200825684 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電腦機殼内部之散熱結構，特別是一種可 針對多個高發熱元件加強散熱之散熱導風罩。 【先前技術】 為使電腦糸統更加付合消費者對於貢料處理速度之要长，以 期在最短時間内完成越趨複雜之各種程式，業界無不以增加晶片 精密度之手段，來達成提昇處理速度及多工運算之發展目標，而 在處理速度不斷提昇而晶片尺寸不斷縮小的態勢下，接鐘而來的 便是晶片在高速運算下產生之散熱問題，此點直接影響到電腦系 統之性能與穩定性，如何將晶片產生之廢熱迅速地排出，而提昇 系統内主要晶片的散熱效率，儼然成為近幾年業界最棘手的問 題’其中當，然包括最為普及的個人用桌上型電腦，一般最常使用 的習知散財式，不外乎是於欲加熱之標的物表面加裝各種 散熱鰭片及風扇組成之散熱模組，再_機殼之系統風扇配合下 將廢熱排出電_統外，降低電_助部之溫度。 +以桌上型電腦與筆記型電工作_服器比較下，桌上型 電腦之各主要電子零件間擁有較大之散熱空間，較不易有廢熱益 法排除之問題存在，但隨著各雜運算速度的大幅提昇，就現今 ^桌上51¾¾系統而言，不僅敍要解決中央處理器之散熱問 題曰”他如你體、顯示晶片及設置於主機板之晶>{料被散熱 門題所曜’㈣解的就是在每恤件都加裝散麵組，但如 此便曰曰加⑽系統之造價及電力負荷，且機殼内部擁有多個散 200825684 熱模組也嚴重影響其内部流場之流況，增加散熱模組附近空氣之 /”L動阻力，使空氣無法直接流經其他高發熱元件之表面，而造成 機冗又内部之空氣無法快速地透過系統風扇與外界進行熱對流，以 致於各散熱模缺其他高發熱元件賴&之廢熱_於電腦系統 機殼内部，隨著電腦開機運作的時間增加，機殼内部溫度也因對 流不良不斷升高，進而影響電腦系統之效能與穩定性，甚至因高 溫導致元件過熱而損壞晶片。 於是乎，業界便針對此散熱不佳問題發展出設置於機殼内部 之導風罩，如中華民國專利公告1252972號所揭露散熱裝置之導 風罩’係轉風罩覆蓋於欲加強散齡件，構成—空紐動通道， 再配。中央處理ϋ上裝設置散熱鰭片，以及於導風罩通道一侧邊 2置風扇，藉以穩定欲加強散熱組件周圍空氣之流場，而增加機 殼内部空氣對流效果，但空氣麟直接往散熱則吹送，對於加 強:央麵㈣散熱效果有限，且就現今中央處理器因高精密度 门運速度而產生之散熱需求，此種設計易使其溫度過高而影 響電恥系統之穩定性，已不符使用。 其又如吳國專利公告64伽4號專利所揭露之風管，係利用風 構控觀扇吹出之氣流方向，而將空氣齡並直接朝高 域吹送，藉以加強高發熱元件之散熱效率，但1錢之产 針對少數高發熱元件加強散熱，對於擁有諸多高發 之桌上型電腦並不翻，實有進—步改良 。 【發明内容】 鑒於以上的問題，本發明的主要目的在於提供一種，以解決 6 200825684 先前技術所存在的問題或缺點。 先月ϋ技術之政熱；}:果組易使機殼内部空氣對流不佳，易導致過 多廢熱_造賴糾部溫度過高，硫有之導風罩餅亦無法 有效針對電腦魏之高發熱元件加錄熱m針對少數高 發熱元件加錄熱。_上述問題，本發明提供—種麟散 風罩，可整合纽顯及散_片，並對於多㈣發熱元件㈣ 散熱效率。 為達成上述目的，本發明提供_種散解風罩，固設於一電 腦機殼内部而覆蓋於主機板之複數個高發熱元件上，其包含有一 主導風罩及i鱗風罩。主導風罩係將該電職殼内部區隔出 第&風區且第導風區之一側形成一入風口。附屬導風罩 係固設於主導風罩底部且容置於第_導風區，而於第—導風區内 另外區隔出-第二導風ϋ連通人風π，其中複數個高發熱元件其 中之-係被附屬導鮮所覆蓋，而容i於第二導風區内，以將氣 流集中吹送至欲加強散熱之高發熱元件，藉以提昇電腦機殼内部 高發熱元件之散熱效率。 本發明之功效在於’機殼散熱導風罩界定丨—固定之空氣通 道’並整合有彡顧扇及散熱則’可穩定高發熱元件周圍氣流 之流場，將風扇吹出之氣流直接朝多個高發熱元魏其散熱韓片 吹送’藉❹強機殼内部空氣對流而電腦系統提·熱效率，且 可針對各款主機欲制加強散熱之元件，於導風罩巾搭配合適之 小髮附屬導風罩’增加南發熱元件之散熱效果。 以下在實施方式情細敘述本㈣之詳細特徵以及優點，其 7 200825684 内谷足以使任域f _技#者了解本發日仅技躺容並據以實 施，且根據本_書·露之邮、申請專利麵及圖式，任何 热習相關技*者可輕純理解本發明_之目的及優點。 =之_本發_容之_及町之實财式之說明係用 以雜與轉本㈣m且提供本發狀補申請範圍更 進一步之解釋。 【實施方式】 為使對本發明的目的、構造、特徵、及其功能有進一步的畴 解，茲配合實施例詳細說明如下。 請參考「第1圖」、「第2圖」、「第3圖」、「第4圖」及「第 5圖」所不’係為本發明第—實施例所揭露之—種散熱導風罩 ⑽，設置飾謙丨_，且覆聽主機板Μ之高發熱元件 上，其包含有-主導風罩5〇以及—附屬導風罩6〇。 電腦機殼10為-内部中空略成矩形體之框架結構，用以容置 f種電子元件設置於射。隔板12固設於電腦機㈣内部，以 k供主機板20鎖附於其-側，並配合主機板2{)之另—側鎖附於 電腦機殼ίο之後織u，使域板_狄電職殼iq内部 主機板20上設置有魏個高發熱元件，如記_ 2卜中央處理 器22及其他高發熱電子元件，而各中央處㈣㈡上方設置有散 熱韓片221，可藉由熱傳導將中央處理器22運麵產生之廢執排 出。電腦機殼1G之後側板n _並排設置有二錢風㈣，作 其數量並不以此為限，鄰近域板2G—似分卿應於各中 理器22之散侧221，㈣風扇3Q係將空氣 外 200825684 4吸入至電缺④1Q巾，麵電職殼Μ内外部空氣產生對流， 以強化電腦機殼〗〇之散熱能力。 、當請茶閱「第6圖」、「第7圖」、「第8圖」及「第9圖」，其中 主‘風罩50係由一頂板部51及二側板部&所組成，頂板部幻 八有頂面511及-相對於該頂面之底面犯。頂面犯上交錯妒 成複數個⑽細，以增加頂板部§1之抗撓曲性而強化其^ 強度—底面512上形成複數個凸柱兄，各凸柱％頂端設有螺孔 =二側板部52分別自項板部51兩側向下垂直延伸，與頂板部 4面512側形成—第一導風區M，覆蓋於主機板上，可 =統^ 3〇、記憶體21及中央處理器22之散熱籍片狗 其I °卡扣件53係設置於主導風罩5G之W 51 机 風之另一側端，其中卡扣件53係匹配於電腦樓 殼10之隔板12 ’為-彈性可變形.f折片，於散熱導風罩⑽罢 於主機板20 一側時可卡扣住隔板12，以將散埶導風罩设盍 電腦機殼10㈣。 《知風罩50固設於 -入=1〇:接及「第11圖」所示’第-導風區 几％，讀於電腦機殼1〇之後側板⑴ 產生氣流經由入風口 55導入第一導風區54中=及入，而 賴統風扇30產生之氣流導引至各中__ 罩 221，以加強其散熱效率，避免溫度過高而影 月定^片 附屬導風物係裝設於主轉5G下緣岭 區％中。附料風罩6Q具有細關定孔 喊 刀别對應於主導 200825684 几罩頂板°卩之各凸柱56，各固定孔61係用以提供一螺合 件牙出再螺合方疋入相對應之各凸柱56的螺孔561，以將附 屬導風罩60連接固設於主導風罩5〇之底面512。附屬導風罩⑹ 更包含有一斜折片62，以及分別由斜折片62兩侧向下垂直延伸 之一平板片63，以形成第二導風區64且連通入風口 55，覆蓋於 吕己fe體21上方，將系統風扇3〇產生之氣流集中吹速至記憶體u 上，以加強其散熱效率，但附屬導風罩6〇與主導風罩5〇相對位 置之關係，可依輯之需求改變，以配合各種主機板％上高發熱 電子元件之設置位置。 如「第12圖」及「第13圖」所示，為本發明散熱導風罩之 第二實施例，其實施方式大致與第-實施例相同，然而，兩者的 差異之處在於，附屬導風罩60係採用不同的方式與主導風罩5〇 結合。於第二實施例中，主導風罩5〇之各凸柱56前端分別具有 一彈性嵌合部562，各嵌合部562係分別匹配對應於附屬導風罩 60之各固定孔61。各嵌合部562係為圓錐形態，且具有一破溝， 沿著嵌合部562之徑向切開。於嵌合部562承受一徑向之壓迫力 4，嵌合部562可被壓縮變形，使其外週緣之最大直徑小於固定 孔之直徑。當嵌合部562被插入固定孔61時，嵌合部562承受一 控向之壓迫力被壓縮變形，使嵌合部562通過固定孔61，並於通 過固疋孔61復原’藉以使嵌合部562嵌入對應之各固定孔61。 因此，使用者只需將附屬導風罩60之各固定孔61對準主導風罩 5〇之嵌合部562，再將附屬導風罩6〇朝主導風罩5〇之頂板部51 推壓，使嵌合部562分別嵌入各固定孔61，便可將附屬導風罩6〇 10 200825684 連接固設於主導風罩5〇之底面512。 /故，本發明之散熱導風罩⑽界定出—固定之氣流通道，使 系統風扇30所產生之氣流可集中吹往主機板2〇上欲散熱之元 件’ _屬導風罩6〇可鮮同之散熱需求配置其位置，以區隔出 另-氣流通道’使氣流集中直接吹往欲額外加強散熱之元件，藉 以加強空麟流而提昇散熱效率，且可針對各款主機欲特別加強 散熱之元件進行變化搭配，具備了同時對多個高發熱元件加強散 熱之功效。 雖然本發明以前述之實施例揭露如上，然其並_以限定本 發明。在不麟本發明之精神和範_，所為之更動與潤飾，均 屬本發明之專娜護顧。關於本發明所界定之保 所附之中請翔翻。 【圖式簡單說明】 第1圖為本發日勝—實施射，散熱導風罩與電 體分解圖。 气几又（立 第2圖為本發明第—實細巾，散熱導風罩 機板之立體分解圖。 錢扇與主 第3圖為本發明第一實施例中，散熱導風罩 戶 機板之域11。 第4圖為第3圖另一視角之立體圖。 第5圖為本發明第一實施例中， 之立體圖。 t、、¥風罩讀於電腦機殼 弟6圖為本發明第一實施例中，散熱導風罩之立體圖。 11 200825684 第7圖為第6财，主導風罩與_導風罩之立體分解圖。 第8圖為本發明第一實施例中，散熱導風罩之側視圖。 ^第9圖為本發明第—實施射，散熱導風罩之仰視圖。 ^ 10圖為本發明第—實施例中，散熱導風罩之剖面示意圖。 第11圖為本發明第一實施例中，散熱導風罩之内部氣流方向 示意圖。 第固為本备明第一貫施例中，散熱導風罩之立體圖。 第13圖為本發明第二實施例中，主導風罩與附屬導風罩之立 體分解圖。 【主要元件符號說明】 10·····.········· 11....................... 12...................... 20....................... 21....................... 22............... 221....................... 30.......................50········ 電腦機殼 後侧板 隔板 5H····· 512····· 513····· 主機板 記憶體 中央處理器 散熱鰭片 系統風扇 主導風罩 頂板部 項面 底面 凸肋條 12 200825684 52................ 53................ ..............卡扣件 54................ 55................ ..............入風π 56................ 561.............. ..............螺孔 562•……...... ..............嵌合部 60............... ..............附屬導風罩 61•……··…… ..............固定孔 611............. ..............螺合件 62............... ..............斜折片 63............... 64............... 100............. ..............散熱導風罩 13200825684 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating structure inside a computer casing, and more particularly to a heat dissipating hood capable of enhancing heat dissipation for a plurality of high heat generating components. [Prior Art] In order to make the computer system more suitable for consumers to process the speed of the tribute, in order to complete the more complicated programs in the shortest time, the industry has all the means to increase the precision of the wafer to achieve improvement. The development speed of processing speed and multiplex computing, while the processing speed is increasing and the size of the chip is shrinking, the heat generated by the high-speed operation of the chip is the result of the computer system. Performance and stability, how to quickly dissipate the waste heat generated by the wafer, and improve the heat dissipation efficiency of the main wafers in the system, has become the most difficult problem in the industry in recent years. 'Where, including the most popular personal desktop computer In general, the most commonly used formula is that it is equipped with a heat-dissipating module composed of various fins and fans on the surface of the object to be heated, and the system fan of the chassis is used to discharge the waste heat. Outside the system, reduce the temperature of the electric-assisted part. +Compared with the desktop computer and the notebook type electric work_server, the main electronic parts of the desktop computer have a large heat dissipation space, which is less likely to be solved by the waste heat method, but with the miscellaneous The speed of the operation has been greatly improved. In terms of the current 513⁄43⁄4 system, it is not only to solve the heat dissipation problem of the central processing unit. He is like a body, a display chip and a crystal set on the motherboard. The solution to the '(4) solution is to add a loose-faced group to each piece of clothing, but this adds to the cost and power load of the system, and the presence of multiple 200825684 thermal modules inside the casing also seriously affects its internal flow. The flow of the field increases the air/"L moving resistance near the heat-dissipating module, so that the air