TWM370247U - Electrical connector assembly - Google Patents
Electrical connector assemblyInfo
- Publication number
- TWM370247U TWM370247U TW098208095U TW98208095U TWM370247U TW M370247 U TWM370247 U TW M370247U TW 098208095 U TW098208095 U TW 098208095U TW 98208095 U TW98208095 U TW 98208095U TW M370247 U TWM370247 U TW M370247U
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- lid
- sliding member
- electrical connector
- connector assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098208095U TWM370247U (en) | 2009-05-12 | 2009-05-12 | Electrical connector assembly |
US12/609,020 US20100289513A1 (en) | 2009-05-12 | 2009-10-30 | Test socket assembly having heat dissipation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098208095U TWM370247U (en) | 2009-05-12 | 2009-05-12 | Electrical connector assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM370247U true TWM370247U (en) | 2009-12-01 |
Family
ID=43067992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098208095U TWM370247U (en) | 2009-05-12 | 2009-05-12 | Electrical connector assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100289513A1 (zh) |
TW (1) | TWM370247U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI622135B (zh) * | 2015-05-28 | 2018-04-21 | 台達電子工業股份有限公司 | 封裝型功率電路模組 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM370216U (en) * | 2009-05-12 | 2009-12-01 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly and heatsink module thereof |
KR101549849B1 (ko) * | 2014-02-18 | 2015-09-03 | (주)솔리드메카 | 가혹조건 조성구조가 구비된 메모리 패키지 테스트용 고정지그 |
TWM491975U (zh) * | 2014-05-28 | 2014-12-11 | Hon Hai Prec Ind Co Ltd | 電連接器組合 |
KR101677708B1 (ko) * | 2015-04-06 | 2016-11-21 | (주)마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
JP2017050202A (ja) * | 2015-09-03 | 2017-03-09 | 株式会社エンプラス | 電気部品用ソケット |
KR102352190B1 (ko) * | 2020-07-06 | 2022-01-19 | 부경대학교 산학협력단 | 우수한 방열성 및 내구성을 가지는 반도체 테스트 소켓용 적층재료의 제조방법 및 이에 의해 제조된 반도체 테스트 소켓용 적층재료 |
US11733291B1 (en) * | 2022-06-08 | 2023-08-22 | Nanya Technology Corporation | Chip socket for testing semiconductor chip |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6086387A (en) * | 1998-05-14 | 2000-07-11 | International Business Machines Corporation | Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing |
JP4322635B2 (ja) * | 2003-11-17 | 2009-09-02 | 株式会社エンプラス | 電気部品用ソケット |
JP2007141670A (ja) * | 2005-11-18 | 2007-06-07 | Three M Innovative Properties Co | ソケット、ソケット基台、ソケットの操作方法及びその試験方法 |
JP5383167B2 (ja) * | 2008-12-04 | 2014-01-08 | 株式会社エンプラス | 電気部品用ソケット |
-
2009
- 2009-05-12 TW TW098208095U patent/TWM370247U/zh not_active IP Right Cessation
- 2009-10-30 US US12/609,020 patent/US20100289513A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI622135B (zh) * | 2015-05-28 | 2018-04-21 | 台達電子工業股份有限公司 | 封裝型功率電路模組 |
US10104813B2 (en) | 2015-05-28 | 2018-10-16 | Delta Electronics, Inc. | Power circuit module |
Also Published As
Publication number | Publication date |
---|---|
US20100289513A1 (en) | 2010-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |