TWM359898U - Coplanar heterogeneous circuit board structure - Google Patents

Description

M359898 VIII. New description: [New technical field] This creation involves the same-plane heterogeneous circuit board structure, which aims to provide a heterogeneous substrate at a specific position of the circuit board, which can reduce the production cost. [Prior Art] In the electronic system products, a printed circuit board (PCB) for carrying an electronic component is generally known, and a planar substrate composed of a glass fiber cloth or a soft substrate is usually used. A conductive layer is printed on the substrate. After forming a circuit on the substrate, a plurality of circuit layers and an insulating layer are laminated by a bonding process, and processed into a multilayer printed circuit board. As electronic products move toward the "light, thin and short" design concept, printed circuit boards are also moving toward small apertures, high density, multiple layers, and thin lines. Among them, multilayer printed circuit boards are a good solution for improving line density. • The = brushed circuit board surface is equipped with a plurality of electronic components, and the signals processed by the negative and negative electrons are not the same, and the speed at which the signal needs to be processed is slightly different. For example, the towel The central processing unit (CPU) usually needs to process signals at a higher speed and operating frequency, so it is necessary to provide a special environment to increase the processing speed, for example, a printed circuit board made of a low dielectric constant. A printed circuit board made of a material that can be processed in a printed circuit board, has a high transmission speed, and is processed at a higher speed, or a material having a higher heat dissipation or a higher thermal conductivity, can effectively dissipate the working heat source of the central processing unit. To maintain their work efficiency. M359898 However, if the working characteristics of some electronic components are changed, the material of the entire printed circuit board is changed, for example, changing to a low dielectric constant material or a heat dissipating or heat conducting material 'not only is the production process complicated, and the material needs to be ^ ^ Higher. [New content] In view of this, the "same-plane heterogeneous circuit board structure" is embedded in a circuit board by a heterogeneous substrate, which can reduce the production cost and meet the needs of users. The circuit board of the present invention is provided with at least one circuit board substrate. The circuit board substrate is provided with at least one embedded space, and the heterogeneous substrate different from the circuit board substrate is disposed in the embedded space. The surface of the heterogeneous substrate is in the same plane as the surface of the first circuit board substrate, and the embedding space can be disposed at a suitable position on the substrate of the circuit board as needed. The heterogeneous substrate 'for example, may be a dielectric material, a metal material, a material such as Teflon, or the internal wiring layer density is different from the circuit board substrate to reduce the cost. [Embodiment] In order to enable the reviewing committee to understand the structure of the creation and the overall operation mode, the following is a description of the following: The creation of the same-plane heterogeneous circuit board structure, the overall circuit board 1 is provided with at least one circuit. a board substrate, as shown in the first embodiment of the first figure, the circuit board 1 is provided with a first circuit board substrate 11, and the first circuit board base M359898 material 11 is provided with at least an inlaid space 12, The depth of the embedded space 12 is slightly equal to the first circuit board substrate η, and the contact space 12 is provided with a heterogeneous substrate 13 different from the first circuit board substrate 11, and (iv) the different f substrate 13 is placed. After the embedding space (4), the surface of the heterogeneous bribe 13 (4) the surface of the first rotating substrate 11 is located in the same plane; of course, the embedded hollow and the lining substrate 13 can be disposed on the first board base according to the requirements. The appropriate position of the material 11 'please refer to the second figure as well. 'The embedded space 12 and the heterogeneous substrate 13 can be located on the first circuit board base close to the towel center position, or at the side; or As shown in the second embodiment of the third®, the first circuit board can be mechanically first The substrate 11 is dug out of the embedded space 12 of a fixed depth, the depth of the embedded space 12 being smaller than that of the first circuit board substrate 11, and the foreign substrate u is buried in the embedded space 12. In the embodiment shown in the figure, the heterogeneous substrate 13 is the same material as the first circuit board substrate 11 (may be 卯4), and the heterogeneous substrate 13 and the first circuit board substrate 11 The density of the circuit layers is different, wherein the first circuit board substrate 11 is provided with a plated through hole 14' and is a double panel (or a multilayer board having an inner circuit layer) without any inner circuit layer. The heterogeneous substrate 13 is provided with a plated through hole 14 and a plurality of inner wiring layers 15 , and a portion of the inner wiring layer 15 is electrically connected by the plated through holes 14 , and the first circuit board substrate and the heterogeneous substrate The surface of the material 13 is provided with a conductive layer 16 (which may be a copper box), so that the heterogeneous substrate 13 can be used to increase the density of the circuit layer at a specific position of the circuit board 1; of course, the first circuit board substrate is