M405056 五、新型說明： 【新型所屬之技術領域】 本實用新型涉及一種應用於LED器件的LED支架的 結構，具體涉及一種表面貼裝型功率LED器件支架結構。 【先前技術】 • 半導體照明被譽為第四代照明光源，逐漸普及應用到 - 通用照明領域。其中，功率發光二極體（功率LED)以高 • 亮度、高功率深受市場歡迎。傳統功率LED用的支架有 兩種：PLCC 型（plastic leaded chip carrier，塑封帶引線 片式載體）和陶瓷基板。 如附圖1所示為現有技術的PLCC型支架結構示意 圖。PLCC型支架是具有反射腔結構的塑膠外殼01包裹 金屬引線框架02,該金屬引線框架02帶有承載LED芯片 04的芯片安放部03與電極用的引腳05 ;該芯片安放部 _ 03與正負電極之一成一體結構。由於PLCC型支架帶有 反射腔、且結構緊湊，特別適合應用於配光要求高、貼裝 密度高的領域。大功率LED存在工作時產生高熱能的問 題，需要採用技術手段將所產生的熱能很好的散發，否則 會影響其壽命和出光效果。因此大功率LED用的PLCC 型支架的典型封裝結構是：具有反射腔結構的塑膠外殼除 了包裹金屬引線框架外，還包裹置於LED芯片底部且露 於支架之外的熱沉，該熱沉的材料一般選用散熱效果良好 的金屬材料，例如銅，以利於散發LED工作時產生的高 3 偏5056 熱能。由於散熱效果良好’ PLCC塑大功率LED是目前最 常用的大功率LED封裝結構之一。 另一種傳統功率LED用的支架是陶瓷基板’其典型 封裝結構如附圖2所示：承載LED芯片的基板06與置於M405056 V. New description: [New technical field] The utility model relates to a structure of an LED bracket applied to an LED device, in particular to a surface mount type power LED device bracket structure. [Prior Art] • Semiconductor lighting is known as the fourth generation of lighting sources, and is gradually becoming popular in the field of general lighting. Among them, power LEDs (power LEDs) are well received by the market for their high brightness and high power. There are two types of brackets for conventional power LEDs: a plastic leaded chip carrier (PCB) and a ceramic substrate. Fig. 1 is a schematic view showing the structure of a prior art PLCC type bracket. The PLCC type bracket is a plastic outer casing 01 having a reflective cavity structure, and the metal lead frame 02 is wrapped with a chip mounting portion 03 for carrying the LED chip 04 and a lead 05 for the electrode; the chip mounting portion _ 03 is positive and negative. One of the electrodes is in an integrated structure. Due to its reflective cavity and compact structure, the PLCC bracket is especially suitable for applications with high light distribution requirements and high placement density. High-power LEDs have the problem of generating high thermal energy when working. It is necessary to use technical means to dissipate the generated heat energy well, otherwise it will affect its life and light output. Therefore, the typical package structure of the PLCC type bracket for high-power LEDs is: a plastic case having a reflective cavity structure, in addition to wrapping the metal lead frame, a heat sink placed on the bottom of the LED chip and exposed outside the bracket, the heat sink The material is generally selected from a metal material with good heat dissipation, such as copper, to facilitate the emission of high 3 5050 heat generated by the LED. Due to the good heat dissipation effect, PLCC Plastic High Power LED is one of the most commonly used high power LED package structures. Another conventional power LED bracket is a ceramic substrate. Its typical package structure is as shown in Figure 2: the substrate 06 carrying the LED chip and placed
該基板06上的反射腔07均採用陶瓷材料；對於大功率 LED器件情況，基板06的芯片安放處還具有至少一個的 通孔08，通孔08内填充導熱材料，增強散熱效果，滿足 大功率LED器件的散熱要求。由於陶瓷基板具有良好的 絕緣性和散熱性’所以該類基板廣泛應用在大功率LED 領域’與PLCC型支架一併佔據整個大功率LED市場。 儘管如此，PLCC型支架與陶瓷基板均存在一些缺 點。就PLCC型支架而言，其製造工藝複雜，精度要求高， 已經有很多相關的專利申請，其核心關鍵技術仍掌握在國 外企業手裏，且技術相對成熟，改進空間有限。特別是功 率LED用的PLCC型支架，還需要結合裝配熱沉進行散 熱，由於加入了熱沉，需要製備沉孔和裝配熱沉，所以其 結構更加複雜，導致支架封裝工藝更加繁瑣。同時，pLcc 型的大功率LED體積大，其封裝結構不能應用於迴流焊 接工藝’不適合全自動批量化的測試與編帶卫藝，也不利 :::產品的批量化焊接安装，尤其不適用於後續的LED 时、的表面貼裝卫藝。可見現有的pLcc =雜’使，造工藝相對複雜，產品 二 1二產且成續加工工藝受限，增力The reflective cavity 07 on the substrate 06 is made of a ceramic material; for the case of a high-power LED device, the chip placement portion of the substrate 06 also has at least one through hole 08, and the through hole 08 is filled with a heat conductive material to enhance the heat dissipation effect and satisfy the high power. Thermal requirements for LED devices. Because ceramic substrates have good insulation and heat dissipation, such substrates are widely used in the field of high-power LEDs. Together with PLCC-type brackets, they occupy the entire high-power LED market. Despite this, PLCC brackets and ceramic substrates have some drawbacks. As far as the PLCC type bracket is concerned, its manufacturing process is complicated and its precision requirements are high. There are already many related patent applications, and its core key technologies are still in the hands of foreign companies, and the technology is relatively mature and the space for improvement is limited. In particular, PLCC type brackets for power LEDs need to be combined with heat sinks for heat dissipation. Due to the addition of heat sinks, it is necessary to prepare countersinks and assembly heat sinks, so the structure is more complicated, resulting in a more complicated bracket packaging process. At the same time, the pLcc type high-power LED is large in size, and its package structure cannot be applied to the reflow soldering process 'not suitable for fully automatic batch testing and braiding. It is also unfavorable::: batch soldering installation of products, especially not applicable The surface mounts the follow-up LEDs. It can be seen that the existing pLcc = miscellaneous, the manufacturing process is relatively complicated, the product is produced in two and two, and the continuous processing process is limited, and the force is increased.
的生產成本和降低了生產效率，並相應限制了 PLCC M405056 型支架功率LED的應用範圍。 雖然陶瓷基板能克服PLCC塑支架的主要缺點，但是 陶瓷基板的一個普遍問題是製造工藝難度大，成本高和枓 質脆。這也是目前限制陶瓷基板不能完全取代PLCC型支 架的關鍵因素。 綜上所述，需要尋找一種製造工藝簡單、產品出光和 ^ 散熱效果良好、加工成本較低的led支架結構，與前述 陶瓷基板和PLCC型支架相比，可以克服上述現有pLcc •型支架和陶瓷基板的技術缺點。現有的技術改進中，本領 域技術人員已經在製造材料、製作工藝方面進行了嘗試， 但都沒有很好的解決和克服上述技術缺陷。 在本實用新型作出之前，本申請人曾提出了申請號為 201020182596.9、名稱為“一種表面貼裝型功率led支^ 結構”的中國專利實用新型的技術方案，提出一種採用單 面覆銅線路板和金屬片製成的表面貼袭型功率Led支架 Φ 構，具有製造方法簡早、成本低、散熱效果的優點，能 夠克服功率LED常有的PLCC型支架和陶瓷基板的缺 點，具有佔領功率LED支架市場的潛力。然而，在進一 步的研究中也發現，由於單面覆銅線路板與金屬片之間僅 疋通過粘合膠片連接，在單面覆銅線路板的通孔底部邊緣 與金屬片之間可能出現空隙，所以會引起不易通過如“紅 墨水”等可靠性試驗，導致該功率LED支架的可靠性存在 一定的問題。而且，由於通孔底部與金屬片不是緻密連 接，形成怒片女放處底部不連續平滑，所以會引起led 5 M405056 芯片的反光率降低。 本實用新型是針辦上述技術缺陷 述技術問題技術新方幸太音 袪出的可以解決上 領域技術人型提供1能夠克服本 頂域技術貞9遍過為的普通絕緣板如 為功率LED㈣㈣料㈣㈣見， =:rr下在通孔底部邊緣與^ 出現二隙的問題，提出一種工藝簡 可靠f㈣廣、高散熱性和高反_^: 支架結構。 + ^ 【新型内容】 與現有技術的陶竟基板和PLCC型支架相比，普通絕 緣板，如PCB板，其擁有價格低廉、對於板的加工工敲 相對成熟的優勢，具有成本低、易於加工的優點。然而货， 由於普通絕緣板存在散熱效果差、耐熱性差的缺點，一方 面本領域技術人員普遍認為其不適合功率型led器件的 高散熱性的要求，只能用於小功率的LED器件，故通用 性較差；另一方面，由於其耐熱性差，在LED封裝固晶 工藝中還容易出現分層和變形等問題，成品率較低，本領 域技術人員普遍認為普通絕緣板不適於作為功率LED的 封裝材料。 本實用新型克服上述技術偏見，採用雙面覆金屬層的 普通絕緣板板作為製造功率LED支架的基板，在已經作 出的以单面覆銅線路板為支架基板並枯接金屬片的技術 M405056 方案的 針对還存在的技術缺陷而進行的進一步技 術創新與改進，本實用新型使用普通絕緣板為基板，在其 雙面覆有金屬層構成雙面覆金屬層線路板，作為製造表面 貼裝私力率^ED支架的基板，通過對於支架結構的創新 特殊汉计提供一種表面貼裝型功率LED支架結構目的。 根據本實用新型的表面貼裝型功率LED支架的技術 -方案，其結構包括：一雙面覆金屬層線路板為支架基板， .