CN203292974U - Grinding device - Google Patents
Grinding device Download PDFInfo
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- CN203292974U CN203292974U CN2013203628545U CN201320362854U CN203292974U CN 203292974 U CN203292974 U CN 203292974U CN 2013203628545 U CN2013203628545 U CN 2013203628545U CN 201320362854 U CN201320362854 U CN 201320362854U CN 203292974 U CN203292974 U CN 203292974U
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- break bar
- grinding
- grinding unit
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Abstract
The utility model discloses a grinding device which comprises a workbench, a first grinding unit, a second grinding unit, a machine platform and a manipulator. The first grinding unit and the second grinding unit are arranged above the workbench. The machine platform is used for supporting base plates to move on the workbench, and the base plates are ground through the first grinding unit and the second grinding unit. The machine platform comprises a first machine platform and a second machine platform, wherein the first machine platform supports one base plate to be ground through the first grinding unit, and the second machine platform supports the other base plate to be ground through the second grinding unit. The rotary manipulator is arranged between the first machine platform and the second machine platform, adsorbs and carries the base plates through vacuum suckers and rotates at 90 degrees. Long edges and short edges of the base plates are ground in a separating mode so that the waiting period of the grinding process is shortened and production efficiency of a grinding production line is improved. In addition, during grinding switching, grinding debris is prevented from being taken into a vacuum valve located below the grinding machine platform so that the vacuum device is protected and the service lives of bearings are prolonged.
Description
Technical field
The utility model relates to a kind of lapping device.
Background technology
flat-panel monitor is more and more extensive in the application of list product at present, flat-panel monitor comprises the plasma display (PDP) of active illuminating, electroluminescent display (LED) and organic light emitting diode display (OLED), also comprise passive luminous liquid crystal display (LCD), above-mentioned these flat-panel monitors when processing and manufacturing all indispensable technique be exactly grinding to substrate, existing mode to substrate milling apparatus employing processing grinding is mainly the edging technological process in the Substrate manufacture industry: the first step, substrate is positioned over the break bar rear, add man-hour, image capture device reads alignment mark on glass, second step, program perform calculations to the coordinate figure of mark position, calculate position and the revisal data of grinding, the 3rd step, board absorption substrate, and along adverse current product direction, the substrate minor face is carried out grinding operation, the 4th step, with the substrate 90-degree rotation, positive direction is carried out grinding operation to the long limit of substrate.
But also there is following some deficiency in the equipment that is used for the substrate edging that prior art provides:
(1) edging (long limit and minor face) technique is carried out together, every front stand-by period of substrate processing is exactly the summation of grinding two groups of limit spent times, the pitch time of edging is generally 14s～17s after tested, and the stand-by period is longer, causes streamline production efficiency lower.
(2) when the grinding switching of growing group limit and short group of limit, easily will grind the dust that produces and bring in vacuum valve, and cause vacuum suction abnormal, can not protect well vacuum system device.And grinder station has by a small margin rising while by the mill minor face, being switched to the long limit of mill, can cause the vacuum valve under grinder station to exert an influence to the vacuum suction of substrate in grinder station generation height change, tend to cause switching rear absorption abnormal, affect follow-up grinding operation.
(3) in the whole grinding course of work, the axially-movable of board is many, and the loss ratio of axle is larger, affects the service life of axle, also affects the service life of whole equipment.
(4) when the grinding switching of growing group limit and short group of limit,, if the too high substrate that also can cause of the rotary speed of board slides, reduce grinding precision.
The utility model content
The technical problem that (one) will solve
For above-mentioned defect, the technical problems to be solved in the utility model is how existing substrate edger unit to be improved, and reduces the stand-by period in the edging process, improves whole grinding efficiency.
(2) technical scheme
For addressing the above problem, the utility model provides a kind of lapping device, specifically comprises:
Workbench;
Be arranged at the first grinding unit and the second grinding unit on described workbench;
Board, be used for bearing substrate and move on described workbench, through described the first grinding unit and/or the second grinding unit, described substrate ground.
Further, described board comprises the first board and the second board, described the first described substrate of board carrying grinds described substrate through described the first grinding unit, and described the second described substrate of board carrying grinds described substrate through described the second grinding unit.
Further, described the first board and described the second board comprise vacuum valve, and the described vacuum valve described substrate of absorption also drives described substrate and moves.
Further, described lapping device also comprises the rotatable carrying hand that is arranged between described the first board and described the second board, and described carrying hand is carried described substrate and 90-degree rotation by vacuum cup.
Further, described the first grinding unit comprises two combination break bars that are oppositely arranged, distance between described two combination break bars that are oppositely arranged can be regulated, wherein said combination break bar comprises edging break bar and angle lap break bar, described edging break bar is used for the limit of grinding base plate, and described angle lap break bar is used for four jiaos of grinding base plate.
Further, angle lap break bar in described combination break bar comprises the first angle lap break bar and the second angle lap break bar, edging break bar in described combination break bar is between described the first angle lap break bar and described the second angle lap break bar, and the edging of described edging break bar is parallel with the limit of substrate, and the edging of the edging of described the first angle lap break bar and described the second angle lap break bar is the side of the cone of putting upside down.
Further, described the second grinding unit comprises two edging break bars that are oppositely arranged, and the distance between described two edging break bars that are oppositely arranged can be regulated.
Further, described the first described substrate of board carrying grinds the minor face of described substrate and four jiaos through described the first grinding unit; Described carrying hand carries and drives described substrate 90-degree rotation; The long limit that described the second described substrate of board carrying grinds described substrate through described the second grinding unit.
Further, be provided with guide rail on described workbench, described the first board and described the second board are arranged on guide rail top and can be along described guide rail movement.
Further, described the first grinding unit, described the second grinding unit, described board and described carrying hand all are arranged on described workbench.
(3) beneficial effect
The utility model proposes a kind of lapping device, in the prior art edging technique and angle lap technique are separated on the basis of carrying out, long limit and minor face to substrate independently grind, two grinder stations namely are set, one of them grinder station carries out the grinding of minor face and four jiaos, and another grinder station is grown the grinding on limit.Be provided with the carrying hand between two grinder stations, after minor face and four jiaos are ground, the carrying hand transmits and 90 rotations of spending substrate, and then grow the grinding on limit, the grinding stand-by period between substrate just is reduced to minor face milling time and four jiaos of milling time sums by original long limit milling time and minor face milling time sum, grind latent period and reduce to 8s～10s by original 14s～17s, stand-by period on streamline just greatly reduces, and improves the production efficiency of abrasive flow waterline.Reduce axially-movable in the simultaneous grinding process, will grind chip while avoiding grinding switching and be brought in vacuum valve under board, guard vacuum.
Description of drawings
Fig. 1 is the structural representation of a kind of lapping device in the utility model embodiment one;
Fig. 2 is the top view of combination break bar in the utility model embodiment one;
Fig. 3 is the grinding process figure on the first board in the utility model embodiment one;
Fig. 4 is the workflow schematic diagram of a kind of lapping device in the utility model embodiment one;
Fig. 5 is the workflow schematic diagram of a kind of lapping device in the utility model embodiment two;
Fig. 6 is the workflow schematic diagram of a kind of lapping device in the utility model embodiment three.
Numbering expression respectively in figure:
100, workbench; 10: the first grinding units, 30: the first boards, 11,12: combination break bar, 111,121: the first angle lap break bars; 111a, 121a: the edging of the first angle lap break bar; 112,122: the second angle lap break bars; 112a, 121a: the edging of the second angle lap break bar; 113,123: the edging break bar; 113a, 123a: the edging of edging break bar; 20: the second grinding units; 40: the second boards; 50: the carrying hand; 60: substrate; 60a, 60b: the minor face of substrate; 60c, 60d: the long limit of substrate; 60e, 60f, 60g, 60h: four jiaos of substrate; 70: the three grinding units; 80: the three boards; V: family status direction.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
Embodiment one
A kind of lapping device is provided in the utility model embodiment one, and structural representation as shown in Figure 1, specifically comprises: workbench 100;
Be arranged at the first grinding unit 10 and the second grinding unit 20 on workbench 100;
Board, be used for bearing substrate and move on workbench 100, through the first grinding unit 10 and/or 20 pairs of substrates of the second grinding unit, grinds.
