M350793 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種連接排線之設計，尤其是適合供 高速訊號傳輸介面使用之連接排線。 【先前技術】 依據ANSI-YUA-EIA-644-I995定義的低電壓差動信號 傳輸介® (LVDS)標準，這種LVDS訊號傳輪系統所使用的 訊號傳輸線，必須使用特性阻抗㈤為！嶋±5%的訊號 傳輸線（排線）’才能與液晶顯示介面和系統主機板介面的 電路阻抗⑺相匹配，同時這種低電壓差動信號傳輸介面 LVDS)之訊㈣輸线必彡頁在滿足這種條件的情形之 下，才能降低電磁干擾⑽）和減少雜訊―）干擾，和 正確地執行液晶顯示器介面（或簡稱為UDs介面）和系统 =介面之間的訊號傳輸，或避免錯誤動作產生;否則， 面和系統主機板介面之間的訊號傳輸，將會 產=敍射和雜訊（nQise)干擾，和造成信號損失 和失真。 音圖SSI及第二圖所示’係為習用之排線立體示 置於該基材 .由於芯線80僅僅口有一# =早一層的金屬線所構成， 背僂徐《卜4 θ金屬層’因此其接觸面積少，故 说傳似率較差，己無法符合現今高訊號傳輸品質的要 5 M350793 求。 【新型内容】 為了使能使本創作之特徵與技術優勢能有更清楚的呈 現，特舉一些較佳實施例來加以詳細說明。 本創作係提供一種連接排線，以解決習知由單層芯線 所構成的排線，其訊號傳輸效率較差的問題。 ' 本創作的一實施例所提供之連接排線，包括有基材以 ·' 及複數條芯線，其中複數條芯線係設置於基材内，用於傳 導電子訊號，且每一條芯線均具有相互層疊之第一金屬線 以及第二金屬線，藉由每一條芯線係以二條或以上的第一 金屬線以及第二金屬線組成的方式，可使接觸面積加大， 並同時降低芯線的内部阻抗，來提高訊號傳輪的穩定性。 【實施方式】 為了能使本創作的特徵更為清楚，以下將揭露本創作 φ 各種實施例，例如各種特徵的實施方式，而所描述的特定 . 元件與安排僅為簡化本案說明，然其並非用以限定本創 作。另外，本案可能會於各種實施例中重複使用參考標號 與文字，重複的目的在於簡化與清楚說明，並非用以指定 各種實施例及/或所述架構之間的關係。 請參照第三圖係繪示依照本創作一較佳實施例的一種 連接排線立體示意圖，如圖所示，本創作連接排線之實施 例包括有一基材10以及複數條芯線20，其中複數條芯線 M350793 20係設置於基材10内，係可由銅、鍍錫、鍍金和鍍金等 其中之一或及其組成所構成，用於傳導電子訊號，另請同 時參閱第四圖，係上述實施例之剖面示意圖，如圖所示， 其中每一條芯線20均具有第一金屬線21以及第二金屬線 22，第一金屬線21與第二金屬線22係相互層疊，在本實 施例中第一金屬線21係完全疊合於第二金屬線22，進一 步說，即第一金屬線21之寬度等於第二金屬線22寬度， ' 且在本實施例中第一金屬線21之厚度亦等於第二金屬線 φ- 22厚度，藉由每一條芯線20由二條或以上（在本實施例中 係以二條為例）的第一金屬線21以及第二金屬線22組成的 方式，可使接觸面積加大，並同時降低芯線20的内部阻 抗，來提高訊號傳輸的穩定性，更可降低電子訊號的抖動 時間，以及降低訊號衰減的影響。 為更清楚說明本創作的其他實施方式，請先參閱第五 圖所示，係本創作連接排線另一實施例之剖面示意圖，在 本實施例中，第一金屬線21與第二金屬線22之配設方式 φ 與前一實施例不同，其中第一金屬線21係疊合於第二金屬 , 線22，但第一金屬線21之寬度小於第二金屬線22寬度， 且在本實施例中第一金屬線21之厚度仍等於第二金屬線 22厚度，當然，熟悉此項技藝者可以易於思及，亦可使第 一金屬線21之寬度大於第二金屬線22寬度，但第一金屬 線21之厚度仍等於第二金屬線22厚度，在此一實施例中， 同樣可以達到使接鱗面積加大，並降低芯線20的内部阻 抗，來提高訊號傳輸的穩定性，更可降低電子訊號的抖動 7 M350793 時間，以及降低訊號衰減的影響。 請參閱第六圖所示，係本創作連接排線又一實施例之 剖面示意圖，在本實施例中，第一金屬線21與第二金屬線 22之配設方式與前二個實施例不同，其中第一金屬線21 仍疊合於第二金屬線22，但第一金屬線21之寬度小於第 一金屬線22見度，且在本實施例中第一金屬線21之厚度 亦小於第二金屬線22厚度，當然，熟悉此項技藝者同樣可 以易於思及，第一金屬線21之寬度係可大於第二金屬線 ·‘ 22寬度，但第一金屬線21之厚度大於第二金屬線22厚 度，在此一實施例中，同樣可以達到使接觸面積加大，並 降低芯線20的内部阻抗，來提高訊號傳輸的穩定性，更可 降低電子訊號的抖動時間，以及降低訊號衰減的影響。 當然’本創作之連接排線特別適合供高速訊號傳輸介 面使用’如 HDMI(High-Definition Multimedia Interface)、SATA(Serial ΑΤΑ)、USB (Universal Serial Bus ) 3.0 、 PCI ( Peripheral Component ❿ Interconnect)、display port 或是 LVDS( Low Voltage * Differential Signaling)等傳輸介面。 是以’本創作所提供之連接排線，最重要的是藉由每 一條芯線20由二條或以上的第一金屬線21以及第二金屬 線22組成的方式’當然也可如第七圖所示，包括二條以上 的金屬線’由第一金屬線21、第二金屬線22以及第三金 屬線23組成的方式’來使接觸面積加大，並同時降低芯線 20的内部阻抗’以提高訊號傳輸的穩定性，除此之外，更 8 M350793 可降低電子訊號的抖動時間，以及降低訊號衰減的影響； 另外，於基材ίο —側（如第八圖所示）或兩側（如第九圖 所示）可設有一金屬夾層30，以達到不同特性阻抗（Z0)之 要求。因此本創作極具新穎性及進步性，並充份符合申請 創作專利之要件，爰依法提出申請，祈鈞局早日賜准專 利，實感德便。 雖然本創作已以實施例揭露如上，然其並非用以限定 ' 本創作，任何具有本創作所屬技術領域之通常知識者，在 不脫離本創作之精神和範圍内，當可作各種更動與潤飾， 並可思揣其他不同的實施例，因此本創作之保護範圍當視 後附申請專利範圍所界定者為準。 【圖式簡單說明】 第一圖，係習用之排線立體示意圖。 第二圖，係習用之排線剖面示意圖。 第三圖，係本創作第一實施例之立體示意圖。 φ 第四圖，係本創作第一實施例之剖面示意圖。 , 第五圖，係本創作第二實施例之剖面示意圖。 第六圖，係本創作第三實施例之剖面示意圖。 第七圖，係本創作第四實施例之剖面示意圖。 第八圖，係本創作第五實施例之剖面示意圖。 第九圖，係本創作第六實施例之剖面示意圖。 【主要元件符號說明】 M350793 基材10 複數條芯線20 第一金屬線21 第二金屬線22 金屬夾層30 基材90 芯線80M350793 VIII. New Description: [New Technology Field] This creation is about a connection cable design, especially for connecting cables for high-speed signal transmission interface. [Prior Art] According to the Low Voltage Differential Signal Transmission (® LVDS) standard defined by ANSI-YUA-EIA-644-I995, the signal transmission line used in this LVDS signal transmission system must use the characteristic impedance (5)!嶋±5% of the signal transmission line (wire) can match the circuit impedance of the LCD interface and the system board interface (7), and the low voltage differential signal transmission interface (LVDS) is transmitted. Under such conditions, electromagnetic interference (10)) and noise-reducing interference can be reduced, and signal transmission between the LCD interface (or UDs interface for short) and system=interface can be performed correctly, or errors can be avoided. The action is generated; otherwise, the signal transmission between the surface and the system board interface will produce interference and noise (nQise) interference, and cause signal loss and distortion. The sound map SSI and the second figure show the stereoscopic arrangement of the cable for the conventional use. Since the core wire 80 is only composed of a metal wire of ##1, the back layer of the metal layer of the 4th θ metal layer Therefore, the contact area is small, so the pass rate is poor, and it is impossible to meet the current high signal transmission quality of 5 M350793. [New Content] In order to make the features and technical advantages of the present invention more clear, some preferred embodiments will be described in detail. This creation provides a connection cable to solve the problem of the conventional transmission of a single-layer core wire, which has poor signal transmission efficiency. An embodiment of the present invention provides a connecting cable comprising a substrate with a plurality of core wires, wherein a plurality of core wires are disposed in the substrate for conducting electronic signals, and each of the core wires has a mutual The first metal wire and the second metal wire are stacked, and each of the core wires is composed of two or more first metal wires and second metal wires to increase the contact area and simultaneously reduce the internal impedance of the core wires. To improve the stability of the signal transmission. [Embodiment] In order to make the features of the present invention more clear, various embodiments of the present invention, such as various features, will be disclosed below, and the specific components and arrangements described are merely simplified to illustrate the description of the present invention. Used to limit this creation. In addition, the reference numerals and characters may be repeatedly used in the various embodiments, and the purpose of the description is to simplify and clearly explain the various embodiments and/or the relationship between the structures. 3 is a perspective view of a connecting cable according to a preferred embodiment of the present invention. As shown in the figure, the embodiment of the present invention includes a substrate 10 and a plurality of core wires 20, wherein the plurality The core wire M350793 20 is disposed in the substrate 10 and may be composed of one or a combination of copper, tin plating, gold plating and gold plating for conducting electronic signals, and also refers to the fourth figure, which is the above implementation. A cross-sectional view of an example, as shown in the figure, wherein each of the core wires 20 has a first metal wire 21 and a second metal wire 22, and the first metal wire 21 and the second metal wire 22 are laminated to each other, in this embodiment A metal wire 21 is completely superposed on the second metal wire 22, and further, that is, the width of the first metal wire 21 is equal to the width of the second metal wire 22, and the thickness of the first metal wire 21 is equal to this in the embodiment. The thickness of the second metal line φ-22 can be made by the manner in which each of the core wires 20 is composed of two or more (in the present embodiment, two of the first metal wires 21 and the second metal wires 22). Increase in area and The core wire 20 to reduce the internal impedance to improve the stability of signal transmission, but also reduce the jitter time of the electronic signals, and reduce the influence of signal attenuation. In order to clarify the other embodiments of the present invention, please refer to the fifth figure, which is a schematic cross-sectional view of another embodiment of the present connection cable. In this embodiment, the first metal wire 21 and the second metal wire are used. 22 is different from the previous embodiment in that the first metal wire 21 is superposed on the second metal and the wire 22, but the width of the first metal wire 21 is smaller than the width of the second metal wire 22, and in the present embodiment In the example, the thickness of the first metal line 21 is still equal to the thickness of the second metal line 22. Of course, those skilled in the art can easily think about it, and the width of the first metal line 21 can be made larger than the width of the second metal line 22, but The thickness of a metal wire 21 is still equal to the thickness of the second metal wire 22. In this embodiment, the