1313408 九，發明說明： 【發明所屬之技術領域】 本發月涉及種散熱裝置，尤係指一種用於散熱發熱 電子元件熱量之散熱裝置。 ’ 【先前技術】 隨著電子產業之迅速發展，如電腦中電子元件之運算 速度大幅度提高，其產生之熱量也隨之劇增，如何將電子 元件之熱量散發出去，以保證其正常運行，一直係業者必 需解決之問題。眾所周知，安裝在主機板上之中央處理器 係電腦系統之核心，當電腦運行時，中央處理器產生数量°。 過多熱量會導致巾央處理器無法正常運行。為了有效散發 中央處理器在運行過程中產生之熱量，通常在電路板上二 裝一與中央處理器接觸之散熱裝置以便將其產生之熱量散 • 電腦主機板上之中央處理器周圍設有複數電晶體、電 容等器件。當電腦運行時，該等器件亦會產生大量之熱量， 該等熱量傳遞至主機板，會導致主機板升溫，進而影響系 /知技術中通常於散熱裝置上安裝―風扇，風扇產生 :氣流流經散熱器’從而提高散熱效率。例如美國專利申 2第6,304,445 B1號揭露了 一種散熱裝置，包括—散埶體、 一安裝於散熱器一側之散熱風扇及—罩體，該散熱器由 數散熱歸片組成，該散㈣片之間形成複數面向風扇之通 6 1313408 風道。風扇提供之強制氣流吹過該通風道，將散熱器從中 央處理器吸收之熱量帶走，達到冷卻中央處理器之效果。 由於罩體將散熱器圍設其内，風扇產生之氣流受罩體 之收攏而兼顧不到周圍之電子元件之散熱。若將罩體去掉 :使風扇產生之氣流四處吹送，則會降低散熱器之散熱性 月匕，當然還會由於氣流分散，中央處理器周圍電子器件之 散熱效果均不佳。 > 因此，需要設計一種新之散熱裝置，該散熱裝置不僅 可以很好地將中央處理器產生之熱量散發出去，還可有針 1對性地對其周圍之電子元件進行散熱。 【發明内容】 本發明旨在提供一種可以同時對多個發熱電子元件進 行散熱之散熱裝置。1313408 IX. Description of the invention: [Technical field to which the invention pertains] The present disclosure relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of an electronic component for heat dissipation. [Prior Art] With the rapid development of the electronics industry, such as the speed of computing electronic components in computers has increased dramatically, the heat generated by them has also increased dramatically. How to dissipate the heat of electronic components to ensure their normal operation. It has always been a problem that must be solved by the system. It is well known that the central processing unit installed on the motherboard is the core of the computer system, and when the computer is running, the central processing unit generates a quantity of °. Excessive heat can cause the towel processor to malfunction. In order to effectively dissipate the heat generated by the central processing unit during operation, a heat sink that is in contact with the central processing unit is usually mounted on the circuit board to dissipate the heat generated by the central processing unit. Devices such as transistors and capacitors. When the computer is running, the devices also generate a large amount of heat, which is transferred to the motherboard, which will cause the motherboard to heat up, which in turn affects the system. The fan is usually installed on the heat sink. The fan generates: airflow. Through the heat sink 'to improve heat dissipation efficiency. For example, U.S. Patent No. 6,304,445 B1 discloses a heat dissipating device comprising a heat dissipating body, a heat dissipating fan mounted on a side of the heat sink, and a cover body, the heat sink being composed of a plurality of heat dissipating pieces, the scattered (four) piece A plurality of 6 1313408 air ducts are formed between the fans and the fan. The forced airflow provided by the fan blows through the air passage to remove the heat absorbed by the heat sink from the central processor to cool the central processor. Since the cover encloses the heat sink therein, the airflow generated by the fan is collected by the cover and the heat dissipation of the surrounding electronic components is not taken into consideration. If the cover is removed: the airflow generated by the fan will be blown around, which will reduce the heat dissipation of the heat sink. Of course, due to the dispersion of the airflow, the heat dissipation of the electronic components around the central processing unit is not good. > Therefore, there is a need to design a new heat sink that not only dissipates the heat generated by the central processing unit well, but also has the ability to dissipate heat from the surrounding electronic components. SUMMARY OF THE INVENTION The present invention is directed to a heat sink that can simultaneously dissipate heat from a plurality of heat-generating electronic components.
一種散熱裝置，包括一散熱器及一罩體，該罩體將該 散熱器圍設其内而形成通過散熱器之通道，該通道包括一 進風口與出風口 體上另安裝有一 ’一風扇安裝於罩體之進風口處，而在罩 連通上述通道與罩體外部之窗體。 與習知技術相比，該散熱裝置可以針對性地兼顧中央 處理器及中央處理器周圍電子器件之散熱需求，並同時取 得較佳之散熱效果。 另外該放熱裝置安裝一活動窗體，窗體結構可根據 不同而求可選擇打開或者關閉之不同選擇方案。 【實施方式】 7 1313408 請參閱圖1，圖i為本發明散熱裝置之第—實施例。該 散熱農置安裝於-電路板（圖未示）上，包括—散孰器 :罩設該散熱器1〇之罩體30、一可安聚於該罩體3〇上之 窗體31及一安置於該散熱器1〇 一側之風扇2〇。 該散熱II 1G包括-與電路板上電子元件（圖未示）貼合 之基座12及置於該基座12上之散熱轉片級14，該散孰鍵 片組14與基座12通過焊接或膠之方式結合。該基座12 ^ #致呈矩形板狀設置，該基座12之相對兩側邊緣分別水平向 外凸伸二固定部120,每一固定部12〇兩端分別設有一通孔 122,以供罩體3〇鎖固。該散熱鰭片組14由複數散熱鰭 組成形成複數通風道，以供風扇2G提供之強制氣流通過。 該散熱‘鰭片組U -側呈階梯狀設置，—方面為防孰鍵 片纽U與窗體31發生干涉，另一方面以結合罩體3〇 = 構以引導一部分氣流流向窗體31。 請結合圖1參閱圖2及圖3,該罩體3〇大致呈一殼體 狀，用以將散熱鰭片組14罩設其内，共包括一大致呈長方 之頂板32、为別與頂板32垂直連接且置於頂板32兩側 之二擋板33、34。該頂板32前端緣向下垂直延伸一正方形 面板35 ’該面板35兩側分別與擋板％、34連接。該面板 %設有一大致呈圓形之進風口 35〇。該面板”之四角落352 上分別設有一螺孔3520。該面板35上四周粘有一具有一定 厚度之正方形墊圈37，該墊圈37由彈性材料組成，如橡 膠，用以連接該散熱裝置與機箱之一侧板。該擋板33、34 相對面板35之另外一侧下端緣設有一加強肋3〇4，該加強 1313408 肋304與頂板32、擋板33、34之後端緣圍成一出風口 302。 該進風口 350與出風口 302形成一通過散熱器10之通道以 利务氣流從該流道流過。 該擋板33、34之下邊緣分別形成二支架38，該每一支 .架38包括一自擂板33、34下端緣垂直向外延伸之底板382 以及一連接底板382外邊緣且平行擋板33、34之加強板 381。該每一支架38上形成二固定柱36，以供螺釘50穿設 $ 進而與電路板鎖固，從而將整個散熱裝置固定在電路板 上。該每一支架38之底板382上設有二螺孔3820，該螺孔 3820設置於二固定柱36之間，與基座12之通孔122對應。 ’該擋板34設有一矩形開口 340，該開口 340之一邊緣上設 •有連通開口 340之凹口 342。 該窗體31呈百葉窗狀，包括一框架310及與該框架310 連接之複數導風片。該框架310係由二水平之安裝板314 及分別連接安裝板314二相對端且相互平行之二連接板 # 313、311圍成之平行四邊形框體，其輪廓與開口 340大致 相同。該連接板311朝向罩體30之邊緣中部向外形成一卡 塊3122,該卡塊3122與該凹口 342對應。該導風片包括一 自連接板313朝向罩體30延伸之第一導風片312及夾至於 二安裝板314之間且與二連接板313、311平行之第二導風 片315 ;其中第一導風片312側面形成一卡塊3120，該第 二導風片315亦朝向罩體30延伸，所有導風片312向罩體 30延伸之長度沿進風口 350至出風口 302之方向遞增。 請參閱圖4及圖5，安裝時，首先將風扇20套置於罩 9 1313408 體30内，使風扇20之一端面與面板35之内側接觸，並且 將該風扇20之四角落22上之鎖固孔220與面板35上之螺 孔3520對齊，以供螺釘40鎖固，使風扇20安裝於罩體30 之進風口 350處，並在面板35上粘上墊圈37，以減弱風扇 20運行時產生之振動；其次，將散熱器10套至罩體30内， 該散熱器10之基座12之固定部120置於二固定柱36之 間，該基座12上之通孔122與該螺孔3820對齊，通過螺 絲（圖未示）將散熱器10與罩體30鎖固在一起；接著，將該 * 窗體31安裝於罩體30之擋板34之開口 340處，其中該卡 塊3122與開口 340邊緣上之凹口 342扣合，該卡塊3120 —與開口 340另一邊緣之内壁相扣合。此時該框架310卡掣 -於該開口 340之外側，該第一及第二導風片312、315延伸 至罩體30内部，以引導氣流吹向其他電子元件；最後，通 過螺釘50將整個散熱裝置固定在電路板上。 工作時，中央處理器產生之熱量通過基座12傳遞至散 #熱鰭片組14;風扇20產生之強制氣流一部分經過散熱鰭片 組14之内部之通道，將散熱鰭片組14之熱量帶走，使中 央處理器之熱量散發；另一部分氣流則通過窗體31吹向罩 體30旁邊之其他電子元件，從而同時達到冷卻中央處理器 周圍電子元件之效果。 在本實施例中，可以將窗體31設置成活動式，即導風 片312活動安裝於框架310上，且可相對框架310擺動。當其 他電子元件產生之熱量較小而不需要進行冷卻時，可以擺 動導風片312使整個窗體31閉合，以阻止風扇20產生之氣流 1313408 從窗體31中流出 【圖式簡單說明】 加強氣流對散熱鳍片組14之散熱作用。 圖1是本發明第-實施例散熱裝置的立體分解圖。 圖2是圖1的罩體之立體分解圖。 圖3是圖1中罩體倒轉後之之視圖。 圖4是圖1中散熱裝置之組合圖。 圖5是圖4中散熱裝置另一角度之視圖。 • 【主要元件符號說明】 散熱器 10 基座 12 固定部 120 通孔 122 散熱鰭片組 14 風扇 20 角落 22 ' 352 鎖固孔 220 罩體 30 出風π 302 加強肋 304 窗體 31 框架 310 連接板 311 ' 313 第一導風片 312 卡塊 3120、3122 安裝板 314 第二導風片 315 頂板 32 擋板 33、34 開口 340 凹口 342 面板 35 進風〇 350 螺孔 3520 ' 3820 固定柱 36 墊圈 37 支架 38 11 1313408 382 加強板 381 底板 螺釘 40、50A heat dissipating device includes a heat sink and a cover body, the cover body enclosing the heat sink to form a passage through the heat sink, the passage includes an air inlet and an air outlet body, and a fan mounting is additionally installed At the air inlet of the cover, and the cover communicates with the window and the outside of the cover. Compared with the prior art, the heat dissipating device can specifically balance the heat dissipation requirements of the central processor and the electronic components around the central processing unit, and at the same time obtain a better heat dissipation effect. In addition, the heat release device is provided with an active form, and the form structure can be selected according to different options for opening or closing. [Embodiment] 7 1313408 Please refer to FIG. 1, which is a first embodiment of a heat sink according to the present invention. The heat sink is mounted on a circuit board (not shown), including a diffuser: a cover 30 covering the heat sink 1 , a window 31 condensable on the cover 3 and A fan 2 is disposed on one side of the heat sink. The heat dissipation II 1G includes a susceptor 12 that is attached to an electronic component (not shown) on the circuit board and a heat dissipating rotor stage 14 disposed on the susceptor 12, and the enthalpy key set 14 and the pedestal 12 pass through A combination of welding or glue. The pedestal 12 ^ is arranged in a rectangular plate shape, and the opposite side edges of the pedestal 12 respectively protrude horizontally outwardly from the two fixing portions 120, and each of the fixing portions 12 〇 is respectively provided with a through hole 122 for the cover Body 3〇 lock. The heat dissipation fin group 14 is composed of a plurality of heat dissipation fins to form a plurality of air passages for the forced airflow provided by the fan 2G to pass. The heat sink 'the fin group U - side is arranged in a stepped manner—in the aspect, the tamper-resistant key sheet U interferes with the window 31, and on the other hand, the combined cover body 3 〇 = is configured to guide a part of the airflow to the window 31. Referring to FIG. 2 and FIG. 3, the cover body 3 is substantially in the shape of a casing for covering the heat dissipation fin set 14 and includes a substantially rectangular top plate 32. The top plate 32 is vertically connected and placed on the two baffles 33, 34 on both sides of the top plate 32. The front end edge of the top plate 32 extends vertically downwardly to a square panel 35'. Both sides of the panel 35 are connected to the shutters %, 34, respectively. The panel % is provided with a substantially circular air inlet 35〇. A screw hole 3520 is defined in each of the four corners 352 of the panel. A square washer 37 having a certain thickness is adhered to the periphery of the panel 35. The gasket 37 is made of an elastic material, such as rubber, for connecting the heat sink and the chassis. The side plate is provided with a reinforcing rib 3〇4 opposite to the lower end edge of the other side of the panel 35. The reinforcing 1313408 rib 304 and the rear edge of the top plate 32 and the baffle 33, 34 define an air outlet 302. The air inlet 350 and the air outlet 302 form a passage through the radiator 10 to flow from the flow passage. The lower edges of the baffles 33 and 34 respectively form two brackets 38, each of which 38 The bottom plate 382 includes a bottom plate 382 extending perpendicularly from the lower end edge of the bottom plate 33, 34, and a reinforcing plate 381 connecting the outer edge of the bottom plate 382 and paralleling the baffles 33, 34. Each of the brackets 38 defines two fixing posts 36 for The screw 50 is inserted into the circuit board to fix the entire heat sink to the circuit board. The bottom plate 382 of each bracket 38 is provided with two screw holes 3820, and the screw holes 3820 are disposed on the two fixing posts 36. Between, corresponding to the through hole 122 of the pedestal 12. The baffle 34 is provided with a rectangular opening 340, and one of the openings 340 is provided with a notch 342 having a communication opening 340. The window 31 has a louver shape and includes a frame 310 and a plurality of air guiding plates connected to the frame 310. The frame 310 is a parallelogram frame surrounded by two horizontal mounting plates 314 and two connecting plates #313, 311 which are respectively connected to opposite ends of the mounting plate 314, and has a contour substantially the same as the opening 340. The connection is the same. The plate 311 forms a block 3122 outwardly from the middle of the edge of the cover 30. The block 3122 corresponds to the notch 342. The air guide piece includes a first air guiding piece 312 extending from the connecting plate 313 toward the cover 30. And a second air guiding piece 315 which is sandwiched between the two mounting plates 314 and parallel with the two connecting plates 313, 311; wherein a side of the first air guiding piece 312 forms a blocking block 3120, and the second air guiding piece 315 is also facing the cover. The body 30 extends, and the length of all the air guiding fins 312 extending toward the cover body 30 increases along the air inlet 350 to the air outlet 302. Referring to FIG. 4 and FIG. 5, the fan 20 is first placed in the cover 9 1313408 body during installation. 