M415258 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關一種照明裝置，尤指一種散熱器及具該散 熱器的LED照明裝置。 【先前技術】 [0002] 近年來因發光二極體（LED)技術的蓮勃發展及日趨成熟， 且其具有低耗能、使用壽命長、體積小、反應快等特點 ’已逐步的取代傳統的照明裝置；然而影響LED壽命的最 關鍵因素莫過於熱量的堆積問題’是以目前的相關業者 都已竭盡全力的在開發可供LED使用的散熱器等產品。 _] f知的LED照明裝置，主要包括-紹擠散熱器及―⑽發 光模組，此鋁擠散熱器包含一座板及自座板的一端向上 延伸出的多數散熱鰭片，各散熱鰭片大致呈一長條狀， 並在任二相鄰散熱鰭片之間形成有一散熱通道；led發光 模組則固定在座板並相互熱接觸傳導。 [0004] 然而，習知的LED照明裝置，在實際使用上仍存在下述的 問題點，㈣其各散熱趙片呈一長條狀，能與周圍氣體 作熱交換的散熱表面積受到限制，更易因為風向的關係 而造成死角的問題。另其座板為一封閉板體，不僅板體 上、下兩側的氣體無法進行有效的熱交換，且用在室外 的空間時易在板體的上表面堆積或沾黏灰塵、污物；如 此，皆將嚴重的影響到其散熱效能。 【新型内容】 [0005] 本創作之一目的，在於提供一種散熱器及具該散熱器的 表單编號A0101 第3頁/共23頁 M415258 LED照明裝置，其係藉由各散熱柱的獨立佈設，能夠大幅 度的增加與氣體的熱交換表面積，進而提高散熱器的散 熱效能。 [0006] 為了達成上述之目的，本創作提供一種散熱器，包括一 導熱基板及多數散熱柱，該導熱基板開設有多數貫穿孔 ;各該散熱柱分別設置在該導熱基板的一表面上，各該 散熱柱為分離配置。 [0007] 為了達成上述之目的，本創作提供一種具散熱器的LED照 明裝置，包括一散熱器及一LED發光模組，該散熱器包括 一導熱基板及多數散熱柱，該導熱基板開設有多數貫穿 孔，各該散熱柱分別設置在該導熱基板的一表面上且分 離配置；該LED發光模組固定在該導熱基板上，且其包括 一電路板及佈設在該電路板的多數LED。 [0008] 本創作還具有以下功效，其係藉助各貫穿孔的開設，不 僅可擴增散熱基板與周圍冷空氣的熱交換作用，並可大 幅度的減輕整體的重量。利用各圓柱狀散熱柱的均勻分 佈，可減少散熱死角的產生，而充分的發揮散熱效能。 各貫穿孔除了可作為散熱通道外，此LED照明裝置若配置 在室外的空間中時，此等貫穿孔亦可被用來作為水洗的 流道，因此能夠有效的避免粉塵、污物等的堆積影響。 藉由在各散熱柱開設剖槽或形成中空柱，不但可減輕整 體總重量，更能擴大與周圍氣體的熱交換表面積。 【實施方式】 [0009] 有關本創作之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本創 表單編號A0101 第4頁/共23頁 作加以限制者。 [0010] 請參閱第一至七圖所示，本創作係提供一種散熱器及具 散熱器的LED照明裝置’此LED照明裝置主要包括一散熱 盗1及一LED發光模組5。 [0011] 散熱器1包括一導熱基板10及多數散熱柱20，本實施例的 導熱基板10由一上板11和一下板12所組合而成，上、下 板11 ' 12大致呈一矩形狀，且皆以銅、鋁或其合金等導 散熱性良好材料所製成；在上、下板11、12分別開設有 相互對應的多數貫穿孔丨丨丨、121，各貫穿孔m、121大 致呈橫向排列；另在上、下板11、12相互疊接的表面開 設有多數條槽道112、122，此等槽道112、122是形成在 前述各排貫穿孔111、121之間。 [0012] 各散熱柱20是形成在上、下板Π ' 12的上、下表面上， 此等散熱柱20可與上、下板11、12—體成型製出，或以 組合方式連接在上、下板11、12上，各散熱柱2〇可為一 實心圓柱（如第六圖所示），其沿著前述槽道112、122兩 侧間隔排列佈設，且相鄰排的散熱柱2〇又恰位在前述貫 穿孔111、121外周圍區域（參閱第五圖所示）。另在下板 12的下表面中間區域的各散熱柱2〇之間形成有一容置區 123(參閱第四圖所示），此容置區123是供前述的LED發 光模組5安裝固定’且前述各槽道122的一端恰位在容置 區123的正上方位置。 [0013] 此外，本創作的散熱器1更包括多數的熱管3〇(Heat Pipe) ’各熱管30的内部具有毛細組織和工作流體，利用 工作流體的汽液相變化和毛細組織所提供的液體回流機 表單編號A0101 第5頁/共23頁 M415258 制5來產生連續循環的熱量傳遞；每一熱管30具有一蒸 發段31和自蒸發段31延伸出的一冷凝段32，此等熱管30 是安置在前述的槽道112、122内，且被上、下板11、12 所夾掣固定（參閱第六圖所示），其中各蒸發段31被安置 在容置區123正上方的各槽道112、122内（參閱第三圖所 示）。進一步，在上、下板11、12組合後的一側邊形成有 一套接孔13(參閱第二圖所示）。 [0014] LED發光模組5主要包括一電路板51、多數LED52及一均 溫板53(Vapor Chamber)，此電路板51係為一金屬基印 刷電路板（Metal Core PCB，MCPCB)，各LED52是以矩 陣排列方式佈設在電路板51的一表面上，均溫板53的内 部亦具有毛細組織、工作流體和支撐體，利用工作流體 的汽液相變化和毛細組織所提供的液體回流機制，來產 生連續循環的熱量傳遞；此均溫板53的一端面是與下板 12和各熱管30的蒸發段31熱傳導，另一端面則供電路板 51固定並與各LED52熱傳導。 [0015] 此外，本創作的LED照明裝置更包括一透光罩6，此透光 罩6是罩蓋在LED發光模組5外部且固定在下板12上；如此 ，以組合成一具散熱器的LED照明裝置。 [0016] 使用時各LED52發光並產生高熱量，其將直接熱傳導給 均溫板53，均溫板53在接受此等熱量後，將令其内部的 工作流體產生蒸發而成為一氣體，此氣體將帶著大量的 熱往均溫板53的冷端快速移走，並將此熱量傳導給導熱 基板10和各熱管30，各熱管30則將此等熱量快速擴散傳 導到導熱基板10的大部分區域，藉助導熱基板10上的各 表單编號A0101 第6頁/共23頁 貫穿孔111 ' 121來與外部的冷空氣進行熱交換，同時利 用各散熱柱20的大散熱表面積來與外部的冷空氣進行大 量的熱交換’而得一高效能的散熱效果。 [0017] 請參閱第八圖所示’為本創作第二實施例的LED照明裝置 ’此LED照明裝置與第一實施例led照明裝置的主要區別 在於：各散熱柱20a分別自上板11或下板12的一端面延伸 成型’且各散熱柱20a為一中空圓柱體，如此可大幅度的 減輕上、下板11、12和各散熱柱2〇a的重量，且能夠有效 的擴增散熱表面積。 [0018] 請參閱第九圖所示’為本創作第三實施例的LED照明裝置 ’此LED照明裝置與前述各實施例LED照明裝置的主要區 別在於：各散熱柱2〇b係自上板11或下板12的一端面延伸 成型’在各散熱柱2〇b的中心位置開設有一字狀剖槽21b ’但不以此種形狀為限，其亦可為其它各種不同幾何造 型的剖槽’如此亦具有減輕重量和擴增散熱表面積的等 同效果。 [0019] 請參閱第十圖所示，為本創作第四實施例的LED照明裝置 ’此LED照明裝置與前述各實施例LED照明裝置的主要區 別在於：導熱基板10c由單一板體所構成，在導熱基板10c 的單一端面延伸有多數散熱柱20，並在導熱基板l〇c對應 LED發光模組5的位置開設有多數條凹槽1〇〇c，以供各熱 管30來埋設，LED發光模組5則是固定在容置區123c内。 [0020] 請參閱第十一圖所示，為本創作第五實施例的Led照明裝 置’此LED照明裝置與前述各實施例LED照明裝置的主要 區別在於：導熱基板1〇d亦由單—板體所構成，在導熱基 表單編號A010〗 « „ ^ M415258 板10d的上下兩端面分別延伸有多數根散熱柱20，發光模 組5的均溫板53直接固定在導熱基板10d的下端面。 [0021] 综上所述，本創作之散熱器及具該散熱器的LED照明裝置 ，確可達到預期之使用目的，而解決習知之缺失，又因 極具新穎性及進步性，完全符合新型專利申請要件，爰 依專利法提出申請，敬請詳查並賜准本案專利，以保障 創作人之權利。 【圖式簡單說明】 [0022] 第一圖係本創作第一實施例立體分解圖。 [0023] 第二圖係本創作第一實施例組合外觀圖。 [0024] 第三圖係本創作第一實施例組合俯視圖。 [0025] 第四圖係第三圖之4-4剖視圖。 [0026] 第五圖係第三圖之5-5剖視圖。 [0027] 第六圖係第三圖之6-6剖視圖。 [0028] 第七圖係第三圖之7-7剖視圖。 [0029] 第八圖係本創作第二實施例組合剖視圖。 [0030] 第九圖係本創作第三實施例組合剖視圖。 [0031] 第十圖係本創作第四實施例組合剖視圖。 [0032] 第十一圖係本創作第五實施例組合剖視圖。 【主要元件符號說明】 [0033] 1…散熱器 表單編號A0101 第8頁/共23頁 M415258 [0034] [0035] [0036] [0037] [0038] [0039] [0040]M415258 V. New description: [New technical field] [0001] This creation relates to a lighting device, especially a radiator and an LED lighting device having the same. [Prior Art] [0002] In recent years, due to the development and maturity of the light-emitting diode (LED) technology, it has the characteristics of low energy consumption, long service life, small size, fast response, etc. The lighting device; however, the most critical factor affecting the life of the LED is the accumulation of heat. The current related industry has made every effort to develop products such as radiators for LEDs. _] The known LED lighting device mainly includes a squeezing radiator and a (10) illuminating module. The aluminum squeezing radiator comprises a plate and a plurality of fins extending upward from one end of the seat plate, and each fin The utility model has a long strip shape and a heat dissipation channel is formed between any two adjacent heat dissipation fins; the LED light module is fixed on the seat plate and is in thermal contact with each other. [0004] However, the conventional LED lighting device still has the following problems in practical use. (4) The heat-dissipating Zhao film has a long strip shape, and the heat-dissipating surface area capable of heat exchange with the surrounding gas is limited, and is easier. Because of the relationship between the wind direction, the problem of dead ends. In addition, the seat plate is a closed plate body, not only the gas on the upper and lower sides of the plate body can not be effectively exchanged heat, and it is easy to accumulate or stick dust or dirt on the upper surface of the plate body when used in an outdoor space; In this way, it will seriously affect its heat dissipation performance. [New Content] [0005] One of the purposes of this creation is to provide a heat sink and a form number A0101 with the heat sink, page 3 of 23, M415258 LED lighting device, which is independently arranged by each heat dissipation column. The heat exchange surface area with the gas can be greatly increased, thereby improving the heat dissipation performance of the heat sink. [0006] In order to achieve the above object, the present invention provides a heat sink comprising a heat conducting substrate and a plurality of heat dissipating columns, wherein the heat conducting substrate is provided with a plurality of through holes; each of the heat dissipating columns is respectively disposed on a surface of the heat conducting substrate, The heat sink column is in a separate configuration. [0007] In order to achieve the above object, the present invention provides an LED lighting device with a heat sink, comprising a heat sink and an LED lighting module, the heat sink comprising a heat conducting substrate and a plurality of heat dissipating columns, the heat conducting substrate having a majority Each of the heat dissipation columns is disposed on a surface of the heat conductive substrate and disposed separately; the LED light emitting module is fixed on the heat conductive substrate, and includes a circuit board and a plurality of LEDs disposed on the circuit board. [0008] The present invention also has the following effects, which are achieved by the opening of each through hole, which not only amplifies the heat exchange between the heat dissipation substrate and the surrounding