TWM403608U - Heat-dissipation module for LED lamp - Google Patents

Heat-dissipation module for LED lamp Download PDF

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Publication number
TWM403608U
TWM403608U TW099222584U TW99222584U TWM403608U TW M403608 U TWM403608 U TW M403608U TW 099222584 U TW099222584 U TW 099222584U TW 99222584 U TW99222584 U TW 99222584U TW M403608 U TWM403608 U TW M403608U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
heat
led lamp
pair
dissipation module
Prior art date
Application number
TW099222584U
Other languages
Chinese (zh)
Inventor
Meyer Iv George A
Chien-Hung Sun
Chieh-Ping Chen
Original Assignee
Celsia Technologies Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Priority to TW099222584U priority Critical patent/TWM403608U/en
Publication of TWM403608U publication Critical patent/TWM403608U/en
Priority to DE202011050730U priority patent/DE202011050730U1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Description

M403608 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係關於一種散熱模組，尤指一種用於LED燈具的散 熱模組。 [0002] 【先前技術】 發光二極體（Light Emitting Diode, LED)具有低耗能 1 、省電、使用壽命長、體積小、反應快等特點，已逐步 取代傳統燈泡而廣泛應用各種照明燈具中。但是溫度的 • 高低變化卻是關係到LED的使用壽命和各種性能，因此如 何對此散熱模組作最適切的佈置設計則為本案所研究的 重要課題。 [0003] 習知用於LED燈具的散熱模組，如本創作人在先前申請且 公告的中華民國新型專利證書號TWM369430所揭露，其 主要包括一中空筒體和一均溫板，均溫板具有一蒸發段 和一冷凝段，冷凝段是穿設在中空筒體内並與其内壁面 • 貼接’蒸發段則供所述LED燈具固定；如此，以組合成一 散熱模組。 [0004] 然而，上述結構雖然具有良好的導散熱效果，但對於曰 益提昇的高功率LED或高瓦數LED而言，其導散熱效果顯 然並不足夠’仍然存在有待改善的空間來予以克服。 [0005] 【新型内容】 本創作之一目的，在於可提供一種用於led燈具的散熱模 組’其係藉由各散熱鰭片與中空筒體和均溫板直接熱接 觸’而能夠高效率地將led燈具所產生的熱量散逸出去。 表單编號A0101 第3頁/共15頁 [0006]M403608 為了達成上述之目的，本創作係提供一種用於LED嶝具的 散熱模組，㈣-均溫板 中空筒體及多數散熱轉片’違均溫板具有-蒸發段和自該蒸發段延伸出的一對冷 凝段，該中空筒體外表面開設有相互對應的一對凹槽， 忒均溫板的該對冷凝段是埋設在該對凹槽内；該等散熱 鰭片是環形排列在該中空筒體和該對冷凝段外周緣且彼 此熱接觸》 [0007] 本創作還具有以下功效，各散熱鰭片係以薄板沖壓成型 後再連接於均溫板和中空筒體，不僅可大幅度地降低整 體重量，且在單位體積內可配設省較大的散熱表面積。 另在導熱纽有容置連接，並 藉助貫穿槽σ設置而使均導孰。又 在各散熱鰭片設有通槽，以在任二相鄰的氣體通道之間 形成有側向氣體對流效果。 [0008] [0009] [0010] 【實施方式】 * · - * · Ϊ | ► · ». * t «； i · 1 i >, 有關本創作之特徵及技術内::容Η:部,參輯以下之詳細說明 與附圖，而所附圖示僅提供參考;與(說明，並非用來對本 創作加以限制者》 請參閱第一至四圖所示，本創作係提供一種用於燈具 的散熱模組，本實施例的散熱模組主要包括一導熱座10 、一均溫板20、一中空筒體30及多數散熱鰭片40。 導熱座10為以鋁、銅或其合金等金屬材質所製成，其大 致呈一圓板狀，在其中間位置開設有一矩形容置槽11， 且容置槽11的底部形成有一貫穿槽口 1Π，另在容置槽11 表單編號A0101 第4頁/共15莨 的二側邊分別設有對應的—台階丨2。 [0011] 均溫板20 (Vapor Chamber)為一真空容腔内部裝設有毛 細組織、工作流體等元件，利用工作流體的汽液相變化 來達成熱傳導，並藉助毛細組織來提供液體的回流機制 ，藉以構成連續循環的作動型態；本實施例的均溫板2〇 大致呈一u字型，其具有橫向部份的一蒸發段21和自蒸發 段21延伸出的一對縱向部份的冷凝段22、23，蒸發段以 是沉入前述容置槽11内以與導熱座1〇熱接觸，並在對應 貫穿槽口 111的位置形成有裸露且與導熱座1〇底面齊平的 一平表面211 ;各冷凝段22、23的橫向剖斷面呈一圓弧形 (如第四圖所示），並分別形成有一内弧面221、231和一 外弧面222、232。 [0012] 中空筒體30為以鋁、銅等導散性良好的材質所製成，在 中空筒體30的外表面開設有相互對應的一對凹槽31、32 ，前述均溫板20的各冷凝段22、23是分別埋設在各凹槽 31、32内，且其内弧面221、231是與中空筒體3〇緊密貼 接以傳導熱量，而各冷凝段22、23的外弧面222、232則 是裸露，並與中空筒體3〇的外周面共同形成一圓形周緣（ 如第四圖所示）。 [0013] 各散熱結片4〇為以係以薄板沖麼成型其材質可為銘、 銅或其合金等，此散熱鰭片4〇大致呈_L字型（如第四圖 所示）’其短邊是熱接觸在中空筒體30和各冷凝段22、23 的外弧面222、232上且呈環形排歹，j，長邊則呈放射狀形 成在中空筒體3〇和各冷凝段22、23外周圍。另在各散熱 鰭片40的自由端開設有複數通槽41，藉以在任二 表單編號A010丨 ^ ^ 第5頁/共15頁 M403608 氣體通道之間形成有側向氣體對流效果。 [0014] 此外，本創做更包括一散熱體50，此散熱體50為以鋁、 銅或其合金等金屬材質所製成，其具有一底板51並於底 板51上延伸有多數散熱柱52，並在此些散熱柱52外部自 底板51延伸有一對凸板53 ;此散熱體50是以底板51壓掣 均溫板20的蒸發段21，並令各凸板53分別嵌入前述台階 12而固定。M403608 V. New Description: [New Technology Field] [0001] This creation is about a heat dissipation module, especially a heat dissipation module for LED lamps. [0002] [Prior Art] Light Emitting Diode (LED) has the characteristics of low energy consumption, power saving, long service life, small volume, fast response, etc., and has gradually replaced traditional light bulbs and widely used various lighting fixtures. in. However, the change in temperature is related to the service life and various performances of the LED. Therefore, the optimal layout of the thermal module is an important issue for this case. [0003] A heat dissipating module for an LED luminaire is known, as disclosed by the creator of the Republic of China, New Patent No. TWM369430, which was previously filed and disclosed, and which mainly includes a hollow cylinder and a temperature equalizing plate, and a temperature equalizing plate. The utility model has an evaporation section and a condensation section. The condensation section is disposed in the hollow cylinder body and is connected to the inner wall surface thereof. The evaporation section is fixed for the LED lamp; thus, the heat dissipation module is combined. [0004] However, although the above structure has a good heat dissipation effect, the heat dissipation effect of the high power LED or the high wattage LED which is improved is obviously not enough. 'There is still room for improvement to overcome. . [0005] [New content] One of the purposes of the present invention is to provide a heat dissipation module for a LED lamp, which is capable of high efficiency by directly contacting each of the heat dissipation fins with the hollow cylinder and the temperature equalization plate. The heat generated by the led luminaire is dissipated. Form No. A0101 Page 3 of 15 [0006] M403608 In order to achieve the above objectives, the present invention provides a heat dissipation module for LED cookware, (4) - uniform temperature plate hollow cylinder and most heat transfer rotors' The counter-average temperature plate has an evaporation section and a pair of condensation sections extending from the evaporation section, the outer surface of the hollow cylinder is provided with a pair of corresponding grooves, and the pair of condensation sections of the uniform temperature plate are embedded in the pair The heat dissipating fins are annularly arranged on the outer circumference of the hollow cylinder and the pair of condensation sections and are in thermal contact with each other. [0007] The present invention also has the following effects: each fin is stamped and formed by a thin plate. The connection to the temperature equalizing plate and the hollow cylinder not only greatly reduces the overall weight, but also provides a large heat dissipation surface area per unit volume. In addition, there is a connection in the heat-conducting button, and the conduction is made by the through-groove σ setting. Further, a through groove is formed in each of the heat radiating fins to form a lateral gas convection effect between any two adjacent gas passages. [0010] [Embodiment] * · - * · Ϊ | ► · ». * t «; i · 1 i >, About the characteristics and technology of this creation:: 容Η:部, The following detailed description and drawings are included, and the accompanying drawings are only provided for reference; and (illustrated, not intended to limit the creation), please refer to the first to fourth figures, the present invention provides a lamp for lighting The heat dissipation module of the embodiment mainly includes a heat conduction seat 10, a temperature equalization plate 20, a hollow cylinder 30 and a plurality of heat dissipation fins 40. The heat conduction seat 10 is made of metal such as aluminum, copper or its alloy. The material is made of a substantially circular plate shape, and a rectangular receiving groove 11 is formed at a middle portion thereof, and a through-groove 1 is formed at the bottom of the receiving groove 11 and a receiving groove 11 is formed. Form No. A0101 Page 4 The two sides of the total 15 设有 are respectively provided with corresponding steps 丨 2. [0011] The Vapor Chamber is equipped with a capillary structure, a working fluid and the like for the inside of a vacuum chamber, and the working fluid is used. The vapor-liquid phase changes to achieve heat conduction, and the capillary structure is used to provide a liquid reflux mechanism. The actuating pattern constituting the continuous cycle; the temperature equalizing plate 2 of the present embodiment has a substantially U-shape, and has an evaporation portion 21 in a lateral portion and a pair of longitudinal portion condensation portions extending from the evaporation portion 21. 22, 23, the evaporation section is submerged into the accommodating groove 11 to be in thermal contact with the heat conducting seat 1 , and a flat surface 211 which is exposed and flush with the bottom surface of the heat conducting seat 1 is formed at a position corresponding to the through slot 111 . The transverse sections of each of the condensation sections 22, 23 have a circular arc shape (as shown in the fourth figure), and are respectively formed with an inner curved surface 221, 231 and an outer curved surface 222, 232. [0012] The body 30 is made of a material having good dispersibility such as aluminum or copper, and a pair of grooves 31 and 32 corresponding to each other are formed on the outer surface of the hollow cylinder 30, and the condensation sections 22 of the temperature equalizing plate 20, 23 is embedded in each of the grooves 31, 32, and the inner curved surfaces 221, 231 are closely attached to the hollow cylindrical body 3 to conduct heat, and the outer curved surfaces 222, 232 of the respective condensation sections 22, 23 are It is bare and forms a circular circumference together with the outer peripheral surface of the hollow cylinder 3( (as shown in the fourth figure). [0013] Each heat sink 4〇 is formed by thin plate punching and its material can be Ming, copper or its alloy, etc. The heat sink fin 4〇 is roughly _L-shaped (as shown in the fourth figure) 'The short side is hot contact The hollow cylinder 30 and the outer curved surfaces 222, 232 of the respective condensation sections 22, 23 are annularly arranged, j, and the long sides are radially formed around the hollow cylinder 3 and the outer circumferences of the respective condensation sections 22, 23. In addition, a plurality of through grooves 41 are formed at the free ends of the heat dissipation fins 40, thereby forming a lateral gas convection effect between any two form numbers A010丨^^5/15 pages M403608 gas passages. [0014] In addition, the present invention further includes a heat dissipating body 50 which is made of a metal material such as aluminum, copper or alloy thereof, and has a bottom plate 51 and a plurality of heat dissipating columns 52 extending on the bottom plate 51. And a pair of convex plates 53 extending from the bottom plate 51 outside the heat dissipating columns 52; the heat dissipating body 50 is pressed against the evaporation section 21 of the temperature equalizing plate 20 by the bottom plate 51, and the convex plates 53 are respectively embedded in the step 12 fixed.

[0015] 請參閱第五圖所示，本創作的散熱模組係可應用在一LED 燈具8上，此LED燈具8具有一電路:板各1及佈設在電路板 81上的多數LED82 ;組合於導熱座 1 0的底面貼|，並令背面對正 於平表面211位置來配設，熱量將從平 表面211傳導給均溫板20，藉助均溫^_汽液相熱傳機 制將此等熱量帶離到各冷凝段22、23浐其中一部份的熱 量是傳導給中空筒體30予卞汗#份的熱量則是 直接傳導給各散熱鰭片40本以嘴私此，而高效率地 將LED燈具8的各LED82所產生散逸出去。 [0016] 综上所述，本創作之用於LED燈具的散熱模組，確可達到 預期之使用目的，而解決習知之缺失，又因極具新穎性 及進步性，完全符合新型專利申請要件，爰依專利法提 出申請，敬請詳查並賜准本案專利，以保障創作人之權 利0 【圖式簡單說明】 [0017] 第一圖係本創作散熱模組的立體分解圖。 表單編號A0101[0015] Referring to FIG. 5, the heat dissipation module of the present invention can be applied to an LED lamp 8 having a circuit: a board 1 and a plurality of LEDs 82 disposed on the board 81; The bottom surface of the heat conducting block 10 is attached to the bottom surface of the heat conducting block 10, and the back surface is aligned with the flat surface 211. The heat is transferred from the flat surface 211 to the temperature equalizing plate 20, and is heated by the uniform temperature ^_ vapor phase heat transfer mechanism. The heat of the equal heat is transferred to each of the condensation sections 22, 23, and a part of the heat is transmitted to the hollow cylinder 30. The heat of the heat is directly transmitted to the heat sink fins 40, and the heat is high. The LEDs of the LED lamp 8 are efficiently dissipated. [0016] In summary, the heat dissipation module for the LED lamp of the present invention can achieve the intended purpose of use, and solves the lack of conventional knowledge, and is completely in line with the novel patent application requirements due to its novelty and progress. According to the patent law, please apply for the patent in detail to protect the rights of the creator. 0 [Simple description] [0017] The first picture is an exploded view of the heat dissipation module. Form number A0101

第6頁/共15頁 M4.03608 第二圖係本創作散熱模組的組合外觀圖。 第三圖係第二圖之3-3剖視圖。 第四圖係第三圖之4-4剖視圖。 第五圖係本創作應用於LED燈具使用狀態剖視圖。 【主要元件符號說明】 [0018] 10…導熱座 11…容置槽 111…貫穿槽口 1 2…台階 20…均溫板 21…蒸發段 211…平表面 2 2、2 3…冷凝段 221、 231…内弧面 222、 232…外弧面 30···中空筒體 31、32"·凹槽 40…散熱鰭片 41…通槽 50…散熱體 51…底板 52…散熱柱 5 3…凸板 8…LED燈具 81…電路板 表單編號A0101 第7頁/共15頁 M403608 82Page 6 of 15 M4.03608 The second picture shows the combined appearance of the creative cooling module. The third figure is a cross-sectional view of 3-3 of the second figure. The fourth figure is a cross-sectional view of 4-4 of the third figure. The fifth figure is a cross-sectional view of the application of the LED lighting fixture. [Description of main component symbols] [0018] 10... Thermal conductive seat 11... accommodating groove 111... through slot 1 2... step 20... temperature equalizing plate 21... evaporation section 211... flat surface 2 2, 2 3 ... condensation section 221, 231... inner arc surface 222, 232... outer arc surface 30··· hollow cylinder 31, 32"·groove 40...heat dissipation fin 41...through groove 50...heat radiator 51...base plate 52...heat dissipation column 5 3...convex Board 8...LED Lamp 81...Board Form No. A0101 Page 7 of 15 M403608 82

LEDled

表單編號A0101 第8頁/共15頁Form No. A0101 Page 8 of 15

Claims (1)