30, one end face of the fan 20 and the inner side of the panel 35 Touching, and aligning the locking hole 220 on the four corners 22 of the fan 20 with the screw hole 3520 on the panel 35 for locking the screw 40, so that the fan 20 is mounted at the air inlet 350 of the cover 30, and A washer 37 is attached to the panel 35 to weaken the vibration generated when the fan 20 is operated. Secondly, the heat sink 10 is sleeved into the cover 30, and the fixing portion 120 of the base 12 of the heat sink 10 is placed on the two fixing posts 36. The through hole 122 of the base 12 is aligned with the screw hole 3820, and the heat sink 10 and the cover 30 are locked together by screws (not shown); then, the * window 31 is attached to the cover body. At the opening 340 of the baffle 34 of the 30, the block 3122 is engaged with the notch 342 on the edge of the opening 340, and the block 3120 is engaged with the inner wall of the other edge of the opening 340. At this time, the frame 310 is jammed on the outer side of the opening 340, and the first and second air guiding sheets 312, 315 extend to the inside of the cover body 30 to guide the airflow to the other electronic components; finally, the whole is passed by the screws 50. The heat sink is fixed to the circuit board. During operation, the heat generated by the central processing unit is transferred to the heat-heating fin group 14 through the susceptor 12; a portion of the forced airflow generated by the fan 20 passes through the inner passage of the heat-dissipating fin group 14, and the heat-dissipating fin group 14 is heat-retained. The heat is dissipated by the central processing unit; the other part of the airflow is blown through the window 31 to other electronic components beside the cover 30, thereby simultaneously achieving the effect of cooling the electronic components around the central processing unit. In the present embodiment, the window 31 can be arranged in a movable manner, that is, the wind guide 312 is movably mounted on the frame 310 and swingable relative to the frame 310. When the heat generated by the other electronic components is small and cooling is not required, the air deflector 312 can be swung to close the entire window 31 to prevent the airflow 1313408 generated by the fan 20 from flowing out of the window 31. The heat dissipation effect of the airflow on the heat sink fin set 14. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a heat sink according to a first embodiment of the present invention. Figure 2 is an exploded perspective view of the cover of Figure 1. Figure 3 is a view of the cover of Figure 1 after being inverted. 4 is a combination view of the heat sink of FIG. 1. Figure 5 is a perspective view of the heat sink of Figure 4 from another angle. • [Main component symbol description] Heatsink 10 Base 12 Fixing part 120 Through hole 122 Heat sink fin set 14 Fan 20 Corner 22 ' 352 Locking hole 220 Cover 30 Outlet π 302 Reinforcing rib 304 Form 31 Frame 310 Connection Plate 311 ' 313 first air guide 312 block 3120, 3122 mounting plate 314 second air guide 315 top plate 32 baffle 33, 34 opening 340 notch 342 panel 35 inlet 〇 350 screw hole 3520 ' 3820 fixing column 36 Washer 37 bracket 38 11 1313408 382 stiffener 381 bottom plate screws 40, 50
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