TWM417745U - Polyimide composite film used for printed circuit board - Google Patents
Polyimide composite film used for printed circuit board Download PDFInfo
- Publication number
- TWM417745U TWM417745U TW100212989U TW100212989U TWM417745U TW M417745 U TWM417745 U TW M417745U TW 100212989 U TW100212989 U TW 100212989U TW 100212989 U TW100212989 U TW 100212989U TW M417745 U TWM417745 U TW M417745U
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- polyimine
- composite film
- layer
- mil
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims description 78
- 229920001721 polyimide Polymers 0.000 title claims description 75
- 239000004642 Polyimide Substances 0.000 title description 8
- 239000010410 layer Substances 0.000 claims description 88
- 239000002356 single layer Substances 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000012528 membrane Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 11
- 150000002466 imines Chemical class 0.000 description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 235000010215 titanium dioxide Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002098 polyfluorene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004408 titanium dioxide Substances 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000004060 quinone imines Chemical class 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
Landscapes
- Laminated Bodies (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100212989U TWM417745U (en) | 2011-07-15 | 2011-07-15 | Polyimide composite film used for printed circuit board |
| KR2020120002282U KR200483278Y1 (ko) | 2011-07-15 | 2012-03-21 | 회로판용 폴리이미드 복합 필름 구조체 |
| KR2020160002967U KR20160002098U (ko) | 2011-07-15 | 2016-05-31 | 회로판용 폴리이미드 복합 필름 구조체 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100212989U TWM417745U (en) | 2011-07-15 | 2011-07-15 | Polyimide composite film used for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM417745U true TWM417745U (en) | 2011-12-01 |
Family
ID=46449957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100212989U TWM417745U (en) | 2011-07-15 | 2011-07-15 | Polyimide composite film used for printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR200483278Y1 (ko) |
| TW (1) | TWM417745U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715164A (zh) * | 2012-09-29 | 2014-04-09 | 富葵精密组件(深圳)有限公司 | 柔性电路板及芯片封装结构 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5358782A (en) * | 1992-12-15 | 1994-10-25 | E. I. Du Pont De Nemours And Company | Coextruded multi-layered, electrically conductive polyimide film |
| JP4734837B2 (ja) * | 2004-03-23 | 2011-07-27 | 宇部興産株式会社 | 接着性の改良されたポリイミドフィルム、その製造方法および積層体 |
| KR100793177B1 (ko) * | 2006-02-24 | 2008-01-10 | 주식회사 코오롱 | 가요성 양면 도체 적층소재 및 그의 제조방법 |
-
2011
- 2011-07-15 TW TW100212989U patent/TWM417745U/zh not_active IP Right Cessation
-
2012
- 2012-03-21 KR KR2020120002282U patent/KR200483278Y1/ko not_active Expired - Lifetime
-
2016
- 2016-05-31 KR KR2020160002967U patent/KR20160002098U/ko not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715164A (zh) * | 2012-09-29 | 2014-04-09 | 富葵精密组件(深圳)有限公司 | 柔性电路板及芯片封装结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130000596U (ko) | 2013-01-23 |
| KR20160002098U (ko) | 2016-06-17 |
| KR200483278Y1 (ko) | 2017-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102143646B (zh) | 用于印刷电路板的补强板 | |
| TWM377823U (en) | Complex double-sided copper clad laminate and structure of flexible printed circuit board using the same | |
| KR20090060877A (ko) | 고온용 촉각센서 및 그 제조 방법 | |
| CN102950856B (zh) | 用于印刷电路板的聚酰亚胺复合膜 | |
| TWM417745U (en) | Polyimide composite film used for printed circuit board | |
| TWM474318U (zh) | 用於印刷電路板之黑色補強板 | |
| CN103458607A (zh) | 用于印刷电路板的消光补强板 | |
| CN202242153U (zh) | 用于印刷电路板的聚酰亚胺复合膜 | |
| CN102458051B (zh) | 基板的制造方法及用于简化制备工艺的结构 | |
| CN205223731U (zh) | 一种格拉辛印刷双面离型纸 | |
| TWM525600U (zh) | 補強板 | |
| TWM380180U (en) | Polyimide composite film used for printed circuit board | |
| JP2018168232A (ja) | 粘着シート | |
| CN204408744U (zh) | 印刷电路板用消光性黑色补强板 | |
| CN201657483U (zh) | 用于印刷电路板的补强板 | |
| CN202652692U (zh) | 用于印刷电路板的消光补强板 | |
| TWM434676U (en) | Light extinction reinforcement board for printed circuit board | |
| JP2013116577A (ja) | 転写印刷用転写シートおよびその製造方法 | |
| TW201825639A (zh) | 黏著組成物及軟性積層結構 | |
| CN202889773U (zh) | 用于印刷电路板的消光性黑色补强板 | |
| CN111851149A (zh) | 具有高防伪性的热敏纸及其制备方法 | |
| TW200922803A (en) | Sublimation type thermal transfer image receiving sheet | |
| CN212194565U (zh) | 双面混合铜箔基材板 | |
| CN206553446U (zh) | 一种特殊黑色补强膜 | |
| TWM446478U (zh) | 用於印刷電路板之銅箔基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4K | Expiration of patent term of a granted utility model |