M383202 五、新型說明： 【新型所屬之技術領域】 本創作係有關-種光源裝置，尤指—種光源裝置之封裝結構。 【先前技術】 發光二極體(LED)因具有壽命長、體積小、高耐震性及耗電量 低等優點，故廣泛地顧於家制品及作為各式魅之指示燈或光 源。 而經過多年的發展，垂直式光源裝置及表面黏著元件型 (surface-mounted device ’以下簡稱為SMD) Lm封裝結構已可說是 才不準產α〇。a青參閱弟1圖，第1圖係一習知SMD-LED封裝結構之 剖面圖。如第1圖所示’習知SMD-LED 100係包含一第一導線架 102、一第二導線架1〇4與一設置於第一導線架1〇2表面之發光元件 110。發光元件110包含有一正電極與一負電極（圖未示），並分別 利用一導線112、114與第一導線架1〇2及第二導線架1〇4電性連接。 請參閱第1圖。SMD-LED封裝結構1〇〇更包含一杯狀基板 120 ’其包含聚碳酸酯樹脂(p〇iyCarb〇nate，pc resin)、聚鄰苯二甲酿 胺(polyphthalamide，PPA)、聚丙烯/硫酸鋇(polypropylene/barium sulfate ’ PPB)或聚甲基丙烯酸甲 g旨(p〇iymethylmethacrylate ’ M383202 之光源裝置200係以一表面黏著元件型(SMD)LED封裝結構為例， 其包含有一基板202，且基板202具有一反射杯204。基板202包含 聚碳酸酯(polycarbonate，PC)、PPA、PPB、PMMA、改性聚笨_ (noryl)、聚丁稀對苯二甲酸醋(polybutylene terephthalate，PBT)、玻 璃纖維、氧化鈦、氧化鈣或上述材料之組合，並且利用射出成型方 法形成一白殼，但熟習該項技藝之人士應知基板202所採用的材料 不限於此。 值得注意的是，在製作基板202時，係將一種反光粉末206添 加於上述材料中一同射出成型或轉注成型pjansfer m〇lding)，使得反 光粉末206均勻地分佈於基板202，尤其是反射杯204中。換句話 說，反光粉末206係滲入白殼之中。反光粉末206可為非金屬非導 電的絕緣粉末’其包含礦物粉末、聚氣乙烯^polyyinylchlofide，PVC) 粉末、或配向聚丙烯(oriented polypropylene，OPP)粉末或上述材料 之組合，且礦物粉末可為雲母石粉末或鑽石粉末。 請繼續參閱第2圖。光源裝置200尚包含一導線架208，其上 °又置有發光元件’如LED晶片210’利用銀膠或透明膠（圖未示） 黏著於導線架208上，且LED晶片210係設置於反射杯204之内。 LED晶片210至少包含一半導體複合層、一正電極與一負電極（圖 皆未示），半導體複合層包含一 !!型磊晶層、一 p型磊晶層，以及設 置於η型遙晶層與p型遙晶層之活性層’上述膜層與正負電極皆為 熟習該技藝之人士所知者，故於此係不再贅述。導線架2〇8包含印 刷電路板(pnnted circuit board，PCB)、金屬基印刷電路板(metai core 7 M383202 printed circuit board ’ MCPCB)、陶兗基板(ceramic substrate)或覆銅 陶瓷基板(direct bond cooper，DBC)等高導電導熱類型導線架，但不 限於此。部分導線架208係利用埋入成型製作於基板202内，但延 伸而外露出基板202，用以作為電性接點。 光源裝置200亦包含至少一導線212，用以分別電性連接導線 架208與LED晶片210之正電極與負電極。最後，光源裝置2〇〇 更包含一封膠214，設置於反射杯204内，且包覆LED晶片210與 導線212。封膠214的材料包含環氧樹脂(ep0Xy)、石夕膠⑽丨⑺㈣或 一可透光材料’且當光源裝置200為一藍光、白光或紫外光光源裝 置時’較佳之材料為較抗短波長光的石夕膠。此外，配合光源裝置2〇〇 所欲發出的顏色光種類，光源裝置200亦可包含黃光螢光粉體、紅 光螢光粉體、綠光螢光粉體等、其他不同顏色營光粉體其級合。 接下來請參閱第3圖’第3圖係本創作所提供之光源裝置之一 第二較佳貫施例之剖面示意圖。如第3圖所示，本第二較佳實施例 所提供之光源裝置300亦以一 SMD-LED封裝結構為例，其包含有 一基板302 ’且基板302具有一反射杯304。基板302所包含的材料 與第一較佳實施例之基板202相同，包含PC、PPA、PPB、PMMA、 改性聚苯醚、PBT、玻璃鐵維、氧化鈦、氧化鈣或上述材料之組合， 但不限於此；此外基板302亦利用射出成型或轉注成型方式形成。 在製作基板302時’係將一反射層306利用塗佈(c〇ating)的方 式’形成並包覆反射杯304之一内表面。值得注意的是，反射層306 M383202 圖。 第3圖係本創作所提供之光源裝置之一第二較佳實施例之剖面八立 圖。 ％M383202 V. New description: [New technical field] This creation is related to a kind of light source device, especially the package structure of a kind of light source device. [Prior Art] Since the light-emitting diode (LED) has the advantages of long life, small size, high shock resistance, and low power consumption, it is widely used for home products and as an indicator light or light source of various charms. After years of development, the vertical light source device and the surface-mounted device (SMD) Lm package structure can be said to be incapable of producing α〇. a green reference to the brother 1 picture, the first picture is a cross-sectional view of a conventional SMD-LED package structure. As shown in Fig. 1, the conventional SMD-LED 100 includes a first lead frame 102, a second lead frame 1〇4, and a light-emitting element 110 disposed on the surface of the first lead frame 1〇2. The light-emitting element 110 includes a positive electrode and a negative electrode (not shown), and is electrically connected to the first lead frame 1〇2 and the second lead frame 1〇4 by using a wire 112 and 114, respectively. Please refer to Figure 1. The SMD-LED package structure 1 further comprises a cup-shaped substrate 120' which comprises a polycarbonate resin (p〇iyCarb〇nate, pc resin), polyphthalamide (PPA), polypropylene/barium sulfate (Polypropylene/barium sulfate 'PPB) or polymethyl methacrylate (M 202 旨 ( ( M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 202 has a reflective cup 204. The substrate 202 comprises polycarbonate (PC), PPA, PPB, PMMA, modified polyyl, polybutylene terephthalate (PBT), glass. Fiber, titanium oxide, calcium oxide or a combination of the above materials, and a white shell is formed by an injection molding method, but those skilled in the art will recognize that the material used for the substrate 202 is not limited thereto. At 202 o'clock, a reflective powder 206 is added to the above materials to be injection molded or transferred into a pjansfer m〇lding), so that the reflective powder 206 is evenly distributed on the substrate 