M374588 五、新型說明： 【新型所屬之技術領域】 本創作係為一種具逃氣孔之影像感測器模組，特別係指一種 在影像感測器製造過程中，可提昇產品之良率、生產效率者。 【先前技術】 請參閱圖一，為一種影像感測器模組構造剖視圖，其包括 有：一基板10設有一上表面12及一下表面14,上表面12形 成有第一電極16,下表面14形成有第二電極18連接對應的第 一電極16 ;晶片20係設置於基板10之上表面12，其上形成 有焊墊22;多數條導線24係電連接晶片20之焊墊22至基板 10之第一電極16; —接著劑26係塗佈於基板10之上表面12; 一鏡座28設有内螺紋30，係藉由接著劑26黏設於基板10之 上表面12，將晶片20環繞住；及一鏡筒32設有外螺紋34， 係螺鎖於鏡座28之内螺紋30上。 惟，上述之影像感測器模組，因接著劑26在烘烤製程中 會大量釋放揮發性氣體，使得鏡座28内之密閉空間因受熱及 膨脹效應而產生内壓，造成已經精準對位暫時固定的鏡座28 會偏離預定位置，因而無法達到鏡頭28與感測器感測中心精 準對位的目的，使得光學對焦之失準，影像品質無法達到標準。 有鑑於此，本創作人乃本於精益求精、創新突破之精神， 戮力於影像感測器之封裝研發，而創作出本新型影像感測器模 組，使其可有效提升良率及產品更為輕薄短小者。 M374588 【新型内容】 本創作之主要目的，在於提供一種具逃氣孔之影像感測器 模組，其具有提高產品良率之效果，以達到更為實用之目的。 本創作之另一目的，在於提供一種具逃氣孔之影像感測器 模組，其具有製造便利及提昇生產效率之功效，以達到更為實 用之目的。 本創作包括有一基板設有一上表面及一下表面，上表面形 -成有第一電極，下表面形成有第二電極連接對應之第一電極； 一晶片係設置於基板之上表面，其上形成有感測區及焊墊；多 數條導線係電連接晶片之焊墊至基板之第一電極；一接著劑係 塗佈於基板之上表面；一鏡座設有一逃氣孔、一側壁及内螺 紋，鏡座之側壁係藉由接著劑黏設於基板之上表面上。一鏡筒 設有一外螺紋係螺鎖於鏡座之内螺紋上。一密封膠係用於塞住 逃氣孔，避免微塵等污染源進入鏡座内。 本創作之上述及其它目的、優點和特色由以下較佳實例之 φ 詳細說明並參考圖式俾得以更深入了解。 【實施方式】 請參閱圖二，為本創作具逃氣孔之影像感測器之模組示意 圖，其包括有一基板40、晶片42、多數條導線44、接著劑46、 鏡座48、鏡筒50及密封膠51。 基板40其設有一上表面52及一下表面54，上表面52形 成有第一電極56,下表面形成有第二電極58連接對應的第一 電極56。 4 M374588 晶片42係設置於基板40之上表面52,其上形成有感測區 60及焊墊62。 多數條導線44係電連接晶片42之焊墊62至基板40之第 一電極5 6。 接著劑46為黏著膠，係塗佈於基板40之上表面52上， 並位於第一電極56週邊。 鏡座48其設有一側壁63、一逃氣孔65、一密封膠51、一 肩部67及内螺紋69,鏡座48之側壁63藉由接著劑46黏設於 基板40之上表面52上。逃氣孔65係一貫穿肩部67之小氣孔 係用以釋放接著劑46在鏡座48烘烤製程中所產生之大量揮發 性氣體，可有效防止鏡座48内之感測區60因内壓過大所造成 之光學對焦失準，進而影響影像品質，逃氣孔65内之密封膠 51係用以塞住逃氣孔65，避免在烘烤製程結束後微塵等污染 源進入鏡座4 8内。 鏡筒50設有外螺紋66,係螺鎖於鏡座48之内螺紋69上。 請參閱圖三，為本創作具逃氣孔之影像感測器模組之製造 方法示意圖，其包括有一基板40、晶片42、多數條導線44、 接著劑46、鏡座48、鏡筒50及密封膠51。 提供一基板40，其設有一上表面52及一下表面54，上表 面52形成有多數個第一電極56,下表面54形成有多數個第二 電極58連接對應的第一電極56。 提供一晶片42，其係設置於基板40之上表面52，其上形 成有感測區60及焊墊62。 提供多數條導線44,係電連接晶片42之焊墊62至基板 M374588 40之第一電極56。 提供一接著劑46為黏著膠，係塗佈於基板40之上表面52 上，並位於第一電極56週邊。 提供一鏡座48，其設有一側壁63、一逃氣孔65、一密封 膠51、一肩部67及内螺紋69，鏡座48之側壁63藉由接著劑 46黏設於基板40之上表面52上。逃氣孔65係一貫穿肩部67 之小氣孔用以釋放接著劑46在鏡座48烘烤製程中所產生之大 量揮發性氣體，可有效防止鏡座48内之感測區60因内壓過大 所造成之光學對焦失準，進而影響影像品質。 提供一鏡筒50，設有外螺紋66，係螺鎖於鏡座48之内螺 紋69上。 提供一密封膠51，係用以塞住逃氣孔65，避免在烘烤製 程結束後微塵等污染源進入鏡座48内。 切割鏡座48之側壁63及黏著於鏡座48之基板40，使其 成為更小尺寸之模組。 是以，本實施例具有如下優點： 1. 將鏡座48之側壁切除時，可使模組體積縮小，且可得 到較一致之產品尺寸。 2. 貫穿肩部67之逃氣孔65可有效釋放烘烤製程中接著劑 46所產生之揮發性氣體，並維持鏡座40内、外之壓力均衡可 防止因内壓過大所造成鏡座40之傾斜效應，造成光學對焦失 準，進而影響影像品質。 在較佳實施例之詳細說中所提出之具體實施例僅為易於 說明本創作之技術内容，並非將本創作狹意地限制於實施例， M374588 凡依本創作之精神及以下由 — 申μ專利範圍之情況所作之種種變 化實施均屬本創作之範圍。 【圖式簡單說明】 圖一為習知影像感測器組之示意圖。 圖二為本創作具有逃氣孔之影像感測器模組之示意圖。 ，圖三為本創作具有逃氣孔之影像感測器模組之製造方法示意 -圖。 多數條導線 44 鏡筒 50 下表面 54 感測區 60 逃氣孔 65 内螺紋 69 42 48 52 58 63 67 【主要元件符號說明】 晶片 鏡座 上表面 第二電極 側壁 肩部 基板 40 接著劑 46 密封膠 51 第一電極 56 焊墊 62 外螺紋 66M374588 V. New Description: [New Technology Field] This creation is an image sensor module with escape holes, especially in the process of manufacturing image sensor, which can improve the yield and production of products. Efficiency. [Previous Art] Referring to FIG. 1 , a cross-sectional view of a structure of an image sensor module includes a substrate 10 having an upper surface 12 and a lower surface 14 . The upper surface 12 is formed with a first electrode 16 and a lower surface 14 . The second electrode 18 is formed to connect the corresponding first electrode 16; the wafer 20 is disposed on the upper surface 12 of the substrate 10, and the pad 22 is formed thereon; the plurality of wires 24 are electrically connected to the pad 22 of the wafer 20 to the substrate 10 The first electrode 16; the adhesive 26 is applied to the upper surface 12 of the substrate 10; a lens holder 28 is provided with an internal thread 30, which is adhered to the upper surface 12 of the substrate 10 by an adhesive 26 to bond the wafer 20. Surrounding; and a lens barrel 32 is provided with an external thread 34, which is screwed onto the internal thread 30 of the lens holder 28. However, in the image sensor module described above, the adhesive 26 releases a large amount of volatile gas during the baking process, so that the sealed space in the lens holder 28 generates