所述支架基板上具有孔以及支架線路層 ，組成所述功率 鲁LED X架；所述支架基板是由金屬層一、金屬層二和置於 所述兩金屬層之間的普通絕緣基板組成；所述線路層包括 在基板上表面的線路層一和在基板下表面的線路層二；所 述線路層一疋由對應孔周圍、用於焊接金屬線的引線連接 部以及對應所述孔兩側的正負電極層一組成，所述引線連 接部分別電性連接正負電極層一；在所述支架基板底部具 有厚金屬層’所述線路層二是由對應所述孔底部的厚金屬 ❿層作為怒片安放部和對應所述芯片安放部並與其電性絕 緣的正負電極層二組成；所述正負電極層一、正負電極層 二電性連接組成支架電極；所述孔内壁設有金屬層。 本實用新型是不同於現有技術的結構的支架，本實用 新型的技術方案在產品結構上進行了創新。一方面，本實 用新型克服現有技術的偏見，採用在普通絕緣板上雙面覆 金屬層作為製造支架的雙面覆金屬層線路板，通過本實用 新型技術方案結構的創新設計，採用普通絕緣板加工工藝 與其他LED支架製造的傳統工藝，使用雙面覆金屬層線 7 M405056 路板製造出表面貼裝塑功率led支架，一方面工藝簡單， 生產效率高，產品可靠i生好，大大降低了生產成本；另〜 方面，通過本實用新变對於支架結構的創新設计，使得用 普通絕緣板製造的LED支架能夠滿足功率LED的高耐熱 要求，由於本實用新塑的支架結構將LED芯片直接與導 熱良好的、構成芯片安放部的一體結構厚金屬層接觸，讓 LED芯片工作時釋放的熱量能夠直接通過厚金屬層釋放 至外界，所以該LED支粲具有良好的散熱效果和高的可 靠性，並且具有良好的出光效果，通過試驗證明，該雙面 覆金屬層普通絕緣板製造的led支架具有優良的耐熱性 能’在LED封裝的銀漿固晶中不會出現分層和裂解等問 題。 綜上所述，本實用新塑的方法克服了本領域技術人員 普遍認為普通絕緣板不能夠用於製造功率LED支架的技 術偏見’巧妙地將普通絕緣板應用於LED支架的製造， 極大的簡化了現有的功率LED支架的製造工藝，提高了 生產效率、降低了生產成本，本實用新型的方法製造的產 品成本低廉，可靠性好，散熱和出光效果好，能應用於迴 流焊接工藝，適合全自動批量化的測試與編帶工藝，有利 於下游產品的批量化焊接安裝，尤其適用於後續:腳 產品製造的表面貼裝工藝’具有更為廣闊的應用範圍。可 見，本實用新型是克服了技術偏見的發明創造，本實用新 型的產品相對於現有技術具有顯著的進步，取得了十分突 出的、積極的技術效果。 刀The production cost and production efficiency are reduced, and the application range of PLCC M405056 bracket power LED is limited accordingly. Although the ceramic substrate can overcome the main disadvantages of the PLCC plastic stent, a common problem with the ceramic substrate is that the manufacturing process is difficult, costly, and brittle. This is also a key factor in limiting the inability of ceramic substrates to completely replace PLCC-type brackets. In summary, it is necessary to find a led bracket structure with simple manufacturing process, good product light emission and heat dissipation effect, and low processing cost, and can overcome the above existing pLcc type bracket and ceramic compared with the above ceramic substrate and PLCC type bracket. The technical disadvantages of the substrate. In the existing technical improvements, those skilled in the art have already tried in the manufacture of materials and manufacturing processes, but have not solved and overcome the above technical defects well. Prior to the present invention, the applicant has proposed a technical solution of the Chinese patent utility model entitled "Surface Mount Type Power LED Support Structure" of Application No. 201020182596.9, and proposes a single-sided copper-clad circuit board. The surface-applied power Led bracket Φ structure made of metal sheet has the advantages of simple manufacturing method, low cost and heat dissipation effect, and can overcome the shortcomings of the PLCC type bracket and the ceramic substrate which are common in power LEDs, and has the occupation power LED. The potential of the stent market. However, in further research, it has been found that since only a single-sided copper-clad circuit board and a metal piece are connected by an adhesive film, a gap may occur between the bottom edge of the through-hole of the single-sided copper-clad circuit board and the metal piece. Therefore, it will cause difficulty in passing reliability tests such as "red ink", which leads to certain problems in the reliability of the power LED holder. Moreover, since the bottom of the through hole is not densely connected with the metal piece, the bottom of the female face is not continuously smooth, so the light reflectance