heterogeneous and heterogeneous. A conductive material 17 may be disposed between the substrates 13. As shown in the third embodiment of FIG. 4A, the conductive material 17 may be a conductive adhesive. The conductive material 17 may constitute the upper and lower conductive layers 16 M359898. Electrically connected; if the first circuit board substrate 11 and the heterogeneous substrate 13 have an inner circuit layer 15, as described FIG. (B), the circuit board may be on the first base material 11 is formed with a through hole ore § Hai hetero junction 13 of the substrate 14 'can be turned on and each of the wiring layer 15. As shown in the fifth figure, which is a fourth embodiment of the present invention, the circuit board 1 is provided with first and second circuit board substrates 11, 111, and the first circuit board substrate 11 is provided with at least one The embedded space 12 ′ is provided with a heterogeneous substrate 13 that is different from the first circuit board substrate 11 such that the first circuit board substrate 11 and the heterogeneous substrate 13 are in the same plane, and The first circuit board substrate η and the surface of the heterogeneous substrate 13 are provided with a conductive layer 16 ′, wherein the hetero-substrate η is different from the material of the first circuit board substrate 11 , and the first circuit board substrate Η It is FR4, and the heterogeneous substrate 13 can be made of metal material, dielectric material or Teflon, and a heterogeneous substrate of different materials can be selected according to requirements, for example, a heterogeneous substrate 13 by Teflon is embedded in the first circuit. The disadvantage of the bending deformation of the overall circuit board can be improved in the board substrate η. Further, as shown in the fifth embodiment of the sixth figure, the first circuit board substrate 11 and the heterogeneous substrate 13 are press-fitted under the laminated substrate 18 to increase the line density of the integrated circuit board. The present invention has the following advantages over the Xishui system: The present invention can embed the heterogeneous substrate at a suitable position on the circuit board substrate as needed to 'only fit the heterogeneous substrate at the specific position to meet the demand (for example) Special dielectric properties), do not need to completely change the material of the board, can reduce the cost 'and can maintain the characteristics of the board itself. 2. The heterogeneous 8 M359898 substrate different from the substrate material of the circuit board can be selected according to the requirements, especially the circuit board formed by pressing the substrate of different materials after pressing, the circuit board formed is easy to be different due to different materials. Thermal stress causes the disadvantage of bending deformation of the entire circuit board. 3. A heterogeneous substrate having different inner circuit layer densities can be embedded in the circuit board substrate to change the density of the circuit layers in the same plane. As described above, the present invention provides another preferred and feasible planar heterogeneous circuit board structure and a molding method thereof, and an application for a new patent is proposed according to law; however, the above implementation description and the drawings show that the creation is better. The embodiments are not limited to this creation. Therefore, any similarity and similarity to the structure, installation, and features of the creation should be within the creation purpose and patent application scope of the creation. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic structural view of a first embodiment of a circuit board structure in the present invention. The second figure is a schematic diagram of the front structure of the circuit board structure in the creation. The third figure is a schematic structural view of the second embodiment of the circuit board structure in the present creation. The fourth (A) and (B) are schematic views showing the structure of the third embodiment of the circuit board structure in the present invention. The fifth figure is a schematic view of the structure of the fourth embodiment of the circuit board structure in the present creation. The sixth figure is a schematic structural view of the fifth embodiment of the circuit board structure in the present creation. M359898 [Description of Component Symbols] Circuit Board 1 First Circuit Board Substrate 11 Second Circuit Board Substrate 111 Embedded Space 12 Heterogeneous Substrate 13 Mine Through Hole 14 Inner Circuit Layer 15 Conductive Layer 16 Conductive Material 17 Laminated Board 18

Claims (1)

M359898 Nine, the scope of application for patents: said · '1, a homoplanar heterogeneous circuit board structure, the circuit board is provided with at least one nd channel substrate, the first circuit board substrate is provided with at least - embedded space, the embedded resistance The heterogeneous substrate is different from the first substrate of the first circuit board substrate, and the surface of the different light substrate is in the same plane as the surface of the first circuit board substrate. 2 such as Shen π patent (four) first! In the same plane heterogeneous circuit board structure, the first circuit board substrate and the surface of the heterogeneous substrate are provided with a conductive layer. 