M377039 五、新型說明： 【新型所屬之技術領域】 本創作係一種直立式喷液裝置，尤其是一種於濕製程 中避免薄型基板因液體的喷灑而晃動而與箱體内之喷頭等 元件碰觸，導致基板;ί貝壞而降低良率所設置的喷液裝置。 【先前技術】 I的電路基板可分為兩種’一為傳統的硬式基板， 另一則為如紙一般可以彎折的薄型基板，而這兩種基板皆 會在形成預設之電路製程中經過濕製程程序。 基板漁製程有水平濕製程及垂直濕製程二種方式，二 種製程均可用於硬式或軟性基板，在對於基板上線路精度 要求不高之情況下，以上二種製程在操作上並無問題；惟 因隨著電子產品體積微型化及基板線路精細度要求愈來愈 咼之情況下，基板在濕製程過程中被要求不得有與濕製程 箱體中之任何元件會有碰觸的情況發生，而以上二種製程 於硬式基板之應用並無問題，但對於厚度薄如紙張的軟式 基板將會無法達成要求；以均局核准之第339188號「薄 板材輸送裝置」為例，其係水平濕製程的應用例，係且有 上、下滾輪組以及上、下錢裝置，該下滚輪組係在該基 板下方用以傳輸該基板，而上滾輪組係在該基板上方用於 輔助該下滾輪組傳輸該基板，而在傳輸的過程中，該上、 下働置會分別朝該基板的上表面和下表面嘴㈣刻 液之液體，以使基板的上表面和下表面形成預設線路，缺 因基板係於上下輸送輪㈣輸送，其輸送輪會碰觸到基板 3 之線路部分，光 濕製程箱體中夕：:在濕製程過程中基板被要求不得與 月妨 何70件會有碰觸的情況要求；再如均 局核准之第523246號「古Λ 4办 為例，复你千古、J直立式電路板輸送及吹風結構」 '、，、+濕製程的應用例，該裝置頂部中央設有一 ^ 心夾持薄型基板’基板係於左右輸送輪組件 你巧^裝置的兩側則分別設有—喷麗裝置（圖中未繪）， 二該運輸夾具移動時’該等噴灑裝置能朝該薄型基板的 :側面噴麗如姓刻液之液體’以達成形成預設線路的效 ’但此種設計之輸送輪亦會碰觸到基板之線路部分，並 不符合基板在濕製程過程中被要求不得與濕製程箱體中之 任何疋件會有碰觸的情況要求。 、·目刚又-種濕製程直立式的裝置，該裝置於頂部設有 運輸炎具，用^持薄型基板上料，而在該裝置的兩側 則僅刀別⑨有—喷丨麗裝置，使得該運輸夹具移動時，該等 喷灑裝置能朝該薄型基板的兩側面噴灑蝕刻液，以達成形 成預設線路的效果，此種裝置並未設有如第523246號「直 立式電路板輸送及吹風結構」案之輸送輪組，故基板於濕 製程過程中不會有碰觸輸送輪之問題，然此種裝置使用於 硬式基板時，因基板較重及較硬，於輸送過程中不易晃動， 故基板並不會碰_喷灑裝置之嗔嘴，不會產生影響基板 良率之問題。 然而，當應用在薄型基板之輸送時，因基板本身較輕 且柔軟，在基板剛進入濕製程裝置中且尚未經噴灑裝置喷 灑如蝕刻液等液體之前，係呈現完全乾燥的狀態，並僅於 頂部設有運輸夹具，用以夾持薄型基板上端緣，因此在剛 M377039 進入喷濃裝置之間喷麗液體時’該薄型基板會因為喷丨麗穿 置液體高速噴灑所產生的噴力以及所帶動的氣流而讓尚未 完全濕潤的薄型基板擺蕩晃動，而碰觸到噴灑裝置之喷 嘴’造成該薄型基板上線路的損壞，因此既有的濕製程直 立式裝置無法提升薄型基板的良率。 為了避免上述情形，另一種改良之設計，係在前述濕 - 製程基板底部設置有另一下運輸夾具，使得該薄型基板的 上、下皆被夾持而拉直，以便於基板進入噴灑裝置之間喷 鲁灑液體時，可以減少基板擺蕩晃動，但是此種設計必須因 應不同面積之基板重新設置不同之下運輸夹具，且將基板 夾設於下運輸夾具亦增加工時，，增加該濕製程裝置的基 板製作成本’並不符合經濟效益。 【新型内容】 本創作人有鑑於既有的薄型基板濕製程裝置會讓薄型 基板的生產良率無法提升，或者有經濟成本上的負擔，因 此經過不斷的嘗試與努力，終於創作出此薄型基板濕製程 _ •裝置。 本創作之目的係在於提供一種於濕製程中避免薄型基 板因液體的喷灌喷力而晃動碰觸到喷嘴等元件，導致某板 預設線路損壞而降低良率所設置的噴液裝置。 為達上述目的，本創作之薄型基板濕製程裝置，其係 包括： 一濕製程箱體，其兩端部形成有一入口以及一出口， 且於兩側接近該入口處各設有一直立式低喷速喷液裝置， 且該濕製程箱體之兩側且鄰近於直立式低噴速喷液裝置各 5 設有一喷灑裝置； 一運送裝置，其係具有一運送轨道以及一夾具，該運 送執道係設置於該濕製程箱體之頂部’且設置於該等噴濃 裝置之間的位置，而該失具係移動式地與該運送軌遒結 合’以於該運送軌道中移動。 由於本創作之濕製程箱體的兩側各設有一直立式低喷 .速噴液裝置，所以能夠在薄型基板通過喷麗裝置之前就會 .被喷濕，由於其具有較喷灑裝置低的噴灑速度，因此能夠 ♦避免薄型基板在喷濕的過程中晃動；且在以直立式低喷速 喷液裝置喷濕後’薄型基板的重量提高，且會有液體往下 ⑽動的力量將該薄型基板拉直’所以即使之後以喷灑裝置 朝該薄型基板高速錢，亦不會使薄型基板晃動而碰觸到 喷嘴等7G件，故能使該薄型基板預設線路獲得良好的品 質，而提高薄型基板製作的良率。 【實施方式】 料看第—圖所示，本創作係-種薄型基板濕製程裝 • 置，其係包括： • 一前處理箱體（10); 一濕製程箱體（20) ’其係結合於該前處理箱體（1〇)之 後端，且連通於該前處理箱體（1〇)，該濕製程箱體（2〇)之 兩端4形成有-入口（21)以及一出口（22)，且於兩侧接近 該入口（21)處各設有一直立式低喷速喷液裝置（23)，且該 濕製程箱體（20)之兩側且鄰近於直立式低纽魏裝置（23) 各6又有1灌裝置（24)，各喷麗裝置（24)係包括複數橫向 δ又置的輸送官（241)，且各輸送管上設有複數喷嘴（242卜 6 各噴嘴（242)的出水口係朝向該濕製程箱體㈣）内部； —運送裝置（30)，其具有1送轨道（31)以及一連接 滚輪（33)的夾具（32) ’該運送軌道（Μ)係—體設置於該前 处理箱體(10)與該濕製程箱體(2〇)之頂部，且設置於該等 喷;麗裝置（24)之間的位置，而該夾具（32)之滾輪（33)係移動 式地設置於該運送軌道（31)中，以於該運送軌道（31)中移 動。 本創作所提供之直立式低喷速噴液裝置（23)可與該喷 灑裝置（24)分別連通於不同的姓刻液輸入管；亦可連通於 同一蝕刻液輸入管（25)，即該蝕刻液輸入管（25)設有二具有 水閥（253)(254)的支管（251 )(252)，分別連接於該直立式低 喷速喷液裝置（23)與該喷灑裝置（24)。各直立式低喷速喷液 裝置（2 3)和該喷麗裝置（24)可分別設有調整噴速的調整閥或 藉由對應之支管（251 )(252)的水閥（253)(254)調整。 請繼續參看第一圖所示，在進行濕式蝕刻前，先將一 薄型基板（40)放入該前處理箱體（1〇)内，並且使用該運送裝 置（30)的炎具（32)夾持該薄型基板（40)的上緣，而後，讓夾 '具（32)在該運送軌道（31)中朝著該濕製程箱體（2〇)的入口 (21)行進。 請附加參看第二及三圖所示，當該薄型基板（40)的前 緣進入該入口（21)後’該直立式低喷速噴液裝置（23)即開 始朝該薄型基板（40)喷灑液體’於本實施例中係喷灑蝕刻 液，其成分同之後進行之钱刻所用的钱刻液。 該運送裝置（30)會繼續將該薄型基板（40)朝喷灑裝置 (24)裝置前進，所以薄型基板（40)已經喷濕後才會進入噴 M377039 灑裝置（24)之間，再進行蝕刻步驟，而 ^ 型美或蝕刻步驟的溥 土板（40)會從該濕製程箱體（2〇)出 箱髀/on、 離開該濕製程 (〇)，即可得到姓刻完成的薄型基板（4Q)預設線路。 請參看第一圖所示’在此—實施例中，各直立式低喷 各#液裝置（23)係包括二直立且平行設置的輪送管（2川， 别送管（231)上設有複數噴嘴（232)，各喷嘴（232)的出水 係朝向該濕製程箱體（2〇)内部。 請參看第四圖所示，在另—實施例中，各直立式低喷 ^㈣置（23a)僅由—直立設置的輸送管（23ia)所組成， 送官（231a)上設有複數噴嘴（232a)，各噴嘴⑽句的 出水口係朝向該濕製程箱體（2〇)内部。 請參看第五圖所示，在又—態樣中，各直立式低喷速 嘴液褒置（23 b)包括二直立且平杆 _ 立十仃設置的輸送管（23b)，且 二輪送管（231b)之間設置有一遠 韦運接管（233b)，各連接管 ,上。又有至^ 一喷嘴（232b)，各喷嘴（232b)的出水口 係朝向該濕製程箱體（2〇)内部。 由此可知’所屬技術領域中具有通常知識者在了解本 創作後，能夠將本創作之直立式低喷速喷液裝置（23)的型 =依照不同的需要而做些許修飾’但其仍屬於本創作之範 疇。 本創作係藉由設置在該濕製程箱體（2〇)入口（21)處的直 ^式低喷速喷液裝置（23)，將原本乾燥的薄型基板（40)先以 k低的㈣速度將如钱刻液等液體脅灑於其上，而形成濕 满的薄基板（4G)，由於濕潤的薄型基 其經過喷湛裝置（24)的處理 ； ^ 不會因液體產生的喷力而晃 8 M377039 因此本創作能 動造成薄型基板(40)碰觸其他元件而損傷 提高薄型基板（40)預設線路的產出良率。 【圖式簡單說明】 第一圖係本創作一實施例的側視圖。 第一圖係本創作進行濕式蝕刻一薄型基板的實施狀態 側視圖。 第三圖係本創作利用直立式低喷速喷液裝置喷濕一薄 型基板時的端視圖。M377039 V. New description: [New technical field] This is an upright liquid spraying device, especially a component that avoids the shaking of a thin substrate due to the spraying of liquid in the wet process and the nozzle in the box. Touching, causing the substrate; ίBay is bad and the yield is reduced by the spray device. [Prior Art] The circuit substrate of I can be divided into two types: a conventional rigid substrate, and the other is a thin substrate that can be bent like paper, and both substrates are processed in a predetermined circuit process. Wet process program. The substrate fishing process has two methods: horizontal wet process and vertical wet process. Both processes can be used for hard or soft substrates. In the case where the line precision on the substrate is not high, the above two processes have no problem in operation; However, as the volume of electronic products is miniaturized and the fineness of the substrate line is becoming more and more serious, the substrate is required to have no contact with any components in the wet process box during the wet process. However, there is no problem in the application of the above two processes on the rigid substrate, but the soft substrate with a thin thickness such as paper will not be able to meet the requirements; for example, the thin plate conveying device No. 339188 approved by the uniform office is horizontally wet. The application example of the process includes an upper and a lower roller group and an upper and lower money device. The lower roller group is disposed under the substrate for transmitting the substrate, and the upper roller group is above the substrate for assisting the lower roller. The group transports the substrate, and during the transfer, the upper and lower devices respectively inject liquid into the upper surface and the lower surface of the substrate (4) to make the upper surface of the substrate Forming a preset line with the lower surface, the missing substrate is transported by the upper and lower transport wheels (4), the transport wheel will touch the line portion of the substrate 3, and the light wet process box is in the middle of the day: the substrate is not required during the wet process It is required to meet the situation of 70 pieces of the moon; and, as approved by the Board of Directors, No. 523246, "The ancient Λ 4 office is an example, reviving your eternal, J vertical circuit board conveying and blowing structure" ',, + For the application of the wet process, the center of the device is provided with a core clamping thin substrate. The substrate is attached to the left and right transport wheel assemblies. On both sides of the device, a spray device (not shown) is provided. When the transport jig moves, the spray devices can spray the liquid of the thin substrate to the side of the thin substrate to achieve the effect of forming a preset line. However, the transport wheel of this design also touches the circuit of the substrate. In part, it does not meet the requirements that the substrate is required to be in contact with any of the components in the wet process chamber during the wet process.目 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚 刚When the transport jig is moved, the spraying device can spray the etching liquid toward both sides of the thin substrate to achieve the effect of forming a preset circuit. The device is not provided with the vertical circuit board conveying as in No. 523246 And the conveying structure of the blowing structure case, so the substrate does not have the problem of touching the conveying wheel during the wet process, but when the device is used on the hard substrate, the substrate is heavy and hard, and it is not easy to convey during the transportation process. Shake, so the substrate does not touch the nozzle of the spray device, and there is no problem that affects the yield of the substrate. However, when applied to a thin substrate, since the substrate itself is light and soft, it is completely dry before the substrate has just entered the wet process device and has not been sprayed with a liquid such as an etchant through the spray device, and only There is a transport jig at the top for clamping the upper edge of the thin substrate, so when the liquid spray liquid is sprayed between the M377039 and the spray device, the thin substrate will be sprayed by the high-speed spray of the sprayed liquid and The air flow that is driven causes the thin substrate that has not been completely wet to sway and the nozzle that touches the spray device causes damage to the line on the thin substrate. Therefore, the existing wet process vertical device cannot improve the yield of the thin substrate. In order to avoid the above situation, another improved design is to provide another lower transport jig at the bottom of the wet-process substrate, so that the upper and lower sides of the thin substrate are clamped and straightened, so that the substrate enters between the spray devices. When spraying liquid, it can reduce the sway of the substrate, but this design must reset the transport jig according to different substrates of different areas, and the clamping of the substrate to the lower transport jig also increases the working time, and the wet process device is added. The cost of substrate fabrication is not economical. [New content] The creator has finally created this thin substrate after continuous attempts and efforts in view of the existing thin substrate wet process device that will not improve the production yield of the thin substrate or the economic cost. Wet process _ • device. The purpose of the present invention is to provide a liquid ejecting apparatus which is provided in a wet process to prevent a thin substrate from swaying against a nozzle or the like due to a liquid spray force, thereby causing damage to a predetermined line of the board and reducing the yield. In order to achieve the above object, the thin substrate wet processing apparatus of the present invention comprises: a wet process box body having an inlet and an outlet formed at both ends thereof, and each of the two sides is adjacent to the inlet and is provided with a vertical low a spray rate liquid spraying device, and a spray device is disposed on each side of the wet process box body adjacent to the vertical low spray rate liquid spray device 5; a transport device having a transport track and a clamp, the transport The obstruction is disposed at the top of the wet process box and is disposed at a position between the spray devices, and the lock is movably coupled to the transport rail to move in the transport rail. Since the two sides of the wet process box of the present invention are provided with a vertical low-spray speed spray device, the thin substrate can be sprayed before passing through the spray device, because it has a lower spray device. The spraying speed can therefore avoid swaying the thin substrate during the wet process; and after the wet spray with the vertical low-spray spray device, the weight of the thin substrate increases, and the force of the liquid moving downward (10) will be Since the thin substrate is straightened, even if the thin device is quickly moved toward the thin substrate by the spraying device, the thin substrate is not shaken and touches a 7G member such as a nozzle, so that the thin substrate can be obtained with a good quality. And improve the yield of thin substrate production. [Embodiment] As shown in the figure, the creation system is a thin substrate wet process assembly, which includes: • a pre-treatment chamber (10); a wet process chamber (20) Combined with the rear end of the pre-treatment tank (1〇) and connected to the pre-treatment tank (1〇), the two ends 4 of the wet process tank (2〇) are formed with an inlet (21) and an outlet. (22), and each side of the inlet (21) is provided with a vertical low-spray spray device (23), and the wet process box (20) is on both sides and adjacent to the vertical low button Wei device (23) each has a 1 irrigation device (24), each spray device (24) includes a plurality of transverse δ and a set of transport officials (241), and each of the transport tubes is provided with a plurality of nozzles (242 b 6 The water outlet of each nozzle (242) faces the inside of the wet process box (4)); the transport device (30) has a 1 feed rail (31) and a clamp (32) connecting the rollers (33) 'The transport track (Μ) is disposed at the top of the pre-treatment tank (10) and the wet process box (2〇), and is disposed at a position between the spray device and the device (24), and the fixture The roller (33) of (32) is movably disposed in the transport rail (31) for movement in the transport rail (31). The vertical low-spray liquid spraying device (23) provided by the present invention can communicate with the spraying device (24) respectively for different surname input pipes; or can be connected to the same etching liquid input pipe (25), that is, The etchant input pipe (25) is provided with two branch pipes (251) (252) having water valves (253) (254) connected to the vertical low-spray spray device (23) and the spray device ( twenty four). Each of the vertical low-spray liquid spraying device (23) and the spray device (24) may be respectively provided with a regulating valve for adjusting the spraying speed or a water valve (253) by the corresponding branch pipe (251) (252) ( 254) Adjustment. Please continue to refer to the first figure, before the wet etching, a thin substrate (40) is placed in the pretreatment chamber (1), and the device (30) is used (32). The upper edge of the thin substrate (40) is clamped, and then the clip (32) is advanced in the transport track (31) toward the inlet (21) of the wet process housing (2). Please refer to the second and third figures. After the leading edge of the thin substrate (40) enters the inlet (21), the vertical low-spray liquid spraying device (23) starts toward the thin substrate (40). In the present embodiment, the spray liquid is sprayed with an etchant, the composition of which is the same as the money used for the engraving. The transport device (30) will continue to advance the thin substrate (40) toward the spray device (24), so that the thin substrate (40) has been wetted before entering the spray M377039 sprinkler device (24), and then proceeding The etching step, and the alumina board (40) of the type or the etching step will be out of the wet process box (2〇) out of the box on/on, leaving the wet process (〇), and the thin type with the surname can be obtained. The substrate (4Q) is preset. Please refer to the first figure shown in the first embodiment. In the embodiment, each of the vertical low-injection liquid devices (23) includes two vertical and parallelly arranged wheel-feeding tubes (2, and the other tubes (231) are provided. There are a plurality of nozzles (232), and the water outlet of each nozzle (232) faces the inside of the wet process box (2〇). Referring to the fourth figure, in another embodiment, each of the vertical low-injection (four) sets (23a) consists only of a delivery tube (23ia) that is placed upright, and a plurality of nozzles (232a) are provided on the delivery unit (231a), and the outlet of each nozzle (10) is oriented toward the inside of the wet process chamber (2〇) Please refer to the fifth figure. In the re-inspection, each vertical low-jet nozzle liquid raft (23 b) includes two vertical and flat rods _ Li Shi 仃 set of conveying tubes (23b), and two wheels Between the feeding pipe (231b), there is a far-moving connecting pipe (233b), each connecting pipe, and a nozzle (232b), and the water outlet of each nozzle (232b) faces the wet process casing (2) 〇) Internal. It can be seen that the general knowledge in the technical field can understand the vertical low-spray spray of this creation. (23) Type = Make some modifications according to different needs' However, it still belongs to the scope of this creation. This creation is made by the straight type set at the entrance (21) of the wet process box (2〇). The spray-speed liquid discharge device (23) deposits a thin substrate (40) such as a money engraving liquid on the originally dried thin substrate (40) at a low (four) speed to form a wet full thin substrate (4G) due to The wet thin base is processed by the spray device (24); ^ It is not shaken by the spray force generated by the liquid. 8 M377039 Therefore, the creation can cause the thin substrate (40) to touch other components and damage the thin substrate (40). The output yield of the preset line. [Simplified description of the drawings] The first figure is a side view of an embodiment of the present creation. The first figure is a side view of the implementation state of the wet etching of a thin substrate. This is an end view of a low-speed substrate sprayed with a vertical low-spray spray device.
第四圖係本創作另一實施例的側視圖。 第五圖係本創作又一實施例的側視圖。 【主要元件符號說明】 (10)前處理箱體 （20)濕製程箱體 (21)入口 （22)出口 (23) (23a) (23b)直立式低喷速噴液裝置 (231) (231a) (231b)輸送管 (232) (232a) (232b)喷嘴The fourth figure is a side view of another embodiment of the present creation. The fifth drawing is a side view of still another embodiment of the present creation. [Description of main components] (10) Pre-treatment cabinet (20) Wet process box (21) Entrance (22) Exit (23) (23a) (23b) Vertical low-spray spray device (231) (231a ) (231b) Duct (232) (232a) (232b) Nozzle
(233b)連接管 (241)輸送管 (25)液體輸入管 (253)(254)水閥 (31)運送軌道 (33)滚輪 (24)喷灑裝置 (242)噴嘴 (251)(252)支管 (30)運送裝置 (32)夾具 (40)薄型基板 9(233b) connecting pipe (241) conveying pipe (25) liquid input pipe (253) (254) water valve (31) conveying rail (33) roller (24) spraying device (242) nozzle (251) (252) branch pipe (30) Conveying device (32) Fixture (40) Thin substrate 9