cold air, but also greatly reduces the overall weight. By using the uniform distribution of the cylindrical heat dissipating columns, the generation of heat dissipation dead angle can be reduced, and the heat dissipation performance can be fully exerted. In addition to being used as a heat dissipation channel, the through holes can be used as a water-washing flow path when the LED lighting device is disposed in an outdoor space, thereby effectively preventing the accumulation of dust, dirt, and the like. influences. By forming a groove or forming a hollow column in each of the heat dissipating columns, not only the overall weight of the whole body can be alleviated, but also the heat exchange surface area with the surrounding gas can be enlarged. [Embodiment] [0009] The detailed description and technical contents of the present invention are described below with reference to the drawings, but the drawings are only provided for reference and explanation, and are not used for the original form number A0101, page 4 of 23 Be restricted. [0010] Please refer to the first to seventh figures. The present invention provides a heat sink and an LED lighting device with a heat sink. The LED lighting device mainly includes a heat sink 1 and an LED lighting module 5. [0011] The heat sink 1 includes a heat conductive substrate 10 and a plurality of heat dissipation columns 20. The heat conductive substrate 10 of the present embodiment is formed by combining an upper plate 11 and a lower plate 12, and the upper and lower plates 11'12 are substantially rectangular. And all of them are made of a material having good heat dissipation properties such as copper, aluminum or an alloy thereof; and a plurality of through holes 121, 121 are formed in the upper and lower plates 11 and 12, respectively, and the through holes m and 121 are substantially The plurality of channels 112 and 122 are formed on the surface of the upper and lower plates 11 and 12 which are overlapped with each other. The channels 112 and 122 are formed between the rows of through holes 111 and 121. [0012] Each of the heat dissipating columns 20 is formed on the upper and lower surfaces of the upper and lower plates 12 12, and the heat dissipating columns 20 can be integrally formed with the upper and lower plates 11 and 12, or connected in combination. On the upper and lower plates 11 and 12, each of the heat dissipating columns 2〇 can be a solid cylinder (as shown in FIG. 6), which is arranged along the two sides of the grooves 112 and 122, and the adjacent columns of the heat dissipating columns are arranged. 2〇 is also located in the outer peripheral area of the aforementioned through holes 111, 121 (refer to the fifth figure). Another accommodating area 123 is formed between each of the heat dissipating columns 2 at the middle portion of the lower surface of the lower plate 12 (refer to the fourth figure). The accommodating area 123 is for mounting and fixing the LED lighting module 5 described above. One end of each of the aforementioned channels 122 is located just above the accommodating area 123. [0013] In addition, the heat sink 1 of the present invention further includes a plurality of heat pipes (Heat Pipe). The inside of each heat pipe 30 has a capillary structure and a working fluid, and utilizes a vapor-liquid phase change of the working fluid and a liquid provided by the capillary structure. Reflow machine form number A0101 page 5 / 23 pages M415258 system 5 to generate a continuous cycle of heat transfer; each heat pipe 30 has an evaporation section 31 and a condensation section 32 extending from the