M431426 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種晶圓加工設備，尤指一種可依據晶圓為 切。j或研磨加工製程所需，可替換為切割片或研磨片形式之具複 合式功能之晶圓加工設備。 【先前技街】 • …、 a曰圓係為製作積體電路元件之基礎，而晶圓的製作過程包含 有下列幾個主要步驟：首先備製出高純度的液態半導體原料（如 矽），接著利用晶種(Seed)藉由拉晶（?〇〇11118)生成圓柱狀的晶棒 (ingot) ’之後再進行切片（slieing)將晶棒切割成碟狀，以形成 的晶圓。而晶圓於製造後，會將晶圓送置於測試廠以進行晶圓測 °式後再將已測试的晶圓進行封裝（packagin)程序，而晶圓於封 魯裝（packagln;)程序過程乃必須先對晶圓進行切割作業程序，使原 本一整片的關以切娜成複數粒(die)，再依序將晶粒(die) 進行焊線(Wire bond)、封膠(Molding)、檢測（Inspecti〇n)等程 序。 然而，為了有效降低生產成本及減少廢棄晶_數量，因此 逐漸發屐出再生晶圓的行業’而回收晶圓於切割形成複麵晶粒 (die)後’該些晶粒(die)為了符合新規格所需之厚度，乃必須再 經過-研磨加工程序，導致從事再生晶_封裝加域商則必須 另外再添購—研磨加王贿；如此—來，添購新的研磨加工設備 3 M431426 不僅會造成所需成本增加， 佔用加工工薇其有限的空間 同時增設新的 研磨加工設備也會相對 【新型内容】 供一=上述㈣術的問題與缺陷，本創作主要目_ 工設備’係可同時應用於晶圓切割加工及研磨加] 衣程’ /、ο括有-驅_置及至少―鎖心而驅動裝置其延伸注 有一驅動軸，並於驅動軸上套設有-_秘；而鎖片設有1 孔，使得驅動裝置之驅動軸可穿設鎖片之穿孔，並由鎖固元件套 設於驅動轴上並相對位於鎖片之外侧面位置達到鎖片可固定結 :於驅動軸上，且鎖片設可為切割片或研磨片。藉此，可依據晶 圓為切割或研磨加JL製程所需，替換鎖片為蝴片或研磨片之形 式，提供加工業者僅需購置一晶圓加工設備，俾可對晶圓進行切 割或研磨加工製程，藉以降低成本及減少加工設備所佔用之工作 空間。 同時，於替換該鎖片為切割片或研磨片形式時，只需先將鎖 固元件取下，替換為切割片或研磨片形式之鎖片後，再將鎖固元 件鎖固於驅動裝置之驅動軸，使鎖片固定結合於驅動轴上，達到 具快速替換鎖片之功效。 以下在實施方式中詳細敘述本創作之詳細特徵以及優點，其 内容足以使任何熟習相關技藝者了解本創作之技術内容並據以實 施’且根據本說明書所揭露之内容、申請專利範圍及圖式，任何 4 M431426 热習相關技藝者可輕易地理解本創作前述之目的及優點。 【實施方式】 為使貴審查員方便簡捷瞭解本創作之其他特徵内容與優點 及其所達成之功效能夠更為顯現，茲將本創作配合附圖，詳細敘 这本創作之·以及優點’町之實關健—步詳細說明本新 型之觀點，但非以任何觀點限制本新型之範疇。 请參閱第-、二所示’本創作係揭露—種晶圓加卫設備係 可同時細於晶圓5酬加工及研磨加卫製程，義複合式之晶 圓加工設備包括有一驅動裝置丄及至少—鎖片2。 驅動裝置！係可設置於1設卫作機台上，而驅動裝置工直 ，伸出有-驅動軸Η，並於驅動轴u可套設有—鎖固元件工 有-侧定結合於驅動裝置1之驅動轴11，而鎖片2設 穿21 ’且鎖片2可為域片4研磨片。 另外，本創作之晶圓加工設借 4，而冷卻裝置4係可設置於—預^一步包括有一冷卻裝置 設有-輸人管41及-輸出管42 _台上，該冷卻震置4 2周圍。由冷卻裝置4之輸入管且令輸出管4 2相鄰於鎖片 管相連接，使得液體導管内的液體^輿—液體（如冷卻液）導 流入並由輸出管4 2流出。 如冷卻液）可由輸入管41 如此，驅動裝置1之驅動軸工 J穿設鎖片2之穿孔2 1， 5 26 再鎖口 tc件1 2套設於驅動轴丄丄上並相對位於鎖片2之外侧 面位置，以透過鎖㈣件12對鎖片2夾合，使鎖片2固定結合 於驅動轴11上15此外，驅動軸1 1可設有螺紋，而鎖固元件工 2可為螺母，使得鎖固元件i 2可穩固鎖合於驅動軸u上。 一當晶圓5進行切割加工製程時（請配合參閱第二、六圖所 不）可將鎖片2設定為切割片，以對晶圓5進行縱向及橫向切 J使曰曰圓5形成複數個晶片；此外，當晶圓$或晶片進行研磨 ㈣T將鎖片2從原先切割片形式替換成研磨片形式（如 人2所7’以對晶圓5或晶片進行研磨，使晶圓5或晶片可符 ⑥之厚度。麵可依據晶圓5為切割或研磨加工製程所需， =鎖片^為切割片或研磨片之形式，提供加工業者僅需講置一 日日β、加工。又備’俾可對晶圓5進行切割或研磨加工製程，藉以降 加工設備所佔用之卫作空間。再者，於替換該鎖片 士、’、。/研磨片形式時，只需先將鎖固祕12取下，替換 動梦=或研磨片形式之鎖片2後，再將鎖固元件1 2鎖固於驅 、驅動軸11 ’使鎖片2固定結合於驅動軸1!上，達 到具快速替換鎖片2之功效。 達 進裝置4之輪出管4 2相鄰於鎖片2周圍，當晶圓5於 進仃切副或研磨加工窜 _ 流出的液體（如冷卻液)、可透Γ裝置4之輸出管4 2所 的古㈤ 猎以冷卻晶圓5於切割或研磨時所產生 請配合參閱第 、四圖所示，本創作之晶圓加工設備可進 M431426 步包括有一固定機構3，該固定機構3係可結合於驅動裝置1之 驅動軸11，其包括有一第一夾片31、第二夾片3 2及蓋體3 3。而弟一夾片31凸設有一凸部311，並設有相對貫穿第— 失片31及凸部311之鎖孔312 ;而第二夾片32設有一鎖 孔3 21 ;而蓋體3 3設有一鎖孔3 31。於組裝時，驅動裝置 1之驅動軸11可先穿設第一失片3 i之鎖孔3 i 2，而鎖片2 _ 之穿孔21可套設於第-夾片3 i之凸部3工工，再將驅動裝置 1之驅動軸1i依序穿設第二夾片3 2及蓋體3 3之鎖孔3 2 1、3 31，使鎖片2相對位於第一夹片31與第二夾片3 2之 間’最後由鎖固元件i 2套設於驅動軸丄！上並相對位於蓋體3 3之外側面位置’以透過鎖固元件i 2分珊固定機構3及鎖片 2夾合’達到鎖片2更可穩固結合於驅動轴11上。 睛同時配合參閱第五圖所示’本創作之冷卻裝置4可依照切 ⑩或研磨加工所需，進行設置（如第一至四圖所示）或拆卸、(如 第五圖所示）。 綜上所述，糊作在突破先狀技賴構下，確實已達到所 ^增進之功效，且也麵其所屬技術賴中具麵f知識者依申 凊前之先驗術完成，綠法翻_專 主 局核准本件翻糊申縣，__，域德便。〜，貝 惟上列詳細說明係針對本創狀—可行實施例之具 該實施例歸職_摘作，就械縣靖 之等效實施或變更，均應包含於本案之專利範財。埘所為 7 M431426 【圖式簡單說明】 第-圖係本創作之晶圓加工設備第—實細分解圖。 第二圖係本創作之晶圓加工設備第二實施例分解圖。 第三圖係本創作之晶圓加玉鋪$三實施例分解圖。 第四圖係本創作之晶圓加玉設備第三實施娜合圖。 第五圖係本創作之晶圓加工設備第三實施例另_實施狀態示意 圖。 第/、圖係本創作之晶圓加工設備_操作實施例示意圖。 【主要元件符號說明】 1、 驅動裝置 11、 驅動軸 12、 鎖固元件 2、 鎖片 2 1、穿孔 3、 固定機構 3 1、第一夾片 311、 凸部 312、 鎖孔 3 2、第二夾片 3 21、鎖孔 3 3、蓋體 8 M431426 3 31、鎖孔 4、 冷卻裝置 41、輸入管 4 2、輸出管 5、 晶圓M431426 V. New Description: [New Technology Field] This creation is about a wafer processing equipment, especially one that can be cut according to the wafer. j or a grinding process, which can be replaced by a wafer processing device with a composite function in the form of a dicing sheet or an abrasive sheet. [Previous Tech Street] • ..., a circle is the basis for making integrated circuit components, and the wafer fabrication process includes the following main steps: first, prepare high-purity liquid semiconductor materials (such as germanium). Then, using a seed (Seed), a cylindrical ingot is formed by pulling crystals (? 11118), and then the ingot is slieed to cut the ingot into a dish to form a wafer. After the wafer is manufactured, the wafer is placed in a test factory for wafer measurement, and then the tested wafer is packaged (packagin) program, and the wafer is packaged (packagln;) program. The process must first perform a cutting operation on the wafer, so that the original piece of the film is cut into a plurality of dies, and then the die is wired and sealed (Molding). ), detection (Inspecti〇n) and other procedures. However, in order to effectively reduce the production cost and reduce the amount of waste crystals, the industry of regenerating wafers is gradually emerging, and the wafers are recovered after cutting to form a dies. The thickness required for the new specification must be subjected to a -grinding process, resulting in the remanufacturing of the crystal. The package must be purchased separately - grinding and bribery; so - to purchase a new grinding equipment 3 M431426 Not only will it increase the required cost, but also occupy the limited space of the processing worker and add new grinding processing equipment. It will also be relative to the [new content] for the problem and defect of the above (4). Can be applied to both wafer cutting and grinding plus] clothing, /, including - drive - and at least - lock the drive device with a drive shaft extending from the drive shaft, and set on the drive shaft - _ secret The locking piece is provided with a hole, so that the driving shaft of the driving device can pass through the perforation of the locking piece, and the locking element is sleeved on the driving shaft and is opposite to the outer side of the locking piece to reach the locking piece to fix the knot: On the drive shaft And the locking piece can be a cutting piece or an abrasive piece. Therefore, according to the wafer for cutting or grinding plus JL process, the replacement of the locking piece is in the form of a butterfly or an abrasive sheet, and the manufacturer only needs to purchase a wafer processing equipment, and the wafer can be cut or ground. Processing process to reduce costs and reduce the work space occupied by processing equipment. At the same time, when replacing the locking piece in the form of a cutting piece or an abrasive piece, it is only necessary to first remove the locking component, replace it with a locking piece or a locking piece in the form of an abrasive piece, and then lock the locking component to the driving device. The drive shaft enables the locking piece to be fixedly coupled to the drive shaft for the purpose of quickly replacing the locking piece. The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient to enable anyone skilled in the art to understand the technical contents of the present invention and to implement the contents of the present disclosure, the scope of the patent application and the drawings. Any of the 4 M431426 enthusiasts can easily understand the aforementioned purposes and advantages of this creation. [Embodiment] In order to make it easier for your examiner to understand the other features and advantages of this creation and the effects achieved by it, this book will be combined with the drawings to describe the creation and advantages of the town.