cannot directly flow through the surface of other high-heating components, and the machine is redundant and the internal air cannot be quickly convected through the system fan and the outside. Therefore, the heat dissipation molds lack the waste heat of other high-heating components. In the computer system casing, as the computer starts to operate, the internal temperature of the casing is also increased due to poor convection. Affect the performance and stability of computer systems, due to the high temperature even cause overheating and damage to the wafer element. As a result, the industry has developed an air hood that is placed inside the casing for the problem of poor heat dissipation. For example, the hood of the heat dissipating device disclosed in the Republic of China Patent Publication No. 1,252,972 is a hood that is intended to be used to strengthen the aging parts. , constitutes - empty movement channel, and then match. The central processing unit is provided with a heat dissipating fin, and a fan is disposed on one side of the air duct cover channel, so as to stabilize the flow field of the air around the heat dissipating component, thereby increasing the air convection effect inside the casing, but the air lining directly dissipates heat. Then, for the enhancement, the heat dissipation effect of the central surface (4) is limited, and the heat dissipation demand of the current central processing unit due to the high precision door speed is easy to make the temperature too high and affect the stability of the shame system. Has not been used. In addition, as disclosed in the Wu Guo Patent Announcement 64 gamma 4 patent, the air duct is controlled by the wind control to fan the airflow direction, and the air age is directly blown toward the high ground, thereby enhancing the heat dissipation efficiency of the high heat generating component. However, the production of 1 money for a small number of high-heating components to enhance heat dissipation, for the desktop computer with many high-volume is not turned, there is a step-by-step improvement. SUMMARY OF THE INVENTION In view of the above problems, it is a primary object of the present invention to provide a solution to the problems or disadvantages of the prior art of 2008. The political enthusiasm of the first month ϋ technology;}: the fruit group is easy to make the air convection inside the casing is not good, easy to lead to excessive waste heat _ the temperature of the stagnation part is too high, the sulphur hood can not effectively target the high fever of the computer Wei The component adds heat m to record heat for a few high heat-generating components. _ The above problem, the present invention provides a kind of scatter hood, which can integrate the new display and the scatter piece, and the heat dissipation efficiency for the (four) heating element (4). In order to achieve the above object, the present invention provides a diffusing hood which is fixed inside a computer casing and covers a plurality of high heat generating components of the main board, and includes a main hood and an i-scale hood. The main hood is formed by separating the inner portion of the electric housing from the first & wind region and forming an air inlet on one side of the air guiding region. The auxiliary air hood is fixed at the bottom of the main hood and is accommodated in the _air guiding area, and is separated from the second air guiding raft in the first air guiding area, wherein the plurality of high heats are connected. The components are covered by the auxiliary fresh air, and are accommodated in the second air guiding zone to blow the airflow to the high-heating component to be cooled, thereby improving the heat dissipation efficiency of the high-heating component inside the computer casing. The effect of the invention is that the 'enclosure heat-dissipating hood defines the 丨-fixed air passage' and integrates the fan and the heat dissipation to stabilize the flow field around the high-heat element, and directly blows the airflow of the fan toward the air High-heating element Wei Wei's cooling Korean film blowing 'borrowing the internal air convection of the case and the computer system to mention the thermal efficiency, and can be used to strengthen the components of the heat dissipation for each type of host, in the windshield towel with a suitable small hair accessory The windshield' increases the heat dissipation effect of the south heating element. In the following, the detailed features and advantages of this (4) are described in detail in the embodiment, and the 7 200825684 is enough for the domain to understand the basics and implement it, and according to this book, The purpose of the present invention is to understand the purpose and advantages of the present invention. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ [Embodiment] In order to further understand the objects, structures, features, and functions of the present invention, the embodiments will be described in detail below. Please refer to "1", "2", "3", "4" and "5" for the heat dissipation of the first embodiment of the present invention. The cover (10) is provided with a high-heating element that covers the main board, and includes a leading hood 5 〇 and an auxiliary air hood 6 〇. The computer casing 10 is a frame structure with a hollow inner rectangular body for accommodating f kinds of electronic components. The partition 12 is fixed inside the computer (4), and the main board 20 is locked to the side thereof, and the other side of the main board 2{) is attached to the computer casing ίο, and then the domain board _ Di's internal shell iq internal motherboard 20 is provided with Wei high-heating components, such as the _ 2 central processor 22 and other high-heating electronic components, and the central part (four) (two) is provided with a heat-dissipating Korean film 221, which can be The heat conduction discharges the waste generated by the central processing unit 22 surface. After the computer case 1G, the side plates n _ are arranged side by side with two money winds (four), the number of which is not limited to this, the adjacent domain board 2G - like the branch should be on the side of each of the 22 221, (4) fan 3Q system The air outside 200825684 4 is sucked into the 41Q towel, and the internal and external air of the electric housing is convected to enhance the heat dissipation capability of the computer case. Please read the "Picture 6", "Picture 7", "Figure 8" and "Picture 9", where the main 'hood hood 50' consists of a top plate portion 51 and two side plate portions & The top panel has a top surface 511 and is opposite to the bottom surface of the top surface. The top surface is interlaced into a plurality of (10) thin, to increase the flexural resistance of the top plate portion and strengthen the strength of the top plate. The bottom surface 512 forms a plurality of convex column brothers, and the top end of each of the protruding columns is provided with a screw hole = two side plates. The portion 52 extends vertically downward from both sides of the panel portion 51, and forms a first air guiding region M with the surface 512 of the top plate portion 4, covering the motherboard, and can be processed, processed, and processed centrally. The heat-dissipating dog of the device 22 is disposed on the other side of the W 51 wind of the main windshield 5G, wherein the latching member 53 is matched with the partition 12' of the computer housing 10 - The elastically deformable .f flap can be used to fasten the partition 12 when the heat-dissipating air hood (10) is on one side of the main board 20 to set the divergent air hood to the computer casing 10 (4). "The windshield 50 is fixed at -1 = 〇: connected to the "the first air-conducting area shown in Figure 11", and is read in the computer case 1 〇 after the side plate (1) generates airflow through the air inlet 55 In the air guiding area 54, the airflow generated by the Laiwu fan 30 is guided to each of the middle __ hoods 221 to enhance the heat dissipation efficiency, and the temperature is too high, and the auxiliary air guiding system is installed. In the main turn 5G lower margin area. The attachment hood 6Q has a fine-cut hole knives corresponding to the main protrusions 56 of the top cover of the 200825684 top cover, and each fixing hole 61 is used for providing a screwing piece and then screwing into the corresponding side. The screw holes 561 of the respective protrusions 56 are connected to the bottom surface 512 of the main windshield 5 连接 by connecting the auxiliary air hood 60. The auxiliary air hood (6) further includes a slanting flap 62, and a flat sheet 63 extending vertically downward from both sides of the slanting flap 62 to form a second air guiding area 64 and communicating with the air inlet 55, covering the hexagram Above the fe body 21, the airflow generated by the system fan 3〇 is concentrated and blown onto the memory u to enhance the heat dissipation efficiency, but the relationship between the auxiliary air hood 6 〇 and the position of the main hood 5 , can be The demand changes to match the setting position of the high-heat electronic components on various motherboards. As shown in Fig. 12 and Fig. 13, a second embodiment of the heat dissipating hood of the present invention is substantially the same as the first embodiment, however, the difference between the two is that The air hood 60 is combined with the main hood 5〇 in a different manner. In the second embodiment, the front ends of the respective protrusions 56 of the main hood 5b have an elastic fitting portion 562, and the fitting portions 562 are respectively matched with the fixing holes 61 corresponding to the auxiliary air guiding cover 60. Each of the fitting portions 562 has a conical shape and has a broken groove and is cut along the radial direction of the fitting portion 562. The fitting portion 562 is subjected to a radial pressing force 4, and the fitting portion 562 is compressively deformed so that the outer diameter of the outer peripheral edge is smaller than the diameter of the fixing hole. When the fitting portion 562 is inserted into the fixing hole 61, the fitting portion 562 is compressed and deformed by a pressing force, and the fitting portion 562 is passed through the fixing hole 61 and restored by the fixing hole 61. The portion 562 is embedded in each of the corresponding fixing holes 61. Therefore, the user only needs to align the fixing holes 61 of the auxiliary air hood 60 with the fitting portion 562 of the main hood 5 ,, and then push the auxiliary air hood 6 〇 toward the top plate portion 51 of the main hood 5 〇. The fitting portion 562 is fitted into each of the fixing holes 61, and the auxiliary air guiding cover 6〇10 200825684 can be connected and fixed to the