Board comprises that the first board 30 and the second board 40, the first board 30 bearing substrates grind through 10 pairs of substrates of the first grinding unit.Wherein the first grinding unit 10 comprise two combination break bars 11 that are oppositely arranged and 12, two combination break bars that are oppositely arranged between distance can regulate.Combination break bar 11 comprises the first angle lap break bar 111, edging break bar 113 and the second angle lap break bar 112, and edging break bar 113 is used for the limit of grinding base plate, and the first angle lap break bar 111 and the second angle lap break bar 112 are used for two angles of four jiaos of grinding base plate.Wherein edging break bar 113 is between the first angle lap break bar 111 and the second angle lap break bar 112, and the edging 113a of edging break bar 113 is parallel with the limit of substrate, the edging 112a of the edging 111a of the first angle lap break bar and/or the second angle lap break bar is the side of the cone of putting upside down, the edging 112a of the edging 111a of the first angle lap break bar and the second angle lap break bar can regard trapezoidal limit as, with the angle of the vertical edge of edging break bar 113, is approximately 45 degree.With the corresponding combination break bar 12 of combination break bar 11 also comprise with combination break bar 11 in the first angle lap break bar 111, edging break bar 113 and the second angle lap break bar 112 26S Proteasome Structure and Functions identical the first angle lap break bar 121, edging break bar 123 and the second angle lap break bar 122, the first angle lap break bars 121 and the second angle lap break bar 122 four jiaos of remaining two angles being used for grinding base plate all.Wherein the edging 123a of edging break bar 123 is also parallel with the limit of substrate, the edging 122a of the edging 121a of the first angle lap break bar and/or the second angle lap break bar is the side of the cone of putting upside down, the edging 122a of the edging 121a of the first angle lap break bar and the second angle lap break bar can regard trapezoidal limit as, with the angle of the vertical edge of edging break bar 123, is approximately 45 degree.Edging 111a, 113a in combination break bar 11 and edging 121a, 123a in 112a and combination break bar 12 and 122a are symmetrical, make up the top view of break bar 11 and 12 as shown in Figure 2.
The second board 40 bearing substrates grind through 20 pairs of substrates of the second grinding unit.The second grinding unit 20 comprises two edging break bars 21 and 22 that are oppositely arranged, and between edging break bar 21 and edging break bar 22, distance can be regulated.Edging break bar 113, the 123 and 21 and 22, first angle lap break bar 111, the 121 and second angle lap break bar 112,122 are all under the set of blades High Rotation Speed of up and down, each limit of substrate (or angle) to be ground.The first board 30 and the second board 40 comprise the vacuum valve (not shown in figure 1), and vacuum valve utilizes the vacuum suction substrate, and the drive substrate moves.
Lapping device also comprises the rotatable carrying hand 50 that is arranged between the first board 30 and the second board 40, and carrying hand 50 is adsorbing substrate by vacuum cup to be carried, and with the substrate 90-degree rotation.
Accurate for what grind, above-mentioned lapping device also comprises the first image acquisition device (not shown in figure 1), and it is arranged on the place ahead of the first grinding unit 10, is used for the position of the substrate 60 on the first board 30 is identified and locates.Before grinding, after the first image acquisition device read alignment mark on substrate 60, program performed calculations to the coordinate figure of alignment mark position, calculates abrasion site and revisal data, grind according to the abrasion site that calculates again, can improve the precision of grinding.The vacuum valve of the below of the first board 30 just utilizes pull of vacuum absorption substrate 60, makes substrate 60 along with the first board 30 moves.after calculating abrasion site and revisal data, the first board 30 is adsorbing substrate 60 and is moving forward, when substrate 60 moves to the combination break bar 11 of the first grinding unit 10 and 12 position along with the first board 30, according to the abrasion site that calculates and the revisal data minor face 60c to substrate 60, 60d and four jiaos of 60e, 60f, 60g and 60h grind, the concrete grinding steps of the first grinding unit 10 is: after distance suitable between substrate size adjustment combination break bar 11 and 12, two angle 60e and 60f that at first the first angle lap break bar 111 that is oppositely arranged and the 121 pairs of substrates 60 arrive grind, substrate 60 moves along with the movement of the first board 30, two minor face 60c and the 60d of the edging break bar 113 that centre is oppositely arranged and 123 pairs of substrates 60 grind, substrate 60 continues to move forward along with moving of the first board 30, latter two angle 60g and the 60h of the second angle lap break bar 112 that is oppositely arranged and 122 pairs of substrates 60 grind, the grinding work of the first grinding unit 10 is completed, the process of lapping of above-mentioned the first grinding unit 10 as shown in Figure 3.
