TWM370067U - Non-contact type circuit probe - Google Patents
Non-contact type circuit probeInfo
- Publication number
- TWM370067U TWM370067U TW098213290U TW98213290U TWM370067U TW M370067 U TWM370067 U TW M370067U TW 098213290 U TW098213290 U TW 098213290U TW 98213290 U TW98213290 U TW 98213290U TW M370067 U TWM370067 U TW M370067U
- Authority
- TW
- Taiwan
- Prior art keywords
- contact type
- type circuit
- circuit probe
- probe
- contact
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/315—Contactless testing by inductive methods
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202008010533U DE202008010533U1 (de) | 2008-08-07 | 2008-08-07 | Kontaktlose Schleifensonde |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM370067U true TWM370067U (en) | 2009-12-01 |
Family
ID=39917805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098213290U TWM370067U (en) | 2008-08-07 | 2009-07-21 | Non-contact type circuit probe |
Country Status (8)
Country | Link |
---|---|
US (1) | US8963570B2 (zh) |
EP (1) | EP2321655A1 (zh) |
CN (1) | CN102112884B (zh) |
CA (1) | CA2732189C (zh) |
DE (1) | DE202008010533U1 (zh) |
HK (1) | HK1157018A1 (zh) |
TW (1) | TWM370067U (zh) |
WO (1) | WO2010015315A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014117300B4 (de) * | 2014-11-26 | 2019-04-04 | Technische Universität Dresden | Anordnung und Verfahren zur Vermessung einer elektronischen Struktur |
US11047951B2 (en) | 2015-12-17 | 2021-06-29 | Waymo Llc | Surface mount assembled waveguide transition |
US10222207B2 (en) * | 2016-09-09 | 2019-03-05 | Quality Vision International, Inc. | Articulated head with multiple sensors for measuring machine |
US11041880B2 (en) * | 2017-12-01 | 2021-06-22 | Tektronix, Inc. | Contactless coupling between test and measurement system and a device under test |
CN109884561B (zh) * | 2019-03-29 | 2021-04-20 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 磁场检测模块及磁场探头 |
JP7387285B2 (ja) * | 2019-04-26 | 2023-11-28 | 日置電機株式会社 | プローブ装置 |
TWI814176B (zh) * | 2020-12-22 | 2023-09-01 | 財團法人工業技術研究院 | 磁場結構 |
US12044726B2 (en) * | 2021-04-30 | 2024-07-23 | Xcerra Corporation | Calibration system |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894612A (en) * | 1987-08-13 | 1990-01-16 | Hypres, Incorporated | Soft probe for providing high speed on-wafer connections to a circuit |
US4829242A (en) * | 1987-12-07 | 1989-05-09 | Microelectronics And Computer Technology Corporation | Multigigahertz probe |
US4849689A (en) * | 1988-11-04 | 1989-07-18 | Cascade Microtech, Inc. | Microwave wafer probe having replaceable probe tip |
FR2681946A1 (fr) | 1991-09-27 | 1993-04-02 | Thomson Csf | Dispositif pour tests hyperfrequences a large bande realises in situ. |
US5539323A (en) * | 1993-05-07 | 1996-07-23 | Brooks Automation, Inc. | Sensor for articles such as wafers on end effector |
US5867020A (en) | 1996-10-31 | 1999-02-02 | Sematech, Inc. | Capacitively coupled RF voltage probe having optimized flux linkage |
JPH1123615A (ja) * | 1997-05-09 | 1999-01-29 | Hitachi Ltd | 接続装置および検査システム |
DE19945178C2 (de) * | 1999-09-21 | 2003-05-28 | Rosenberger Hochfrequenztech | Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung |
US7091915B1 (en) * | 2001-09-24 | 2006-08-15 | Pctel Antenna Products Group, Inc. | Glass-mounted coupler and passive glass-mounted antenna for satellite radio applications |
EP1316806A1 (en) | 2001-11-28 | 2003-06-04 | SP Sveriges Provnings- & Forskningsinstitut | Non-contact measuring probe device for directional detection of an electromagnetic wave and measuring method |
FR2871951B1 (fr) * | 2004-06-17 | 2006-09-08 | Cnes Epic | Dispositif de transition rntre un guide d'ondes et deux circuits redondants chacun couple a une ligne coplanaire |
US7482814B2 (en) * | 2004-08-27 | 2009-01-27 | The Board of Regents University Community College System of Nevada on Behalf of the University of Nevada-Las Vegas | Electric/magnetic field sensor |
US7501833B2 (en) * | 2004-10-20 | 2009-03-10 | Wright State University | Evanescent microwave microscopy probe and methodology |
GB0505646D0 (en) * | 2005-03-18 | 2005-04-27 | Oxborrow Mark | Solid-state maser oscillator of high frequency stability and low phase noise |
DE202007010784U1 (de) * | 2007-08-03 | 2007-10-04 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Kontaktloses Messsystem |
-
2008
- 2008-08-07 DE DE202008010533U patent/DE202008010533U1/de not_active Expired - Lifetime
-
2009
- 2009-07-15 US US13/057,900 patent/US8963570B2/en active Active
- 2009-07-15 CN CN2009801299287A patent/CN102112884B/zh active Active
- 2009-07-15 CA CA2732189A patent/CA2732189C/en active Active
- 2009-07-15 WO PCT/EP2009/005144 patent/WO2010015315A1/de active Application Filing
- 2009-07-15 EP EP09777210A patent/EP2321655A1/de not_active Ceased
- 2009-07-21 TW TW098213290U patent/TWM370067U/zh not_active IP Right Cessation
-
2011
- 2011-10-20 HK HK11111264.3A patent/HK1157018A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20110267088A1 (en) | 2011-11-03 |
DE202008010533U1 (de) | 2008-10-30 |
CN102112884A (zh) | 2011-06-29 |
US8963570B2 (en) | 2015-02-24 |
HK1157018A1 (en) | 2012-06-22 |
CA2732189A1 (en) | 2010-02-11 |
WO2010015315A1 (de) | 2010-02-11 |
CN102112884B (zh) | 2013-08-14 |
EP2321655A1 (de) | 2011-05-18 |
CA2732189C (en) | 2017-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |