M424527 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種電腦架構，尤指一種具有極佳空間配置，以便利 散熱運作及提昇空間利用率之無風扇電腦系統架構。 【先前技術】 按，電腦設備中之重要元件如中央處理器(CPU)、南北橋晶片、硬碟等， 其運作時皆會產生高熱，若溫度過高將會影響電腦運作之性能，甚至會產 生當機或折損使用壽命，使得電腦設備其散熱措施便顯得非常重要，而電 _ 腦設備之散熱運作通常係藉由風扇來進行散熱，但在特定之電腦系統中也 有無風扇設置之架構，如一種電腦準系統，其常為精簡電腦之體積空間而 利用適度之傳導散熱以取代風扇之設置。習知無風扇電腦系統架構如第1、 2圖所示’該電腦系統架構90包括有一機殼91，該機殼91具有一容置空 間910，該容置空間910底部設有一硬碟基板92，用以設置一硬碟93 ;該 容置空間910並設有支架911以架設定位一電路板94,該電路板94上係設 有一處理器941、晶片942及其他電子元件943，再者，一散熱殼95係設 於該電路板94上，該散熱殼95相對該處理器941、晶片942處係設有導熱 φ 塊951、952，該導熱塊951、952係分別接觸該處理器941、晶片942，該 散熱殼95上並設有複數散熱鰭片953。 前述該習知無風扇電腦系統架構係將硬碟93之熱能藉由該硬碟基板92 傳導至機殼91而進行散熱’且將該處理器941、晶片942之熱能藉由該導 熱塊95卜952傳導至散熱殼95、散熱鰭片953而進行散熱。此類習知無風 扇電腦系統架構雖可前述構成進行散熱’但仍有其缺失存在，例如，該發 熱源之硬碟93及處理器941、晶片942係設於該容置空間910，如此將使 得熱源累積聚集於同一空間，造成相互熱干擾效應，更不利熱能之排除， 且將會影響電腦系統之運作，顯非理想之設計；再者，該習知無風扇電腦 系統架構為避免該硬碟93與處理器941、晶片942之相互熱干擾，乃必須 3 M424527 保持兩者一適當距離，如此將使得該容置空間910之空間利用率受到影響， 無法達到精簡空間之設置，相形之下也使該無風扇電腦系統架構體積之縮 小受到限制，無法更小型化，亦有一併加以改善之必要。因此，如何改善 習知此類無風扇電腦系統架構該等缺失問題，為業界應努力解決、克服之 進一課題》 緣此，本創作人有鑑於習知無風扇電腦系統架構使用上之缺失及其結 構設計上未臻理想之事實，本案創作人即著手研發其解決方案，希望能開 發出一種更具空間利用率、體積可縮小化及更佳散熱效果之無風扇電腦系 統架構，以服務社會大眾及促進此業之發展，遂經多時之構思而有本創作 之產生。 【新型内容】 本創作之目的係在提供一種無風扇電腦系統架構，其能提供不同之空 間設置而區隔成相異之熱源區，並藉由其極佳之空間配置而積極連到更佳 散熱效果及提昇空間利用率之功效者》 本創作之再一目的係在提供一種無風扇電腦系統架構，其能藉由不同 空間上發熱源電子元件之設置，以避免相互熱干擾效應，並能達到整體系 統架構其體積可縮小化之更佳設計者。 本創作為達到上述目的所採用之技術手段，其包括有：一機殼，該機 殼具有不同方位之第-端面及第二端面，該第—端面係設有一第一容置空 間’該第二端面係設有相鄰之-第二容置空間及第三容置空間，該第一容 置空間與該第二容置空間之_具有-區隔板而呈相反對應之設置；一硬 碟裝置，係固設於該第-容置空間，顧碟裝置至少包括有一硬碟，該硬 碟係設於-硬絲板上’該補基板鍾設於容置抑上；一孰導 管裝置，係、包括有至少-熱導座及至少—熱導管，該熱導座係設有至少一 第-熱導塊，該熱導管係固設於該機殼上，該熱導管—端係接觸該熱導座； -電路板裝置’係設於該機殼之該第二容置空間及該第三容置空間該電 M4245.27 路板裝置係包括有一電路板及設於該電路板上之一處理器，該處理器係接 觸該第一熱導塊。 本創作之技術手段進一步包括有：一般體裝置’該般體裝置包括有一 機殼，該機殼包括有四周呈相對之二組側面，該機殼具有上、下不同方位 端面之第一端面及第二端面，該第一端面設有一第一容置空間及位於該第 一容置空間一側之第一面板；該第二端面係包括有相鄰之一第二容置空間 及第三容置空間，該第二容置空間與該第一容置空間之間係設有一區隔板 而呈相反對應之設置，該第三容置空間係呈相對該第一面板之設置。 茲為使貴審査委員對本創作之技術特徵及所達成之功效更有進一步 之瞭解與認識，謹佐以較佳之實施例圖及配合詳細之說明，說明如後： 【實施方式】 請參閱第3至6圖，本創作無風扇電腦系統架構係包括有一殼體裝置 10、硬碟裝置20、電路板裝置30及熱導管裝置40 ;該殼體裝置10包括有 一機般11，該機殼11包括有四周呈相對之二組側面111、112，其中一側 面111係設有一固定孔114 ’而至少一側面112上係設有複數插接端113 (或 其他電子元件’如開關等）；該機般11具有上、下不同方位端面（依第4圖 所示方向）之第一端面12及第二端面13(參第4A圓），該第一端面12設有 一第一容置空間121及位於該第一容置空間121 —側之第一面板124,該第 一容置空間121下方係設有一區隔板120,該區隔板12〇係設有一連通缺部 123，即該區隔板120係未封閉該第一容置空間121之下方，使該第一容置 空間121(第一端面12)得以藉該連通缺部123連通該第二端面13，該第一 面板124係固結於該機殼11，或該第一面板124係與該機殼11 一體成型， 該第一面板124相鄰該第一容置空間121係向下彎折連接有一隔板us，該 隔板125係連接該區隔板120,用以形成該第一容置空間121之適當深度設 置；另第一容置空間121(機殼11)相對該固定孔114之另側係設有一抵肋 122，該抵肋122係設於該側面111上。參第4A圖，該第二端面13係包括 5 M424527 有相鄰之一第二容置空間131及第三容置空間132,該第二容置空間丨31係 呈相對該區隔板120(第一容置空間121)之設置’並藉該連通缺部123連通 該第二容置空間131與第一容置空間121，即該第一容置空間與該第二容置 空間之間藉該區隔板而呈相反對應之設置，該第三容置空間132係呈相對 該第一面板124之設置，該第三容置空間132較第二容置空間131係具有 較大之深度空間。又，在適當之實施方式中，該側面111或機殼11之適當 位置係設有複數散熱鰭片（未圖示），用以增加散熱效果。 該硬碟裝置20係包括有一硬碟21，係設於一硬碟基板22上，該硬碟 21 —端係設有一插接端211，該插接端211係連接有導線212;該硬碟基板 22兩端係分別彎折延伸設有一抵片組221及穿孔片223。該硬碟裝置20組 合時，係將該硬碟基板22蓋設於該第一端面12之第一容置空間121上， 並使該抵片組221抵卡於該抵肋122及藉一螺件115螺固於該穿孔片223、 固定孔114(如第5圖所示），使該硬碟裝置20固設於該機般11之第一容置 空間121處，此時該硬碟21係呈相對該區隔板120並留有適當間隙距離， 而該硬碟基板22係鄰接該第一面板124而相互略呈一平面。 該熱導管裝置40係包括有一熱導座41，該熱導座41相對該電路板裝 置30之一面係設有一第一熱導塊44及第二熱導塊45，該熱導座41係接觸 或包覆有熱導管42、43，該熱導管42、43並從該熱導座41兩側延伸出， 在本實施例中，該熱導管42、43係分別以雙管設置，其末端分別分設有一 熱導管端421、422、431及432，該熱導管端421、422、431及432係固設 於該機殼11上，且使該熱導管42 —端係傳導接觸該第一熱導塊44，而該 熱導管43 —端係傳導接觸該第二熱導塊45 ;在較佳之實施方式中，該熱導 管42、43係接觸該區隔板120，即該熱導座41係相對位於該第二容置空間 131或呈相對該區隔板120之設置。 該電路板裝置30係包括有一電路板31，該電路板31上設有一處理器 32 (CPU)、晶片33及複數電子元件34,該電路板31 —端係設有向上(側向） 延伸之擴充板311，該擴充板311上係設有複數電子元件312。該電路板裝 6 M424527 置3〇組合時，係將該電路板31設於該第二端面13之第二容置空間131與 第三容置空間132處，使該電路板31相對固設於該區隔板120之固定柱(未 圓示）上’並使該處理器32、晶片33係相對該第二容置空間131，而該擴 充板311、複數電子元件312係相對該第三容置空間132,由於該第三容置 空間132具有較大之深度空間，因此得以配合該擴充板311、複數電子元件 312具有位於該電路板31上之較大高度空間；而該硬碟裝置2〇之導線212 即通過該連通缺部123,由該第一容置空間121進入該第二容置空間131並 插接於該電路板31對應之連接器上(插接狀態未圖示），此時，該處理器32、 晶片33係分別接觸該第一熱導塊44、第二熱導塊45。 本創作無風扇電腦系統架構在完成上述組裝後，再以一第二面板110 蓋設於該機殼11之第二端面13，如第6圖所示，用以封閉該第二容置空間 131及第三容置空間132 ’而完成整體之組裝設置。 本創作無風扇電腦系統架構運作時，該硬碟21係藉由該硬碟基板22、 機殼11等之導接進行散熱，該處理器32、晶片33係藉由該第一熱導塊44、 第二熱導塊45、熱導管42、43及機殼11等之導接進行散熱，由於該硬碟 21及處理器32、晶片33係呈設於不同端面（第一端面12及第二端面13) 之第一容置空間121及第二容置空間131，將使得該硬碟21及處理器32、 晶片33所產生之熱源不會積聚於同一空間，易於散熱排除；再者，該殼體 裝置10兩端面其第一容置空間121及第二容置空間131、第三容置空間132 之設置’亦便利適當構件設置之規劃配置，而得以縮小整體體積空間，便 利電腦系統架構之輕薄短小化發展，相當具有產業上發展之實用性。 當本創作無風扇電腦系統架構藉由前述構成，能提供不同之空間設置 而區隔成相異之熱源區，使避免相互熱干擾效應，並藉由其極佳之空間配 置而積極達到更佳散熱效果及提昇空間利用率之功效，進而達到整體系統 架構其體積可縮小化之極佳構成設計》 综上所述，本創作確已符合新型專利之要件，爰依法提出專利申請。 惟以上所述者，僅為本創作較佳實施例而已，並非用來限定本創作實施之 範圍，故舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為 之均等變化與修飾，均應包括於本創作之申請專利範圍内。 【圖式簡單說明】 第1圖係習知無風扇電腦系統架構示意囷。 第2圖係習知無風扇電腦系統架構剖視示意圓。 第3圖係本創作之立體組合示意囫。 第4圖係本創作之分解示意圓。 第4A圖係本創作機殼之另一角度立遨示意圖。 第5圖係沿第3圖A-A剖線之剖視示意圓。 第6圖係沿第3圖B-B剖線之剖視示意囷。 【主要元件符號說明】 殼體裝置 10 硬碟裝置 20 電路板裝置30 熱導管裝置 40 機殼 11 第二面板 110 側面 111 侧面 112 固定孔 114 側面 112 插接端 113 第一端面 12 第二端面 13 第一容置空間121 第一面板 124 區隔板 120 連通缺部 123 隔板 125 抵肋 122 第二容置空間131 第三容置空間132 硬碟 21 硬碟基板 22 插接端 211 導線 212 抵片組 221 穿孔片 223 螺件 115 電路板 31 處理器 32 晶片 33 複數電子元件 34 擴充板 311 電子元件 312 熱導座 41 第一熱導塊 44 第二熱導塊45 熱導管 42 熱導管 43 熱導管端 421 熱導管端 422 熱導管端 431 熱導管端 432M424527 V. New Description: [New Technology Area] This creation is about a computer architecture, especially a fanless computer system architecture with excellent space configuration to facilitate heat dissipation and improve space utilization. [Prior Art] Press, important components in computer equipment such as central processing unit (CPU), north-south bridge chip, hard disk, etc., will generate high heat during operation. If the temperature is too high, it will affect the performance of computer operation, and even The occurrence of crash or loss of service life makes the heat dissipation measures of computer equipment very important, and the heat dissipation operation of the electric equipment is usually performed by a fan, but there is also a structure without a fan setting in a specific computer system. For example, a computer barebone system, which often reduces the volume of the computer and uses moderate conduction heat to replace the fan setting. The structure of the conventional fanless computer system is as shown in the first and second figures. The computer system architecture 90 includes a casing 91. The casing 91 has a receiving space 910. The hard disk substrate 92 is disposed at the bottom of the receiving space 910. The accommodating space 910 is provided with a bracket 911 for setting a circuit board 94. The circuit board 94 is provided with a processor 941, a chip 942 and other electronic components 943. A heat dissipating shell 95 is disposed on the circuit board 94. The heat dissipating shell 95 is provided with heat conducting blocks 951 and 952 opposite to the processor 941 and the wafer 942. The heat conducting blocks 951 and 952 are respectively in contact with the processor 941. On the wafer 942, the heat dissipation shell 95 is provided with a plurality of heat dissipation fins 953. The conventional fanless computer system architecture heats the heat of the hard disk 93 to the casing 91 by the hard disk substrate 92, and heats the processor 941 and the chip 942 by the heat conducting block 95. The 952 is conducted to the heat dissipation case 95 and the heat dissipation fins 953 for heat dissipation. The conventional fanless computer system architecture can be configured to perform heat dissipation, but there is still a defect. For example, the heat source hard disk 93 and the processor 941 and the chip 942 are disposed in the accommodating space 910. The accumulation of heat sources in the same space causes mutual thermal interference effects, which is more unfavorable for the elimination of thermal energy, and will affect the operation of the computer system, which is not ideal design. Moreover, the conventional fanless computer system architecture avoids the hard The mutual interference between the disc 93 and the processor 941 and the chip 942 requires that the M M 512 527 maintain an appropriate distance between the two, so that the space utilization of the accommodating space 910 is affected, and the compact space setting cannot be achieved. It also limits the size of the fanless computer system architecture to a smaller size, and it is not necessary to be more compact. Therefore, how to improve the lack of such fanless computer system architectures is a problem that the industry should strive to solve and overcome. Therefore, the creator has the lack of use of the fanless computer system architecture. The fact that the structural design is not ideal, the creator of the case started to develop its solution, hoping to develop a fanless computer system architecture with more space utilization, smaller size and better heat dissipation to serve the public. And to promote the development of this industry, through the long-term conception and the creation of this creation. [New Content] The purpose of this creation is to provide a fanless computer system architecture that can provide different spatial settings and separate into different heat source areas, and is actively connected to it with its excellent space configuration. The effect of heat dissipation and the improvement of space utilization efficiency is further aimed at providing a fanless computer system architecture capable of avoiding mutual thermal interference effects by setting the heat source electronic components in different spaces. A better designer who can achieve a smaller overall size than the overall system architecture. The technical means for achieving the above object includes: a casing having a first end surface and a second end surface of different orientations, wherein the first end surface is provided with a first accommodating space' The second end surface is provided with an adjacent second accommodating space and a third accommodating space, and the first accommodating space and the second accommodating space have an opposite corresponding arrangement; The disc device is fixed in the first-accommodating space, and the disc device comprises at least one hard disc, and the hard disc is disposed on the hard-wire board. The patch-mounting clock is disposed on the receiving device; The system includes at least a heat guide seat and at least a heat pipe. The heat guide seat is provided with at least one first heat guide block, and the heat pipe is fixed on the casing, and the heat pipe is in contact with the end pipe. The thermal conductive seat; the circuit board device is disposed in the second accommodating space of the casing and the third accommodating space. The electric M4245.27 circuit board device comprises a circuit board and is disposed on the circuit board. A processor that is in contact with the first thermal block. The technical means of the present invention further includes: a general body device, wherein the body device comprises a casing, and the casing comprises two opposite side faces which are opposite to each other, the casing has a first end face of the upper and lower end faces of different azimuths and a second end surface, the first end surface is provided with a first accommodating space and a first panel on a side of the first accommodating space; the second end surface includes a second accommodating space and a third accommodating space The space is disposed, and the second accommodating space is disposed opposite to the first accommodating space, and the third accommodating space is disposed opposite to the first panel. In order to give your reviewers a better understanding and understanding of the technical features of the creation and the efficacies achieved, please refer to the preferred embodiment diagram and the detailed description to explain the following: [Embodiment] Please refer to section 3. As shown in FIG. 6, the fanless computer system architecture includes a housing device 10, a hard disk device 20, a circuit board device 30, and a heat pipe device 40. The housing device 10 includes a machine 11 including the casing 11 There are two opposite side faces 111, 112, one of which has a fixing hole 114' and at least one side 112 is provided with a plurality of plug ends 113 (or other electronic components such as switches, etc.); The first end surface 12 and the second end surface 13 (refer to the 4A circle) having upper and lower end faces (in the direction shown in FIG. 4), the first end surface 12 is provided with a first accommodating space 121 and The first accommodating space 121 is on the side of the first panel 124. The first accommodating space 121 is provided with a partition plate 120. The partition 12 is provided with a connecting portion 123, that is, the partition The plate 120 is not closed below the first accommodating space 121, so that The first accommodating space 121 (the first end surface 12) is connected to the second end surface 13 by the connecting portion 123. The first panel 124 is fixed to the casing 11, or the first panel 124 is connected thereto. The first panel 124 is connected to the first accommodating space 121 to be bent downwardly connected with a partition plate us. The partition plate 125 is connected to the partition plate 120 to form the first volume. The first accommodating space 121 (the casing 11) is provided with a rib 122 on the other side of the fixing hole 114, and the rib 122 is attached to the side surface 111. Referring to FIG. 4A, the second end surface 13 includes 5 M424527 having a second one of the second accommodating spaces 131 and the third accommodating space 132, and the second accommodating space 丨31 is opposite to the partitioning plate 120 ( The first accommodating space 121) is connected to the second accommodating space 131 and the first accommodating space 121, that is, between the first accommodating space and the second accommodating space. The third accommodating space 132 is disposed opposite to the first panel 124, and the third accommodating space 132 has a larger depth space than the second accommodating space 131. . Moreover, in a suitable embodiment, a plurality of heat dissipating fins (not shown) are provided at appropriate positions of the side surface 111 or the casing 11 for increasing the heat dissipation effect. The hard disk device 20 includes a hard disk 21, which is disposed on a hard disk