2. The same plane heterogeneous electric two-reflex structure as described in the second item of the patent range. The conductive layer may be a face foil. ^ Shen (four) 1 rhyme circuit board structure, β Hai" shell substrate can be further set up mine through hole., as claimed in the scope of the i-term flat cup h X ^ t /, shell circuit board structure, 忒 嗓 嗓Conductive between the plate substrate and the heterogeneous substrate, as in the same plane as described in claim 5 of the patent scope. The conductive material may be a conductive paste, a shell circuit board structure, as in the first application of the patent scope The heterogeneous substrate is made of the same material as the material of the first circuit board substrate, and is similar to the same plane as described in claim 7. The heterogeneous substrate may be made of metal or dielectric. Material ^ circuit board structure, 9, the same plane of the same fluorine as described in the first paragraph of the application of the δ blue, the heterogeneous substrate and the material of the first circuit board substrate; circuit board structure, shellfish and The density of the circuit layers in the first circuit board substrate is the same, and the edge 10 is the same plane as described in the patent application scope 1 - wherein the first circuit board substrate and the heterogeneous substrate enter the second The structure of the electricity, 杈. ν枣 has a layer of which one of them M359898 11 If the scope of the hook is in the range of item 1, the depth of the moving space may be slightly equal to the structure of the first side of the board. 12, as described in the second paragraph of the patent application;; the depth of the electrical material. Bean Φ, this mountain into the court to listen to the life of thousands of different shell circuit board structure ' / 't between 4 degrees can be less than the depth of the first ~ board substrate. ^ "The same plane as described in the second paragraph of the same plane", the structure of the first circuit board substrate and the different f substrate have an inner circuit layer, which can be used in the first circuit board substrate A plated through hole is formed at the intersection of the heterogeneous substrate. 14. A homoplanar heterogeneous circuit board structure, the circuit board is provided with at least one cymbal board substrate, and the 3 haiyi-one circuit board substrate is provided with at least one desired space, and the other two are provided with a medium An electrically conductive substrate, the surface of the dielectric substrate being in the same plane as the surface of the first circuit board substrate. 15. The homoplanar heterogeneous circuit board structure according to claim [19], wherein the first circuit board substrate and the dielectric substrate surface are provided with a conductive layer. 16. The homoplanar heterogeneous circuit board structure according to claim 15, wherein the conductive layer may be a copper foil. 17. In the same plane heterogeneous circuit board structure as described in claim 14 of the patent application scope, "the 5 hai dielectric substrate may further be provided with a mine through hole. For example, as described in item 14 of the patent application scope" In the planar heterogeneous circuit board structure, a conductive material is disposed between the first circuit board substrate and the dielectric substrate. I9, in the same plane heterogeneous circuit board structure as described in claim 18, in the conductive The material may be a conductive adhesive. In addition, in the same plane heterogeneous circuit board structure as described in claim 14, in the f, the first circuit board substrate and the dielectric substrate are further pressed under the dielectric substrate to have a layer I, such as In the same plane heterogeneous circuit board structure as described in claim 14, the depth of the embedded space may be slightly equal to the degree of the first circuit board substrate. M359898 22. In the case of the patent application scope l4, the degree of y 肷 肷 空间 空间 以 以 以 以 以 以 以 以 以 以 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 . Wherein, the first circuit board substrate and the heterogeneous homogenous heterogeneous circuit board structure 's first circuit board substrate and the heterogeneous base board have an inner circuit layer, which can be heterogeneous in a plane A plated through hole is formed in the parent of the circuit board. ~ a circuit board substrate, the first circuit board based on the ancient read circuit board is provided with at least one eighth space is provided with a heterogeneous substrate, the display;: less - embedded space 'the same chair, and the heterogeneous base The material is different from the base-board base density, and the surface of the hetero-substrate is in the same plane as the first =. The surface of the circuit board substrate is the same plane heterogeneous circuit board structure as described in 2 V Di; H::24, in which the surface of the circuit board substrate and the heterogeneous substrate are provided with conductive #. 26. The same plane as described in claim 25, wherein the conductive layer may be a copper foil. , σ ΤΙ ΤΙ ΤΙ ΤΙ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ § § § § § § § § § § § 28. In the same plane heterogeneous circuit board structure as described in claim 24 of the patent scope, the first circuit board substrate and the heterogeneous substrate are provided with a conductive material 29, as described in Item 28 of the application. The same plane heterogeneous circuit board structure, 'medium' the conductive material can be a conductive adhesive. 3=, the same plane heterogeneous circuit board structure mentioned in item 24 of the profit range, in the middle, the % road board substrate and the heterogeneous substrate are pressed together with a laminate layer #t 31专韵围/ 2 4 The depth of the flat surface f, , and the middle side of the space can be slightly equal to the depth of the 1st board substrate ^ 13 M359898 e. 2: 2. The same plane heterogeneous circuit board structure as described in claim 24, wherein the depth of the embedded space may be less than the depth of the first circuit board substrate. 33. The homoplanar heterogeneous circuit board structure according to claim 24, wherein the first circuit board substrate and the heterogeneous substrate each have an inner circuit layer, and the first circuit board substrate and the heterogeneity Plated through holes are formed at the intersection of the substrates. 14