M403608 •、申請專利範圍： 1 . 一種用於LED燈具的散熱模組，包括： 一均溫板，具有一蒸發段和自該蒸發段延伸出的一對冷凝 段； 一中空筒體，外表面開設有相互對應的一對凹槽，該均溫 板的該對冷凝段是埋設在該對凹槽内；以及 多數散熱鰭片，環形排列在該中空筒體和該對冷凝段外周 緣且彼此熱接觸。 2 .如請求項1所述之用於LED燈具的散熱模組，其更包括一 導熱座，該均溫板的該蒸發段係熱接觸在該導熱座上。 3 .如請求項2所述之用於LED燈具的散熱模組，其中該均溫 板呈一U字型，該蒸發段形成在該均溫板的橫向部份，該 對冷凝段則形成在該均溫板的縱向部份。 4 .如請求項3所述之用於LED燈具的散熱模組，其中該冷凝 段的橫向剖斷面呈一圓弧形，並分別形成有一内弧面和一 外弧面，該内弧面與該中空筒體貼接，該外弧面則與該等 散熱鰭片貼接。 5 .如請求項4所述之用於LED燈具的散熱模組，其中該外弧 面與該中空筒體的外周面共同形成一圓形周緣。 6 .如請求項2所述之用於LED燈具的散熱模組，其中該導熱 座開設有一容置槽，在該容置槽的底部形成有一貫穿槽口 ，該蒸發段係沉入該容置槽内，並在該蒸發段對應該貫穿 槽口的位置形成有裸露且與該導熱座底面齊平的一平表面 〇 7 .如請求項6所述之用於LED燈具的散熱模組，其更包括一 099222584 表單編號A0101 第9頁/共15頁 0992069908-0 M403608 散熱體，該散熱體是熱接觸在該蒸發段上。 如請求項7所述之用於LED燈具的散熱模組，其中該散熱 體具有貼接該蒸發段的一底板及在該底板上延伸有多數散 熱柱。 如請求項8所述之用於LED燈具的散熱模組，其中該底板 延伸有一對凸板，該導熱座的該容置槽二側邊分別設有對 應的一台階，該凸板嵌固在該台階上。 ίο . 如請求項1所述之用於LED燈具的散熱模組，其中該散熱 鰭片呈一L字型，該等散熱鰭片的短邊分別與該中空筒體M403608 •, patent application scope: 1. A heat dissipation module for an LED lamp, comprising: a temperature equalizing plate having an evaporation section and a pair of condensation sections extending from the evaporation section; a hollow cylinder body, an outer surface a pair of mutually corresponding grooves are opened, the pair of condensation sections of the temperature equalization plate are embedded in the pair of grooves; and a plurality of heat dissipation fins are annularly arranged on the outer circumference of the hollow cylinder and the pair of condensation sections and are mutually Thermal contact. 2. The heat dissipation module for an LED lamp of claim 1, further comprising a heat conducting block, the evaporation section of the temperature equalizing plate being in thermal contact with the heat conducting seat. 3. The heat dissipation module for an LED lamp according to claim 2, wherein the temperature equalization plate has a U shape, the evaporation portion is formed at a lateral portion of the temperature equalization plate, and the pair of condensation segments are formed at The longitudinal portion of the temperature equalization plate. The heat dissipation module for an LED lamp according to claim 3, wherein the condensation section has a circular cross section and is formed with an inner arc surface and an outer arc surface, respectively. The hollow cylinder is attached to the hollow cylinder, and the outer curved surface is attached to the heat dissipation fins. 5. The heat dissipation module for an LED lamp of claim 4, wherein the outer arc surface and the outer circumferential surface of the hollow cylinder form a circular circumference. The heat dissipation module for an LED lamp according to claim 2, wherein the heat conduction seat defines a receiving groove, and a through slot is formed at a bottom of the receiving groove, and the evaporation section is sunk into the receiving portion. a flat surface 〇7 which is exposed and flush with the bottom surface of the heat conducting seat is formed in the groove at a position corresponding to the venting portion, and a heat dissipating module for the LED luminaire according to claim 6 Including a 099222584 Form No. A0101 Page 9 / Total 15 Page 0992069908-0 M403608 Heat sink, the heat sink is in thermal contact on the evaporation section. The heat dissipation module for an LED lamp of claim 7, wherein the heat sink has a bottom plate attached to the evaporation section and a plurality of heat dissipation columns extending on the bottom plate. The heat dissipation module for the LED lamp of claim 8, wherein the bottom plate extends with a pair of convex plates, and the two sides of the receiving groove of the heat conducting seat are respectively provided with a corresponding step, and the convex plate is embedded in On the steps. The heat dissipation module for an LED lamp according to claim 1, wherein the heat dissipation fin has an L shape, and the short sides of the heat dissipation fins respectively correspond to the hollow cylinder 或該對冷凝段貼接，磷等蘇譏鱗技的長逶韌呈放射狀形成 *·. 在該中空筒體及該對冷凝軺 11 如請求項1 〇所述之用鼴娜嫌fe組遷其中該散熱 鰭片的自由端開設有複數： I ; j ni® ‘>5\ I :，·Τ· ' ' .. - ·' < \Or the pair of condensation sections are attached, and the long toughness of the phosphorus and other scales is formed radially*. The hollow cylinder and the pair of condensation chambers 11 are as described in claim 1 The free end of the heat sink fin is opened with multiple numbers: I; j ni® '>5\ I :,·Τ· ' ' .. - ·' < \ \> ^··; 099222584 表單編號A0101 第10頁/共15頁 0992069908-0\>^··; 099222584 Form Number A0101 Page 10 of 15 0992069908-0
TW099222584U 2010-11-19 2010-11-19 Heat-dissipation module for LED lamp TWM403608U (en)

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TW099222584U TWM403608U (en) 2010-11-19 2010-11-19 Heat-dissipation module for LED lamp
DE202011050730U DE202011050730U1 (en) 2010-11-19 2011-07-15 Cooling module for light-emitting diode lamp

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426213B (en) * 2011-08-05 2014-02-11
CN111156484A (en) * 2012-07-20 2020-05-15 杨泰和 Heat radiator with heat conducting ribs forming flow guide holes at intervals for electric energy luminous body

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426213B (en) * 2011-08-05 2014-02-11
CN111156484A (en) * 2012-07-20 2020-05-15 杨泰和 Heat radiator with heat conducting ribs forming flow guide holes at intervals for electric energy luminous body
CN111156484B (en) * 2012-07-20 2022-03-18 杨泰和 Heat radiator with heat conducting ribs forming flow guide holes at intervals for electric energy luminous body

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