M378418 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及散熱領域，尤其涉及一種散熱器保媒套及具M378418 V. New Description: [New Technology Field] [0001] This creation relates to the field of heat dissipation, especially to a radiator protection sleeve and
有該種保護套之散熱裝置。 A 【先前技術】 [0002] 電腦機箱内裝有很多部件’如電源、光碟機、硬碟機及 主機板等，於使用過程中，各個部件均會產生熱量而使 整個機箱内之溫度升高，當機箱内之溫度過高時，各個 部件可能就無法正常工作，故為保障該等部件能正常工 作，部件之散熱就顯得很重要。 [0003] 現常用之一種散熱系統是於電腦前板上開設進風口，cpu 散熱採用一側吹風扇模組及一導風罩結合，導風罩對鹿 前板之進風口，後板於設個另一風扇模組將氣流排出而 對電腦内部進行散熱。於該種設計中，處於cpu這條散熱 通道之部件散熱效果比較好，而對於前板上端之磁碟機 模組由於氣流較小散熱效果很不理想。 【新型内容】 [0004] 鑒於以上内容’有必要提供一種便於磁碟機模組散熱之 散熱系統。 [0005] 一種散熱系統，包括一第一風扇模組、一電腦機殼及一 處於一電腦電源中之第二風扇模組，該電腦機殼包括— 前板、一與該前板相對之後板、一連接該前板與該後板 之頂板及一側板’該側板連接該前板、該後板及該頂板 ，該側板用於裝設一主機板，該第一風扇模組用於對該 表單编號A0101 第3頁/共Π頁 M378418 主機板之一CPU進行散熱，該後板設有對應該第二風扇模 組之出風口，一發熱模組裝設於該前板上並靠近該頂板 ，該頂板於靠近該前板之一端設有多個對應該發熱模組 之開孔，該開孔用於讓氣流進入對該發熱模組進行散熱 0 [0006] 優選地，該前板設有多個用於讓氣流進入對該發熱模組 進行散熱之進風孔。 [0007] 優選地，該第一風扇模組為一正吹型風扇模組，該第一 風扇模組可收集從該開孔流入之氣流。 [0008] 優選地，該散熱系統還包括一裝設於該後板上之第三風 扇模組，該後板設有對應該第三風扇模組之出風口。 [0009] 優選地，該多個開孔於該頂板上呈長方形分佈。 [0010] 優選地，該發熱模組為一磁碟機模組。 [0011] 優選地，該第一風扇模組包括一散熱器' 一散熱器保護 套及一散熱風扇，該保護套設置於該散熱器與該散熱風 扇之間，該散熱器包括多個散熱鰭片，該散熱鰭片包括 一邊角部，該散熱器保護套設置於該散熱鰭片之邊角部 並收容該邊角部。 [0012] 優選地，該散熱器保護套包括一第一保護片及一自該第 一保護片延伸形成之第二保護片，該第一保護片及該第 二保護片之間形成一收容部，該收容部用於收容該邊角 部。 [0013] 優選地，該散熱鰭片包括一第一邊緣及一第二邊緣，該 表單編號A0101 第4頁/共17頁 第一邊緣與該第二邊緣相連而形成該邊角部，該第一保 護片及該第二保護片分別用於接觸該散熱鰭片之第一邊 緣及第二邊緣。 [0014] 優選地，該散熱器保護套之橫截面呈l形。 [0015] 與習知技術相比，本創作散熱系統之電腦機殼設有開孔 ’該開孔便於氣流進入而對該磁碟機模組進行散熱。 【實施方式】 [0016] 請參閱圖1，本創作散熱系統較佳實施例包括一用於cpu 散熱之第一風扇模組10、一電腦機殼70、一處於一電腦 電源76中之第二風扇模組761及一裝設於該電腦機殼70上 之第三風扇模組77。 [0017] 該電腦機殼70包括一前板71、一與該前板71相對之後板 72、一連接該前板71及該後板72之頂板73及一側板74， 該側板74連接並垂直該前板71、該後板72及該頂板73。 一發熱模組裝設於該前板71上且靠近該頂板73，於本實 施例中，該發熱模組為一磁碟機模組75。該前板71設有 多個進風孔711，該頂板73對應該磁碟機模組75設有多個 開孔733，該多個開孔733於該頂板73上呈長方形分佈。 [0018] 一主機板（圖未示）裝設於該電腦機殼7〇之側板74上， 該第一風扇模組1〇裝設於該主機板之cpu (圖未示）上， 該第一風扇模組10為正吹型風扇模組，即風流從上往下 正吹CPU。 [0019] 該第二風扇模組76裝設於該電腦機殼7〇之後板72上，該 後板72設有一對應電腦電源76之第二風扇模組761之第一 表單編號A0101 第5頁/共17頁 [0020] [0020] [0021] [0022] [0023] 出風口 723及一對應該第三風扇模組77之第二出風口725 〇 睛參閲圖2及圖4，該第一風扇模組1〇包括一散熱器3〇、 一散熱器保護套40及一散熱風扇50 β 該散熱器30包括一基體31、多個自該基體31向四周延伸 之散熱趙片32及四個自該基體31向四周延伸之固定部33 。每一固定部33處於兩相鄰之散熱鰭片32之間，每一固 定部33包括一第一安裝部331及_第二安裝部332，該第 一安裝部331包括一用於固定該散熱器於一電路板上之固 定件3311，該第二安裝部332設有安裝孔3321。每一散 熱鰭片32包括一第一邊緣321及一第二孝緣322，該第一 邊緣321及第二邊緣322垂直相連而形成一邊角部323。 該多個散熱鰭片32之第二邊緣322圍繞形成一環形。 該散熱風扇50包括四個鎖固部51，每一鎖固部51設有一 通孔511。 請參閱圖1及圖3 ’該散熱器保護套40與該邊角部323形成 之外邊緣對應，該散熱器保護套40包括一第一保護片41 及一自該第一保護片41垂直向下延伸之第二保護片42， 從而該第一保護片41與該第二保護片42之間形成一收容 部43 ’該散熱器保護套40之橫截面呈L形，該散熱器保護 套40之形狀與該多個散熱鰭片32之邊角部圍繞形成之形 狀對應。該第一保護片41上包括四個向内延伸之安裝部 411，每一安裝部411設有一對應該散熱器30之安裝孔 3321及該散熱風扇50之通孔511之開孔412及一對應該固 表單編號Α0101 第6頁/共17頁 M378418 .定件3311之開口 413。該第二保護片42設有四個對應該 開孔41 2用於貼合該散熱器30之第二安裝部332之避讓部 422 ° [0024] 請參閱圖2至圖4，組裝該第一風扇模組10時，將該散熱 器保護套40從上往下放置於該散熱器30上，該散熱器保 護套40之避讓部422貼合該散熱器30之第二安裝部332， 該散熱器保護套40之開口 413與該散熱器30之第一安裝部 331之固定件3311對應，該散熱器保護套40之第一保護 片41接觸該散熱器30之第一邊緣321，該散熱器保護套 40之第二保護片42接觸該散熱器30之第二邊緣322，該 收容部43收容該散熱鰭片32之邊角部323。將該散熱風扇 50之通孔511對應該散熱器保護套40之開孔412。將四個 螺絲60分別鎖入該散熱風扇50之通孔511 '該散熱器保護 套40之開孔412及該散熱器30之安裝孔3321，而將該散 熱風扇50及該散熱器保護套40固定於該散熱器上，從而 該第一風扇模組10組裝完畢。 [0025] 請繼續參閱圖1及圖5，散熱系統工作時，該第一風扇模 組10從四周收集氣流，氣流從該前板71之進風孔711及該 頂板73之開孔733進入，這樣部分氣流從前面及頂上流過 該磁碟機模組75而給該磁碟機模組75散熱。部分氣流從 該前板71之進風孔711進入之氣流向該主機板之其他電子 元件而給它們散熱，該第一風扇模組10將氣流由上往下 流過該CPU而給該CPU散熱。該第三風扇模組77及該電腦 電源76之第二風扇模組761將氣流從該電腦機殼70之後板 72之第一出風口 723及第二出風口 725排出。 表單編號A0101 第7頁/共17頁 M378418 [0026] 綜上所述，本創作確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本創作之較佳實施方式 ，舉凡熟悉本創作技藝之人士，爰依本創作之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0027] 圖1為本創作散熱系統較佳實施例之一立體圖，該散熱系 統包括一第一風扇模組。 [0028] 圖2為圖1中之第一風扇模組之立體分解圖，該第一風扇 模組包括一散熱器保護套。 [0029] 圖3為圖2中之第一風扇模組之散熱器之局部放大圖。 [0030] 圖4為圖2中之散熱器保護套之截面圖。 [0031] 圖5為本創作散熱系統較佳實施例之另一立體圖。 【主要元件符號說明】 [0032] 第一風扇模組：1 0 [0033] 散熱器：30 [0034] 基體：31 [0035] 散熱鰭片：32 [0036] 第一邊緣：321 [0037] 第二邊緣：322 [0038] 邊角部：3 2 3 表單编號A0101 第8頁/共17頁 M378418There is a heat sink for this kind of protective cover. A [Prior Art] [0002] There are many components in the computer case, such as power supply, CD player, hard disk drive and motherboard. During use, each component generates heat and raises the temperature inside the chassis. When the temperature inside the chassis is too high, the various components may not work properly. Therefore, in order to ensure that these components can work normally, the heat dissipation of the components is very important. [0003] A commonly used heat dissipation system is to open an air inlet on a front panel of a computer, and the cpu heat dissipation is combined with a side blower fan module and a wind guide cover, and the air guide cover is applied to the air inlet of the deer front panel, and the rear panel is provided. Another fan module discharges airflow to dissipate heat from the inside of the computer. In this design, the heat dissipation effect of the component in the heat dissipation channel of the cpu is relatively good, and the disk drive module on the front plate end is not ideal due to the small airflow. [New Content] [0004] In view of the above, it is necessary to provide a heat dissipation system that facilitates heat dissipation of the disk drive module. [0005] A heat dissipation system includes a first fan module, a computer casing, and a second fan module in a computer power supply, the computer casing including a front plate and a front plate opposite to the front plate Connecting the front panel and the top panel of the rear panel and the side panel, the side panel connecting the front panel, the rear panel and the top panel, wherein the side panel is configured to install a motherboard, and the first fan module is configured to Form No. A0101 Page 3 / Total Page M378418 One CPU of the motherboard performs heat dissipation, and the rear panel is provided with an air outlet corresponding to the second fan module, and a heating die is assembled on the front panel and close to the a top plate, the top plate is provided with a plurality of openings corresponding to the heat generating module near one end of the front plate, and the opening is used for allowing airflow to enter the heat generating module for heat dissipation. [0006] Preferably, the front plate is provided There are a plurality of air inlet holes for allowing airflow to dissipate heat from the heat generating module. [0007] Preferably, the first fan module is a forward blow type fan module, and the first fan module collects airflow flowing in from the opening. [0008] Preferably, the heat dissipation system further includes a third fan module mounted on the rear panel, and the rear panel is provided with an air outlet corresponding to the third fan module. [0009] Preferably, the plurality of openings are distributed in a rectangular shape on the top plate. [0010] Preferably, the heating module is a disk drive module. [0011] Preferably, the first fan module includes a heat sink, a heat sink protection cover, and a heat dissipation fan. The protection cover is disposed between the heat sink and the heat dissipation fan, and the heat sink includes a plurality of heat dissipation fins. The heat dissipating fin includes a corner portion, and the heat sink protective cover is disposed at a corner portion of the heat dissipating fin and accommodates the corner portion. [0012] Preferably, the heat sink protection cover includes a first protection sheet and a second protection sheet extending from the first protection sheet, and a receiving portion is formed between the first protection sheet and the second protection sheet. The accommodating portion is for accommodating the corner portion. [0013] Preferably, the heat dissipation fin includes a first edge and a second edge, and the first edge of the form number A0101 is connected to the second edge to form the corner portion. A protective sheet and the second protective sheet are respectively used for contacting the first edge and the second edge of the heat dissipation fin. [0014] Preferably, the heat sink protection sleeve has a cross section in an l shape. [0015] Compared with the prior art, the computer casing of the present heat dissipation system is provided with an opening </ RTI> which facilitates airflow and dissipates heat to the disk drive module. [0016] Referring to FIG. 1 , a preferred embodiment of the present heat dissipation system includes a first fan module 10 for cpu cooling, a computer casing 70, and a second in a computer power supply 76. The fan module 761 and a third fan module 77 mounted on the computer casing 70. [0017] The computer casing 70 includes a front plate 71, a rear plate 71 opposite to the front plate 71, a top plate 73 connecting the front plate 71 and the rear plate 72, and a side plate 74. The side plate 74 is connected and vertically The front plate 71, the rear plate 72, and the top plate 73. A heat generating module is disposed on the front plate 71 and adjacent to the top plate 73. In the embodiment, the heat generating module is a disk drive module 75. The front panel 71 is provided with a plurality of air inlet holes 711. The top plate 73 is provided with a plurality of openings 733 corresponding to the disk drive module 75. The plurality of openings 733 are rectangularly distributed on the top plate 73. [0018] A motherboard (not shown) is mounted on the side panel 74 of the computer casing 7. The first fan module 1 is mounted on a cpu (not shown) of the motherboard. A fan module 10 is a forward blow type fan module, that is, the wind blows the CPU from top to bottom. [0019] The second fan module 76 is mounted on the rear panel 72 of the computer casing 7. The rear panel 72 is provided with a second fan module 761 corresponding to the computer power supply 76. The first form number A0101 is page 5. [0023] [0022] [0023] [0023] The air outlet 723 and a pair of second air outlets 725 of the third fan module 77 should be referred to FIG. 2 and FIG. A fan module 1A includes a heat sink 3〇, a heat sink protection cover 40, and a heat dissipation fan 50β. The heat sink 30 includes a base body 31, a plurality of heat dissipation Zhao 32 and four extending from the base body 31. A fixing portion 33 extending from the base body 31 to the periphery. Each of the fixing portions 33 is disposed between the two adjacent heat dissipation fins 32. Each of the fixing portions 33 includes a first mounting portion 331 and a second mounting portion 332. The first mounting portion 331 includes a heat dissipation portion. The fixing portion 3311 is mounted on a circuit board, and the second mounting portion 332 is provided with a mounting hole 3321. Each of the heat sink fins 32 includes a first edge 321 and a second edge 322. The first edge 321 and the second edge 322 are vertically connected to form a corner 323. The second edge 322 of the plurality of heat dissipation fins 32 is formed to form a ring shape. The heat dissipation fan 50 includes four locking portions 51, and each of the locking portions 51 is provided with a through hole 511. Referring to FIG. 1 and FIG. 3 , the heat sink protection cover 40 corresponds to the outer edge of the corner portion 323 . The heat sink protection cover 40 includes a first protection sheet 41 and a vertical direction from the first protection sheet 41 . The second protective sheet 42 is extended, so that a receiving portion 43 is formed between the first protective sheet 41 and the second protective sheet 42. The heat sink protective sleeve 40 has an L-shaped cross section, and the heat sink protective sleeve 40 The shape corresponds to a shape formed by the corner portions of the plurality of heat dissipation fins 32. The first protective sheet 41 includes four inwardly extending mounting portions 411. Each mounting portion 411 is provided with a pair of mounting holes 3321 of the heat sink 30 and openings 412 and a pair of through holes 511 of the heat radiating fan 50. The form number Α0101, page 6 of 17 M378418. The opening 413 of the piece 3311. The second protection sheet 42 is provided with four relief portions 422 corresponding to the second mounting portion 332 of the heat sink 30. [0024] Please refer to FIG. 2 to FIG. In the case of the fan module 10, the heat sink protection cover 40 is placed on the heat sink 30 from the top to the bottom. The relief portion 422 of the heat sink protection cover 40 is attached to the second mounting portion 332 of the heat sink 30. The opening 413 of the protective cover 40 corresponds to the fixing member 3311 of the first mounting portion 331 of the heat sink 30. The first protective sheet 41 of the heat sink protective cover 40 contacts the first edge 321 of the heat sink 30, the heat sink The second protection piece 42 of the protective cover 40 contacts the second edge 322 of the heat sink 30. The receiving portion 43 receives the corner portion 323 of the heat dissipation fin 32. The through hole 511 of the heat dissipation fan 50 corresponds to the opening 412 of the heat sink protection cover 40. The four screws 60 are respectively locked into the through hole 511 of the heat dissipation fan 50 and the opening 412 of the heat sink protection cover 40 and the mounting hole 3321 of the heat sink 30, and the heat dissipation fan 50 and the heat sink protection cover 40 are respectively The first fan module 10 is assembled by being fixed on the heat sink. [0025] Please continue to refer to FIG. 1 and FIG. 5. When the heat dissipation system is in operation, the first fan module 10 collects airflow from the periphery, and the airflow enters from the air inlet hole 711 of the front panel 71 and the opening 733 of the top panel 73. Such a portion of the airflow flows through the disk drive module 75 from the front and the top to dissipate heat to the disk drive module 75. A portion of the airflow enters the airflow from the air inlet 711 of the front panel 71 to dissipate heat to other electronic components of the motherboard. The first fan module 10 streams airflow from the top to the bottom to dissipate heat to the CPU. The third fan module 77 and the second fan module 761 of the computer power supply 76 discharge airflow from the first air outlet 723 and the second air outlet 725 of the rear panel 72 of the computer casing 70. Form No. A0101 Page 7 of 17 M378418 [0026] In summary, this creation has indeed met the requirements of the invention patent, and filed a patent application according to law. However, the above descriptions are only preferred embodiments of the present invention. Those who are familiar with the creative techniques, equivalent modifications or changes made in accordance with the spirit of this creation, shall be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is a perspective view of a preferred embodiment of a heat dissipation system of the present invention, the heat dissipation system including a first fan module. 2 is an exploded perspective view of the first fan module of FIG. 1, the first fan module including a heat sink protection cover. 3 is a partial enlarged view of the heat sink of the first fan module of FIG. 2. 4 is a cross-sectional view of the heat sink protection cover of FIG. 2. [0031] FIG. 5 is another perspective view of a preferred embodiment of the heat dissipation system of the present invention. [Main component symbol description] [0032] First fan module: 1 0 [0033] Heat sink: 30 [0034] Base: 31 [0035] Heat sink fin: 32 [0036] First edge: 321 [0037] Two edges: 322 [0038] Corner: 3 2 3 Form number A0101 Page 8 of 17 M378418
[0039] 固定部：3 3 [0040] 第一安裝部：331 [0041] 固定件：3311 [0042] 第二安裝部：332 [0043] 安裝孔：3321 [0044] 散熱器保護套：40 [0045] 第一保護片：41 [0046] 安裝部：411 [0047] 開孔：412 [0048] 開口 ： 413 [0049] 第二保護片：42 [0050] 避讓部：42 2 [0051] 收容部：43 [0052] 散熱風扇：50 [0053] 鎖固部：51 [0054] 通孔：511 [0055] 螺絲：60 [0056] 電腦機殼：70 [0057] 前板：71 表單编號A0101 第9頁/共17頁 M378418 [0058] 進風口 ： 711 [0059] 後板：72 [0060] 第一出風口 ： 723 [0061] 第二出風口 ： 725 [0062] 頂板：73 [0063] 開孔：733 [0064] 側板：74 [0065] 磁碟機模組：75 [0066] 電腦電源：76 [0067] 第二風扇模組：761 [0068] 第三風扇模組：77 表單編號A0101 第10頁/共17頁[0039] Fixing portion: 3 3 [0040] First mounting portion: 331 [0041] Fixing member: 3311 [0042] Second mounting portion: 332 [0043] Mounting hole: 3321 [0044] Radiator protective cover: 40 [ 0045] First protective sheet: 41 [0046] Mounting portion: 411 [0047] Opening: 412 [0048] Opening: 413 [0049] Second protective sheet: 42 [0050] Avoiding portion: 42 2 [0051] Housing :43 [0052] Cooling fan: 50 [0053] Locking: 51 [0054] Through hole: 511 [0055] Screw: 60 [0056] Computer case: 70 [0057] Front plate: 71 Form No. A0101 9 pages/total 17 pages M378418 [0058] Air inlet: 711 [0059] Rear plate: 72 [0060] First air outlet: 723 [0061] Second air outlet: 725 [0062] Top plate: 73 [0063] Opening :733 [0064] Side panel: 74 [0065] Disk drive module: 75 [0066] Computer power supply: 76 [0067] Second fan module: 761 [0068] Third fan module: 77 Form number A0101 10 Page / Total 17 pages