substrate 22. The hard disk 21 is provided with a plug end 211, and the plug end 211 is connected with a wire 212; the hard disk A pair of gussets 221 and a perforated sheet 223 are respectively bent and extended at both ends of the substrate 22 . When the hard disk device 20 is combined, the hard disk substrate 22 is placed on the first accommodating space 121 of the first end surface 12, and the yoke group 221 is stuck to the rib 122 and the snail The member 115 is screwed to the through hole 223 and the fixing hole 114 (as shown in FIG. 5), so that the hard disk device 20 is fixed to the first accommodating space 121 of the machine 11, and the hard disk 21 is at this time. The spacers 120 are spaced apart from each other by a suitable gap distance, and the hard disk substrate 22 is adjacent to the first panel 124 to be slightly planar with each other. The heat conducting device 40 includes a heat conducting seat 41. The heat conducting seat 41 is provided with a first heat guiding block 44 and a second heat guiding block 45 on one side of the circuit board unit 30. The heat conducting base 41 is in contact with Or coated with heat pipes 42, 43 extending from both sides of the heat conduction seat 41. In the embodiment, the heat pipes 42 and 43 are respectively disposed in a double tube, and the ends thereof are respectively A heat pipe end 421, 422, 431, and 432 is disposed on the casing 11, and the heat pipe 42 is electrically connected to the first heat. a guide block 44, and the end of the heat pipe 43 is in conductive contact with the second heat conducting block 45; in a preferred embodiment, the heat pipes 42, 43 are in contact with the partition plate 120, that is, the heat conducting block 41 Relatively located in the second accommodating space 131 or in the arrangement opposite to the partition plate 120. The circuit board device 30 includes a circuit board 31. The circuit board 31 is provided with a processor 32 (CPU), a chip 33 and a plurality of electronic components 34. The circuit board 31 is provided with an upward (lateral) extension. The expansion board 311 is provided with a plurality of electronic components 312. When the circuit board is mounted with a 6 M 424 527, the circuit board 31 is disposed at the second accommodating space 131 and the third accommodating space 132 of the second end surface 13 so that the circuit board 31 is relatively fixed to the circuit board 31. The fixing column (not shown) of the partition plate 120 of the area is disposed on the second housing space 131, and the expansion board 311 and the plurality of electronic components 312 are opposite to the third capacity. The space 132 is provided, because the third accommodating space 132 has a large depth space, so that the expansion board 311 and the plurality of electronic components 312 have a large height space on the circuit board 31; and the hard disk device 2 The wire 212 is inserted into the second accommodating space 131 through the first accommodating space 121, and is inserted into the corresponding connector of the circuit board 31 (not shown in the plugged state). At this time, the processor 32 and the wafer 33 are in contact with the first thermal block 44 and the second thermal block 45, respectively. After the assembly of the fanless computer system is completed, a second panel 110 is disposed on the second end surface 13 of the casing 11, as shown in FIG. 6, to close the second accommodating space 131. And the third accommodating space 132' completes the