实实关健—Steps detailing the views of this new model, but do not limit the scope of this novelty by any point of view. Please refer to the first and second sections. 'This creation department exposes that the wafer enhancement equipment can be finer than the wafer 5 processing and grinding and curing process. The composite wafer processing equipment includes a driving device. At least - the locking piece 2. Drive unit! The system can be set on a set-top machine, and the driving device is straightened, and a drive shaft 伸出 is extended, and the drive shaft u can be sleeved--the lock component is operatively-side-coupled to the drive device 1 The shaft 11 is driven, and the locking piece 2 is provided through 21 ' and the locking piece 2 can be a field piece 4 abrasive piece. In addition, the wafer processing of the present invention is provided by 4, and the cooling device 4 can be disposed in a pre-step including a cooling device provided with an input pipe 41 and an output pipe 42_, and the cooling is disposed 4 2 around. The inlet tube of the cooling device 4 is connected and the outlet tube 4 2 is connected adjacent to the lock tube so that liquid liquid (e.g., coolant) in the liquid conduit flows into and out of the outlet tube 42. Such as the coolant) can be made by the input pipe 41, the drive shaft of the drive device 1 is pierced by the perforation 2 of the lock piece 2, 5 26, and the lock tc member 12 is sleeved on the drive shaft and relatively opposite to the lock piece 2 The outer side position is such that the locking piece 2 is clamped by the locking piece (four) member 12, so that the locking piece 2 is fixedly coupled to the driving shaft 11 . Further, the driving shaft 1 1 can be provided with a thread, and the locking element 2 can be The nut enables the locking element i 2 to be securely locked to the drive shaft u. When the wafer 5 is subjected to a cutting process (please refer to the second and sixth figures), the locking piece 2 can be set as a cutting piece to perform longitudinal and lateral cutting of the wafer 5 so that the circle 5 is formed into a plurality of a wafer; in addition, when the wafer $ or wafer is ground (4) T, the locking sheet 2 is replaced from the original dicing sheet form into an abrasive sheet form (such as the person 2 7' to grind the wafer 5 or the wafer, so that the wafer 5 or The wafer can be of a thickness of 6. The surface can be cut or polished according to the wafer 5, and the lock piece is in the form of a dicing sheet or an abrasive sheet, which provides the processing industry with only one day of processing and processing. The device can be used to cut or grind the wafer 5, so that the processing space occupied by the processing equipment can be used. In addition, when replacing the locker, ', . After the lock 12 is replaced, the lock element 2 is locked to the drive and the drive shaft 11 ', so that the lock piece 2 is fixedly coupled to the drive shaft 1! The utility model has the function of quickly replacing the locking piece 2. The wheeling pipe 4 of the reaching device 4 is adjacent to the periphery of the locking piece 2, when the crystal Round 5 in the cutting or cutting process 窜 _ outflow of liquid (such as coolant), the output of the permeable device 4 of the ancient tube (5) hunting to cool the wafer 5 when cutting or grinding, please cooperate As shown in FIG. 4, the wafer processing apparatus of the present invention can include a fixing mechanism 3, which can be coupled to the driving shaft 11 of the driving device 1, and includes a first clip 31, The second clip 3 2 and the cover body 33. The other clip 31 is convexly provided with a convex portion 311, and is provided with a locking hole 312 which penetrates through the first lost piece 31 and the convex portion 311; and the second clip 32 A locking hole 3 21 is provided; and the cover body 33 is provided with a locking hole 3 31. During assembly, the driving shaft 11 of the driving device 1 can first pass through the locking hole 3 i 2 of the first lost piece 3 i, and the locking piece 2 _ the through hole 21 can be sleeved on the convex portion 3 of the first clip 3 i, and then the drive shaft 1i of the driving device 1 is sequentially passed through the second clip 3 2 and the locking hole 3 of the cover 3 3 2, 3 31, the locking piece 2 is located between the first clamping piece 31 and the second clamping piece 3 2. Finally, the locking element i 2 is sleeved on the driving shaft 丄! and is opposite to the cover body 3 3 Outer side position 'to penetrate The over-locking element i 2 is divided into the fixing mechanism 3 and the locking piece 2 is clamped 'to reach the locking piece 2 and can be stably coupled to the driving shaft 11. The eye is simultaneously matched with the cooling device 4 of the present drawing as shown in the fifth figure. Cut 10 or grind processing, set (as shown in Figures 1 to 4) or disassemble, (as shown in Figure 5). In summary, the paste is based on the breakthrough technology. To achieve the effect of the improvement, and also the technology of the subordinates of the technology in the sub-family, the completion of the a priori, according to the application of the green law _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ ~, Bei Wei's detailed description above is for the present invention - the feasible embodiment of this embodiment of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _埘 为 7 M431426 [Simple description of the diagram] The first-graph is the first and the actual breakdown of the wafer processing equipment of this creation. The second drawing is an exploded view of a second embodiment of the wafer processing apparatus of the present invention. The third figure is an exploded view of the three-part embodiment of the wafer plus jade shop of the present creation. The fourth picture is the third implementation of the wafer and jade equipment of this creation. The fifth drawing is a schematic diagram of a third embodiment of the wafer processing apparatus of the present invention. The figure / diagram is a schematic diagram of the wafer processing equipment of the present invention. [Description of main component symbols] 1. Drive device 11, drive shaft 12, locking member 2, locking piece 2 1, perforation 3, fixing mechanism 3 1, first clip 311, convex portion 312, locking hole 3 2, Two clips 3 21, lock holes 3 3, cover 8 M431426 3 31, lock holes 4, cooling device 41, input tube 4, output tube 5, wafer