M417745 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種聚醯亞胺複合膜，尤係關於 坦且具有遮蔽效果之聚醯亞胺複合膜。 【先前技術】 聚酿亞胺樹脂熱穩定性高且具有優異的絕緣性 強度、及抗化學腐蝕性，常用於多種電子加工材料機械M417745 V. New description: [New technical field] This is a kind of polyimine composite film, especially the polyimine composite film which has a shielding effect. [Prior Art] Polyaniline resin has high thermal stability and excellent insulation strength and chemical resistance. It is commonly used in a variety of electronic processing materials machinery.
於軟性印刷電路板(Flexible printed Circuit)之絕緣爲 用 進一步地用於電子零組件，例如印刷電路板之補或者 裡用途。 聚醯亞胺薄膜已廣泛地應用於電子材料，复 /、t ’印刷 電路板所用之聚醯亞胺補強板，一般可區分為單層厚板戋 複合式之聚醯亞胺補強板，而複合式之補強板，如中華民 國專利1257898所揭露之聚醯亞胺板結構，其係以2密爾 (mil)之聚醯亞胺板與不同厚度之熱硬化接著劑形成不同 厚度之複合式聚醯亞胺板。然而，聚醯亞胺複合膜於應用 上遭遇的問題，在於受限於聚醯亞胺膜成本及複合膜之厚 度，無法遮蔽電路佈局圖案而易於被同業抄襲。此外’複 合膜係由聚醯亞胺和接著劑層組合而得，但其二者之熱膨 脹係數差異常導致用於補強之複合膜在貼覆至軟性電路板 後，產生翹曲的現象。 因此’仍需要一種不易麵曲且具有遮蔽效果之聚醯亞 胺複合膜。 【新型内容】 鑒此，本創作提供一種用於印刷電路板之聚醯亞胺複 3 M417745 合膜，包括：複數層聚醯亞胺膜；以及複數接著劑層，分 別形成於各該聚醯亞胺膜之間，且該聚醯亞胺複合膜之總 厚度z符合下式（I)之關係： mX^m^z+nY^Z (I) 式中，X:係表示厚度為1 mil之單層聚醯亞胺膜，X2 係表示厚度為2 mil之單層聚It亞胺膜；m係表示X!之聚 醯亞胺膜層數，m’係表示X2之聚醯亞胺膜層數；η係表示 該複合膜中之接著劑層層數；以及Υ係表示各該接著劑層 之厚度，且該Υ係根據特定Ζ值而定，其中，該Ζ值為6 至15 mil，且該1 mil之聚醯亞胺膜和2 mil之聚醯亞胺膜 之整體疊構係為對稱。 此外，本創作之聚醯亞胺複合膜復可包括純膠層及油 墨層，係形成於該聚醯亞胺膜上，使該聚醯亞胺膜整體疊 構夾置於該純膠層與油墨層之間。 本創作係利用特定厚度之聚醯亞胺複合膜降低複合 膜貼覆至電路板後的翹曲高度，具有油墨層時，亦適合用 於有保護電路圖案之消費性電子產品。此外，本創作複合 膜之油墨層可包含碳粉、奈米碳管或二氧化鈦之顯色劑， 甚至是碳化矽、氮化硼、氧化鋁及氮化鋁所成群組之散熱 粉體，因此，亦具有電磁遮蔽效果。 【實施方式】 以下係藉由特定的具體實例說明本創作之實施方 式，熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本創作之優點及功效。本創作亦可以其它不同的方式 I · M417745 r 予以實施，即，在不惊離本創作所揭示之範鳴下，能予不 同之修飾與改變。 第1圖係』不本創作之聚職亞胺複合膜100結構，包 括複數層聚醯亞胺膜101;形成於該聚驢亞胺膜101之間 的接著劑層102，以及復可包括純膠層⑽，係形成於複數 •層㈣亞賴⑻的底面，以供作為補強板。 帛2 ®係顯示本創作之另-聚酿亞胺複合膜100,結 構，包括複數層聚醯亞胺膜101;形成於該聚醯亞胺膜101 鲁之間的接著劑層102;純膠層1〇3,係形成於複數層聚醯亞 胺膜101的底面；以及油墨層104，係形成於該複數層聚 醯亞胺膜101之頂面。 本創作之聚酿亞胺複合膜中，可視該複合膜之總厚度 需要，並根據式⑴調整複合膜中i 11111與2mil之單層聚醯 亞胺膜層數m及m’ ’搭配調整各接著劑層之厚度Y與接 著劑層層數η，以形成所需總厚度之聚醯亞胺複合膜： mXi+mJX2+nY^2： (1)。 亦即’本創作之聚醯亞胺複合膜結構，可依所欲複合 膜總厚度’凋整聚驢亞胺膜與黏著層之組成層數與厚度’ 以形成具有高平坦性之聚醯亞胺複合膜。 於一具體實例中，該Z為6，m為2且m，為1 ’或者 該Z為7，m為1且m，為2。 亦可使Z為8或9，而m與m，皆為2，於此態樣中， 可使二層2 mil之單層聚醯亞胺膜分別位於該聚醯亞胺膜 整體疊構最外側。如第3圖所示，該聚醯亞胺複合膜結構 5 M417745 包括二層位於最外側之2 mil之聚醯亞胺膜101a ;二層夾 置於該聚醯亞胺膜101a中間的1 mil之聚醯亞胺膜101b ; 以及形成於該聚醯亞胺膜l〇la或101b之間的接著劑層 102。 於另一具體實例中，該Z為10, m為4且m’為1。 亦可使Z為11，m為2且m’為3，於此態樣中，可 使該聚醯亞胺膜整體疊構最外側皆為2 mil之聚醯亞胺 膜。如第4圖所示，該聚醯亞胺複合膜結構包括二層位於 最外側之2 mil之聚醯亞胺膜101a ;依序夾置於該聚醯亞 胺膜101a中間的1 mil之聚醯亞胺膜101b、2 mil之聚醯 亞胺膜101a與1 mil之聚醯亞胺膜101b;以及形成於該聚 醯亞胺膜101a或101b之間的接著劑層102。 於又一具體實例中，該Z為12，m為2且m’為3， 且於此態樣中，該聚醯亞胺膜整體疊構最外側皆為lmil 之聚醯亞胺膜。如第5圖所示，該聚醯亞胺複合膜結構包 括2層位於最外侧之1 mil之聚醯亞胺膜101b ;夾置於該 聚醯亞胺膜l〇lb中間之3層2mil之聚醯亞胺膜101a;以 及形成於該聚醯亞胺膜l〇la或101b之間的接著劑層102。 於再一具體實例中，亦可使該Z為13，m為1且m’ 為4。 或者使該Z為14或15，m為2且m’為4。於此態樣 中，可使該聚醯亞胺膜整體疊構最外側皆為2 mil之聚醯 亞胺膜。如第6圖所示，該聚醯亞胺複合膜結構，包括2 層位於最外側之2 mil之聚醯亞胺膜101a ;依序夾置於該 M417745 • « r 聚酿亞胺膜101a尹間的2 mil之聚酿亞胺膜i〇ia、i 之聚醯亞胺膜l〇lb、1 mil之聚酿亞胺膜1〇1b與2 mil之 聚醯亞胺膜l〇la ;以及形成於該聚醯亞胺膜i〇la或1〇lb 之間的接著劑層102。 本創作之聚醯亞胺複合膜包括之油墨層係形成於該 聚醯亞胺膜上，使該聚醯亞胺膜整體疊構夾置於該純膠層 與油墨層之間，且該油墨層包括白色或黑色之顯色劑。於 另一實施態樣中，該油墨層包括環氧樹脂、一種或多種選 •自於碳化石夕、氮化删、氧化銘及氮化紹所成群組之散熱粉 體，以令本創作之複合膜具有散熱功能。為滿足各式電子 產品需求，在白色產品應用需求者，該白色顯色劑係選自 二氧化鈦及白色顏料所組成群組的一種或多種。而有需要 較佳電路圖案遮蔽效果者，可選用黑色顯色劑，其係選自 黑色顏料、碳粉及奈米碳管所組成群組的一種或多種。在 本文中’顏料亦涵蓋染料或俗稱之色粉，且顏料可包括以 φ 有機或無機材料所製得者。 /經研究發現’本創作所用之白色顯色劑與環氧樹脂混 合後，可令複合膜具有優異的反射率，其中，白色顯色劑 係佔該環氧樹脂固含量之6〇至95喊，且即便白色顯色 劑含量高達樹脂固含量之95，但控制光反射層之厚 度，I於5至50微米仍可令反射層不至於脫落。至於黑色 ‘”’頁色劑之含董則以佔該環氧樹脂固含量之3至i5 ， 並以4至8 wt%為較佳。 該聚醯亞胺複合膜中，所使用之聚醯亞胺膜與接著劑 7 M417745 種類並無特別之限制，較佳係使用不含齒素之聚醯亞胺材 料及接著劑，更佳係使用具有自黏性且不含鹵素之接著劑。 於本創作之具體實施例中，Xi為1 mil之單層聚醯亞 胺膜，X2為2 mil之單層聚醯亞胺膜，m及m’分別為Xi 與X2之聚醯亞胺膜層數，且接著劑層之厚度Y係根據特 定Z值而定，然而因接著劑與聚醯亞胺之熱膨脹係數差異 較大，使得聚醯亞胺複合膜貼覆至電路板後常有翹曲的問 題，因此本創作可於該複數層聚醯亞胺膜之頂面形成一油 墨層，由於油墨層與純膠層之間的核心層為聚醯亞胺膜， 使得該核心層兩側為對稱結構，進而得到避免翹曲的效 果。於實施上，該油墨層之厚度介於13至15μιη ;而該純 膠層之厚度介於10至40μιη。 此外，本創作係利用複數層聚醯亞胺膜形成降低翹曲 高度之複合膜，且為了提高該聚醯亞胺膜之平坦度，雖無 較具體的理論依據，本創作係分別於該複數層聚醯亞胺膜 兩外側面塗覆油墨層及純膠，使該聚醯亞胺膜整體疊構夾 置於該純膠層與油墨層之間，更降低翹曲高度之複合膜。 在本創作中，並未限定所使用的接著劑及純膠材料，但通 常，係使用環氧樹脂型樹脂。 第一具體實例 於本具體實例中，係使用二層聚醯亞胺膜形成聚醯亞 胺複合膜。首先，於1 mil之單層聚醯亞胺膜表面塗佈一 層熱硬化接著劑（亞洲電材環氧樹脂膠，型號 8 M417745 AEM-HQLV-N-002)，亦可採型號 ΑΕΜ-ΤΡΙ-Ν-001 之熱可 塑性聚醯亞胺樹脂，置於烘箱加熱乾燥後，藉由熱滚輪與 另一層2 mil之單層聚醯亞胺膜壓合。接著，於180°C之條 件下熟化1小時，最後，於該二層聚醯亞胺膜上塗覆純膠 層，形成聚醯亞胺複合膜樣品。 第二具體實例 於本具體實例中，係揭示形成含三層以上聚醯亞胺膜 之聚醯亞胺複合膜。首先，取如第一具體實例製得之聚醯 • 亞胺複合膜，接著於該複合膜表面塗佈一層熱硬化接著 劑，置於烘箱加熱乾燥後，藉由熱滚輪與另一層為1 mil 或2 mil之單層聚醯亞胺膜壓合，再於180°C之條件下熟化 1小時，最後，分別於該三層聚醯亞胺膜外側面塗覆純膠 層，形成聚醯亞胺複合膜樣品。 第三具體實例 於本具體實例中，係使用特定厚度之油墨層以與形成 二層或三層以上複數層之聚醯亞胺膜形成複合膜。首先， 取如第一或第二具體實例製得之聚醯亞胺複合膜，接著於 該複合膜表面塗佈一層熱硬化接著劑，置於烘箱加熱乾燥 後，藉由熱滾輪與另一層為1 mil或2 mil之單層聚醯亞胺 膜壓合，再於180°C之條件下熟化1小時，最後，分別於 該複數層聚醯亞胺膜兩外側面塗覆油墨層及純膠，形成聚 醯亞胺複合膜樣品。 另一方面，本創作之聚醯亞胺複合膜結構可由奇數層 1 mil之單層聚醯亞胺膜與偶數層2 mil之單層聚醯亞胺膜 9 M417745 層疊壓合而成°或者，本創作之聚醯亞胺複合膜結構可由 奇數層2mil之單層聚醯亞胺膜與偶數層imil之單層聚醯 亞胺膜層疊壓合而成。 測試例1聚酿亞胺複合膜翹曲度之量測 依下表一中之數據製備本創作之聚醯亞胺複合膜。在 包含有油墨層之聚醯亞胺複合膜中，該油墨層包括環氧樹 脂、碳粉或二氧化鈦粉體（杜邦公司生產，型號為R_l〇3)。 另外’復製備對照例樣品，該對照例樣品之複合膜係 如中華民國專利1257898所揭露之聚醯亞胺板結構，其係 不包括油墨層’僅以2 mil之聚醯亞胺板與不同厚度之熱 硬化接著劑形成不同厚度之複合式聚醯亞胺板。 實施例及對照例樣品之複合膜皆係使用SONY公司 所生產之純膠（商品名D3430)。接著，將複合膜裁切為25 cmx25cm之尺寸，並於18〇。〇之條件不壓合至74 5土lum 之3-Layer雙面軟性鋼落基板上，再以16〇。〇之條件進行熟 化’再將各個實施例樣品置於光滑平面上，靜置2〇分鐘 後’量測四個邊角_曲高度（公分），進行平坦度測試， 結果紀錄於表·一。 M417745 表一 樣 品 nI 1膜 度 X 膜i Ii 旦亞 胺 層f 奴本 曰。亞 一胺 膜 接 荖 劑 層 厚 度 ㈣ 油 墨 層 厚 度 ㈣ 鍾曲高度(cm) 實施例 對照例 1 6 2 1 25 - 2.8 3.5 2 6 2 1 25 13 2.6 - 3 7 1 2 25 2.5 3.1 4 7 1 2 25 13 2.3 - 5 8 2 2 16.7 - 2.1 2.7 6 8 2 2 16.7 13 1.9 - 7 9 2 2 25 1.8 2.4 8 9 2 2 25 13 1.6 - 9 10 4 1 25 - 1.3 1.8 10 10 4 1 25 13 1.2 - 11 11 2 3 18.7 - 1.2 1.5 12 11 2 3 18.7 13 1.0 - 13 12 2 3 25 1.1 1.4 14 12 2 3 25 13 0.8 - 15 13 1 4 25 - 0.6 1.1 16 13 1 4 25 13 0.7 - 17 14 2 4 20 - 0.5 0.9 18 14 2 4 20 13 0.3 - 19 15 2 4 25 0.2 0.6 20 15 2 4 25 13 0.1 - 11 M417745 如表一結果所示，在總厚度（z)相同之條件下，相較於 對照例僅以2 mil之聚醯亞胺板與不同厚度之接著劑所形 成之聚醯亞胺複合膜，本創作之複合膜的翹曲高度相對較 小，因而具有較佳之平坦性，且隨著總厚度增加，平坦性 更為明顯。此外，相較於貼覆有油墨層之複合膜樣品，其 複合膜的翹曲高度亦對較小。 上述說明書及實施例僅為例示性說明本創作之原理 及其功效，而非用於限制本創作。本創作之權利保護範圍， 應如後述之申請專利範圍所列。 