After the grinding work of the first board 30 was completed, the vacuum cup of carrying hand 50 was adsorbing substrate 60 and moves and rotate, and after substrate 60 90-degree rotations that the first board 30 is transmitted, it was transferred to the second board 40.
The lapping device that the present embodiment provides also comprises the second image acquisition device, is arranged on the place ahead of the second grinding unit 20, is used for the position of the substrate 60 on the second board 40 is identified and locates.Before grinding, after first by the second image acquisition device, reading alignment mark on substrate, program performs calculations to the coordinate figure of alignment mark position, calculates abrasion site and revisal data.Vacuum valve under the second board 40 is adsorbing substrate 60 to be continued to move forward, then the edging break bar 21 that is oppositely arranged according to the abrasion site utilization of calculating and long limit 60a and the 60b of 22 pairs of substrates 60 grind, and so far, completes the grinding of a substrate.Again position the precision that can improve grinding before grinding for the second time.Further, carry out respectively the abrasion site of twice and determined before twice grinding, can increase substantially grinding precision.
The grinding workflow of above-mentioned whole milling apparatus as shown in Figure 4, wherein: V represents the family status direction, S1 represents the first board 30 bearing substrates 60 through the first grinding unit 10, and minor face 60c, 60d and four jiaos of 60e, 60f, 60g and 60h of substrate 60 are ground; S2 represents to carry hand 50 and carries and drive substrate 60 90-degree rotations; S3 represents the second board 40 bearing substrates 60 through the second grinding unit 20, and long limit 60a, the 60b of substrate 60 ground.
Need to prove, the vacuum cup that the rotation mode of substrate is not limited to the present embodiment and provides transmits and rotates, and can also realize by other means the rotation to substrate.
Substrate can be below along with board, moving due to board vacuum valve utilize vacuum suction and driving the substrate realization of moving, and the movement of board is because be provided with the guide rail (not shown) on workbench, the below of the first board 30 and the second board 40 has pulley, and the first board 30 and the second board 40 are arranged on the guide rail top, and the first board 30 and the second board 40 just can be by pulley along guide rail movements.In addition, the first grinding unit 10, the second grinding unit 20, the first board 30, the second board 40 and carrying hand 50 are arranged on workbench 100.
Need to prove, the movement of board is not only limited to yet pulley is set on board, in the mode that guide rail is set on workbench, realizes the movement of board on workbench, can also be to realize the integrated moving of board on workbench by alternate manner.
The utility model separately carries out two groups of edgings, mainly in order to reduce the stand-by period in process of lapping, if the time t1 that grind on the long limit of 22 pairs of substrates of edging break bar grinds the time t2 of minor face and the time t3 sum that angle lap break bar 13 grinds four jiaos, i.e. t1＜t2+t3 less than edging break bar 11.When the lapping device that the present embodiment provides grinds, the time in limit milling time t1 and minor face milling time and angle lap time sum t2+t3 of growing is grown as latent period T, be T=t2+t3, because the angle lap time is smaller than the long limit time of mill, so the angle lap time grinds the minor face time with mill minor face time sum T and the long limit time sum of mill is short, the value of T is 8s～10s as calculated.In prior art, the stand-by period is 14s～17s, and the milling apparatus that the present embodiment provides, for the time that the stand-by period T of the substrate that grinds same size has shortened 6s～7s, makes production efficiency be greatly improved.
To grow limit and grind to grind to separate with minor face and carry out, reduce the spinning movement of board, be conducive to the maintenance of bearing, extension device service life, also reduce the action that switch back and forth on the length limit, make the simplification of traveling process.Board no longer rotates in process of lapping, and the first board and the second board are carried out respectively twice contraposition, has significantly improved the precision of grinding.
Except said structure, the equipment that is used for the substrate edging also should comprise the structure with support function, power function that other existing lapping device possesses, and repeats no longer one by one.