scale area can be increased and the internal impedance of the core wire 20 can be reduced to improve the stability of the signal transmission. Reduce the jitter of the electronic signal by 7 M350793 and reduce the effects of signal attenuation. Referring to FIG. 6 , it is a schematic cross-sectional view of another embodiment of the present connection cable. In this embodiment, the first metal wire 21 and the second metal wire 22 are arranged differently from the first two embodiments. The first metal line 21 is still superposed on the second metal line 22, but the width of the first metal line 21 is smaller than the first metal line 22, and in the embodiment, the thickness of the first metal line 21 is also smaller than the first The thickness of the two metal wires 22, of course, can be easily imagined by those skilled in the art, the width of the first metal wire 21 can be greater than the width of the second metal wire · '22, but the thickness of the first metal wire 21 is greater than the second metal The thickness of the line 22, in this embodiment, can also increase the contact area and reduce the internal impedance of the core 20 to improve the stability of the signal transmission, reduce the jitter time of the electronic signal, and reduce the signal attenuation. influences. Of course, the connection cable of this creation is especially suitable for high-speed signal transmission interface such as HDMI (High-Definition Multimedia Interface), SATA (Serial ΑΤΑ), USB (Universal Serial Bus) 3.0, PCI (Peripheral Component ❿ Interconnect), display Port or transmission interface such as LVDS (Low Voltage * Differential Signaling). It is a connection cable provided by the present creation, and most importantly, a method in which each core wire 20 is composed of two or more first metal wires 21 and second metal wires 22, of course, as shown in the seventh figure. The method includes two or more metal wires 'in a manner of a first metal wire 21, a second metal wire 22, and a third metal wire 23 to increase the contact area and simultaneously reduce the internal impedance of the core wire 20 to improve the signal. The stability of the transmission, in addition, the 8 M350793 can reduce the jitter time of the electronic signal, and reduce the impact of signal attenuation; In addition, on the substrate ίο - side (as shown in Figure 8) or both sides (such as A metal interlayer 30 can be provided to achieve different characteristic impedance (Z0) requirements. Therefore, this creation is extremely novel and progressive, and fully meets the requirements for applying for a patent. If you apply in accordance with the law, the Prayer Council will grant the patent as soon as possible. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the technical field of the present invention can make various changes and refinements without departing from the spirit and scope of the present creation. And other different embodiments are contemplated, so the scope of protection of this creation is subject to the definition of the scope of the patent application. [Simple description of the diagram] The first figure is a three-dimensional diagram of the conventional cable. The second figure is a schematic diagram of the conventional cable line. The third figure is a perspective view of the first embodiment of the present creation. φ The fourth figure is a schematic cross-sectional view of the first embodiment of the present creation. The fifth figure is a schematic cross-sectional view of the second embodiment of the present creation. Figure 6 is a schematic cross-sectional view showing a third embodiment of the present creation. The seventh figure is a schematic cross-sectional view of the fourth embodiment of the present creation. The eighth figure is a schematic cross-sectional view of a fifth embodiment of the present creation. The ninth drawing is a schematic cross-sectional view of a sixth embodiment of the present creation. [Main component symbol description] M350793 Substrate 10 Multiple core wires 20 First metal wire 21 Second metal wire 22 Metal interlayer 30 Substrate 90 Core wire 80