【圖式簡單說明】 第1圖係顯示本創作之聚醯亞胺複合膜結構； 第2圖係顯示本創作之另一聚醯亞胺複合膜結構； 第3圖係顯示本創作之聚醯亞胺複合膜總厚度Z為8 或9之聚醯亞胺複合膜結構示意圖； 第4圖係顯示本創作之聚醯亞胺複合膜總厚度Z為 11之聚醯亞胺複合膜結構示意圖； 第5圖係顯示本創作之聚醯亞胺複合膜總厚度Z為 12之聚醯亞胺複合膜結構示意圖；以及 第6圖係顯示本創作之聚醯亞胺複合膜總厚度Z為 14或15之聚醯亞胺複合膜結構示意圖。 【主要元件符號說明】 100、100’聚醯亞胺複合膜 101 聚醯亞胺膜 101a 聚醯亞胺膜 12 M417745 101b 102 103 聚醯亞胺膜 接著劑層 純膠層 油墨層 104Insulation for flexible printed circuits is further used for electronic components such as printed circuit boards or for use. Polyimine film has been widely used in electronic materials, poly-imine reinforcing plates used in complex /, t 'printed circuit boards, generally can be divided into a single layer of thick plate 戋 composite type of polyimide reinforced plate, and A composite reinforcing plate, such as the polyimine plate structure disclosed in the Republic of China Patent No. 1,257,889, which is formed by a combination of a 2 mil polyimine plate and a different thickness of a heat hardening adhesive to form different thicknesses. Polyimine plate. However, the problem encountered in the application of the polyimide film is that it is limited by the cost of the polyimide film and the thickness of the composite film, and it is impossible to shield the circuit layout pattern and is easily copied by the industry. Further, the composite film was obtained by a combination of a polyimide and an adhesive layer, but the difference in thermal expansion coefficient between the two was abnormal, resulting in warpage of the composite film for reinforcement after being applied to a flexible circuit board. Therefore, there is still a need for a polyimide film which is difficult to face and has a masking effect. [New content] In view of this, the present invention provides a polyimine complex 3 M417745 film for a printed circuit board, comprising: a plurality of layers of polyimide film; and a plurality of adhesive layers respectively formed on each of the particles Between the imine membranes, and the total thickness z of the polyimine composite membrane conforms to the relationship of the following formula (I): mX^m^z+nY^Z (I) wherein X: indicates a thickness of 1 mil The monolayer polyimide film, X2 represents a single layer poly-imine film with a thickness of 2 mil; m represents the number of layers of X! polyimine film, and m' represents a polyimide film of X2 a number of layers; η represents the number of layers of the adhesive layer in the composite film; and lanthanide indicates the thickness of each of the adhesive layers, and the lanthanum is determined according to a specific enthalpy value, wherein the Ζ value is 6 to 15 mil And the monolithic structure of the 1 mil polyimine film and the 2 mil polyimide film is symmetrical. In addition, the polyimine composite film of the present invention may comprise a pure rubber layer and an ink layer formed on the polyimide film, so that the polyimine film is integrally sandwiched between the pure rubber layer and Between the ink layers. This creation uses a polytheneimide composite film of a specific thickness to reduce the warpage height of the composite film after being attached to a circuit board. When it has an ink layer, it is also suitable for a consumer electronic product having a protective circuit pattern. In addition, the ink layer of the composite film of the present invention may contain a toner, a carbon nanotube or a titanium dioxide developer, or even a group of heat-dissipating powders of tantalum carbide, boron nitride, aluminum oxide and aluminum nitride. It also has an electromagnetic shielding effect. [Embodiment] The following describes the implementation of the present invention by a specific specific example, and those skilled in the art can easily understand the advantages and effects of the present invention by the contents disclosed in the present specification. This creation can also be implemented in a different way than I. M417745 r, that is, it can be modified and changed without stunned by the fan of this creation. 1 is a structure of a polyimine composite film 100 which is not composed of a plurality of layers, comprising a plurality of polyimide films 101; an adhesive layer 102 formed between the polyimide films 101, and a complex comprising pure The glue layer (10) is formed on the bottom surface of the plural layer (4) Yalai (8) for use as a reinforcing plate.帛2® shows the other-polyimine composite film 100 of the present invention, the structure includes a plurality of layers of polyimide film 101; an adhesive layer 102 formed between the polyimide film 101; The layer 1〇3 is formed on the bottom surface of the plurality of layers of the polyimide film 101; and the ink layer 104 is formed on the top surface of the plurality of layers of the polyimide film 101. In the poly-imine composite film of the present invention, the total thickness of the composite film may be required, and the number of layers of the single-layer polyimine film of i 11111 and 2 mil in the composite film may be adjusted according to formula (1). Then, the thickness Y of the agent layer and the number of layers of the adhesive layer η are formed to form a polyimide film of the desired total thickness: mXi+mJX2+nY^2: (1). That is to say, the poly-imine composite membrane structure of the present invention can form the layer and thickness of the polyimine film and the adhesive layer according to the total thickness of the composite film to form a highly flat polythene. Amine composite membrane. In one embodiment, the Z is 6, m is 2 and m is 1 ' or the Z is 7, m is 1 and m is 2. It is also possible to make Z 8 or 9, and m and m are both 2. In this aspect, a two-layer 2 mil single-layer polyimide film can be located in the entire stack of the polyimide film. Outside. As shown in Fig. 3, the polyimine composite film structure 5 M417745 comprises two layers of the outermost 2 mil polyimine film 101a; the second layer is sandwiched between the polyimide film 101a and 1 mil. The polyimide film 101b; and an adhesive layer 102 formed between the polyimide film 10a or 101b. In another embodiment, the Z is 10, m is 4 and m' is 1. Further, Z may be 11, m is 2, and m' is 3, and in this aspect, the polyimide film may be a laminate of 2 mils on the outermost side of the polyimide film. As shown in Fig. 4, the polyimine composite membrane structure comprises two layers of the outermost 2 mil polyimine film 101a; and a 1 mil layer sandwiched between the polyimide film 101a. The quinone imine film 101b, the 2 mil polyimine film 101a and the 1 mil polyimide film 101b; and the adhesive layer 102 formed between the polyimide film 101a or 101b. In still another embodiment, the Z is 12, m is 2, and m' is 3. In this aspect, the polyamidimide film has a lmil polyimine film on the outermost side. As shown in Fig. 5, the polyimine composite membrane structure comprises two layers of a 1 mil polyimine film 101b located at the outermost side; and 3 layers of 2 mil sandwiched between the polyimide membranes The polyimide film 101a; and an adhesive layer 102 formed between the polyimide film 101a or 101b. In still another embodiment, the Z may be 13, m is 1 and m' is 4. Alternatively, the Z is 14 or 15, m is 2 and m' is 4. In this aspect, the polyimine film can be integrally laminated with a 2 mil polyimine film on the outermost side. As shown in Fig. 6, the polyimine composite membrane structure comprises 2 layers of the outermost 2 mil polyimine film 101a; sequentially placed in the M417745 • « r polyimine film 101a Yin a 2 mil polyimine film i〇ia, a polyimine film l〇lb, a 1 mil polyimine film 1〇1b and a 2 mil polyimine film l〇la; An adhesive layer 102 formed between the polyimide film i〇la or 1〇1b. The polyimine composite film of the present invention comprises an ink layer formed on the polyimide film, such that the polyimide film is integrally sandwiched between the pure rubber layer and the ink layer, and the ink The layer includes a white or black developer. In another embodiment, the ink layer comprises an epoxy resin, one or more heat-dissipating powders selected from the group consisting of carbon carbide, nitriding, oxidizing, and nitriding to make the creation The composite film has a heat dissipation function. In order to meet the needs of various electronic products, the white color developer is selected from one or more groups consisting of titanium dioxide and white pigments in demand for white product applications. For those who need a better circuit pattern shielding effect, a black color developer may be selected, which is selected from one or more of the group consisting of black pigment, carbon powder and carbon nanotubes. Herein, the pigment also encompasses a dye or a commonly known toner, and the pigment may include those made of φ organic or inorganic materials. /It has been found that the white color developer and epoxy resin used in this creation can make the composite film have excellent reflectivity. Among them, the white color developer accounts for 6〇 to 95 of the solid content of the epoxy resin. And even if the white developer content is as high as 95% of the resin solid content, controlling the thickness of the light reflecting layer, I can keep the reflective layer from falling off at 5 to 50 micrometers. As for the black '"'s coloring agent, the amount of the epoxy resin is 3 to i5, and 4 to 8 wt% is preferred. In the polyimine composite film, the polyfluorene used is used. The imine film and the adhesive 7 M417745 are not particularly limited, and it is preferred to use a porphyrin-free polyimine material and an adhesive, and it is more preferable to use a self-adhesive and halogen-free adhesive. In a specific embodiment of the present invention, Xi is a 1 mil single layer polyimide film, X2 is a 2 mil single layer polyimide film, and m and m' are respectively a polyimide layer of Xi and X2. The thickness of the adhesive layer Y is determined according to the specific Z value. However, due to the large difference in thermal expansion coefficient between the adhesive and the polyimide, the polyimide film is often warped after being attached to the circuit board. Therefore, the present invention can form an ink layer on the top surface of the plurality of polyimide films, since the core layer between the ink layer and the pure rubber layer is a polyimide film, so that the core layer is a symmetrical structure, thereby obtaining an effect of avoiding warpage. In practice, the thickness of the ink layer is between 13 and 15 μm; and the purity The thickness of the layer is between 10 and 40 μm. In addition, the present invention uses a plurality of layers of polyimide film to form a composite film with reduced warpage height, and in order to improve the flatness of the polyimide film, there is no specific theory. According to the invention, the ink layer and the pure glue are respectively coated on the outer sides of the plurality of layers of the polyimide film, so that the polyimine film is integrally sandwiched between the pure rubber layer and the ink layer, and A composite film having a reduced warpage height. In the present invention, the adhesive used and the pure rubber material are not limited, but usually, an epoxy resin type resin is used. In the specific example, the second embodiment is used. The polyimide film is formed into a polyimide film. First, a layer of thermosetting adhesive is applied to the surface of a 1 mil single layer polyimide film (Asian Electric Epoxy Resin, Model 8 M417745 AEM-HQLV- N-002), can also be used in the type ΑΕΜ-ΤΡΙ-Ν-001 thermoplastic polyimine resin, placed in an oven after heating and drying, with a hot roller and another layer of 2 mil single layer polyimide film pressure Then, it is aged at 180 ° C for 1 hour, and finally