M423197 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種發光二極體燈管，特別是指一 種^有中央導熱平台之發光二極體燈管’且中央^熱 =台之厚度係自中央位置處逐漸朝向邊緣位置處遞 【先前技術】 在曰常生活中，為了在光線黑暗的環境中 =境;:位:照明設備遂成為一種不可或缺 現有之照明設備，多半都具備有燈 lii S3光源’在這些燈管或燈泡中，較為常 t者^日先燈管、白熾燈泡、齒素燈管或 中，^曰光燈管之耗電量約僅為白熾燈泡的四分; 二:命卻可達到白熾燈泡的五至十倍，且入二 ’可：用於廣角照明之緣故，故在 戋燈 泡中，日光燈管最廣為大眾所用。 然而，在啟動日光燈具發光時，電極 广、f管内之粒子（通常是呆蒸氣的粒子）發生碰 線於燈管内的螢光粉發 常都含有污染性之重全屬元夸之勞先私’通 回收細，更容易 壽命長等優點，發光時i H電量低、使用M423197 V. New description: [New technical field] This creation is about a light-emitting diode lamp, especially a light-emitting diode lamp with a central heat-conducting platform and the thickness of the center From the central position gradually toward the edge position [prior art] In the normal life, in the dark environment of the light =: position: lighting equipment becomes an indispensable existing lighting equipment, most of which have There are lights lii S3 light source 'in these lamps or bulbs, more often t ^ day first tube, incandescent bulb, dentate tube or medium, ^ dimming tube power consumption is only about four incandescent bulbs Divided into two; life can reach five to ten times the incandescent bulb, and into the second 'can: for the sake of wide-angle lighting, so in the bulb, the fluorescent tube is most widely used by the public. However, when the fluorescent lamp is activated, the particles in the tube and the particles in the tube (usually the particles that stay in the vapor) are often exposed to the fluorescent powder in the tube, which is always contaminated. Private 'pass recycling fine, easier to live longer, etc., when the light is low, i H low battery, use
遂逐㈣運用於製成咖燈管，藉以取代/上V 3 M423197 光燈管。 然而，環顧現有的LED燈管， 模組。在實務上，散有—散熱 屬合金(如鋁合金)材料所之金 組均勾挖空。以下常會將散熱模 來加以具體說明。 〃、代表性的習知技術 請參閱第一圖，j：係_干搞„ Λ 管之簡易構造示意圖/:::㈡習知發光二極體燈The 遂 (4) is used to make a coffee tube, in order to replace / on the V 3 M423197 light tube. However, look around the existing LED tube, module. In practice, the gold group of the scattered-heat-dissipating alloy (such as aluminum alloy) is hollowed out. The following will often specify the heat dissipation module. 〃, representative of the known technology, please refer to the first picture, j: Department _ dry „ Λ 之 simple structure diagram /::: (b) conventional light-emitting diode lamp
個發光二極體（第—圖中僅標 =U ]3)與-透光罩體14。 個發先-極體 你&承11所丄述’為了節省材料成本，散敎模組11 Πΐ圓柱狀結構，並且包含-散钕殼^ ^1、一導熱平台】12與複數個突起結構Η3。妒 體⑴係為一半圓管狀結構。導^ =ί=ί:!ιη的兩側，藉以與散‘體二 為構成上述之中空半圓柱狀結構。突 散熱殼體111的外表面向外突伸出。…冓3係自 ，板η具有-燈板寬度W1，為了節省燈板的材 :成ί興燈f寬度W1通常不寬，只需足以供設置發 ί一極體L之所需即可。透光罩體14 I结合於散熱 模組11，藉以容置並封裝燈板12與發光二極體13。 然而，在以上所述之習知技術中，普遍存在兩個 主要問趨第一個主要問題為在發光二極體1 3發光 產生熱旎丄導熱平台112越接近發光二極體13處 的mi度會越咼，導致在越接近發光二極體13處的導 熱平台112需要越高的熱容量，藉以快速吸收發光二 M423197 極體π發光時所產生之熱能。然而，由於導熱平台 】12係均勻地延伸連結至散熱殼體〗]]的兩側的緣 故，所以在導熱平台1]2鄰近於發光二極體13處的 熱容量與其他位置無異，無法快速吸收發光二極體13 發光時所產生之熱能。 第二主要問題在於在習知技術中，燈板12之燈 板寬度通常只滿足設置發光二極體13之所需即 可，所以燈板12之燈板寬度W1並未延伸至鄰接於 散熱殼體111處。在此前提下，當發光二極體燈管1 中之電源組件（圖未示）為一非隔型電源組件時，燈 板12無法提供足夠的空間，讓發光二極體13連接至 燈板的複數個引腳（圖未示）之間保持安全距離。 【新型内容】 本創作所欲解決之技術問題與目的： 有鑒於在習知技術所提供之發光二極體（Light Emitting Diode; LED)燈管中，普遍存在「導熱平台 鄰近於發光二極體處的熱容量不足，無法快速吸收發 光二極體發光時所產生之熱能」以及「燈板之燈板寬 度不足，致使當發光二極體燈管中之電源組件為一非 隔型電源組件時，無法提供足夠的空間讓發光二極體 的引腳能夠保持安全距離」等問題。 緣此，本創作之主要目的在於提供一種發光二極 體燈管，其係具有一中央導熱平台，並使中央導熱平 台鄰近於發光二極體處之厚度大於遠離發光二極體 處之厚度。 本創作之主要目的在於提供一種發光二極體燈 管，其係具有一燈板，且燈板延伸至鄰接於散熱殼體 5 M423197 處，藉以在發光二極體燈管中之電源組件（圖未示） 為一非隔型電源組件時，可以提供足夠的空間，使發 光二極體連接至燈板的複數個引腳之間保持安全距 離0 本創作解決問題之技術手段： 本創作為解決習知技術之問題，所採用之必要技 術手段係提供一種發光二極體（Light Emitting Diode; LED)燈管，且LED燈管包含一散熱組件、一燈板 與複數個LED。散熱組件係沿一延伸方向延伸，並且 包含一散熱殼體與一導熱座。 散熱殼體係為一近似半圓管狀結構；導熱座係為 一近似η形截面結構，並且包含一中央導熱平台與二 導熱延伸片。中央導熱平台係設置於散熱殼體内，並 自一中央位置朝向鄰近於散熱殼體之兩側延伸至二 個邊緣位置，中央導熱平台之厚度係自中央位置處逐 漸朝向邊緣位置處遞減。導熱延伸片係自中央導熱平 台之邊緣位置延伸至散熱殼體，且散熱殼體、中央導 熱平台與導熱延伸片係一體成型。 燈板係沿延伸方向延伸，並具有一配置面、一散 熱面與二個侧邊，其中，散熱面係貼附於中央導熱平 台，且側邊係鄰接於散熱殼體。上述複數個LED係 沿延伸方向設置於配置面對應於中央導熱平台處。 從上述之必要技術手段加以延伸，在本創作較佳 實施例所提供之較佳技術手段中，LED燈管更包含一 透光罩體"透光罩體可為另一近似半圓管狀結構’用 以結合於散熱組件，藉以封裝並容置燈板與LED。較 佳者，透光罩體可具有至少一罩體卡接部，散熱組件 6 M423197 可包含至少一散熱組件卡接部，且罩體卡接部係用以 沿延伸方向移動卡合於散熱組件卡接部，藉以使透光 罩體卡接結合於散熱組件。 LED燈管更可包含一對電極套與一電源組件。電 極套可供套合散熱組件與透光罩體之兩端，且電源組 件可設置於導熱座之近似η形截面結構内，亦可外接 於燈管外部。此外，散熱組件更可包含複數個突起結 構，且突起結構係自散熱殼體之外表面向外突伸出， 藉以增加散熱組件與外界環境接觸之表面積。 本創作對照先前技術之功效： 相較於習知技術所提供之LED燈管，由於在本 創作所提供之LED燈管中，係使中央導熱平台之厚 度自中央位置處逐漸朝向邊緣位置處遞減，換言之， 係使中央導熱平台鄰近於設置LED的中央位置處， 具有較厚的厚度；因此，可在中央導熱平台鄰近於設 置LED的中央位置處具有較高的熱容量，可以快速 吸收發光二極體發光時所產生之熱能，據以發揮較佳 之熱傳導功效。 此外，相較於習知技術所提供之LED燈管，由 於在本創作所提供之LED燈管中，係使燈板之側邊 延伸至鄰接於散熱殼體；因此，在LED燈管中之電 源組件為一非隔型電源組件時，可以提供足夠的空間 讓發光二極體連接至燈板的複數個引腳之間保持安 全距離，藉以使LED燈管符合國際的安全規範。 綜合以上所述，藉由本創作所提供之技術，不僅 可以使LED燈管具有較佳之熱傳導功效，更有助於 符合國際的安全規範而提供更佳之使用安全保障。 7 M423197 【實施方式】 由於本創作所提供之發光二極體（Light Emitting Diode; LED)燈管（以下簡稱為「LED燈管」）可結 合多種燈座，而廣泛運用於製作多種LED燈具，而 且相關之組合實施方式更是不勝牧舉，故在此不再一 一贅述，僅針對LED燈管本身，列舉其中一個較佳 實施例加以具體說明。 請參閱第二圖至第四圖，第二圖係顯示本創作較 佳實施例所提供之LED燈管之主要元件處於分解狀 態下之立體圖；第三圖係顯示本創作較佳實施例所提 供之LED燈管之處於組合狀態下之立體圖；第四圖 係顯示本創作較佳實施例所提供之LED燈管處於組 合狀態下之剖面結構示意圖。如第二圖至第四圖所 示，一 LED燈管2包含一散熱組件21、一燈板22、 複數個LED 23、一透光罩體24、一電源組件（Power Assembly) 25以及一對電極套26與27。 散熱組件21係沿一延伸方向I延伸，並且包含 一散熱殼體211、一導熱座212、複數個突起結構213 以及二個散熱組件卡接部214與215。同時，散熱組 件21係由導熱性較佳之材料所組成，較佳者，散熱 組件21由鋁合金所組成，並利用擠製或壓鑄等方式 成型。 散熱殼體211係為一近似半圓管狀結構。導熱座 212係為一近似η形截面結構，並且包含一中央導熱 平台2121以及二個導熱延伸片2122與2123。 中央導熱平台2121係設置於散熱殼體211内， 並自一中央位置2121a朝向鄰近於散熱殼體之兩側延 8 M423197 伸至二個邊緣位置2〗21b與2】21c。中央導熱平台 2】2]在中央位置212]a處之具有一最大導熱;^台& 度T】’中央導熱平台2]2]在邊緣位置2i2]b與2】2】c 處之具有一最小導熱平台厚度T2。同時，中央導熱 t台2121之厚度係自令央位置2】21a處逐漸朝向邊' 緣位置2121b與2l2]c處遞減。 導熱延伸片2]22與2】23係自中央導熱平台之邊 、，彔位，212〗b與2121c延伸至散熱殼體21】中間處， 曰:^ 生之熱可快速且有效率的傳導到散熱 ϊΐ ί散熱殼體2Π、中央導熱平台2121以及 ¥…延伸2122與2123係一體成型。 上述複數個突起結構2Π係自散熱殼 體211之外 ‘觸^ j出’藉以增加散熱組件21與外界環境 接觸之表面積。散熱組件卡接部214與215係設置於 散熱殼體211鄰接於透光罩體24處，並且可為卡人 凸條、卡合凹槽或卡合勾。&芷且了為卡口 系f延伸方向I延伸，並具有一配置面 政”、、面222以及二個側邊223與224，苴中， 占附於中央導熱平台2121中間並、利用 熱殼體21】，使燈m邊223與224係鄰接於散 數個LED 23係沿mV登板寬度W2。上述複 於中央導熱平台2⑵處向1设置於配置面221對應 透光罩體24可為另j. ,, π ^ , 以結合於散㈣件^另二近似半圓管狀結構，並用 LED 23。透光封裝並容置燈板22與 242，且罩體卡接^ 241 ^有^個罩體卡接部241與 卡接部214盥215之+ /、2可為配合於散熱組件 /、 之卡合凸條、卡合凹槽或卡合勾。 丄=，罩體卡接部24】與242係用以沿延伸方向】移 體合於散熱組件卡接部214與215，藉以使透光罩 卡接結合於散熱組件21。 座電源組件（PowerAssembb〇25可設置於於導熱 因 之近似η形截面結構内，亦可外接於燈管外部， =，完全不會佔用LED23進行配置、打線或組裝 鱼=之空間。電極套26與27可供套合散熱組件21 忠光罩體24之兩端。電極套26具有兩個LED燈 極261與262，電極套27亦具有兩個LED燈管 亟（圖未示），藉以供結合於一燈座之二對燈座電 極（圖未示）。 相較於習知技術所提供之LED燈管1，由於在本 1作所提供之LED燈管2中，係使中央導熱平台2121 ’厚度自中央位置2121a處逐漸朝向邊緣位置2121b 與2121c處遞減，換言之，係使中央導熱平台2121 鄰近於設置LED 23的中央位置2121a處，具有較厚 的厚度（即最大導熱平台厚度丁1);因此，可在中央 導熱平台2121鄰近於設置LED23的中央位置2121a 處具有較高的熱容量，並且與導熱延伸片2122以及 2123直接連接，可以快速吸收LED 23發光時所產生 之熱能’據以發揮較佳之熱傳導功效。 此外’相較於習知技術所提供之Led燈管1，由 於在本創作所提供之LED燈管2中，係使燈板22之 側邊延伸至鄰接於散熱殼體211 ;因此，可使LED燈 管2之燈板寬度W2大於（習知）LED燈管1之燈板 寬度W1。 在LED燈管2中之電源組件（圖未示）為一非 隔型電源紕件時，可以提供足夠的空間讓LED 23連 接至燈板22的複數個引腳（圖未示） 距離，藉赠LED燈管2符合國^安全^f。女全 综合以上所述，藉由本創作所提供之技術， 可=使LED燈管2具有較佳之熱料功效， 於符合國際的安全規範而提供更佳之使用安全保障。 藉由上述之本創作實施例可知，本創作確具 f之利用價值。惟以上之實_說明’僅為本^作2 ^佳實施例說明，舉凡所屬技術領域中具有通常知 者當可依據本創作之上述實施例說明而作苴它種^ ^改良及變化。然而這些依據本創作實施例所作 改f及I：化，當仍屬於本創作之創作精神及界定之 專利範圍内。 【圖式簡單說明】 第圖係顯示一種習知發光二極體燈管之簡易構造 示意圖； 第二圖係顯示本創作較佳實施例所提供之LED燈管 之主要.元件處於分解狀態下之立體圖； 第二圖係顯示本創作較佳實施例所提供之LED燈管 之處於組合狀態下之立體圖；以及 第四圖係顯示本創作較佳實施例所提供之led燈管 處於組合狀態下之剖面結構示意圖。 