internal pressure due to heat and expansion effects, resulting in accurate alignment. The temporarily fixed lens holder 28 will deviate from the predetermined position, so that the purpose of accurately aligning the lens 28 and the sensor sensing center cannot be achieved, so that the optical focus is out of alignment and the image quality cannot be up to standard. In view of this, the creator is based on the spirit of excellence, innovation and breakthrough, and strives to develop the image sensor module, which creates a new image sensor module, which can effectively improve the yield and product. For the light and short. M374588 [New Content] The main purpose of this creation is to provide an image sensor module with an escape hole, which has the effect of improving product yield for more practical purposes. Another object of the present invention is to provide an image sensor module with an escape hole, which has the advantages of convenient manufacturing and improved production efficiency for more practical purposes. The present invention comprises a substrate having an upper surface and a lower surface, the upper surface is formed with a first electrode, and the lower surface is formed with a second electrode corresponding to the first electrode; a wafer is disposed on the upper surface of the substrate, and is formed thereon There is a sensing area and a pad; a plurality of wires are electrically connected to the pad of the wafer to the first electrode of the substrate; an adhesive is applied to the upper surface of the substrate; and a mirror holder is provided with an escape hole, a side wall and an internal thread The sidewall of the mirror holder is adhered to the upper surface of the substrate by an adhesive. A lens barrel is provided with an external thread to be screwed onto the internal thread of the lens holder. A sealant is used to plug the escape hole to prevent dust and other sources of pollution from entering the lens holder. The above and other objects, advantages and features of the present invention are apparent from the following detailed description of the preferred embodiment and reference to the drawings. [Embodiment] Please refer to FIG. 2 , which is a schematic diagram of a module for creating an image sensor with an escape hole, which comprises a substrate 40 , a wafer 42 , a plurality of wires 44 , an adhesive 46 , a lens holder 48 , and a lens barrel 50 . And sealant 51. The substrate 40 is provided with an upper surface 52 and a lower surface 54. The upper surface 52 is formed with a first electrode 56, and the lower surface is formed with a second electrode 58 connected to the corresponding first electrode 56. 4 M374588 The wafer 42 is disposed on the upper surface 52 of the substrate 40, and the sensing region 60 and the bonding pads 62 are formed thereon. A plurality of wires 44 electrically connect the pads 62 of the wafer 42 to the first electrode 56 of the substrate 40. The adhesive 46 is an adhesive which is applied to the upper surface 52 of the substrate 40 and is located around the first electrode 56. The lens holder 48 is provided with a side wall 63, an escape hole 65, a sealant 51, a shoulder portion 67 and an internal thread 69. The side wall 63 of the lens holder 48 is adhered to the upper surface 52 of the substrate 40 by an adhesive 46. The escape hole 65 is a small air hole penetrating through the shoulder portion 67 for releasing a large amount of volatile gas generated by the adhesive 46 during the baking process of the lens holder 48, thereby effectively preventing the sensing region 60 in the lens holder 48 from being internal pressure. The optical focus caused by the oversize is inaccurate, which in turn affects the image quality. The sealant 51 in the escape hole 65 is used to plug the escape hole 65 to prevent the dust source such as dust from entering the lens holder 48 after the end of the baking process. The lens barrel 50 is provided with an external thread 66 that is screwed onto the internal thread 69 of the lens holder 48. Please refer to FIG. 3 , which is a schematic diagram of a method for manufacturing an image sensor module with an escape hole, which includes a substrate 40 , a wafer 42 , a plurality of wires 44 , a lubricant 46 , a lens holder 48 , a lens barrel 50 , and a seal . Glue 51. A substrate 40 is provided which is provided with an upper surface 52 and a lower surface 54. The upper surface 52 is formed with a plurality of first electrodes 56, and the lower surface 54 is formed with a plurality of second electrodes 58 connected to the corresponding first electrodes 56. A wafer 42 is provided on the upper surface 52 of the substrate 40, on which the sensing region 60 and the pads 62 are formed. A plurality of wires 44 are provided to electrically connect the pads 62 of the wafer 42 to the first electrode 56 of the substrate M374588 40. An adhesive 46 is provided as an adhesive which is applied to the upper surface 52 of the substrate 40 and is located around the first electrode 56. A lens holder 48 is provided, which is provided with a side wall 63, an escape hole 65, a sealant 51, a shoulder portion 67 and an internal thread 69. The side wall 63 of the lens holder 48 is adhered to the upper surface of the substrate 40 by an adhesive 46. 52. The escape hole 65 is a small air hole penetrating through the shoulder portion 67 for releasing a large amount of volatile gas generated by the adhesive 46 during the baking process of the lens holder 48, thereby effectively preventing the sensing region 60 in the lens holder 48 from being excessively pressed due to internal pressure. The resulting optical focus is out of alignment, which in turn affects image quality. A lens barrel 50 is provided with an external thread 66 that is threaded onto the thread 69 in the lens holder 48. A sealant 51 is provided for plugging the escape hole 65 to prevent dusty sources such as dust from entering the lens holder 48 after the end of the baking process. The side wall 63 of the mirror holder 48 and the substrate 40 adhered to the mirror holder 48 make it a module of a smaller size. Therefore, the embodiment has the following advantages: 1. When the side wall of the lens holder 48 is cut off, the module can be reduced in size and a more uniform product size can be obtained. 2. The escape hole 65 penetrating the shoulder portion 67 can effectively release the volatile gas generated by the adhesive 46 in the baking process, and maintain the pressure balance inside and outside the lens holder 40 to prevent the lens holder 40 from being caused by excessive internal pressure. The tilt effect causes optical focus to be out of alignment, which in turn affects image quality. The specific embodiments set forth in the detailed description of the preferred embodiments are merely illustrative of the technical content of the present invention, and are not intended to limit the scope of the present invention to the embodiments, and the M374588 is based on the spirit of the present invention and the following: The implementation of the changes in the scope of the scope is within the scope of this creation. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a conventional image sensor group. Figure 2 is a schematic diagram of an image sensor module with an escape hole. Figure 3 is a schematic diagram of the manufacturing method of the image sensor module with the escape hole. Most of the wires 44 Lens barrel 50 Lower surface 54 Sensing area 60 Escape hole 65 Internal thread 69 42 48 52 58 63 67 [Main component symbol description] Wafer mirror upper surface Second electrode side wall Shoulder substrate 40 Adhesive 46 Sealant 51 first electrode 56 pad 62 external thread 66