TWM425121U - Combined machining center - Google Patents
Combined machining center Download PDFInfo
- Publication number
- TWM425121U TWM425121U TW100216027U TW100216027U TWM425121U TW M425121 U TWM425121 U TW M425121U TW 100216027 U TW100216027 U TW 100216027U TW 100216027 U TW100216027 U TW 100216027U TW M425121 U TWM425121 U TW M425121U
- Authority
- TW
- Taiwan
- Prior art keywords
- module
- laser cutting
- machine tool
- processing
- component
- Prior art date
Links
- 238000003698 laser cutting Methods 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 238000005553 drilling Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000011435 rock Substances 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 239000004753 textile Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
M425121 30上取下成品,即可完成出料動作。 本創作湘該攸模組3Q可供待加王元件5Q置放於其上,以輸 送至雷射切割模組10及研磨加工模组20依序進行雷射切割加工程序 及研磨加J1程序’免除重複上料、下料以及搬運之動作,可有效加速 整體生產之速度。 再者,如第六圖圖面所示,其係為本創作之再一實施例其令, 該輸送模組30係包含至少—設置於雷射切龍組1£)與研磨加工模組 20間之軌道31 ’以及-可滑動地設置於執道31上之輸送平台32,該 輸送平台32進-步可為一真空吸附平台,且該輸送模組3〇更包含有 一自動定位裝置33 ’該自動^位裝置33係為—電荷耗合元件(CCD) 自動定位器,俾供該待加工元件5〇置放於輸送平台32上時,用以對 准定位待加工元件50之位置,並將其吸附固定於輸送平台32上以 利後續輸送至雷射切割模組1〇及研磨加工模組2〇時,得以精準定位、 防止加工誤差產生。 雖然本案是以數個最佳實施例做說明,但精於此技藝者能在不脫 離本案精神與範疇下做各種不同形式的改變。以上所舉實施例僅用以 說明本案而已,非用以限制本案之範圍。舉凡不違本案精神所從事的 種種修改或變化,俱屬本案申請專利範圍。 7 M425121 【圖式簡單說明】 第一圖係為本創作之組合單元示意圖。 第二圖係為本創作之動作流程圖。 第三圖係為本創作之立體外觀圖》 第四圖係為本創作之雷射切割模組平面動作示意圖。 第五圖係為本創作之研磨加工模組平面動作示意圖。 第六圖係為本創作另一實施例之立體外觀圖》 【主要元件符號說明】 雷射切割模組10 研磨加工模組20 輸送模組30 軌道31 輸送平台32 自動定位裝置33 機台40 待加工元件50The finished product can be removed by removing the finished product on the M425121 30. The creation of the 攸 攸 module 3Q is placed on the 5Q to be added to the laser cutting module 10 and the grinding processing module 20 to sequentially perform the laser cutting processing program and the grinding and J1 program' Eliminating the need for repeated loading, unloading and handling, it can effectively speed up the overall production. Furthermore, as shown in the figure of the sixth figure, it is a further embodiment of the present invention. The transport module 30 includes at least one set in the laser cut group 1 and the grinding processing module 20 The track 31' and the transport platform 32 slidably disposed on the road 31, the transport platform 32 can be a vacuum adsorption platform, and the transport module 3 further includes an automatic positioning device 33' The automatic position device 33 is a charge-dissipating component (CCD) automatic positioner for aligning the position of the component to be processed 50 when the component to be processed 5 is placed on the conveying platform 32, and The adsorption is fixed on the conveying platform 32 for subsequent delivery to the laser cutting module 1 and the grinding processing module 2, so that the positioning can be accurately positioned and the machining error can be prevented. Although the case is illustrated by several preferred embodiments, those skilled in the art can make various changes in the form without departing from the spirit and scope of the case. The above embodiments are only used to illustrate the present case and are not intended to limit the scope of the present invention. Any modification or change that is not in violation of the spirit of the case is the scope of patent application in this case. 7 M425121 [Simple description of the diagram] The first diagram is a schematic diagram of the combined unit of the creation. The second picture is the flow chart of the action of this creation. The third picture is the three-dimensional appearance of the creation. The fourth picture is the schematic diagram of the plane action of the laser cutting module. The fifth picture is a schematic diagram of the plane action of the grinding processing module of this creation. The sixth drawing is a three-dimensional appearance of another embodiment of the present invention. [Main component symbol description] Laser cutting module 10 Grinding processing module 20 Transport module 30 Track 31 Transport platform 32 Automatic positioning device 33 Machine 40 Waiting Processing component 50
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100216027U TWM425121U (en) | 2011-08-26 | 2011-08-26 | Combined machining center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100216027U TWM425121U (en) | 2011-08-26 | 2011-08-26 | Combined machining center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM425121U true TWM425121U (en) | 2012-03-21 |
Family
ID=46462288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100216027U TWM425121U (en) | 2011-08-26 | 2011-08-26 | Combined machining center |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM425121U (en) |
-
2011
- 2011-08-26 TW TW100216027U patent/TWM425121U/en not_active IP Right Cessation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |