M379300 五、新型說明： 【新型所屬之技術領域】 本創作涉及一種用來佈設電路之電路基板，特別是一種具有 高散熱效率的基板結構。 【先前技術】 第二圖為顯示習知的印刷電路板結構，係利用影像轉移技術 將FR-4或陶瓷基板上的線路移轉至由矽⑶）或石墨材料所製成的 基板1上’然後於基板1上依實際需要設置所需要數量的線路層， 例如第二圖所示的第一線路層3a(Ag)與第二線路層3b，其中的第 二線路層3b又可以包含由下往上依序堆疊的第一導電層 3bl(Cu)、第二導電層3b2(Ni)與第三導電層3b3(Au或Ag);但因 矽(Si)屬於半導體，故在製程中需要在基板丨與線路層之間增加 一絕緣層2。 植设於電路基板的晶片在運作時所產生的熱量，除了大部分 熱量會由設於“上的散親組扣排除外，部分熱量則會經由 電路基板傳導，但因前述習知電路基板所採用的絕緣層，其導熱 般在20w/m_k以下’因此’在電路基板的導熱路徑中，該 絕緣層乃是導熱速率最小的地方，以致於電路基板累積過高的溫 度可能影響晶片的可靠度。 【新型内容】 3 M379300 作時所產生的熱量’除了大部分熱量會由設於晶片上的散熱模組 予以排除外，部分熱量則會經由電路基板傳導，由於本創作之電 路基板所包含的各基板1、絕緣層2、各線路層均具有高導熱係數， 因此，得以快速的將熱量排除，從而維持晶片的可靠度。 以上所述者僅為用以解釋本創作之較佳實施例，並非企圖據 以對本創作作任何形式上之_，是以，凡有在相同之創作精神 下所作有關本創作之任何修許或變更，皆仍應包括在本創作意圖 # 保護之範疇。 M379300 【圖式簡單說明】 第一圖為顯示本創作電路基板實施例結構之平面示意圖。 第二圖為顯示習知電路基板結構之平面示意圖。 【主要元件符號說明】 1… •基板 2…·. •絕緣層 3a… …第一線路層 3b… …第二線路層 3bl- 第一導電層 3b2- ••…第二導電層 3b3- ••…第—導電層 4·..._ -緩衝層 7M379300 V. New Description: [New Technology Field] This creation relates to a circuit board for laying circuits, and in particular to a substrate structure with high heat dissipation efficiency. [Prior Art] The second figure shows a conventional printed circuit board structure using image transfer technology to transfer a line on an FR-4 or ceramic substrate to a substrate 1 made of ruthenium (3) or graphite material. Then, a required number of circuit layers are disposed on the substrate 1 as needed, for example, the first circuit layer 3a (Ag) and the second circuit layer 3b shown in FIG. 2, wherein the second circuit layer 3b may further comprise The first conductive layer 3b1 (Cu), the second conductive layer 3b2 (Ni) and the third conductive layer 3b3 (Au or Ag) are sequentially stacked upward; however, since bismuth (Si) belongs to a semiconductor, it is required in the process An insulating layer 2 is added between the substrate and the wiring layer. The heat generated during operation of the wafer implanted on the circuit substrate, except that most of the heat is removed by the loose-fitting group disposed on the upper portion, part of the heat is conducted through the circuit substrate, but the conventional circuit substrate is used. The insulating layer used has a thermal conductivity of less than 20w/m_k. Therefore, in the heat conduction path of the circuit substrate, the insulating layer is the place where the heat conduction rate is the smallest, so that excessive accumulation of temperature of the circuit substrate may affect the reliability of the wafer. [New content] 3 The heat generated by the M379300 is 'except that most of the heat is removed by the heat dissipation module provided on the wafer, and some of the heat is conducted through the circuit substrate, which is included in the circuit substrate of the present invention. Each of the substrate 1, the insulating layer 2, and each of the circuit layers has a high thermal conductivity, so that the heat can be quickly removed, thereby maintaining the reliability of the wafer. The above is only a preferred embodiment for explaining the present invention. It is not an attempt to make any form of this creation, so that any modification or change relating to the creation in the same creative spirit is made. It should still be included in the scope of this creation intention #. M379300 [Simple description of the diagram] The first diagram is a schematic plan view showing the structure of the circuit board embodiment of the present invention. The second diagram is a schematic diagram showing the structure of a conventional circuit substrate. [Main component symbol description] 1... • Substrate 2...·. Insulation layer 3a...first wiring layer 3b...second wiring layer 3b1-first conductive layer 3b2- ••...second conductive layer 3b3- •...第—conductive layer 4·..._ - buffer layer 7