TWM419001U - Drive mechanism of wafer cleaning device - Google Patents

Drive mechanism of wafer cleaning device Download PDF

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Publication number
TWM419001U
TWM419001U TW100213560U TW100213560U TWM419001U TW M419001 U TWM419001 U TW M419001U TW 100213560 U TW100213560 U TW 100213560U TW 100213560 U TW100213560 U TW 100213560U TW M419001 U TWM419001 U TW M419001U
Authority
TW
Taiwan
Prior art keywords
gear
baffle
wafer cleaning
rotating shaft
cleaning device
Prior art date
Application number
TW100213560U
Other languages
Chinese (zh)
Inventor
Yuan-Zhou Liu
Original Assignee
Kojem Internat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kojem Internat Co Ltd filed Critical Kojem Internat Co Ltd
Priority to TW100213560U priority Critical patent/TWM419001U/en
Priority to CN2011202758275U priority patent/CN202199565U/en
Publication of TWM419001U publication Critical patent/TWM419001U/en

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Description

五、新型說明: 【新型所屬之技術領域】 特別是關於一種晶圓清 本創作係與半導體設備有關, 潔裝置之驅動機構。 【先前技術】 晶圓清潔裝置主要具有二可旋轉之清潔刷,利用清潔 Z附清雜刷洗㈣表面,如移除諸在 面 微粒與製程殘餘物。 衣 上述晶圓清潔裝置之清潔刷係由一驅動裝置所帶動旋 2,驅動裝置包含杨輪組’ _皮帶繞設於齒輪組與清 4刷即可帶動其旋轉。 … 然而,當皮帶與齒輪相互傳動的時候,兩者之間係直 察而科造成磨耗現象,使得齒輪必須常做更換,影 曰了衣造運作的職’以及增加使 圓的清潔液多為氫氟酸陬,氫:再者因㈣曰曰 合虱鼠齩具有強烈的腐蝕性, Α成使狀位組件受到賴 加維修上的_。 撕吊更換零件,增 【新型内容】 因此’本創作之主要目的乃在於提供一種晶圓清潔裝 置之驅動機構,其可辦知你田*人 本 曰吏用哥命’降低維修更新之成 圓清潔裝置之驅動 為達成上述目的,本_所提供 3 機構,包含有一轉軸、一第一齒輪、一第一擋板、一第二 齒輪,以及一第二擋板;該轉軸具有一第一端與一第二 端;該第一齒輪具有7侧面.,該第一齒輪係設於該轉軸之 第一端;該第一擋板係可拆卸地設於該第一齒輪之側面, 且該第一擋板之外緣大於該第一齒輪之外周;該第二齒輪 具有一侧面’該第二齒輪係設於該轉軸之第二端;該第二 檔板係可拆卸地設於該第二齒輪之側面,且該第二擋板之 外緣大於該第二齒輪之外周ό 有關本創作所提供之詳細構造、特點、組裝或使用方 式,將於後續的實施方式詳細說明中予以描述。然而,在 本創作領域中具有通常知識者應能瞭解,該等詳細說明以 及實施本創作所列舉的特定實施例,僅係用於說明本創 作,並非用以限制本創作之專利申請範圍。 【實施方式】 以下將藉由所列舉之實施例配合隨附圖式,詳細說明 本創作之技術内容及特徵,其中: 第-圖係為本創作一較佳實施例之立體分解圖。 第二圖係為本創作—較佳f施例之立體組合圖。 第三圖係為本創作—較佳實施例另一角度之立體組合 圖。 弟四圖係為本舍丨& Ju. /» «fc» , 怎J作一較佳實施例之側視圖。 第五圖係為第二r γ , i —圖中5-5剖線之剖視圖。 請先參閱第一圖至j _ 足第二圖所不,係為本創作一較佳實 施例所提供晶圓清潔裝置之驅動機構,包含一基座10、 一第一齒輪組件20,與一第二齒輪組件.40。第一、第二 齒輪組件20、40平行分設於基座10之左右二側。 第一齒輪組件20包括一轉軸22,轉軸22具有一第 一端24與一第二端26。一第一齒輪28具有一固定部 30,固定部30為旋向與轉軸22轉向相:反之螺紋。第一齒 輪28具有二側面32,第一齒輪?28係以固定部30螺設於 轉軸22之第一端24。第一齒輪28之立側面32分別設有 •-第一檔板34,第一擋板34呈圓環狀,且以具有自潤性 材質製成,第一擋板34利用若干螺絲35可拆卸地設於第 一齒輪28之側面32,第一擋板34之外緣大於第一齒輪 28之外周。 轉軸22之第二端26亦設有一第二齒輪36,第二齒 輪36具有一固定部33,固定部33套設於轉軸22,第二 齒輪36利用複數螺絲41以平行於轉軸22軸向地固定於 轉軸22之第二端26。第二齒輪36具有一側面37,第二 齒輪36之側面32設有一第二播板38,第二擔板38亦為 圓環狀,且以具有自潤性材料,例如工程塑膠所製成。第 二擋板38係利用螺栓39可拆卸地設於第二齒輪36之側 面32,第二擋板38之外緣同樣大於第二齒輪36之外 周。 第一齒輪組件20與第二齒輪組件40係藉由二分設各 轉軸22且嚙合之第三齒輪42相互帶動,第二齒輪組件 40之構件概同於第一齒輪組件20,具有第一齒輪28與設 M419001 於第^輪28側面32之第—播板34 ’差異則在於第二 ω輪、、且件40並未設置第二齒輪%,只單純由第一齒輪組 件20所傳動。 ^如第四圖所示,當本創作應用於8吋Mirra Mesa化 :機械研料、統或l2t^ReflexiQn化學機械研㈣統之晶 圓/月冻褒置時,晶圓清雜置設有—用以帶動清潔刷之定 位,、且件5G ’疋位組件5G具有—傳動齒輪%皮帶 係繞設於本創作之第—齒輪Μ與傳減輪Μ,另十皮帶 54則繞設於驅動源及第三齒輪36。藉由上述連結關係, 驅動機構即可帶動定位組件5G旋轉。而當皮帶%帶動第 -及第二齒輪28、36旋轉的時候,各皮帶54可分別由第 、第一撞板34、38限位於0i合位置,除了不會讓皮帶 54產生滑脫的問題’也由於第一及第二擔板%%皆為 具自潤性材料’減少皮帶54與各擔板34、38接觸時的磨 擦力’增加使用壽命’而且維修時也只需拆下與更換擋板 4 38即可降低更新的成本。再者,由於第-齒輪28 固疋於轉軸22的旋向與轉轴22轉向相反,可以加強齒輪 28的固定強度’使齒輪28不易鬆脫。 最後ΊΜ再·欠㈣’本創作於前揭實施例中所揭露 =構成元件,僅為舉例說明,並非絲限制本案之範圍, 。他等效7L件㈣代或變化,減林案之巾請專利範圍 M419001 【圖式簡單說明】 第一圖係為本創作一較佳實施例之立體分解圖。 第二圖係為本創作一較佳實施例之立體組合圖。 第三圖係為本創作一較佳實施例另一角度之立體組合 圖。 第四圖係為本創作一較佳實施例之側視圖。 第五圖係為第三圖中5-5剖線之剖視圖。 【主要元件符號說明】 基座10 第一齒輪組件20 轉軸22 第一端24 第二端26 第一齒輪28 固定部30 侧面32 固定部33 第一擋板34 螺絲35 第二齒輪36 側面37 第二擋板38 螺栓39 第二齒輪組件40 螺絲41 第三齒輪42 定位組件50 皮帶54 傳動齒輪52 7V. New description: [New technology field] In particular, a wafer clearing system is related to semiconductor equipment, and the driving mechanism of the cleaning device. [Prior Art] The wafer cleaning device mainly has two rotatable cleaning brushes, which are cleaned and cleaned with a cleaning surface, such as removing surface particles and process residues. The cleaning brush of the wafer cleaning device is driven by a driving device, and the driving device comprises a Yang wheel set. The belt is wound around the gear set and the brush to drive the rotation. ... However, when the belt and the gear are driven by each other, the two are directly inspected and the wear and tear are caused, so that the gear must be replaced frequently, which affects the job of the garment manufacturing operation and increases the cleaning liquid of the circle. Bismuth hydrofluoride, hydrogen: In addition, due to the (4) 虱 虱 虱 齩 齩 齩 齩 齩 齩 齩 齩 齩 齩 齩 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。. Tear-replacement replacement parts, increase [new content] Therefore, the main purpose of this creation is to provide a driving mechanism for the wafer cleaning device, which can know that your field is used by people to reduce the number of maintenance updates. Driving the cleaning device to achieve the above objective, the present invention provides a mechanism including a rotating shaft, a first gear, a first baffle, a second gear, and a second baffle; the rotating shaft has a first end And a second end; the first gear has a 7 side. The first gear is disposed at a first end of the rotating shaft; the first baffle is detachably disposed at a side of the first gear, and the first a baffle outer edge is larger than the outer circumference of the first gear; the second gear has a side surface 'the second gear is disposed at the second end of the rotating shaft; the second baffle is detachably disposed at the second The side of the gear, and the outer edge of the second baffle is larger than the outer circumference of the second gear. The detailed construction, features, assembly or use of the present invention will be described in the detailed description of the following embodiments. However, it should be understood by those of ordinary skill in the art that the description and the specific embodiments set forth in the present invention are merely illustrative of the present invention and are not intended to limit the scope of the patent application. [Embodiment] The technical contents and features of the present invention will be described in detail below with reference to the accompanying drawings, in which: FIG. 1 is a perspective exploded view of a preferred embodiment of the present invention. The second figure is a three-dimensional combination diagram of the creation-preferred embodiment. The third figure is a three-dimensional combination of the other aspects of the creation of the preferred embodiment. The fourth figure is a side view of a preferred embodiment of the present invention. The fifth figure is the second r γ , i — a cross-sectional view taken along line 5-5 in the figure. Please refer to the first figure to the second figure. The driving mechanism of the wafer cleaning device provided by the preferred embodiment of the present invention comprises a base 10, a first gear assembly 20, and a Second gear assembly .40. The first and second gear assemblies 20, 40 are disposed in parallel on the left and right sides of the base 10. The first gear assembly 20 includes a shaft 22 having a first end 24 and a second end 26. A first gear 28 has a fixed portion 30 which is in the direction of rotation and the steering shaft 22: the opposite thread. The first gear 28 has two side faces 32, and the first gear 28 is screwed to the first end 24 of the shaft 22 by a fixing portion 30. The vertical side surface 32 of the first gear 28 is respectively provided with a first baffle 34, the first baffle 34 is annular, and is made of a self-lubricating material, and the first baffle 34 is detachable by using a plurality of screws 35. The outer surface of the first baffle 34 is larger than the outer circumference of the first gear 28 . The second end 26 of the rotating shaft 22 is also provided with a second gear 36. The second gear 36 has a fixing portion 33. The fixing portion 33 is sleeved on the rotating shaft 22. The second gear 36 is axially parallel to the rotating shaft 22 by a plurality of screws 41. It is fixed to the second end 26 of the rotating shaft 22. The second gear 36 has a side surface 37. The side surface 32 of the second gear 36 is provided with a second playing plate 38. The second supporting plate 38 is also annular and is made of a self-lubricating material such as engineering plastic. The second baffle 38 is detachably provided to the side surface 32 of the second gear 36 by bolts 39, and the outer edge of the second baffle 38 is also larger than the outer circumference of the second gear 36. The first gear assembly 20 and the second gear assembly 40 are driven by the third gear 42 which is divided into two rotating shafts 22 and meshed with each other. The second gear assembly 40 is similar to the first gear assembly 20 and has the first gear 28 . The difference from the first board 32' of the side surface 32 of the second wheel 28 of the M419001 is that the second ω wheel is not provided with the second gear %, and is simply driven by the first gear unit 20. ^ As shown in the fourth figure, when the creation is applied to 8吋Mirra Mesa: mechanical material, system or l2t^ReflexiQn chemical mechanical research (4) wafer/monthly installation, the wafer is mixed - used to drive the positioning of the cleaning brush, and the piece 5G 'clamping component 5G has - the transmission gear % belt is wound around the first gear of the creation - the gear Μ and the transmission rim, and the other ten belts 54 are wound around the drive Source and third gear 36. By the above connection relationship, the driving mechanism can drive the positioning assembly 5G to rotate. When the belt % drives the first and second gears 28, 36 to rotate, the belts 54 can be respectively limited by the first and first strikers 34, 38 in the position of 0i, except that the belt 54 is not slipped. 'Also because the first and second plates are %% self-lubricating materials' reduce the friction force of the belt 54 when it comes into contact with the respective plates 34, 38 'increasing the service life' and only need to be removed and replaced during maintenance The baffle 4 38 reduces the cost of the update. Further, since the rotation of the first gear 28 to the rotation shaft 22 is opposite to the rotation of the rotary shaft 22, the fixing strength of the gear 28 can be reinforced to make the gear 28 difficult to loosen. Finally, ΊΜ · ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 He is equivalent to 7L pieces (four) generation or change, and the scope of the invention is limited to the scope of the patent. M419001 [Simple description of the drawings] The first figure is an exploded view of a preferred embodiment of the present invention. The second drawing is a three-dimensional combination diagram of a preferred embodiment of the present invention. The third figure is a perspective view of another perspective of a preferred embodiment of the present invention. The fourth drawing is a side view of a preferred embodiment of the present invention. The fifth drawing is a cross-sectional view taken along line 5-5 in the third figure. [Main component symbol description] Base 10 First gear assembly 20 Rotary shaft 22 First end 24 Second end 26 First gear 28 Fixing portion 30 Side 32 Fixing portion 33 First baffle 34 Screw 35 Second gear 36 Side 37 Two baffle 38 bolt 39 second gear assembly 40 screw 41 third gear 42 positioning assembly 50 belt 54 transmission gear 52 7

Claims (1)

M419001 、申請專利範圍: 1. 一種晶圓清潔裝置之驅動機構,包含有: 一轉軸,具有一第一端與一第二端; 一第一齒輪,具有一侧面,該第一齒輪係設於該轉軸 之第一端; 一第一擋板,係可拆卸地設於該第一齒輪之側面,且 該第一擋板之外緣大於該第一齒輪之外周; 一第二齒輪,具有一侧面,該第二齒輪係設於該轉軸 之弟一端,以及 ' 一第二擋板,係可拆卸地設於該第二齒輪之側面,且 該第二擋板之外緣大於該第二齒輪之外周。 2. 如請求項1所述晶圓清潔裝置之驅動機構,其中該 第一齒輪具有一固定部,該固定部為旋向與該轉軸轉向相 反之螺紋。 3. 如請求項1所述晶圓清潔裝置之驅動機構,其中該 第二齒輪係以複數螺絲以平行於該轉軸軸向地固定於該第 二端。 4. 如請求項1所述晶圓清潔裝置之驅動機構,其中該 第一擋板與第二擋板皆以具自潤性材料製成。 5. 如請求項1所述晶圓清潔裝置之驅動機構,其中該 轉軸另設有一第三齒輪。 8M419001, patent application scope: 1. A driving mechanism for a wafer cleaning device, comprising: a rotating shaft having a first end and a second end; a first gear having a side, the first gear is disposed on a first end of the rotating shaft; a first baffle is detachably disposed on a side of the first gear, and an outer edge of the first baffle is larger than an outer circumference of the first gear; a second gear has a a second gear is disposed at one end of the shaft of the rotating shaft, and a second baffle is detachably disposed at a side of the second gear, and the outer edge of the second baffle is larger than the second gear Outside the week. 2. The driving mechanism of the wafer cleaning apparatus according to claim 1, wherein the first gear has a fixing portion that is rotated in a direction of rotation and the thread is reversed. 3. The driving mechanism of the wafer cleaning apparatus according to claim 1, wherein the second gear train is axially fixed to the second end in parallel with the rotating shaft by a plurality of screws. 4. The driving mechanism of the wafer cleaning device of claim 1, wherein the first baffle and the second baffle are both made of a self-lubricating material. 5. The driving mechanism of the wafer cleaning device of claim 1, wherein the rotating shaft is further provided with a third gear. 8
TW100213560U 2011-07-22 2011-07-22 Drive mechanism of wafer cleaning device TWM419001U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100213560U TWM419001U (en) 2011-07-22 2011-07-22 Drive mechanism of wafer cleaning device
CN2011202758275U CN202199565U (en) 2011-07-22 2011-08-01 Driving mechanism of wafer cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100213560U TWM419001U (en) 2011-07-22 2011-07-22 Drive mechanism of wafer cleaning device

Publications (1)

Publication Number Publication Date
TWM419001U true TWM419001U (en) 2011-12-21

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Application Number Title Priority Date Filing Date
TW100213560U TWM419001U (en) 2011-07-22 2011-07-22 Drive mechanism of wafer cleaning device

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Country Link
CN (1) CN202199565U (en)
TW (1) TWM419001U (en)

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Publication number Publication date
CN202199565U (en) 2012-04-25

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