evaporation section 31, these heat pipes 30 are It is disposed in the aforementioned channels 112, 122, and is fixed by the upper and lower plates 11, 12 (refer to the sixth figure), wherein each evaporation section 31 is disposed in each groove directly above the accommodating area 123. In lanes 112, 122 (see the third figure). Further, a set of through holes 13 is formed on one side of the combination of the upper and lower plates 11, 12 (see Fig. 2). [0014] The LED lighting module 5 mainly includes a circuit board 51, a plurality of LEDs 52, and a Vapor Chamber. The circuit board 51 is a metal-based printed circuit board (MCPCB), and each LED 52 is provided. It is arranged on a surface of the circuit board 51 in a matrix arrangement. The interior of the temperature equalization plate 53 also has a capillary structure, a working fluid and a support body, and utilizes a vapor-liquid phase change of the working fluid and a liquid reflux mechanism provided by the capillary structure. To produce a continuous cycle of heat transfer; one end face of the temperature equalization plate 53 is thermally conducted to the lower plate 12 and the evaporation section 31 of each heat pipe 30, and the other end face is fixed to the circuit board 51 and thermally conducted to the respective LEDs 52. [0015] In addition, the LED lighting device of the present invention further includes a transmissive cover 6 which is externally attached to the LED lighting module 5 and fixed on the lower plate 12; thus, combined to form a heat sink. LED lighting device. [0016] In use, each LED 52 emits light and generates high heat, which directly conducts heat to the temperature equalizing plate 53. After receiving the heat, the temperature equalizing plate 53 will evaporate the working fluid inside it to become a gas, and the gas will be A large amount of heat is quickly removed to the cold end of the temperature equalizing plate 53, and the heat is transferred to the heat conducting substrate 10 and the heat pipes 30, and the heat pipes 30 are quickly diffused and conducted to most areas of the heat conducting substrate 10. The heat exchange with the external cold air is performed by the through-holes 111' 121 of each of the form numbers A0101 and the 23 pages on the heat-conductive substrate 10, while utilizing the large heat-dissipating surface area of each of the heat-dissipating columns 20 to cool the outside with the outside. A lot of heat exchange is carried out to get a high-performance heat dissipation effect. [0017] Please refer to the eighth embodiment of the LED lighting device of the second embodiment of the present invention. The main difference between the LED lighting device and the LED lighting device of the first embodiment is that the heat dissipating columns 20a are respectively from the upper plate 11 or One end surface of the lower plate 12 is extended and formed, and each of the heat dissipating columns 20a is a hollow cylinder, so that the weight of the upper and lower plates 11, 12 and the heat dissipating columns 2〇a can be greatly reduced, and the heat dissipation can be effectively amplified. Surface area. [0018] Please refer to the ninth embodiment of the LED lighting device of the third embodiment of the present invention. The main difference between the LED lighting device and the LED lighting device of the foregoing embodiments is that the heat dissipating columns 2〇b are from the upper plate. 11 or one end surface of the lower plate 12 is formed by forming a word-shaped groove 21b in the center of each heat-dissipating column 2〇b. However, it is not limited to such a shape, and it can also be used for other various geometric shapes. 