In sum, the lapping device that the present embodiment provides independently grinds long limit and the minor face of substrate, and two boards namely are set, and wherein the first board grinds the minor face of substrate and four jiaos, and the second board grinds the long limit of substrate.Be provided with the carrying hand between two boards, minor face group and four jiaos of rear just substrate being transported to the carrying hand of grinding are carried out rotation and the carryings of 90 degree, and then grow the grinding of limit group, the grinding stand-by period just becomes present minor face milling time and four jiaos of milling time sums by original long limit milling time and minor face milling time sum, duration reduces to 8s～10s by original 14s～17s, stand-by period on streamline just greatly reduces, and improves the production efficiency of abrasive flow waterline.Reduce axially-movable in process of lapping, will grind chip while avoiding grinding switching and be brought in vacuum valve under board, guard vacuum.
Embodiment two
A kind of lapping device also is provided in embodiment two, the difference of comparing grinding process with embodiment one is: in embodiment two first the long limit to substrate grind, again the minor face of substrate and four jiaos are ground, change simultaneously the order of lapping device board in embodiment one, namely on the family status direction, the second board 40 is front, and the first board 30 is rear.
The workflow of the lapping device that the embodiment of the present invention two provides as shown in Figure 5, specifically comprises:
S4, the second board 40 are carrying edging break bar that substrate 60 moves to the second grinding unit 20, the second grinding units 20 long limit 60a, the 60b of substrate 60 are being ground, and substrate 60 moves to the position of carrying hand 50 along with the second board 40;
S5,50 pairs of substrates of carrying hand 60 carry out the rotation of 90 degree, and send substrate 60 to first board 30;
S6, the first board 30 are carrying substrate 60 and are moving to the first grinding unit 10, combination break bar on the first grinding unit 10 is successively to the first two angle 60e, the 60f of substrate 60, two minor face 60c, 60d of substrate 60 and latter two angle 60g, the 60h of substrate 60 grind respectively, so far, complete the grinding of a substrate, the grinding latent period between substrate remain long limit time of mill and mill minor face time and angle lap in the time time the longest.Concrete milling time will determine according to the size of substrate, but it is shorter to grind the stand-by period for the lapping device that the substrate of same size uses the present embodiment to provide.
In the structure of the combination break bar in the embodiment of the present invention two and embodiment one, the 26S Proteasome Structure and Function of combination break bar is all identical.
The embodiment of the present invention two has the identical beneficial effect of same embodiment one, does not repeat them here.
Embodiment three
Embodiment three also provides a kind of lapping device, be on the workbench 100 of lapping device in embodiment three to comprise three grinding units and corresponding three boards, i.e. the first grinding unit 10 and the first board 30, the second grinding unit 20 and the second board 40 and the 3rd grinding unit 70 and the 3rd board 80 with the difference of lapping device in embodiment one and embodiment two.The first grinding unit 10 comprises one group of edging break bar, is used for two minor face 60c, 60d of substrate 60 are ground.The second grinding unit 20 comprises for two long limit 60a, 60b to substrate 60 and grinding, the 3rd grinding unit 70 is between the first grinding unit 10 and the second grinding unit 20, be used for four angle 60e, 60f, 60g and 60h of substrate 60 are ground, as shown in Figure 6.Identical with embodiment two with embodiment one is, lapping device also comprises carrying hand 50 and workbench 100, and also has the structure that matches with guide rail by pulley between workbench 100 and three boards, and the principle of realization slip is also identical.
Based on the structure of above-mentioned lapping device, as shown in Figure 6, the grinding steps that carries out successively according to family status direction V is the workflow of the lapping device that Application Example three provides:
Four jiaos of 60e, 60f, 60g and 60h of B, 70 pairs of substrates 60 of the 3rd grinding unit grind;
C, 50 pairs of substrates of carrying hand 60 carry out the rotation of 90 degree;
Need to prove, if the order of grinding unit in three kinds of lapping devices that provide of embodiment is made variation, for example according to family status direction V according to being at first the second grinding unit, then being the 3rd grinding unit, is the order of the first grinding unit finally, and so corresponding grinding process is exactly the long limit of first grinding substrate, four angles of regrinding substrate, grind finally the minor face of substrate, the structure of each grinding unit is same as embodiment one and embodiment two, repeats no more herein.
Adopt the lapping device of the present embodiment three to grind will to grind long limit time, grinding minor face time and grind among four jiaos of times the longest as the stand-by period.Except the stand-by period further shortens, embodiment three is identical with the beneficial effect of embodiment one and embodiment two, does not repeat them here.
