TWM403610U - Heat-dissipation structure of illuminating equipment - Google Patents

Heat-dissipation structure of illuminating equipment Download PDF

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Publication number
TWM403610U
TWM403610U TW99224330U TW99224330U TWM403610U TW M403610 U TWM403610 U TW M403610U TW 99224330 U TW99224330 U TW 99224330U TW 99224330 U TW99224330 U TW 99224330U TW M403610 U TWM403610 U TW M403610U
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Taiwan
Prior art keywords
heat
layer
lamp holder
heat dissipation
lamp
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TW99224330U
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Chinese (zh)
Inventor
Hung-Chang Chen
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Jin Wei Electronic Co Ltd
Huang Hsin Ming
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Application filed by Jin Wei Electronic Co Ltd, Huang Hsin Ming filed Critical Jin Wei Electronic Co Ltd
Priority to TW99224330U priority Critical patent/TWM403610U/en
Publication of TWM403610U publication Critical patent/TWM403610U/en

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Description

五、新型說明: 【新型所屬之技術領域】 本創作係關於一種照明設備,尤指一種針對散熱結構 進行改良的照明設備散熱結構。 【先前技術】 取代了傳統所使用之燈泡,LED因為無需暖燈時間、 反應速度快、體積小'用電省、污染低及耐震等特性,在 現今已經成為主流的照明元件,LED的發光原理是透過對 半導體施加電流,透過電子與電洞結合,將激發過剩的能 量以光的形式釋出,然而,並非所有過剩的能量都會以光 的形式釋出,未以光之形式釋出的能量則會轉換成熱能, 一般而言,若使用10W的電,只有不到2W的電能可轉換 成光’其餘皆以熱能形式散出,故LED燈的散熱效果若不 好’造成熱的累積使溫度升高,會對led的發光效率及使 用壽命造成損害。 為了有效散熱,LED燈都會設置有散熱結構,習知技 術以導熱性良好的金屬為主,但使用金屬雖可有效導熱, 但熱能在金屬上會集中於受熱面,無法在金屬上均勻導 熱,故開始有使用石墨來代替之情事’石墨有均熱的性質, 可將所吸收之熱能平均傳導至石墨整體,然而在使用石墨 上亦會有以下之缺點: 1,傳導至石墨之熱能無法有效快速的散出,同樣造成熱能 M403610 的累積,造成LED的損害。 2·熱能從石墨散出後,仍會累積在燈座内,習知技術中雖 有於燈座上設置開孔以增加熱對流的效率,但孔洞會導 致空氣中的灰塵積存於燈座内,反倒使熱能更不易散出。 3.石墨製成之散熱結構會有落粉的情況,若落粉掉在lEE) 的電路基板或電源基板上時,會於電流導通時造成短 路’進而損害電路。 有鑑於此’本案之創作者以多年之研究經驗,研發出 一種可解決習知技術所無法解決的一種照明設備散熱結 構。 【新型内容】 本創作之第一目的,在於提供一種照明設備散熱結 構,藉由在散熱結構之石墨層的兩表面上分別塗上導熱塗 料及散熱塗料,一方面藉由導熱塗料加速發光元件之熱能 傳導至石墨’在藉由散熱塗料將石墨所吸收之熱能加速散 出,以同時提升散熱及導熱的效率,有效散去發光元件所 產生的熱能。 本創作的第二目的,係在燈座的表面塗上熱輻射塗料 及設置有氣體導槽,將熱能分別以熱輻射及熱對流的方式 加速散出燈座之外。 本創作的第三目的,係藉由在散熱結構之石墨的兩表 面上分別塗有導熱材料及散熱材料,進而避免石墨表面有 M403610 落粉的情況發生。 本創作之一種照明設備散熱結構,係包含:一燈頭, 係具有至少二導線;一燈座,其一端係連接於該燈頭,其 表面係設有一散熱層及複數個氣體導槽;一散熱結構,係 喪合於該燈座内部’係包含:一石墨層,係具有一第一面、 一第二面及至少二穿孔’該穿孔係供該導線穿過;一導熱 層’係連接於該石墨層之該第一面;一散熱層,係連接於 石墨層之該第二面;一發光元件,係設置於燈座内部並連 接於遠導熱層,且與通過穿孔之導線電性連接;及一燈罩, 係連接於燈座與該燈頭連接之另一端。 【實施方式】 為了此夠更清楚地描述本創作所提出之一種照明設備 散熱結構,以下將配合圖示,詳盡說明本創作之較佳實施 例0 請同時參閱第一圖及第二圖,係本創作之一較佳實施 例之立體示思圖及該較佳實施例之立體展開示意圓,係包 含·燈頭1 ’係、具有二導、線11,以供電性連接使用; -_ 2,甘' 、一 %係連接於該燈頭1 ’該燈座2係以鋁 製成外°卩表面係設有複數個氣體導槽22,該氣體 導槽22 為橋接孔狀,可避免灰塵直接飄進燈座2内 部,此外,請再回a ]時參閱第三圖,係本創作之較佳實施例 之燈座剖面圖,心 圖所示,燈座2的外表面更設有一散熱 5 M403610 層2丨’該散熱層21可為熱輻射塗料或散熱材料,其中, 燈座2内部之壁面更可設計成凹凸狀或波浪狀(圖中未 不)’以增加可接觸的表面積,以提升散熱效率; 一散熱結構3,係嵌合於該燈座2内部,並請同時參 閲第四圖’係本創作較佳實施例之散熱結構組成示意圖, 如圖所不’該散熱結構3係包含:一石墨層3丨,係具有一 第面311、一第一面312及二穿孔313,該二穿孔313該 二導線11穿過;一導熱層32,係連接於石墨層31之該第 一面311; —散熱層33,係連接於石墨層31之該第二面 312;其中,該導熱層32及散熱層33可為導熱材料、散熱 材料、熱輕射材料及導電材料,為具體實現本實施例,在 本實施例田中之導熱㉟32係、以導熱塗料製成,而散熱層 33係以散熱塗料製成,並且藉由將塗料塗於石墨層η上, 可有效避免石墨層3 1的落粉情形; 發光兀件4,係設置於燈座2内部並連接於該導熱 層32,且與通過該穿孔313之導線u電性連接,其中, 該發光元件4在本實施例中可為_咖燈;及一燈罩” 係連接於燈座2與該燈頭丨連接之另一端。 上述已針對本創作之結構作一 & 再^ 几整也边,以下將進一 步揭露本創作熱能產生及傳導 寻导途k,當電源流經發光元件 4’除了使發光元件發亮,爭合 更會產生相當的熱能,此時,熱 能藉由導熱層32加速傳導至 石墨層31,石墨層31具有均 6 M403610V. New description: [New technology field] This creation is about a lighting device, especially a lighting device heat dissipation structure that is improved for the heat dissipation structure. [Prior Art] Instead of the traditionally used light bulb, LED has become the mainstream lighting component because of the need of no warming time, fast response speed, small size, low power consumption, low pollution and shock resistance. By applying current to the semiconductor, the electrons are combined with the holes to dissipate the excess energy in the form of light. However, not all excess energy is released in the form of light, and the energy is not released in the form of light. It will be converted into heat. Generally speaking, if 10W of electricity is used, less than 2W of electric energy can be converted into light. The rest are radiated in the form of heat. Therefore, if the heat dissipation effect of the LED lamp is not good, the heat accumulation will cause When the temperature rises, it will cause damage to the luminous efficiency and service life of the LED. In order to effectively dissipate heat, the LED lamp will be provided with a heat dissipation structure. The conventional technology is mainly made of a metal with good thermal conductivity. However, although the metal can effectively conduct heat, the heat energy is concentrated on the heating surface on the metal and cannot be uniformly conducted on the metal. Therefore, there is a need to use graphite instead. 'Graphite has a soaking property, and the absorbed heat energy can be transmitted to the graphite as a whole. However, the use of graphite also has the following disadvantages: 1. The heat energy transmitted to graphite cannot be effective. The rapid dissipation also caused the accumulation of thermal energy M403610, causing damage to the LED. 2. After the heat is released from the graphite, it will still accumulate in the lamp holder. In the prior art, although the opening is provided in the lamp holder to increase the efficiency of heat convection, the hole will cause the dust in the air to accumulate in the lamp holder. On the contrary, it makes heat more difficult to dissipate. 3. The heat dissipation structure made of graphite may be in the form of powder falling. If the powder falls on the circuit substrate or the power substrate of the lEE), it may cause a short circuit when the current is turned on, thereby damaging the circuit. In view of the fact that the creators of this case have developed many years of research experience, they have developed a lighting structure that can solve the problem that the conventional technology cannot solve. [New content] The first purpose of the present invention is to provide a heat dissipation structure for a lighting device, which is coated with a heat conductive paint and a heat dissipating paint on both surfaces of a graphite layer of a heat dissipating structure, and on the other hand, the light emitting element is accelerated by a heat conductive paint. The heat energy is transmitted to the graphite to accelerate the heat energy absorbed by the graphite by the heat-dissipating paint to simultaneously improve the heat dissipation and heat conduction efficiency, and effectively dissipate the heat energy generated by the light-emitting element. The second purpose of the creation is to apply a thermal radiation coating to the surface of the lamp holder and to provide a gas guiding groove to accelerate the thermal energy out of the lamp holder by means of heat radiation and heat convection, respectively. The third object of the present invention is to prevent the occurrence of M403610 falling powder on the graphite surface by coating the heat-conducting material and the heat-dissipating material on the two surfaces of the graphite of the heat-dissipating structure. The lighting device heat dissipation structure of the present invention comprises: a