of the LED 5 M405056 chip is lowered. The utility model relates to the technical problem of the above-mentioned technical defects. The technical innovation of the new party is solved by the above-mentioned technology. The utility model provides a conventional insulating board capable of overcoming the top-end technology, such as power LED (4) (four) material (four) (four) See, =: rr under the bottom edge of the through hole and ^ two gap problem, proposed a simple and reliable process f (four) wide, high heat dissipation and high anti-^: bracket structure. + ^ [New content] Compared with the prior art ceramic substrate and PLCC type bracket, ordinary insulating board, such as PCB board, has the advantages of low price and relatively mature for the processing of the board. It has low cost and is easy to process. The advantages. However, due to the disadvantages of ordinary insulating plates, such as poor heat dissipation and poor heat resistance, on the one hand, those skilled in the art generally believe that they are not suitable for the high heat dissipation requirements of power type LED devices, and can only be used for low power LED devices, so On the other hand, due to its poor heat resistance, problems such as delamination and deformation are prone to occur in the LED package die-bonding process, and the yield is low. It is generally recognized by those skilled in the art that ordinary insulating plates are not suitable as packages for power LEDs. material. The utility model overcomes the above-mentioned technical prejudice, and adopts a common insulating plate board with double-sided metal-clad layer as a substrate for manufacturing a power LED bracket, and a technology M405056 scheme which has been made with a single-sided copper-clad circuit board as a support substrate and a dead metal piece Further technological innovations and improvements for the technical defects that still exist, the utility model uses a common insulating board as a substrate, and a double-sided metal-clad circuit board is formed on the double-sided surface of the metal layer as a surface mount private The substrate of the force rate ^ED bracket provides a surface mount type power LED bracket structure through an innovative special design for the bracket structure. According to the technology of the surface mount type power LED bracket of the present invention, the structure comprises: a double-sided metal-clad circuit board as a support substrate, the support substrate has a hole and a support circuit layer, and the power is formed. a LED X frame; the support substrate is composed of a metal layer, a metal layer 2 and a common insulating substrate disposed between the two metal layers; the circuit layer includes a circuit layer 1 on the upper surface of the substrate and the substrate a circuit layer 2 on the lower surface; the circuit layer is composed of a lead connection portion for soldering a metal line and a positive and negative electrode layer corresponding to both sides of the hole, and the lead connection portion is electrically connected to each other The electrode layer has a thick metal layer at the bottom of the support substrate. The circuit layer 2 is composed of a thick metal layer corresponding to the