bottom surface 512 of the main windshield 5〇. Therefore, the heat-dissipating hood (10) of the present invention defines a fixed airflow passage, so that the airflow generated by the system fan 30 can be concentratedly blown onto the component of the motherboard 2, which is intended to dissipate heat. The heat dissipation needs to be configured to separate the airflow channel to direct the airflow to the components that need to be additionally enhanced, so as to enhance the airflow efficiency and improve the heat dissipation efficiency. The components are changed and matched, and the heat dissipation effect of a plurality of high heat-generating components is simultaneously enhanced. Although the present invention has been disclosed above in the foregoing embodiments, it is intended to limit the invention. In the spirit and scope of the present invention, the changes and retouchings are all the care of the present invention. Regarding the warranty defined by the present invention, please pay attention to it. [Simple description of the diagram] The first picture is the first day of the day - the implementation of the radiation, the heat dissipation hood and the exploded view of the electric body. The gas is again (the second picture is the first-dimensional thin towel of the invention, the three-dimensional exploded view of the heat-dissipating windshield machine plate. The money fan and the main figure 3 are the first embodiment of the invention, the heat-dissipating air-conductor cover machine Figure 4 is a perspective view of another perspective of Fig. 3. Fig. 5 is a perspective view of the first embodiment of the present invention, t, and ¥ windshield read on the computer case 6 is the invention In the first embodiment, a perspective view of the heat-dissipating windshield. 11 200825684 Figure 7 is a perspective exploded view of the leading windshield and the air deflector, and the eighth embodiment is a heat-dissipating guide in the first embodiment of the present invention. Side view of the windshield. Fig. 9 is a bottom view of the first embodiment of the present invention, the heat dissipation air hood is provided. Fig. 10 is a schematic cross-sectional view of the heat dissipation air hood in the first embodiment of the present invention. In the first embodiment of the present invention, a schematic diagram of the internal airflow direction of the heat dissipation air hood is provided. The first embodiment is a perspective view of the heat dissipation air hood in the first embodiment, and FIG. 13 is a second embodiment of the present invention. An exploded view of the main hood and the auxiliary air hood. [Description of main components] 10·········· ···· 11..........................12..................... 20....................... 21..........................22 ............... 221....................... 30.......... .............50········ Computer case rear side panel partition 5H····· 512····· 513····· Main board Memory central processor cooling fin system fan leading hood top plate part surface bottom rib 12 200825684 52................ 53.......... ........................Snaps 54................ 55......... .........................Into the wind π 56................ 561........ ........................ screw hole 562•.............................. fitting part 60 .................................Auxiliary air hood 61•.............................. ..... fixing hole 611............................... screwing piece 62........... .... .............. Oblique flaps 63............... 64............ ...100...............................heating air hood 13