202, especially Cup 204. In other words, the reflective powder 206 penetrates into the white shell. The reflective powder 206 may be a non-metallic non-conductive insulating powder containing mineral powder, polyyinylchlofide (PVC) powder, or oriented polypropylene (OPP) powder or a combination of the above materials, and the mineral powder may be Mica stone powder or diamond powder. Please continue to see Figure 2. The light source device 200 further includes a lead frame 208, and a light-emitting element such as the LED chip 210 is adhered to the lead frame 208 by silver glue or transparent glue (not shown), and the LED chip 210 is disposed on the lead frame 208. Inside the cup 204. The LED chip 210 comprises at least a semiconductor composite layer, a positive electrode and a negative electrode (not shown). The semiconductor composite layer comprises a !! type epitaxial layer, a p-type epitaxial layer, and an n-type remote crystal. The active layer of the layer and the p-type crystal layer is the same as those known to those skilled in the art, and therefore will not be described again. The lead frame 2〇8 includes a printed circuit board (PCB), a metal-based printed circuit board (Metai core 7 M383202 printed circuit board 'MCPCB), a ceramic substrate or a copper-clad ceramic substrate (direct bond cooper) , DBC) is equivalent to the conductive and heat conduction type lead frame, but is not limited thereto. A portion of the lead frame 208 is formed in the substrate 202 by embedding, but extends to expose the substrate 202 for use as an electrical contact. The light source device 200 also includes at least one wire 212 for electrically connecting the lead frame 208 and the positive electrode and the negative electrode of the LED chip 210, respectively. Finally, the light source device 2 further includes a glue 214 disposed in the reflective cup 204 and covering the LED chip 210 and the wire 212. The material of the sealant 214 comprises epoxy resin (ep0Xy), Shixi gum (10) 丨 (7) (four) or a light transmissive material' and when the light source device 200 is a blue light, white light or ultraviolet light source device, the preferred material is relatively short. Wave light of Shi Xijiao. In addition, the light source device 200 may also include a yellow light fluorescent powder, a red fluorescent powder, a green fluorescent powder, and the like, and other different color camping powders, in combination with the type of color light to be emitted by the light source device 2 Cascade. Next, please refer to FIG. 3'. FIG. 3 is a schematic cross-sectional view showing a second preferred embodiment of the light source device provided by the present invention. As shown in FIG. 3, the light source device 300 of the second preferred embodiment is also exemplified by an SMD-LED package structure, which includes a substrate 302' and the substrate 302 has a reflective cup 304. The substrate 302 comprises the same material as the substrate 202 of the first preferred embodiment, and comprises PC, PPA, PPB, PMMA, modified polyphenylene ether, PBT, glass iron, titanium oxide, calcium oxide or a combination thereof. However, the substrate 302 is also formed by injection molding or transfer molding. When the substrate 302 is fabricated, a reflective layer 306 is formed by coating and coating one of the inner surfaces of the reflective cup 304. It is worth noting that the reflective layer 306 is M383202. Figure 3 is a cross-sectional view of a second preferred embodiment of a light source device provided by the present invention. %
【主要元件符號說明】 100 SMD-LED 104 第二導線架 112 > 114 導線 122 封膠 200 、 300 光源裝置 204、304 反射杯 306 反射層 306b 反光粉末 210 > 310 LED晶片 214、314 封膠 102 第一導線架 110 LED晶片 120 杯狀基板 202、302 基板 206 反光粉末 306a 介質 208、308 導線架 212 > 312 導線 11[Main component symbol description] 100 SMD-LED 104 Second lead frame 112 > 114 Wire 122 Sealing 200, 300 Light source device 204, 304 Reflecting cup 306 Reflecting layer 306b Reflective powder 210 > 310 LED wafer 214, 314 Sealing 102 first lead frame 110 LED chip 120 cup substrate 202, 302 substrate 206 reflective powder 306a medium 208, 308 lead frame 212 > 312 wire 11