Μ4Π6.59 五、新型說明： 【新型所屬之技術領域】 本創作是有關一種發光二極體封裝組件，且特別是有 關於一種於毋須使用模具進行封裝之發光二極體封裝組件 【先前技術】 隨著發光二極體(Light-Emitting Diode，LED)技術的進 步，發光二極體可展現的亮度等級也越來越高，因其具有 壽命長、省電、安全及反應快等特點，所以發光二極體 應用領域相當廣泛。 、 習知發光二極體的透明封膠常使用熱固性塑膠，如石 膠、矽樹脂或環氧樹脂等，並以灌注(p〇tting)或模具成矽 (molding)方式為之。然而，熱固性塑膠的折射率較低，圯 矽膠，環氡樹脂的折射率約為153;而熱塑性塑膠的 率較高，如聚碳酸酯的折射率約為1 585。因此，以埶朔 塑膠作為發*二極體的透_膠可增加其出光效率:'、土陵 但’現今使用_性_作為發光二極體的"^ ，白須透過模具成形的方式為之。此須投資昂貴的槿呈二 用與成型設備，且模具的膠道中會有廢料產生，無开/中辦 加生產成本。 / r曰Μ4Π6.59 V. New Description: [New Technical Field] This creation is related to a light-emitting diode package, and in particular to a light-emitting diode package that does not require a mold to be packaged. [Prior Art] With the advancement of Light-Emitting Diode (LED) technology, the brightness level of the LED can be increased, because of its long life, power saving, safety and fast response. Luminous diode applications are quite extensive. The transparent sealant of the conventional light-emitting diode is often made of a thermosetting plastic such as stone glue, enamel resin or epoxy resin, and is infused or molded into a molding method. However, the thermosetting plastic has a lower refractive index, and the tantalum resin has a refractive index of about 153; while the thermoplastic has a higher rate, such as a polycarbonate having a refractive index of about 1,585. Therefore, 埶朔 plastic can be used as a hair-emitting diode to increase its light-emitting efficiency: ', Tuling, but nowadays use _ sex _ as the light-emitting diode's "^, the white whisker is formed by the mold It. This requires the investment of expensive bismuth and molding equipment, and there will be waste in the glue path of the mold, and there is no production cost for opening/working. / r曰
【新型内容】 其 中 本創作實施例在於提供一種發光二極體封 =:貴的模具或成型設備’且可避免模二道 包括： 該導電 本創作實施例提供一種發光二極體封灰級件， 一絕緣單元；一導電單元，其設置於該絕緣單， 3/12 早兀具有兩個彼此分離一特定距離之導電本體 於上述兩個導電本體之間的間隙；-發光單元〜形成 電性連接於上述兩個導電本體之發光I極體晶片?具有一 封裝單元，直且女=| ^ 妝3曰方，以及一 體日片7帛於叉熱軟化以覆蓋該發光一極 肢日日片的熱塑性之塑膠顆粒， 先一極 該發光二極體晶片的一側。 ’姆顆极毁置於 =外’本創作實施例另提供—種發光二極體 ，包括：一導電單亓，並見古 封裝組件 —#定^具有一电路板以及兩個彼此分離 t疋距離之導電本體， 匕刀離 板上；-發光罩★ “ > 又於所述電路 光二極體晶片的熱塑性之塑義粒 ^ 土膠顆粒攻置於該發光二極體晶片的一側。 件，:上所述’本創作實施例所提供的發光二極體封裝組 本。’、毋須使用昂貴的模具或成型設備，藉以降低設備成 者’本創作實施例之發光二極體封裝組件可避免模 - '曝道中形成有廢料，藉以大幅提升材料（如：塑膠顆粒 的使用率’進而降低生產成本。 為使能更進一步瞭解本創作之特徵及技術内容，請參 附同下有關本創作之詳細說明與附圖，但是此等説明與所 ^式僅係用來說明本創作，而非對本創作的權利範圍作 任何的限制。 【貫施方式】 〔第一實施例〕 - °月參閱圖1 ’其為本創作的第-實施例，其中，圖1為 4/12 、貫'施例的平面示意圖。 -/ ’4?、圖】，其為一種發光二極體封壯 肢对裝組件包括導 電單x元裝，件。上述發光 及封裝單元4。 〜，‘豕早兀2、發光單元3 導電置於絕緣單元2’且導電單元】農右 電t】】' 間隙】2、及兩條導線。。有兩個 彼此分離-特定距離 ;、戶斤迷兩個導 迷兩個導電本體U之間。此外，W間隙12形成於上 電本為金屬基板，但於實際應=:中^ ^ ”、巴緣單兀2形成有絕緣基部 丨此為限。 間23。財，上述絕緣基部21殖^^壁22、及容置空 心述兩轉電本體】上述環;^内且連 :且位於發光單元3與封裝單 〇包圍於絕緣基部幻 述谷置空間 元3。 ^ 22⑽W於容置發光單 2單元3具有電性連接於 ^二極體晶片3卜再者，所述發光二極體之發 具有兩個電極311，並使上述兩條 ^ 的上表面 於發光二極體晶片31上茅 a 、’…、而分別連接 的另，別連捿於上二兩:本電：兩條導線13 〜忍π兀―7巫體晶片31的一側；攻 顆粒41之一部份設置於容置空間23中，且塑# 抵觸或不抵觸於發光二極體晶片31。 > . 更詳細的說，所述至少—塑_粒41可用β 41 極雕^早疋4具有至少—用於受熱軟化以覆蓋該發光二 肢日日片31的熱塑性之塑膠顆粒41。並且，所述炱少 膠顆粒41設置於發光二極體晶片31的一側J即， 5/12 。又置於傻盍區域42。其中，所述覆蓋區域42位於絕緣單元 2之容置空間23 β ’且覆蓋區域42的外表面呈平面狀。此 外’覆盍區域42的外表面可進一步的限定與上述環側壁22 的上表面齊平，但並不以此為限。 _再者，上述絕緣基部21與環側壁的内緣、兩個導 電本體11的部份上表面、兩條導線13、及發光二極體晶片 31皆位於覆蓋區域42内。 此外，本實施例中以至少一塑膠顆粒4〗為例，而於實 際2用時，塑膠顆粒的數量可作適當的變化，上述數量 交化主要依據塑膠顆粒41受熱軟化後的覆蓋區域42之 紅積。並且，塑膠顆粒41較合適之種類為非結晶性之熱塑 f生塑膠顆粒4卜其巾’以聚碳酸g旨之塑膠顆粒41為最佳， 但並不以此為限。 〔第一貫施例〕 一吻麥閱圖2’其為本創作的第二實施例，本實施例與第 一實施例不同之處主要如下所述。 /、 發光二極體“31的上表面與下表面各具有—個電極 311 ’而導電單幻具有-條導線13。其中，發光二極體晶 下表面的電極311直接電性連接於其中一個導電本體 11。上述導線13的一端連接於發光二極體晶片幻 =極3U ’而上述導線13的另_端連接於另一個導電本 22的内緣、兩個導電本 、及發光二極體晶片31 再者，絕緣基部2】與環側壁 體】1的部份上表面、上述導線】3 白位於覆蓋區域42内。· 〔第三實施例〕 6/12 本 〜請參閱圖3,其為本創作的筮二者 貧施例的平面示意圖。 