Above embodiment only is used for explanation the utility model; and be not limitation of the utility model; the those of ordinary skill in relevant technologies field; in the situation that do not break away from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all technical schemes that are equal to also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.
Claims (10)
1. a lapping device, is characterized in that, comprising:
Workbench;
Be arranged at the first grinding unit and the second grinding unit on described workbench;
Board, be used for bearing substrate and move on described workbench, through described the first grinding unit and/or the second grinding unit, described substrate ground.
2. lapping device according to claim 1, it is characterized in that, described board comprises the first board and the second board, described the first described substrate of board carrying grinds described substrate through described the first grinding unit, and described the second described substrate of board carrying grinds described substrate through described the second grinding unit.
3. lapping device according to claim 2, is characterized in that, described the first board and described the second board comprise vacuum valve, and the described vacuum valve described substrate of absorption also drives described substrate and moves.
4. lapping device according to claim 2, is characterized in that, described lapping device also comprises the rotatable carrying hand that is arranged between described the first board and described the second board, and described carrying hand is carried described substrate and 90-degree rotation by vacuum cup.
5. lapping device according to claim 1, it is characterized in that, described the first grinding unit comprises two combination break bars that are oppositely arranged, distance between described two combination break bars that are oppositely arranged can be regulated, wherein said combination break bar comprises edging break bar and angle lap break bar, described edging break bar is used for the limit of grinding base plate, and described angle lap break bar is used for four jiaos of grinding base plate.
6. lapping device according to claim 5, it is characterized in that, angle lap break bar in described combination break bar comprises the first angle lap break bar and the second angle lap break bar, edging break bar in described combination break bar is between described the first angle lap break bar and described the second angle lap break bar, and the edging of described edging break bar is parallel with the limit of substrate, and the edging of the edging of described the first angle lap break bar and described the second angle lap break bar is the side of the cone of putting upside down.
7. lapping device according to claim 1, is characterized in that, described the second grinding unit comprises two edging break bars that are oppositely arranged, and the distance between described two edging break bars that are oppositely arranged can be regulated.
8. the described lapping device of any one according to claim 4-7, is characterized in that, described the first described substrate of board carrying grinds the minor face of described substrate and four jiaos through described the first grinding unit; Described carrying hand carries and drives described substrate 90-degree rotation; The long limit that described the second described substrate of board carrying grinds described substrate through described the second grinding unit.
9. lapping device according to claim 2, is characterized in that, is provided with guide rail on described workbench, and described the first board and described the second board are arranged on guide rail top and can be along described guide rail movement.
10. lapping device according to claim 4, is characterized in that, described the first grinding unit, described the second grinding unit, described board and described carrying hand all are arranged on described workbench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203628545U CN203292974U (en) | 2013-06-24 | 2013-06-24 | Grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203628545U CN203292974U (en) | 2013-06-24 | 2013-06-24 | Grinding device |
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| CN203292974U true CN203292974U (en) | 2013-11-20 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104044055A (en) * | 2014-05-30 | 2014-09-17 | 京东方科技集团股份有限公司 | Base plate grinding method and base plate grinding device |
| CN105269424A (en) * | 2015-10-22 | 2016-01-27 | 京东方科技集团股份有限公司 | Grinding table mechanism, liquid crystal displayer glass grinding machine and grinding method |
| CN108705407A (en) * | 2018-04-25 | 2018-10-26 | 昆山国显光电有限公司 | Glass edge polishing device |
-
2013
- 2013-06-24 CN CN2013203628545U patent/CN203292974U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104044055A (en) * | 2014-05-30 | 2014-09-17 | 京东方科技集团股份有限公司 | Base plate grinding method and base plate grinding device |
| CN105269424A (en) * | 2015-10-22 | 2016-01-27 | 京东方科技集团股份有限公司 | Grinding table mechanism, liquid crystal displayer glass grinding machine and grinding method |
| CN108705407A (en) * | 2018-04-25 | 2018-10-26 | 昆山国显光电有限公司 | Glass edge polishing device |
| CN108705407B (en) * | 2018-04-25 | 2019-12-20 | 昆山国显光电有限公司 | Glass edge grinding device |
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