Applying a pure gel layer on the two-layer polyimide film to form a polyimide film composite film sample. The second specific example in this specific example reveals the formation of a polyfluorene film containing three or more layers of polyimide film. An imine composite film. First, a polyfluorene/imine composite film prepared as in the first specific example is applied, and then a thermosetting adhesive is applied on the surface of the composite film, and dried in an oven, followed by a hot roller. The other layer is a 1 mil or 2 mil single layer polyimide film, and then aged at 180 ° C for 1 hour. Finally, a pure rubber layer is coated on the outer side of the three-layer polyimide film. A sample of the polyimine composite film was formed. Third Specific Example In this specific example, a specific thickness of the ink layer was used to form a composite film with a polyimine film forming a plurality of layers of two or more layers. First, taking the polyimide film prepared by the first or second specific example, and then coating a surface of the composite film with a heat hardening adhesive, which is placed in an oven after heating and drying, and the other layer is 1 mil or 2 mil of a single layer of polyimide film is pressed, and then aged at 180 ° C for 1 hour, and finally, the ink layer and the pure glue are respectively coated on the outer sides of the plurality of layers of the polyimide film. Forming a sample of the polyimide film. On the other hand, the polyimine composite film structure of the present invention can be laminated and laminated by an odd-numbered layer of a 1 mil single-layer polyimide film and an even-numbered 2 mil single-layer polyimide film 9 M417745. The polyimine composite film structure of the present invention can be formed by laminating and laminating an odd-numbered layer of a 2 mil single-layer polyimide film and an even-layer imil single-layer polyimide film. Test Example 1 Measurement of Warpage of Polyanilin Composite Film The polyimine composite film of the present invention was prepared according to the data in Table 1 below. In the polyimide film comprising an ink layer, the ink layer comprises an epoxy resin, carbon powder or titanium dioxide powder (manufactured by DuPont, model R_l〇3). In addition, a composite sample is prepared, and the composite film of the comparative sample is a polyimine plate structure disclosed in the Republic of China Patent No. 1,257,879, which does not include an ink layer of only 2 mil polyimine plate. The thickness of the thermosetting adhesive forms a composite polyimide sheet of varying thickness. The composite film of the examples and the comparative examples was obtained by using pure gum (trade name: D3430) produced by SONY Corporation. Next, the composite film was cut to a size of 25 cm x 25 cm and at 18 〇. The condition of the crucible is not pressed to the 7-Layer 3-Layer