【主要元件符號說明】 1 (習知）led燈管 M42.3197The light-emitting diodes (first-numbered =U]3) and the light-transmitting cover 14 are used. In order to save material costs, the divergent module 11 Πΐ cylindrical structure, and contains - dilated shell ^ ^ 1, a heat conduction platform 12 and a plurality of protruding structures Η 3. The steroid (1) is a semi-circular tubular structure. The two sides of the ^^ί=ί:!ιη are used to form the hollow semi-cylindrical structure described above. The outer surface of the heat dissipation housing 111 protrudes outward. ... 冓 3 series from , the plate η has - the width of the lamp board W1, in order to save the material of the lamp board: the width W1 of the illuminating lamp f is usually not wide enough, and only needs to be sufficient for the setting of the illuminating body L. The transparent cover 14 I is coupled to the heat dissipation module 11 for accommodating and packaging the lamp plate 12 and the light-emitting diode 13. However, in the above-mentioned conventional techniques, there are two main problems that are ubiquitous. The first major problem is that the closer the light-emitting diode 112 is to the light-emitting diode 112, the closer the light-emitting diode 112 is to the light-emitting diode 13 The higher the degree, the higher the heat capacity required for the heat conducting platform 112 at the closer to the light-emitting diode 13 is, so that the heat energy generated when the light-emitting two M423197 polar body is illuminated by π is quickly absorbed. However, since the heat-conducting platform 12 is evenly extended to the two sides of the heat-dissipating housing, the heat capacity of the heat-conducting platform 1] 2 adjacent to the light-emitting diode 13 is no different from other positions, and cannot be quickly The heat energy generated when the light-emitting diode 13 emits light is absorbed. The second major problem is that in the prior art, the width of the lamp panel 12 is generally only required to set the LEDs 13, so that the panel width W1 of the panel 12 does not extend adjacent to the heat sink. At body 111. Under this premise, when the power component (not shown) in the LED lamp 1 is a non-isolated power component, the lamp 12 cannot provide sufficient space for the LED 13 to be connected to the panel. Maintain a safe distance between the multiple pins (not shown). [New content] The technical problems and objectives to be solved by this creative: In view of the light-emitting diode (LED) lamps provided by the prior art, there is a common "thermal conduction platform adjacent to the light-emitting diode" The heat capacity at the place is insufficient to quickly absorb the heat generated by the light-emitting diodes and the width of the light board of the light board is insufficient, so that when the power supply component in the light-emitting diode lamp is a non-isolated power supply component, There is no way to provide enough space for the pins of the LED to maintain a safe distance. Accordingly, the main object of the present invention is to provide a light-emitting diode lamp having a central heat-conducting platform such that the thickness of the central heat-conducting platform adjacent to the light-emitting diode is greater than the thickness away from the light-emitting diode. The main purpose of the present invention is to provide a light-emitting diode lamp having a light plate extending adjacent to the heat-dissipating housing 5 M423197 for power supply components in the light-emitting diode lamp (Fig. Not shown) When it is a non-isolated power supply unit, it can provide enough space to keep the safety distance between the multiple pins of the light-emitting diode connected to the light board. The technical means to solve the problem is solved by this creation: In the conventional technology, the necessary technical means is to provide a light emitting diode (LED) lamp, and the LED tube comprises a heat dissipating component, a light board and a plurality of LEDs. The heat dissipating component extends along an extending direction and includes a heat dissipating housing and a heat conducting seat. The heat dissipating housing is an approximately semicircular tubular structure; the thermally conductive seat is an approximately n-shaped cross-sectional structure and includes a central thermally conductive platform and two thermally conductive extension sheets. The central heat conduction platform is disposed in the heat dissipation housing and extends from a central position toward the two edge positions adjacent to the heat dissipation housing. The thickness of the central heat conduction platform decreases from the central position toward the edge position. The heat conduction extension extends from the edge of the central heat conduction platform to the heat dissipation housing, and the heat dissipation housing, the central heat conduction platform and the heat conduction extension are integrally formed. The lamp board extends in the extending direction and has a disposition surface, a heat dissipating surface and two side edges, wherein the heat dissipating surface is attached to the central heat conduction platform, and the side edges are adjacent to the heat dissipation housing. The plurality of LEDs are disposed along the extending direction at the arrangement surface corresponding to the central heat transfer platform. In the preferred technical means provided by the preferred embodiment of the present invention, the LED tube further comprises a transparent cover " the transparent cover can be another approximately semi-circular tubular structure. Used to be combined with a heat dissipating component to package and house the lamp panel and the LED. Preferably, the transparent cover can have at least one cover engaging portion, and the heat dissipating component 6 M423197 can include at least one heat dissipating component engaging portion, and the cover engaging portion is configured to be moved and engaged with the heat dissipating component in the extending direction. The latching portion is configured to snap-fit the transparent cover to the heat dissipating component. The LED tube can further comprise a pair of electrode sleeves and a power component. The electrode sleeve can be used for accommodating the heat dissipating component and the two ends of the transparent cover body, and the power component can be disposed in the approximately n-shaped cross-sectional structure of the heat conducting seat, or can be externally connected to the outside of the lamp tube. In addition, the heat dissipating component may further comprise a plurality of protruding structures, and the protruding structure protrudes outward from the outer surface of the heat dissipating casing, thereby increasing the surface area of the heat dissipating component in contact with the external environment. Compared with the LED lamp provided by the prior art, the present invention reduces the thickness of the central heat conduction platform from the central position toward the edge position in the LED tube provided by the present invention. In other words, the central heat conduction platform is adjacent to the central position of the LED, and has a thick thickness; therefore, the central heat conduction platform can have a higher heat capacity adjacent to the central position of the LED, and can quickly absorb the light emitting diode. The heat energy generated when the body emits light is used to exert a better heat transfer effect. In addition, compared with the LED tube provided by the prior art, in the LED tube provided by the present invention, the side of the lamp board is extended to be adjacent to the heat dissipation housing; therefore, in the LED tube When the power supply component is a non-isolated power supply component, it can provide sufficient space for the LED to be connected to the plurality of pins of the lamp board to maintain a safe distance, so that the LED lamp tube meets international safety regulations. In summary, the technology provided by this creation not only enables the LED tube to have better heat transfer efficiency, but also helps to meet the international safety regulations and provide better use safety. 7 M423197 [Embodiment] Light Emitting Diode (LED) lamps (hereinafter referred to as "LED tubes") provided by this creation can be combined with a variety of lamp holders, and are widely used in the production of various LED lamps. Moreover, the related combined implementation manners are more inconsistent, so it will not be repeated here, and only one of the preferred embodiments will be specifically described for the LED tube itself. Please refer to the second to fourth figures. The second drawing shows a perspective view of the main components of the LED lamp provided in the preferred embodiment of the present invention in an exploded state. The third figure shows the preferred embodiment of the present invention. A perspective view of the LED tube in a combined state; the fourth diagram shows a cross-sectional structure of the LED tube provided in the preferred embodiment of the present invention in a combined state. As shown in the second to fourth figures, an LED tube 2 includes a heat dissipating component 21, a light panel 22, a plurality of LEDs 23, a light transmissive cover 24, a power assembly 25, and a pair. Electrode sleeves 26 and 27. The heat dissipating component 21 extends along an extending direction I and includes a heat dissipating housing 211, a heat conducting base 212, a plurality of protruding structures 213, and two heat dissipating component engaging portions 214 and 215. At the same time, the heat dissipating component 21 is composed of a material having better thermal conductivity. Preferably, the heat dissipating component 21 is composed of an aluminum alloy and is formed by extrusion or die casting. The heat dissipation housing 211 is an approximately semi-circular tubular structure. The thermally conductive seat 212 is an approximately n-shaped cross-sectional structure and includes a central thermally conductive platform 2121 and two thermally conductive extension sheets 2122 and 2123. The central heat conduction platform 2121 is disposed in the heat dissipation housing 211 and extends from a central position 2121a toward the two sides adjacent to the heat dissipation housing 8 M423197 to two edge positions 2 21b and 2 21c. The central heat conduction platform 2] 2] has a maximum heat conduction at the central position 212]a; the table & degree T] 'the central heat conduction platform 2] 2] has at the edge positions 2i2] b and 2] 2] c A minimum thermal conductivity platform thickness T2. At the same time, the thickness of the central heat conduction stage 2121 is gradually decreased from the central position 2] 21a toward the edge 'edge positions 2121b and 2l2]c. The heat conduction extension sheets 2] 22 and 2] 23 are from the side of the central heat conduction platform, and the clamp positions 212, b and 2121c extend to the middle of the heat dissipation housing 21], and the heat of the heat can be quickly and efficiently conducted. The heat dissipation housing 2, the central heat conduction platform 2121, and the extension 2122 and 2123 are integrally formed. The plurality of protrusion structures 2 are externally mounted from the heat dissipation housing 211 to increase the surface area of the heat dissipation component 21 in contact with the external environment. The heat dissipating component engaging portions 214 and 215 are disposed at the heat dissipating housing 211 adjacent to the transparent cover body 24, and may be a card ridge, a snap groove or a snap hook. & and extending the direction I of the bayonet f, and having a configuration face", the face 222 and the two sides 223 and 224, in the middle, occupying the middle of the central heat conduction platform 2121, using heat The housing 21] is such that the lamp m sides 223 and 224 are adjacent to the plurality of LEDs 23 along the mV board width W2. The above-mentioned central heat conduction platform 2 (2) is disposed at 1 on the arrangement surface 221 corresponding to the transparent cover 24 Another j.,, π ^ , to be combined with the scattered (four) pieces ^ another two approximately semi-circular tubular structure, and with LED 23. Light-transmissive package and accommodate the light board 22 and 242, and the cover body is attached ^ 241 ^ ^ hood +/-2 of the body engaging portion 241 and the engaging portion 214盥215 may be engaged with the heat dissipating component/, the engaging ridge, the engaging groove or the engaging hook. 丄=, the cover engaging portion 24] And the 242 is used to extend in the extending direction to the heat dissipating component engaging portions 214 and 215, so that the transmissive cover is snap-fitted to the heat dissipating component 21. The power supply component (PowerAssembb〇25 can be set in the heat conduction factor approximation In the n-shaped cross-section structure, it can also be externally connected to the outside of the lamp tube, and it will not occupy the space where the LED 23 is configured, wired or assembled. The pole sleeves 26 and 27 can be used to fit the two ends of the heat shield assembly 24. The electrode sleeve 26 has two LED lamp poles 261 and 262, and the electrode sleeve 27 also has two LED lamp tubes (not shown). The two pairs of lamp holder electrodes (not shown) are combined for use in a lamp holder. Compared with the LED lamp tube 1 provided by the prior art, since the LED tube 2 provided in the present invention is used, the center is The thickness of the heat conducting platform 2121' is gradually decreased from the central position 2121a toward the edge positions 2121b and 2121c, in other words, the central heat conducting platform 2121 is adjacent to the central position 2121a of the set LED 23, and has a thick thickness (ie, maximum heat conduction platform thickness). Therefore, the central heat conduction platform 2121 has a higher heat capacity adjacent to the