'This also has the equivalent effect of reducing weight and amplifying the heat dissipating surface area. [0019] Please refer to the tenth figure, the LED lighting device of the fourth embodiment of the present invention. The main difference between the LED lighting device and the LED lighting device of the foregoing embodiments is that the heat conducting substrate 10c is composed of a single plate body. A plurality of heat dissipation columns 20 extend on a single end surface of the heat conductive substrate 10c, and a plurality of grooves 1〇〇c are opened at positions corresponding to the LED light-emitting modules 5 of the heat-conductive substrate 10c for the heat pipes 30 to be buried, and the LEDs are illuminated. The module 5 is fixed in the accommodating area 123c. [0020] Please refer to the eleventh figure, the main difference between the LED lighting device of the fifth embodiment of the present invention and the LED lighting device of the foregoing embodiments is that the heat conducting substrate 1〇d is also The heat dissipation base form number A010 « „ ^ M415258 The upper and lower end faces of the plate 10d respectively extend a plurality of heat dissipation columns 20, and the temperature equalization plate 53 of the light-emitting module 5 is directly fixed to the lower end surface of the heat-conductive substrate 10d. [0021] In summary, the heat sink of the present invention and the LED lighting device with the same can achieve the intended purpose of use, and solve the lack of the conventional, and completely meet the novelty due to the novelty and the progressiveness. For patent application requirements, apply for the patent law, please check and grant the patent in this case to protect the rights of the creator. [Simplified illustration] [0022] The first figure is an exploded view of the first embodiment of the present creation [0023] The second drawing is a combined appearance view of the first embodiment of the present creation. [0024] The third drawing is a combined top view of the first embodiment of the present creation. [0025] The fourth drawing is a sectional view taken along line 4-4 of the third drawing. [0026] The fifth picture is the first Figure 5-5 is a cross-sectional view. [0027] Figure 7 is a cross-sectional view taken along line 6-6 of the third figure. [0028] Figure 7 is a cross-sectional view taken along line 7-7 of the third figure. [0029] [0030] The ninth drawing is a sectional view of the third embodiment of the present invention. [0031] The eleventh drawing is a sectional view of the fourth embodiment of the present creation. [0032] The eleventh drawing is the fifth embodiment of the present creation. Example sectional view. [Main component symbol description] [0033] 1... Heatsink form number A0101 Page 8 of 23 M415258 [0034] [0036] [0038] [0040]
[0041] [0042] [0043] [0044] [0045] [0046][0044] [0046] [0046]
[0047] [0048] [0049] [0050] [0051] 10、10c、lOd…導熱基板 1 0 0 c…凹槽 11…上板 1 2…下板 111、 121…貫穿孔 112、 122…槽道 123、123c…容置區 13…套接孔20、20a、20b…散熱柱 21b…剖槽 30…熱管 31…蒸發段 32…冷凝段 5 · · · L E D發光模組 51…電路板52 …LED 5 3…均溫板 6…透光罩 表單编號A0101 第9頁/共23頁10, 10c, 10d... heat-conducting substrate 1 0 0 c... groove 11... upper plate 1 2... lower plate 111, 121... through-hole 112, 122... slot [0048] [0050] Lane 123, 123c... accommodating area 13... socket 20, 20a, 20b... heat sink 21b... slot 30... heat pipe 31... evaporation section 32... condensation section 5 · · · LED lighting module 51 ... circuit board 52 ... LED 5 3...Homothermal plate 6...transparent cover form number A0101 Page 9 of 23