bottom of the hole as a ridge piece mounting portion and corresponding to the chip mounting portion and electrically insulated therefrom. The positive and negative electrode layers are composed of two; the positive and negative electrode layers, the positive and negative electrode layers are electrically connected to form a support electrode; and the inner wall of the hole is provided with a metal layer. The utility model is a bracket different from the structure of the prior art, and the technical scheme of the utility model is innovative in product structure. On the one hand, the utility model overcomes the prejudice of the prior art, and adopts a double-sided metal-clad circuit board which is double-coated with a metal layer on a common insulating board as a manufacturing bracket, and adopts an ordinary insulating board through the innovative design of the technical scheme structure of the utility model. The processing technology and the traditional process of manufacturing other LED brackets use the double-sided metal-clad layer 7 M405056 road board to manufacture the surface-mount plastic power led bracket. On the one hand, the process is simple, the production efficiency is high, the product is reliable, and the product is greatly reduced. Production cost; another aspect, through the innovative design of the bracket structure, the LED bracket made of ordinary insulating board can meet the high heat resistance requirements of the power LED, because the utility model has a new structure of the LED chip directly The contact with the thick metal layer of the integral structure forming the chip mounting portion allows the heat released by the LED chip to be directly discharged to the outside through the thick metal layer, so the LED support has good heat dissipation effect and high reliability. And has a good light-emitting effect, through experiments, the double-sided metallized layer is common The LED bracket manufactured by the insulating board has excellent heat resistance. The problem of delamination and cracking does not occur in the silver paste solid crystal of the LED package. In summary, the method of the present invention overcomes the technical prejudice that the ordinary insulating board can not be used for manufacturing the power LED bracket by the person skilled in the art, and skillfully applies the ordinary insulating board to the manufacture of the LED bracket, which is greatly simplified. The manufacturing process of the existing power LED bracket improves the production efficiency and reduces the production cost. The method of the utility model has the advantages of low cost, good reliability, good heat dissipation and light-emitting effect, and can be applied to the reflow soldering process, and is suitable for all The automatic batch testing and braiding process is beneficial to the batch soldering installation of downstream products, especially for the subsequent: surface mount technology for foot product manufacturing' has a wider application range. It can be seen that the utility model is an invention which overcomes the technical prejudice, and the utility model has significant progress over the prior art, and has achieved a very prominent and positive technical effect. Knife