M377531 五、新型說明： 【新型所屬之技術領域】 發光二極體(LED)燈具設計技術領域。 【先前技術】 如第一圖所示，目前LED燈具之設計，採用結構較為複雜之設計方式，將金屬沖壓 或壓鑄方式製作，其燈具形狀類似燈杯或不同結構之燈具基座，耗費加工與組裝成本， 因此本創作是針對改進上述缺點而提出，且可依據需求增加不同功能之元件而成LED燈 具。 【新型内容】 本創作裝置’如第二圖所示是LED燈具，它是利用發光二極體(LED)(1〇1)做為發光 源’並利用導熱性能優異之金屬基板(102)做為導熱板，以錫合金黏著技術將LED(1〇1) 與金屬基板(102)接合在一起，提升LED(lOl)之散熱能力，為了提升導熱性能，在金屬 基板(102)可依據需求增加層數，確保LED(lOl)散熱效果良好；LED(lOl)之光線可選擇 不同光型之LED燈，可將LED燈之光線藉由二次透鏡(1〇7)轉換光型，此二次透鏡(1〇7) 之材料可選擇玻璃或聚碳酸脂（p〇lycarbonate，PC)或高透光率之材料，將二次透鏡 (107)以耐溫膠固定於光學塑膠基座（1〇6)，再以螺絲(1〇8)與耐溫黏著膠黏著於金屬基 板(102)上；LED(lOl)之正負電極藉由耐高溫導線接至可提供固定電流之電子電路 (103) ’此電子電路(1〇3)藉由導電頂針與外部電路連接，此外部電路可為傳統之齒素燈 變壓器或各種交流轉直流之電源供應器；電子電路(1〇3)置入塑膠外座（1〇4)，除了固定 機構之外可美化led燈具之外觀，接著以螺絲（105)將金屬基板(102)、塑膠外座（1〇4) 組合固定而成LED燈具。 综合以上所述，可知本創作具有下列優點： 1· 本創作裝置所採用之金屬基板LED燈具，結構製做簡單，不必製作複雜之散熱金 屬基座，即可達到散熱效果，同時可依據散熱需求增加金屬金板層數，可說至為簡 3 M377531 單的新型創作。 2·本創作裝置所採用之LED燈具，結構設計彈性，可依據現有外觀繁雜之燈具需求 組裝成各式各樣之燈具，不需要另外設計成專有之燈杯，提升燈在現有燈具之 應用效果，可說是非常簡單有效之新型創作。 以上各點，在在顯示本創作確實能達到預期之目的及功效，且_請前未見諸於任何 刊物或公開使用，符合新型專利之申請。 【實施方式】 首先如第二圖所示，選擇所需發光二極體(LED)(1〇1)，依據其[仰規格設計平板型 金屬基板(102) ’以錫合金黏著技術，將LED(101)黏著於平板型金屬基板(1〇2)上，再依 據LED(lOl)之規格設計電子電路（103)，以滿足LED〇〇1)亮度之需求，接著將電子電路 (103)固定於塑膠外座（1〇4)，連接電子電路(1〇3)與LED(lOl)，再用一般習用之螺絲（1〇5) 固疋平板型金屬基板(102)與塑夥外座（104) ’接著以一般習用之螺絲（1〇8)固定光學塑 膠基座（106)，最後以耐溫膠將二次透鏡(107)固定於光學塑膠基座（1〇6)，而形成單層 金屬基板之平板型LED燈具。 另外如第四圖所示’考量LED(lOl)若採用較高功率規格’需增加散熱面積與體積， 應此增加多層之散熱金屬基板，如第二層金屬基板(1〇9)，第三層金屬基板(HQ)，或更 多層金屬基板，以提升散熱能力，並以一般習用之螺絲（111)固定，而形成之多層金屬 基板之平板型LED燈具。。 【圖式簡單說明】 第一圖：表示現有專利之LED燈具。 此LED燈具參考中華民國專利系統中公告號M305311，LED燈杯模組之專利。 第二圖：表示新型創作之單層金屬基板LED燈具爆炸圖。 4 M377531 此爆炸圖呈現每個元件位置。 第三圖：表示新型創作之單層金屬基板LED燈具組合圖。 將第二圖爆炸圖組合後所呈現之組合圖。 第四圖：表示新型創作之多層金屬基板LED燈具爆炸圖。 此爆炸圖呈現每個元件位置。 第五圖：表示新型創作之多層金屬基板LED燈具組合圖。 將第四圖爆炸圖組合後所呈現之組合圖。M377531 V. New description: [New technology field] Light-emitting diode (LED) lamp design technology. [Prior Art] As shown in the first figure, the current design of LED lamps adopts a more complicated design method, which is made by metal stamping or die-casting. The shape of the lamps is similar to that of lamp cups or lamps with different structures. Assembly cost, therefore, this creation is proposed to improve the above-mentioned shortcomings, and LED lamps can be added to the components of different functions according to requirements. [New content] The creation device's as shown in the second figure is an LED lamp, which uses a light-emitting diode (LED) (1〇1) as a light-emitting source' and uses a metal substrate (102) with excellent thermal conductivity. For the heat conducting plate, the LED (1〇1) and the metal substrate (102) are bonded together by the tin alloy bonding technology to enhance the heat dissipation capability of the LED (lOl). In order to improve the thermal conductivity, the metal substrate (102) can be increased according to the demand. The number of layers ensures that the LED (lOl) has good heat dissipation effect; the LED (lOl) light can be selected from different light type LED lamps, and the light of the LED lamp can be converted into a light type by a secondary lens (1〇7). The material of the lens (1〇7) may be glass or polycarbonate (PC) or high transmittance material, and the secondary lens (107) is fixed to the optical plastic base with temperature resistant glue (1〇) 6), and then adhere to the metal substrate (102) with a screw (1〇8) and a temperature-resistant adhesive; the positive and negative electrodes of the LED (101) are connected to the electronic circuit (103) capable of providing a fixed current by the high temperature resistant wire. The electronic circuit (1〇3) is connected to an external circuit by a conductive thimble, and the external circuit can be a conventional guillotin lamp transformer or various The DC power supply is supplied; the electronic circuit (1〇3) is placed in the plastic outer seat (1〇4), and the appearance of the led lamp can be beautified in addition to the fixing mechanism, and then the metal substrate (102) is screwed (105), The plastic outer seat (1〇4) is fixed to form an LED lamp. Based on the above, it can be seen that the present invention has the following advantages: 1. The metal substrate LED lamp used in the creation device is simple in structure, and it is not necessary to make a complicated heat dissipation metal base to achieve the heat dissipation effect, and at the same time, according to the heat dissipation requirement. Increase the number of metal gold plate layers, which can be said to be a new creation of Jane 3 M377531 single. 2. The LED lamps used in the creation device are flexible in structure design and can be assembled into various lamps according to the existing complicated lamps. It is not necessary to design a special lamp cup, and the application of the lamp in the existing lamps The effect can be said to be a very simple and effective new creation. The above points, in the display of this creation can indeed achieve the intended purpose and efficacy, and _ please not see any publications or public use before, in line with the application of the new patent. [Embodiment] First, as shown in the second figure, the desired light-emitting diode (LED) (1〇1) is selected, and the LED is adhered according to the [upper gauge design of the flat metal substrate (102). (101) Adhering to a flat metal substrate (1〇2), and then designing an electronic circuit (103) according to the specifications of the LED (101) to meet the brightness requirement of the LED 〇〇1), and then fixing the electronic circuit (103) In the plastic outer seat (1〇4), connect the electronic circuit (1〇3) and the LED (lOl), and then use the conventional screws (1〇5) to fix the flat metal substrate (102) and the plastic outer seat ( 104) 'Fix the optical plastic base (106) with the usual screws (1〇8), and finally fix the secondary lens (107) to the optical plastic base (1〇6) with temperature resistant glue to form a single Flat panel type LED lamp with layer metal substrate. In addition, as shown in the fourth figure, if the LED (lOl) adopts a higher power specification, it is necessary to increase the heat dissipation area and volume. Therefore, a plurality of heat dissipation metal substrates, such as a second metal substrate (1〇9), A layered metal substrate (HQ), or a plurality of metal substrates, to enhance heat dissipation, and fixed by conventional screws (111) to form a multi-layer metal substrate flat LED lamp. . [Simple description of the diagram] The first picture shows the LED lamps of the existing patents. This LED lamp refers to the patent of the announcement number M305311 and the LED lamp cup module in the Republic of China patent system. The second picture shows the explosion of a single-layer metal substrate LED lamp with a new creation. 4 M377531 This exploded view shows the location of each component. The third picture shows the combination of a single-layer metal substrate LED lamp with a new creation. The combination diagram presented after combining the second map explosion map. The fourth picture shows the explosion of the multi-layer metal substrate LED lamps. This exploded view shows the location of each component. Figure 5: A combination of a new type of multi-layer metal substrate LED lamp. The combination diagram presented after the combination of the explosion maps of the fourth figure.
【主要元件符號說明】 如圖訖 101 :發光二極體(LED) 102 :第一層金屬基板 103 :電子電路 104 :塑膠外座 105 : —般習用之螺絲 106 :光學塑膠基座[Main component symbol description] Figure 101: Light-emitting diode (LED) 102: First metal substrate 103: Electronic circuit 104: Plastic outer seat 105: General-purpose screw 106: Optical plastic base
107 :二次透鏡 108 : —般習用之螺絲 109 :第二層金屬基板 110 :第三層金屬基板 111 : 一般習用之螺絲 5107 : Secondary lens 108 : General used screws 109 : Second metal substrate 110 : Third metal substrate 111 : Commonly used screws 5