lamp cap having at least two wires; a lamp holder having one end connected to the lamp cap, the surface of which is provided with a heat dissipation layer and a plurality of gas guiding grooves; and a heat dissipation structure , the interior of the lamp holder includes: a graphite layer having a first surface, a second surface, and at least two perforations for perforating the wire; a thermally conductive layer is coupled to the a first surface of the graphite layer; a heat dissipating layer is connected to the second surface of the graphite layer; a light emitting element is disposed inside the lamp socket and connected to the far heat conducting layer, and is electrically connected to the wire passing through the through hole; And a lamp cover is connected to the other end of the lamp holder and the lamp cap. [Embodiment] In order to more clearly describe a heat dissipation structure of a lighting device proposed by the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings. Please refer to the first figure and the second figure at the same time. The three-dimensional illustration of a preferred embodiment of the present invention and the three-dimensional expansion of the preferred embodiment include a lamp holder 1 ', a two-conductor, and a wire 11 for power supply connection; -_ 2, Gan's, one% is connected to the base 1'. The lamp holder 2 is made of aluminum. The surface of the lamp holder 2 is provided with a plurality of gas guiding grooves 22, which are bridged holes to prevent dust from floating directly. Into the inside of the lamp holder 2, in addition, please refer back to the third figure, which is a sectional view of the lamp holder of the preferred embodiment of the present invention. As shown in the heart diagram, the outer surface of the lamp holder 2 is further provided with a heat dissipation 5 M403610. The layer 2 丨 'the heat dissipation layer 21 may be a heat radiation coating or a heat dissipation material, wherein the wall surface inside the socket 2 can be designed to be concave or convex or wavy (not shown) to increase the contactable surface area to enhance Heat dissipation efficiency; a heat dissipation structure 3 is fitted to the lamp holder 2, and please refer to the fourth figure at the same time as a schematic diagram of the heat dissipation structure of the preferred embodiment of the present invention. The heat dissipation structure 3 includes: a graphite layer 3丨 having a first surface 311, a first surface 312 and two through holes 313, the two through holes 313 pass through the two wires 11; a heat conducting layer 32 is connected to the first surface 311 of the graphite layer 31; the heat dissipation layer 33 is connected to the graphite layer 31. The second surface 312; wherein the heat conductive layer 32 and the heat dissipation layer 33 can be a heat conductive material, a heat dissipating material, a heat light material, and a conductive material, in order to specifically implement the embodiment, the heat conduction 3532 system in the field of the embodiment The heat dissipation layer 33 is made of a heat-dissipating paint, and the coating layer is applied to the graphite layer η, thereby effectively preventing the powder layer of the graphite layer 31; the light-emitting element 4 is disposed on the lamp The inside of the base 2 is connected to the heat conducting layer 32 and electrically connected to the wire u passing through the through hole 313. The light emitting element 4 can be a light lamp in the embodiment; and a light cover is connected to the lamp socket. 2 The other end of the connection with the lamp holder 。. The above has been made for the structure of the creation. &^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ The thermal energy is accelerated to the graphite layer 31 by the heat conductive layer 32, and the graphite layer 31 has an average of 6 M403610

熱的特性,能使熱能均句的傳導至石墨層31整體,傳導至 石墨層31的熱能再藉由散熱層33加速散置燈座2内此 外,熱能亦可藉由石墨層31嵌合燈座2之部份直接傳導至 燈座2上;傳導至燈座2内之熱能可藉由兩種方式將熱能 散至燈座2外,第一種係藉由燈座2外之散熱層2卜以熱 輻射之方式加速將熱能從燈座2散出;第二種方式是藉由 燈座2上的氣體導槽22,以熱對流的方式將燈座2内的熱 能散出,如此一來,由發光元件4所產生的熱能可有效快 速的藉由散熱結構3的導熱塗料層32、石墨層31、散熱塗 料層33與燈座2的散熱層21及氣體導槽22等元件作用而 散發至燈座2外,增加發光元件的使用壽命。 综上所述,本創作已作了相當完整之揭露,從中,可 以得知歸納出本創作係具有下列之優點: 1.藉由在石墨層上新增導熱塗料層及散熱塗料層,分別將 發光元件產生的熱能加速導入至石墨層以及將石墨層接 收的熱能加速散發至燈座内,提升了散熱的效率,並且 因塗料係塗於石墨層上,亦可有效避免落粉的情形產生。 2.燈座上新增了散熱層及氣體導槽,前者利用熱輻射漆以 熱輻射之方式將燈座内部的熱能傳導散出,後者利用熱 對流的方式將熱能散出,並且因氣體導槽設計為一橋接 狀,故亦可避免灰塵或大型外物直接從孔洞進入,累積 在燈座内造成散熱的不便。 7 M403610 然而,上述之詳細說明係針對本創作可行實施例之具 體說明’惟該實施例並非用以限制本創作之專利範圍,凡 未脫離本創作技藝精神所為之等效實施或變更,均應包含 於本案之專利範圍中。 【圖式簡單說明】 第一圖 係本創作之一種照明設備散熱結構之一較佳 實施例之立體示意圖; 第二圖 係本創作之照明 例之立體展開示 第三圖 係本創作之照明 之燈座剖面圖; 第四圖 係本創作之照明 之散熱結構組成 【主要元件符號說明】 設備散熱結構之該較佳實施 意圖; 設備散熱結構之較佳實施例 及 設備散熱結構之較佳實施例 示意圖。 1 燈頭 11 導線 2 燈座 21、33 散熱層 22 氣體導槽 3 散熱結構 31 石墨層 311 第一面 M403610 312 第 二面 313 穿 孔 32 導熱層 4 發 光元件 5 燈 罩The thermal property enables the thermal energy to be transmitted to the entirety of the graphite layer 31, and the thermal energy transmitted to the graphite layer 31 is accelerated by the heat dissipation layer 33 to be dispersed in the lamp holder 2. Further, the thermal energy can also be fitted by the graphite layer 31. The part of the seat 2 is directly transmitted to the lamp holder 2; the heat energy transmitted to the lamp holder 2 can dissipate the heat energy to the lamp holder 2 by two ways, the first type is the heat dissipation layer 2 outside the lamp holder 2 The heat is accelerated to dissipate the heat from the lamp holder 2; the second way is to dissipate the heat energy in the lamp holder 2 by means of the gas channel 22 on the lamp holder 2, such that The thermal energy generated by the light-emitting element 4 can be effectively and quickly utilized by the heat conductive paint layer 32 of the heat dissipation structure 3, the graphite layer 31, the heat dissipation paint layer 33, the heat dissipation layer 21 of the socket 2, and the gas channel 22, and the like. Dissipated to the outside of the lamp holder 2 to increase the service life of the light-emitting element. In summary, this creation has been fairly completely revealed, from which we can conclude that the creation department has the following advantages: 1. By adding a thermal conductive coating layer and a heat dissipation coating layer on the graphite layer, respectively The thermal energy generated by the illuminating element accelerates the introduction into the graphite layer and accelerates the heat energy received by the graphite layer into the lamp holder, thereby improving the efficiency of heat dissipation, and the coating is applied to the graphite layer, thereby effectively preventing the occurrence of falling powder. 2. The heat sink layer and the gas guide groove are added to the lamp holder. The former uses the heat radiation paint to conduct the heat energy inside the lamp holder by heat radiation, and the latter uses the heat convection method to dissipate the heat energy, and the gas guide The groove is designed to be a bridge shape, so that dust or large foreign objects can be prevented from entering directly from the hole, and accumulation in the lamp holder causes heat dissipation. 