member u and the first sucking The nozzle 321 and the first abutting member 42 are aligned with each other, and the first abutting member 42 is linearly moved by the first uniaxial moving member 41 to abut the top 臈i2i, so that the die is opened. The top film 121 is in contact with the first nozzle 321, and the first nozzle 321 adsorbs the crystal grain 6 by vacuum suction; the state of the separation is as shown in FIG. 3B. The first nozzle 321 has been rotated to a position facing the partition film 221 through the rotating member 2, and the partition film 2U is moved by the second plane moving member 21 to be planarly moved. A storage position is aligned with the die 60, and the second abutting member 52 is linearly moved by the second uniaxial moving member 51 to abut the point. The storage film 221 is disposed such that the storage location on the separation film 221 is in contact with the die 60, and the die 6 is separated from the first nozzle 321 and attached to the storage location of the separation film 221. . In addition, it is to be noted that, in this embodiment, the first 101208285N01 1043156171-0 9 _ and the second absorbing material are the two nozzles 321 facing the top film module 12 for the die and the nozzle At the same time, the milk can face the partitioning membrane module 22 to perform H, so as to save the working time of the grain picking operation. Day, Lizi
由於本新型將該晶粒分存定位機構與該分存膜 ==齡置’不僅簡化上述該些機構的結構,避免該晶 刀 機構背負該分存臈貼附機構而影響定位效能,進一 步提升對晶粒蚊位鮮細及定錢度,因此柄型極具進 步性及符合申請新型專利的要件,纽法提出㈣,祈釣局 早曰賜准專利,實感德便。 以上已將本新龍—詳細·,,_上所述者,僅爲本新 型的-較佳實施例而已,當不能限定本新型實麵範圍。即凡 依本新型申請範圍所作的鱗變化與修飾等,皆應仍屬本新型 的專利涵蓋範圍内。The present invention not only simplifies the structure of the above-mentioned mechanisms, but also prevents the crystal cutter mechanism from carrying the separation mechanism and affecting the positioning performance, thereby further improving the structure. The size and weight of the mosquitoes are fine, so the shape of the handle is very progressive and meets the requirements for applying for a new type of patent. New Zealand proposes (4) that the Prayer Bureau will grant patents as soon as possible. The above description has been made only for the new type of the present invention, and the present invention is not limited to the present invention. That is, the scale changes and modifications made in accordance with the scope of this new application should remain within the scope of this new patent.
【圖式簡單說明】 圖1,為習知分類挑楝機的立體示意圖。 圖2 ’為本新型一實施例的外觀立體示意圖。 圖3A ’為本新型一實施例的挑揀狀態示意圖。 圖3B,為本新型一實施例的分存狀態示意圖。 【主要元件符號說明】 習知 1 :已分類晶粒存放平台 101208285N01 1043156171-0 M436221 /〇♦〇牙鄉 、更正曰期:中華民國10^手05月眷日 2:待分類晶粒存放平台 3:晶粒取放機構 4:第一黏貼膜 5:第一平面移動機構 6:第一抵頂件 7:第二黏貼膜 8:第二抵頂件BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a conventional classification provocation machine. 2 is a perspective view showing the appearance of an embodiment of the present invention. Fig. 3A is a schematic view showing the picking state of an embodiment of the present invention. FIG. 3B is a schematic diagram showing the state of the storage according to an embodiment of the present invention. [Main component symbol description] Convention 1: Divided grain storage platform 101208285N01 1043156171-0 M436221 /〇♦〇牙乡, Correction period: Republic of China 10^手05月眷日2: To be classified as grain storage platform 3 : die pick-and-place mechanism 4: first adhesive film 5: first plane moving mechanism 6: first abutting member 7: second adhesive film 8: second abutting member
9:第二平面移動機構 10 ·晶粒 本新细 10 :晶粒頂取定位機構 11 :第一平面移動構件 111 :第一單軸件 12 :頂取膜組件9: second plane moving mechanism 10 · die This new thin 10 : die topping positioning mechanism 11 : first plane moving member 111 : first single shaft member 12 : top film module
121 :頂取膜 122 :頂取膜支撐座 20 :晶粒分存定位機構 21 :第二平面移動構件 211 :第二單軸件 22 :分存膜組件 221 :分存膜 222 :分存膜支撐座 1043156171-0 101208285N01 11 M436^21 更正曰期:中華民國柏^「OGTTirrn 30 :晶粒挑棟臂 31 :旋轉構件 32 :吸嘴 321 :第一吸嘴 322 :第二吸嘴 40 :頂取膜分離機構 41 :第一單軸移動構件121: the top film 122: the top film support 20: the die separation positioning mechanism 21: the second planar moving member 211: the second single shaft member 22: the divided film assembly 221: the divided film 222: the divided film Support seat 1043156171-0 101208285N01 11 M436^21 Correction period: Republic of China cypress ^ "OGTTirrn 30: die pick arm 31: rotating member 32: nozzle 321: first nozzle 322: second nozzle 40: top Membrane separation mechanism 41: first uniaxial moving member
42 :第一抵頂件 50 :分存膜貼附機構 51 :第二單軸移動構件 52 :第二抵頂件 60 .晶粒 1043156171-0 101208285N01 12 M436221 更正日期:令華民國 新型專利說明_ 月奸曰 (本說明書格式^ 順序,請勿任意更動’※記號部分 ※申請案號:/w>^>^r ※申請曰:/6/ m代碰' 一、 新型名稱:(中文/英文) 晶粒挑楝裝置 二、 中文新型摘要: 一種晶粒挑楝裝置,包括有一晶粒頂取定位機構、—盥 位機構姉設置㈣粒分存粒麟、—設置_晶粒觀 ^立分存定位機構之間轉動的晶粒祧棟臂一與該晶粒頂取定位機構; §史置的頂取膜分離機構以及—與該晶粒分存定位機構分離設置的分存二 附機構,其中該晶粒挑揀裝置對一貼附於該晶粒頂取定位機構的—且 有-挑棟狀·_-分雜態,並藉龍晶粒分存定位機構與該^膜貼 附機構的分m,提兩該晶粒於該分存㈣巾的定位精準度。、 英文新型摘要: 101208285N01 Γ 1043156171-0 142: the first abutting member 50: the divided film attaching mechanism 51: the second single-axis moving member 52: the second abutting member 60. The die 1043156171-0 101208285N01 12 M436221 Correction date: the new patent description of the Republic of China _曰 曰 曰 本 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ ※ English) 晶 楝 楝 二 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , a die truss arm that rotates between the locating and positioning mechanisms and the die plucking and positioning mechanism; § a top picking film separating mechanism and a separating and attaching mechanism separately from the die dividing and positioning mechanism Wherein the die picking device is attached to the die pick-up and positioning mechanism - and has a pick-up type - _-divided state, and the borrowing positioning mechanism and the film attaching mechanism The sub-m is the accuracy of positioning the two grains in the divided (four) towel. English Abstract: 1 01208285N01 Γ 1043156171-0 1
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101208285U TWM436221U (en) | 2012-05-03 | 2012-05-03 | Die selection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101208285U TWM436221U (en) | 2012-05-03 | 2012-05-03 | Die selection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM436221U true TWM436221U (en) | 2012-08-21 |
Family
ID=47048693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101208285U TWM436221U (en) | 2012-05-03 | 2012-05-03 | Die selection device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM436221U (en) |
-
2012
- 2012-05-03 TW TW101208285U patent/TWM436221U/en not_active IP Right Cessation
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