central position 2121a where the LEDs 23 are disposed, and is directly connected to the heat conduction extension sheets 2122 and 2123, and can quickly absorb the heat energy generated when the LED 23 emits light' In order to achieve better heat transfer efficiency, in addition, the Led lamp tube 1 provided by the prior art is such that in the LED tube 2 provided by the present invention, the side of the lamp board 22 is extended to be adjacent to the heat dissipation. case 211; Therefore, the width W2 of the LED tube 2 can be made larger than (the conventional) the width W1 of the LED tube 1. The power component (not shown) in the LED tube 2 is a non-isolated power supply. When the device is provided, sufficient space can be provided for the LED 23 to be connected to the plurality of pins (not shown) of the lamp plate 22, and the lending LED lamp 2 conforms to the national security ^f. The technology provided by the present invention can make the LED tube 2 have better thermal efficiency and provide better use safety in accordance with international safety regulations. It can be seen from the above-mentioned embodiments of the present invention that the present creation has the use value of f. However, the above descriptions are merely illustrative of the preferred embodiments, and those of ordinary skill in the art can be modified and varied in light of the above-described embodiments of the present invention. However, these changes and I's based on the present embodiment are still within the scope of the creative spirit of the creation and the scope of the definition. BRIEF DESCRIPTION OF THE DRAWINGS The figure shows a simplified schematic diagram of a conventional light-emitting diode lamp; the second figure shows the main components of the LED lamp provided by the preferred embodiment of the present invention. The component is in an exploded state. The second figure shows a perspective view of the LED lamp tube provided in the preferred embodiment of the present invention in a combined state; and the fourth figure shows that the led lamp tube provided by the preferred embodiment of the present invention is in a combined state. Schematic diagram of the section structure. [Main component symbol description] 1 (conventional) led lamp M42.3197
11 散熱模組 111 散熱殼體 112 導熱平台 113 突起結構 12 燈板 13 發光二極體 14 透光罩體 2 (本創作）LED燈管 21 散熱組件 211 散熱殼體 212 導熱座 2121 中央導熱平台 2121a 中央位置 2121b ' 2121c 邊緣位置 2122 ' 2123 導熱延伸片 213 突起結構 214 、 215 散熱組件卡接部 22 燈板 221 配置面 222 散熱面 223 ' 224 側邊 23 LED M423197 24 透光罩體 241 ' 242 罩體卡接部 25 電源組件 26 ' 27 電極套 261 、 262 LED燈管電極 W1 燈板寬度 W2 I 燈板見度 延伸方向 T1 最大導熱平台厚度 T2 最小導熱平台厚度11 Heat dissipation module 111 Heat dissipation housing 112 Heat conduction platform 113 Projection structure 12 Light board 13 Light-emitting diode 14 Light-transmissive cover 2 (this creation) LED tube 21 Heat-dissipating component 211 Heat-dissipating housing 212 Thermal-conducting seat 2121 Central heat-conducting platform 2121a Center position 2121b ' 2121c Edge position 2122 ' 2123 Thermal extension piece 213 Projection structure 214 , 215 Heat sink assembly 22 Light plate 221 Configuration surface 222 Heat dissipation surface 223 ' 224 Side 23 LED M423197 24 Transparent cover 241 ' 242 Cover Body clamping part 25 Power supply assembly 26 ' 27 Electrode sleeve 261, 262 LED tube electrode W1 Lamp width W2 I Light board visibility extension direction T1 Maximum thermal conductivity platform thickness T2 Minimum thermal conductivity platform thickness