overall assembly setting. When the fanless computer system is in operation, the hard disk 21 is dissipated by the conduction of the hard disk substrate 22, the casing 11 and the like. The processor 32 and the wafer 33 are supported by the first heat guiding block 44. The second heat conducting block 45, the heat pipes 42, 43 and the casing 11 are connected to each other for heat dissipation, since the hard disk 21, the processor 32, and the wafer 33 are disposed on different end faces (the first end face 12 and the second end) The first accommodating space 121 and the second accommodating space 131 of the end surface 13) are such that the heat source generated by the hard disk 21, the processor 32, and the wafer 33 does not accumulate in the same space, and is easy to be disposed of by heat dissipation; The arrangement of the first accommodating space 121 and the second accommodating space 131 and the third accommodating space 132 on both end faces of the casing device 10 also facilitates the planned arrangement of the appropriate component arrangement, thereby reducing the overall volume and facilitating the computer system architecture. The development of light, thin and short is quite practical for industrial development. The fanless computer system architecture of the present invention can provide different spatial settings and separate into different heat source regions, so as to avoid mutual thermal interference effects, and actively achieve better by its excellent space configuration. The effect of heat dissipation and the efficiency of space utilization, and thus the overall system architecture can be reduced to an extremely compact design. In summary, this creation has indeed met the requirements of the new patent, and filed a patent application according to law. However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the shape, structure, characteristics and spirit described in the scope of the patent application are equally changed and modified. , should be included in the scope of the patent application of this creation. [Simple description of the diagram] Figure 1 is a schematic diagram of the structure of a conventional fanless computer system. Figure 2 is a schematic cross-sectional view of a conventional fanless computer system architecture. The third picture shows the three-dimensional combination of the creation. Figure 4 is a sketch of the decomposition of this creation. Figure 4A is a schematic view of another angle of the creation of the casing. Fig. 5 is a schematic cross-sectional view taken along line A-A of Fig. 3. Fig. 6 is a cross-sectional view taken along line B-B of Fig. 3; [Description of main component symbols] Housing device 10 Hard disk device 20 Circuit board device 30 Heat pipe device 40 Housing 11 Second panel 110 Side 111 Side 112 Fixed hole 114 Side 112 Plug end 113 First end face 12 Second end face 13 The first accommodating space 121, the first panel 124, the partition plate 120, the connecting portion 123, the partition plate 125, the rib 122, the second accommodating space 131, the third accommodating space 132, the hard disk 21, the hard disk substrate 22, the plug end 211, and the wire 212. Sheet set 221 perforated sheet 223 screw 115 circuit board 31 processor 32 wafer 33 complex electronic component 34 expansion board 311 electronic component 312 thermal guide 41 first thermal guide block 44 second thermal guide block 45 heat pipe 42 heat pipe 43 heat Duct end 421 heat pipe end 422 heat pipe end 431 heat pipe end 432