double-sided soft steel substrate, and then 16 〇. The conditions of the crucible were aged. Then, the samples of the respective examples were placed on a smooth surface, and after standing for 2 minutes, four corners and a height (cm) were measured, and the flatness test was performed, and the results were recorded in Table 1. M417745 Table 1 sample nI 1 film degree X film i Ii danthene layer f slave 曰. Sub-monoamine film binder layer thickness (4) Ink layer thickness (4) Bell curvature height (cm) Example Comparative Example 1 6 2 1 25 - 2.8 3.5 2 6 2 1 25 13 2.6 - 3 7 1 2 25 2.5 3.1 4 7 1 2 25 13 2.3 - 5 8 2 2 16.7 - 2.1 2.7 6 8 2 2 16.7 13 1.9 - 7 9 2 2 25 1.8 2.4 8 9 2 2 25 13 1.6 - 9 10 4 1 25 - 1.3 1.8 10 10 4 1 25 13 1.2 - 11 11 2 3 18.7 - 1.2 1.5 12 11 2 3 18.7 13 1.0 - 13 12 2 3 25 1.1 1.4 14 12 2 3 25 13 0.8 - 15 13 1 4 25 - 0.6 1.1 16 13 1 4 25 13 0.7 - 17 14 2 4 20 - 0.5 0.9 18 14 2 4 20 13 0.3 - 19 15 2 4 25 0.2 0.6 20 15 2 4 25 13 0.1 - 11 M417745 As shown in the results of Table 1, under the same total thickness (z), Compared with the comparative example, the polyimide film formed by the polyimide layer of 2 mil and the adhesive of different thicknesses, the composite film of the present invention has a relatively high warpage height and thus has better flatness. And as the total thickness increases, the flatness is more pronounced. In addition, the composite film has a smaller warpage height than the composite film sample to which the ink layer is applied. The above description and examples are merely illustrative of the principles and functions of the present invention and are not intended to limit the present invention. The scope of protection of this creation shall be as set forth in the scope of the patent application described later. [Simple description of the diagram] Fig. 1 shows the structure of the polyimine composite membrane of the present invention; Fig. 2 shows the structure of another polyamidimide composite membrane of the present invention; Fig. 3 shows the cluster of the present creation Schematic diagram of the structure of the polyimine composite membrane with the total thickness Z of the imine composite membrane of 8 or 9; Fig. 4 is a schematic view showing the structure of the polythenimine composite membrane with the total thickness Z of the polyimine composite membrane of the present invention; Figure 5 is a schematic view showing the structure of the polyimine composite film having a total thickness Z of 12 of the present polyimine composite film; and Fig. 6 shows that the total thickness Z of the polyimine composite film of the present invention is 14 or 15 is a schematic diagram of the structure of the polyimine composite membrane. [Main component symbol description] 100, 100' polyimine composite film 101 Polyimine film 101a Polyimide film 12 M417745 101b 102 103 Polyimine film Next layer Pure rubber layer Ink layer 104