、—具施例，其中，圖 復參照圖3,其為一種 4 '極體封裝組件包括導· Λ先一極肢封裝組件。上述發光 。 ⑭以、發光單元3、及封裝單元 焊編Ϊ電單元1具有電路板14、兩個導恭太麵η 缽接件15。兩個導電本體U彼此分離1本肢11、及兩個 兩個導電本體U形成於射ί :離1定距離，且上述 電太雕1〗 '斤处包路板14上。1中，卜、十、道[New content] The present embodiment is to provide a light-emitting diode package =: expensive mold or molding equipment 'and can avoid the mold two-way includes: the conductive embodiment of the present invention provides a light-emitting diode sealing gray-level member An insulating unit; a conductive unit disposed on the insulating sheet, 3/12 having two gaps between the two conductive bodies separated from each other by a certain distance; - the light emitting unit is electrically formed The light-emitting diode chip connected to the two conductive bodies has a package unit, which is straight and female, and the integrated Japanese film 7 is softened by the heat to cover the light-emitting one-pole day. The thermoplastic plastic particles, one side of the light-emitting diode wafer. The invention is also provided with a light-emitting diode, including: a conductive single-turn, and see the ancient package component - #定^ has a circuit board and two separate from each other The conductive body of the distance, the blade is off the board; - the illuminating cover ★ " > and the thermoplastic plastic particles of the circuit photodiode wafer are attacked on one side of the LED chip. The above-mentioned "light-emitting diode package package provided by the present embodiment" does not require the use of expensive molds or molding equipment, thereby reducing the device's LED assembly package of the present embodiment. It can avoid the mold--the formation of waste in the exposure channel, so as to greatly improve the material (such as the use rate of plastic particles) and thus reduce the production cost. In order to further understand the characteristics and technical content of this creation, please refer to the same The detailed description and drawings are intended to be illustrative of the present invention, and are not intended to limit the scope of the present invention. [First Embodiment] [First Embodiment] - °月1 is a first embodiment of the present invention, wherein FIG. 1 is a plan view of a 4/12, "example". - / '4?, Fig., which is a kind of light-emitting diode sealing limb The component assembly comprises a conductive single x-element, the above-mentioned light-emitting and packaging unit 4. ~, '豕早兀2, the light-emitting unit 3 is electrically conductively placed in the insulating unit 2' and the conductive unit】Nongyou electric t]]' gap] 2, and two wires. There are two separate from each other - a specific distance; the two fans are between the two conductive bodies U. In addition, the W gap 12 is formed on the power supply is a metal substrate, but in practice Should be =: medium ^ ^ ”, the edge of the rim 2 is formed with an insulating base, which is limited to this. Between the 23, the insulating base 21, the wall 22, and the hollow body of the two rotating body] the above ring; ^内连连: and is located in the light-emitting unit 3 and the package unit 〇 enclosing the insulating base magic space unit space element 3. ^ 22 (10) W in the accommodating light-emitting unit 2 unit 3 is electrically connected to the ^ diode wafer 3 The light emitting diode has two electrodes 311, and the upper surfaces of the two electrodes are on the light emitting diode chip 31. '..., and connected separately, do not even squat on the last two: the power: two wires 13 ~ π 兀 兀 7 side of the witch wafer 31; part of the tapping particles 41 is placed in the accommodating space 23, and plastic # contradicts or does not contradict the light-emitting diode chip 31. In more detail, the at least - plastic film 41 can be used with β 41 poles and has at least - used for heat softening. The thermoplastic plastic particles 41 covering the illuminating limbs day 31 are disposed on the side J of the illuminating diode chip 31, that is, 5/12. 42. The covering area 42 is located in the accommodating space 23 β ' of the insulating unit 2 and the outer surface of the covering area 42 is planar. Further, the outer surface of the cover area 42 may be further defined to be flush with the upper surface of the ring side wall 22, but is not limited thereto. Further, the insulating base portion 21 and the inner edge of the ring side wall, the upper surface of the two conductive bodies 11, the two wires 13, and the light emitting diode chip 31 are all located in the covering region 42. In addition, in the embodiment, at least one plastic particle 4 is taken as an example, and in actual use 2, the number of plastic particles can be appropriately changed, and the above-mentioned quantity is mainly based on the coverage area 42 of the plastic particle 41 after being softened by heat. Red product. Further, the plastic particles 41 are preferably non-crystalline thermoplastics, and the plastic particles 41 are preferably the same, but not limited thereto. [First Embodiment] A kiss beer Fig. 2' is a second embodiment of the present creation, and the difference between the present embodiment and the first embodiment is mainly as follows. /, the upper surface and the lower surface of the light-emitting diode "31 have an electrode 311' and the conductive single-layer has a --wire 13. The electrode 311 on the lower surface of the light-emitting diode is directly electrically connected to one of the electrodes 311. The conductive body 11. One end of the wire 13 is connected to the illuminating diode chip phantom 3U' and the other end of the wire 13 is connected to the inner edge of the other conductive body 22, two conductive books, and the light emitting diode Further, the upper surface of the insulating base portion 2 and the side wall of the ring body 1 and the above-mentioned conductive wire 3 are located in the covering region 42. · [Third embodiment] 6/12 This is shown in Fig. 3 A schematic diagram of a poor example of the creation of the present invention. - a specific example, wherein the figure refers to Figure 3, which is a 4' pole package assembly including a first pole assembly of the first pole. 14, the light-emitting unit 3, and the package unit-welded electric unit 1 has a circuit board 14 and two guides η 钵 15 15. The two conductive bodies U are separated from each other by 1 limb 11 and two The conductive body U is formed on the ί: a distance from 1 and the above-mentioned electric eagle 1〗 The package on the circuit board 14 in .1, Bu, X. Tao
兒本粗〗1即為形成於電 ，、中上述V 兩個焊接件15可為錫 之電路結構；而上述 又二u』马錫球，但不以此為限。 發光單元3具有電性連接於上述兩 先二極體晶片31。再者，所述發光二極二二】1 :發 具有兩個電極3Π，並使上述兩個焊接^片/的下表面 接於發光二極體晶片3] a接件]3的一端分別焊 杜片下表面的兩個電極311，兩個焊接 ，另Γ端分別焊接於上述兩個導電本體11。 體s H早二!具有至少一用於受熱軟化以覆蓋發光二極 片的熱塑性之塑膠顆粒41。並且，所述至少一 顆粒4!設置於發光二極體晶片31的一側；亦即，塑ς顆 粒4】可抵觸或不抵觸於發光二極體晶片3丨。 夕、 更詳細的說，所述至少一塑膠顆粒4]可用以受埶 設置於覆起域42。其巾，所述覆蓋區域42位於電路板上 ，且覆蓋區域42的外表面呈曲面狀。其中，上述覆蓋區域 42^^卜表面呈曲面狀主要是受到軟化的塑膠顆粒4]表面張 此外，上述電路板14的部份上表面、兩個導電本體η 的部份上表面、兩個焊接件〗5、及發光二極體晶片幻^位 7/12 於覆蓋區域42内。 此外，本實施例中以至少一塑膠顆粒41為例，而於實 際應用時，塑膠顆粒41的數量可作適當的變化，上述數量 之變化主要依據塑膠砸41受熱軟化後的覆蓋區域42之 體積。並且，塑膠顆粒41較合適之種類為非結晶性之熱塑 性塑膠顆粒4卜其中’以聚碳酸之塑膠顆粒41為最佳， 但並不以此為限。 〔實施例的功效〕 根據本創作實施例，上述的發光二極體封裝組件以元 件的適當勒及設置來取代昂貴的模具或成型設備，藉以 達到降低設備成本的效果。 再者，發光二極體封裝組件中的塑膠顆粒41使用率可 南達100%，此不但沒有習知模具膠道中形成有廢料之問題 ’並可有效降低生產成本。 以上所述僅為本創作之實施例，其並非用以侷限本創 作之專利範圍。 【圖式簡單說明】 圖1為本創作第一實施例的平面示意圖； 圖2為本創作第二實施例的平面示意圖；及 圖3為本創作第三實施例的平面示意圖。 【主要元件符號說明】 1導電單元 U導電本體 12間隙 13導線 · 8/12 M417659 14電路板 15焊接件 2絕緣單元 21絕緣基部 22環側壁 23容置空間 3發光單元 31發光二極體晶片 311電極 4封裝單元 41塑膠顆粒 42覆蓋區域 • 9/12The child is thicker, and the two welding members 15 of the above V can be tin circuit structures; and the above two U-Ma Xi balls, but not limited thereto. The light emitting unit 3 is electrically connected to the two first diode wafers 31 described above. Furthermore, the light-emitting diode 2:1 has two electrodes 3Π, and the lower surfaces of the two solder pads are connected to one end of the light-emitting diode chip 3] a connector]3 Two electrodes 311 on the lower surface of the dome are soldered to each other, and the other ends are soldered to the two conductive bodies 11 respectively. The body s H is second; has at least one thermoplastic plastic particle 41 for softening by heat to cover the light-emitting diode. Moreover, the at least one particle 4! is disposed on one side of the LED chip 31; that is, the plastic particle 4] may or may not interfere with the LED chip 3 . Further, in more detail, the at least one plastic particle 4] can be used to be placed in the coating field 42 by the crucible. The cover area 42 is located on the circuit board, and the outer surface of the cover area 42 is curved. Wherein, the surface of the cover area 42 is curved, mainly the surface of the softened plastic particles 4], the upper surface of the circuit board 14, the upper surface of the two conductive bodies η, and the two soldering surfaces. The light-emitting diode wafer 7/12 is in the coverage area 42. In addition, in the embodiment, at least one plastic particle 41 is taken as an example, and in actual application, the number of the plastic particles 41 can be appropriately changed. The change of the above quantity mainly depends on the volume of the cover area 42 after the plastic 砸41 is softened by heat. . Further, the plastic particles 41 are preferably of a non-crystalline thermoplastic plastic particle 4, wherein the polycarbonate plastic particles 41 are optimal, but not limited thereto. [Effect of the embodiment] According to the present embodiment, the above-described light-emitting diode package assembly replaces an expensive mold or molding apparatus with an appropriate arrangement of components, thereby achieving an effect of reducing equipment cost. Furthermore, the use rate of the plastic particles 41 in the LED package can be up to 100%, which is not only a problem of the formation of waste in the conventional mold tunnel and can effectively reduce the production cost. The above description is only an embodiment of the present invention, and is not intended to limit the scope of the patents created by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view schematically showing a first embodiment of the present invention; FIG. 2 is a plan view showing a second embodiment of the present invention; and FIG. 3 is a plan view showing a third embodiment of the present invention. [Main component symbol description] 1 conductive unit U conductive body 12 gap 13 wire · 8/12 M417659 14 circuit board 15 soldering member 2 insulating unit 21 insulating base portion 22 ring side wall 23 accommodating space 3 light emitting unit 31 light emitting diode wafer 311 Electrode 4 package unit 41 plastic particles 42 coverage area • 9/12