TWM425121U - Combined machining center - Google Patents

Combined machining center Download PDF

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Publication number
TWM425121U
TWM425121U TW100216027U TW100216027U TWM425121U TW M425121 U TWM425121 U TW M425121U TW 100216027 U TW100216027 U TW 100216027U TW 100216027 U TW100216027 U TW 100216027U TW M425121 U TWM425121 U TW M425121U
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TW
Taiwan
Prior art keywords
module
laser cutting
machine tool
processing
component
Prior art date
Application number
TW100216027U
Other languages
Chinese (zh)
Inventor
Xi-Fu Zhong
Original Assignee
Chia Hsing Internat Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chia Hsing Internat Technology Co Ltd filed Critical Chia Hsing Internat Technology Co Ltd
Priority to TW100216027U priority Critical patent/TWM425121U/en
Publication of TWM425121U publication Critical patent/TWM425121U/en

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  • Laser Beam Processing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Description

M425121 30上取下成品,即可完成出料動作。 本創作湘該攸模組3Q可供待加王元件5Q置放於其上,以輸 送至雷射切割模組10及研磨加工模组20依序進行雷射切割加工程序 及研磨加J1程序’免除重複上料、下料以及搬運之動作,可有效加速 整體生產之速度。 再者,如第六圖圖面所示,其係為本創作之再一實施例其令, 該輸送模組30係包含至少—設置於雷射切龍組1£)與研磨加工模組 20間之軌道31 ’以及-可滑動地設置於執道31上之輸送平台32,該 輸送平台32進-步可為一真空吸附平台,且該輸送模組3〇更包含有 一自動定位裝置33 ’該自動^位裝置33係為—電荷耗合元件(CCD) 自動定位器,俾供該待加工元件5〇置放於輸送平台32上時,用以對 准定位待加工元件50之位置,並將其吸附固定於輸送平台32上以 利後續輸送至雷射切割模組1〇及研磨加工模組2〇時,得以精準定位、 防止加工誤差產生。 雖然本案是以數個最佳實施例做說明,但精於此技藝者能在不脫 離本案精神與範疇下做各種不同形式的改變。以上所舉實施例僅用以 說明本案而已,非用以限制本案之範圍。舉凡不違本案精神所從事的 種種修改或變化,俱屬本案申請專利範圍。 7 M425121 【圖式簡單說明】 第一圖係為本創作之組合單元示意圖。 第二圖係為本創作之動作流程圖。 第三圖係為本創作之立體外觀圖》 第四圖係為本創作之雷射切割模組平面動作示意圖。 第五圖係為本創作之研磨加工模組平面動作示意圖。 第六圖係為本創作另一實施例之立體外觀圖》 【主要元件符號說明】 雷射切割模組10 研磨加工模組20 輸送模組30 軌道31 輸送平台32 自動定位裝置33 機台40 待加工元件50The finished product can be removed by removing the finished product on the M425121 30. The creation of the 攸 攸 module 3Q is placed on the 5Q to be added to the laser cutting module 10 and the grinding processing module 20 to sequentially perform the laser cutting processing program and the grinding and J1 program' Eliminating the need for repeated loading, unloading and handling, it can effectively speed up the overall production. Furthermore, as shown in the figure of the sixth figure, it is a further embodiment of the present invention. The transport module 30 includes at least one set in the laser cut group 1 and the grinding processing module 20 The track 31' and the transport platform 32 slidably disposed on the road 31, the transport platform 32 can be a vacuum adsorption platform, and the transport module 3 further includes an automatic positioning device 33' The automatic position device 33 is a charge-dissipating component (CCD) automatic positioner for aligning the position of the component to be processed 50 when the component to be processed 5 is placed on the conveying platform 32, and The adsorption is fixed on the conveying platform 32 for subsequent delivery to the laser cutting module 1 and the grinding processing module 2, so that the positioning can be accurately positioned and the machining error can be prevented. Although the case is illustrated by several preferred embodiments, those skilled in the art can make various changes in the form without departing from the spirit and scope of the case. The above embodiments are only used to illustrate the present case and are not intended to limit the scope of the present invention. Any modification or change that is not in violation of the spirit of the case is the scope of patent application in this case. 7 M425121 [Simple description of the diagram] The first diagram is a schematic diagram of the combined unit of the creation. The second picture is the flow chart of the action of this creation. The third picture is the three-dimensional appearance of the creation. The fourth picture is the schematic diagram of the plane action of the laser cutting module. The fifth picture is a schematic diagram of the plane action of the grinding processing module of this creation. The sixth drawing is a three-dimensional appearance of another embodiment of the present invention. [Main component symbol description] Laser cutting module 10 Grinding processing module 20 Transport module 30 Track 31 Transport platform 32 Automatic positioning device 33 Machine 40 Waiting Processing component 50

Claims (1)

100年12月27日修正替換頁 六、申請專利範圍: 1. 一種複合工具機,其係包含有: 一雷射切割模組; 一研磨加工模組;以及 一輸送模組,該輸送模組兩端分別連接並通過雷射切割模組及研磨 加工模組,係可供一待加工元件置放於其上,並透過該輸送模組將待加 工元件依加工程序運送至雷射切割模組及研磨加工模組,以依序進行雷 射切割加工、雷射鑽孔加工及研磨加工等程序。 2. 如申請專利範圍第1項所述之複合工具機,其中,該雷射切割模組係為 一高能脈衝雷射切割裝置。 3. 如申請專利範圍第彳項所述之複合工具機,其中,該研磨加工模組係為 一電腦數值控制(CNC)加工機。 4如申請專利範@第3項所述之複合具機,其巾,該研磨加工模組係以 錢石刀具對該待加工元件進行研磨加工程序。 5. 如申清專利範圍第!項所述之複合工具機,其中,該輸送模組係以壓克 力輸送帶、鐵板輸送帶、紡織輸送帶之至少其中之一。 6. 如申請專利範圍第i項所述之複合工具機,其+,該輸送模組係包含至 少一設置於雷射切刻模組與研磨加工模組間之軌道,以及一可滑動地設 置於軌道上之輸送平台。 7. 如申請專利範圍第6項所述之複合工具機,其中,該輸送平台係為一真 空吸附平台。 8. 如申請專利範圍第1項所述之複合工具播,f丄 具機其中,該輸送模組更包含有 M425121 100年12月27日修正替換頁. 一自動定位裝置,俾供該待加工元件置放於其上時,用以對準定位待加 工元件之用。 9.如申請專利範圍第8項所述之複合工具機,其中,該自動定位裝置係為 一電荷耦合元件(CCD)自動定位器。 M425121 四、指定代表圖: (一) 本案指定代表圖為:第(三)圖。 (二) 本代表圖之元件符號簡單說明: 雷射切割模組10 研磨加工模組20 輸送模組30 機台40Revised replacement page on December 27, 100. Patent application scope: 1. A composite machine tool comprising: a laser cutting module; a grinding processing module; and a conveying module, the conveying module The two ends are respectively connected and passed through the laser cutting module and the grinding processing module, wherein a component to be processed is placed thereon, and the component to be processed is transported to the laser cutting module according to the processing program through the conveying module. And the grinding processing module, in order to perform laser cutting processing, laser drilling processing and grinding processing. 2. The composite machine tool of claim 1, wherein the laser cutting module is a high energy pulsed laser cutting device. 3. The composite machine tool of claim 2, wherein the grinding processing module is a computer numerical control (CNC) processing machine. [4] The composite tool machine of claim 3, wherein the polishing processing module performs a grinding process on the component to be processed by a rock stone cutter. 5. If the scope of patent application is clear! The compound machine tool according to the invention, wherein the conveying module is at least one of an acrylic conveyor belt, an iron plate conveyor belt and a textile conveyor belt. 6. The composite machine tool of claim i, wherein the transport module comprises at least one track disposed between the laser dicing module and the lapping module, and slidably disposed A conveyor platform on the track. 7. The composite machine tool of claim 6, wherein the conveying platform is a vacuum adsorption platform. 8. For the composite tool broadcast mentioned in the first paragraph of the patent application, the transport module further includes M425121 revised replacement page on December 27, 100. An automatic positioning device for the processing When the component is placed thereon, it is used to align the component to be processed. 9. The compound machine tool of claim 8, wherein the automatic positioning device is a charge coupled device (CCD) automatic positioner. M425121 IV. Designated representative map: (1) The representative representative of the case is: (3). (2) Brief description of the component symbols of the representative figure: Laser cutting module 10 Grinding processing module 20 Transfer module 30 Machine 40
TW100216027U 2011-08-26 2011-08-26 Combined machining center TWM425121U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100216027U TWM425121U (en) 2011-08-26 2011-08-26 Combined machining center

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100216027U TWM425121U (en) 2011-08-26 2011-08-26 Combined machining center

Publications (1)

Publication Number Publication Date
TWM425121U true TWM425121U (en) 2012-03-21

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TW100216027U TWM425121U (en) 2011-08-26 2011-08-26 Combined machining center

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