7 M403610 However, the above detailed description is intended to be a specific description of the presently applicable embodiments. The present invention is not intended to limit the scope of the present invention. It is included in the patent scope of this case. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective view of a preferred embodiment of a lighting device heat dissipation structure of the present invention; the second figure is a three-dimensional expansion of the lighting example of the present creation. The fourth embodiment is a heat dissipation structure of the illumination of the present invention. [Main component symbol description] The preferred embodiment of the device heat dissipation structure; the preferred embodiment of the device heat dissipation structure and the preferred embodiment of the device heat dissipation structure schematic diagram. 1 lamp cap 11 wire 2 lamp holder 21, 33 heat sink 22 gas channel 3 heat dissipation structure 31 graphite layer 311 first side M403610 312 second side 313 through hole 32 heat conducting layer 4 light emitting element 5 lamp cover

Claims (1)

M403610 六、申請專利範圍: 1. 一種照明設備散熱結構,係包含: 一燈頭’係具有至少二導線; 一燈座,其一端係連接於該燈頭, 再表面係設有一 散熱層及複數個氣體導槽; 一散熱結構,係嵌合於該燈座内部,係包含. 第一面及至少 一石墨層’係具有一第一面M403610 VI. Patent application scope: 1. A heat dissipation structure for a lighting device, comprising: a lamp cap having at least two wires; a lamp holder having one end connected to the lamp cap and having a heat dissipation layer and a plurality of gases on the surface a heat dissipation structure is embedded in the lamp holder and includes: the first surface and the at least one graphite layer have a first surface 二穿孔,該穿孔係供該導線穿過; 一導熱層,係連接於該石墨層之該第—面 一散熱層,係連接於石墨層之該第二面; 發光元件,係設置於燈座内部並連接於該導熱 層’且與通過穿孔之導線電性連接;及 一燈罩’係連接於燈座與該燈頭連接之另—端。 2.如申請專利範圍第1項所述之照明設備散熱結構,其 中’該燈座係以鋁合金製成。 如申請專利範圍第1項所述之照明設備散熱結構,其 中’該燈座内部之壁面係可設計成凹凸之壁面,以增加 散熱之接觸面積。 4. 如申請專利範圍第1項所述之照明設備散熱結構,其 中’該燈座之該散熱層可為熱輻射材料及散熱材料。 5. 如申請專利範圍第1項所述之照明設備散熱結構,其 中’該散熱結構之該導熱層及該散熱層係以下列任一種 10 M403610 Λ « 材料製成:導熱材料、散熱材料、熱輻射材料及導電材 料。a second through hole, the through hole is for the wire to pass through; a heat conducting layer is connected to the first surface of the graphite layer, a heat dissipation layer is connected to the second surface of the graphite layer; and the light emitting element is disposed on the lamp socket Internally connected to the heat conducting layer 'and electrically connected to the wire passing through the through hole; and a lamp cover' is connected to the other end of the lamp holder and the lamp cap. 2. The illuminating device heat dissipation structure according to claim 1, wherein the lamp holder is made of an aluminum alloy. The illuminating device heat dissipating structure according to claim 1, wherein the wall surface of the lamp holder is designed to be a wall surface of the concavity and convexity to increase the contact area of the heat dissipating. 4. The illuminating device heat dissipating structure according to claim 1, wherein the heat dissipating layer of the lamp holder is a heat radiating material and a heat dissipating material. 5. The illuminating device heat dissipation structure according to claim 1, wherein the heat conducting layer and the heat dissipating layer of the heat dissipating structure are made of any of the following 10 M403610 Λ « materials: heat conductive material, heat dissipating material, heat Radiation materials and conductive materials.
TW99224330U 2010-12-15 2010-12-15 Heat-dissipation structure of illuminating equipment TWM403610U (en)

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