TWM350208U - Density conversion mechanism for PCB testing device - Google Patents

Density conversion mechanism for PCB testing device Download PDF

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Publication number
TWM350208U
TWM350208U TW97209203U TW97209203U TWM350208U TW M350208 U TWM350208 U TW M350208U TW 97209203 U TW97209203 U TW 97209203U TW 97209203 U TW97209203 U TW 97209203U TW M350208 U TWM350208 U TW M350208U
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Taiwan
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pcb
test
spring
conversion mechanism
conversion
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TW97209203U
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Chinese (zh)
Inventor
Yong Wu
Hai Pan
Quan-Jin Hu
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Shen Tzuen Masone Electronic Co Ltd
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Priority to TW97209203U priority Critical patent/TWM350208U/en
Publication of TWM350208U publication Critical patent/TWM350208U/en

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M350208 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種PCB測試機用密度轉換機構,特別是指一種印刷電路板 (Printed Circuit Board,PCB)之測試領域,本裝置是一種PCB測試機用之密度 轉換機構。 - 【先前技術】 , 以往PCB測試產業中,有一種標準通用的測試點規範,測試點規範稱之為 φ 四密度(即在1平方英寸均勻地排列400個測試觸點),而每個測試點必須與等 測試電路連接,而現有的PCB板測試機器均是通過連線將測試電路引腳直接焊 接至測試觸點進行測試工作。 然而現今PCB板測試機器,通常會有下列問題產生: 現今電路板的集成度越來越高,焊點越來越小,密度越密,而相比之 下PCB板賴機的技術發展並報速,企#無法雜先機,甚至導致 企業在激烈競爭的市場中落敗。M350208 VIII. New Description: [New Technology Field] This creation is about a density conversion mechanism for PCB testers, especially for a printed circuit board (PCB). This device is a PCB test. Machine density conversion mechanism. - [Prior Art] In the past, the PCB test industry had a standard universal test point specification. The test point specification was called φ four density (that is, 400 test contacts were evenly arranged in 1 square inch), and each test was performed. The point must be connected to the test circuit, and the existing PCB test machine solders the test circuit pins directly to the test contacts for testing. However, today's PCB board testing machines usually have the following problems: Nowadays, the integration of circuit boards is getting higher and higher, the solder joints are getting smaller and smaller, and the density is denser, and the technical development of the PCB board is reported. Speed, Enterprise # can not be mixed, even leading to the failure of enterprises in the fiercely competitive market.

吹動下,使其適應或者部 需求,已經成為業内急需 市場中級;如觸财戦機财限度的改動下,Blowing it to adapt it to the needs of the department has become an urgent need for the market in the industry;

由此可見,上述習用方式仍有諸多缺失, 改良。 ’實非—良善之設計,而亟待加以 本案創作人鑑於上述習 用方式所衍生的各項缺點 ’乃亟思加以改良創新, M350208 經多年苦心孤詣潛心研究後, 構。 終於成功研發完成本件PCB測試機用密度轉換機 【新型内容】 本創作之目的即在於提供—種PCB職_ __構,财裝置能達 成對無需對縣職機本體進行改動,並使其適應或者部分適驗速增長中更 高密度焊點PCB的測試需求。 。/創作之另_目的即在於提供—種p㈤則試機用密度轉換機構,係本裝置 可提供—種可餘應麟縣測試機上的密度轉換機構,通職機構可實現在 原有較低㈣讀的測試機上對較高密度pcB板進行測試的目的。 °達成上述靖目的之PCB測試機用密度轉換機構,係由彈簧連接針般及 轉換電路_« ;賴_她麻_跡⑽,喃輪It can be seen that there are still many shortcomings and improvements in the above-mentioned conventional methods. The reality is not the design of the good, but it is urgent to be made. In view of the shortcomings derived from the above-mentioned methods of use, the creators of the case have improved and innovated, and M350208 has been painstakingly researched for many years. Finally successfully developed and completed this PCB test machine density converter [new content] The purpose of this creation is to provide a kind of PCB job _ __ structure, the financial device can achieve the need to change the county machine body and adapt it to Or some of the test requirements for higher density solder joint PCBs in speedy growth. . / The other purpose of the creation is to provide a kind of p (five) test machine density conversion mechanism, which is a kind of density conversion mechanism that can be provided on the Yinglin County test machine, and the internal organization can realize the lower (4) The purpose of testing the higher density pcB board on the test machine read. °The density conversion mechanism for the PCB test machine that achieves the above-mentioned purpose is a spring-connected pin-like and conversion circuit _« ; Lai _ her hemp _ trace (10), mute

板係設置於該轉換機構之下層,上層通過座腳架設於下層電路 試機針床JL; wIJ 其中該彈f連接針盤上之表面與測試夾具探針對應設有網 通孔内設有崎接賴位機構㈣,另外通細定設置娜復ς 置,而彈簧復位裝置駐體為_個擁有較好導電性能的彈簀, 略 崎㈣咖,麵_崎_物細嫩,、用於了= 礼式夾具_ ’而彈簧下端收縮形成_直徑小於通孔凸台段内徑的縣段,且 w綱触上層的對 轉換電路板為一 PCB轉換板,其中轉換電路板則包括了基層、上層及 日’其上下層的觸點嶽PCB板的表面,而電路板上層對應彈簧連鱗盤 M350208 通孔設有網狀趨 w 下層職有對制賴針床探 ___床探針上電氣相連,_路 · 的觸點對彻目連的麵; L料排布有聽將上下層 針刪細__床表面探 探針相連,測關通過科針财的科復料置與測試爽具 床凸出的探針在ι/Γ針盤中的復位裝置處於一個壓緊狀態,且測試機針 -下㈣的緩衝下成向内縮進的壓緊狀態 :路板觸點及_針床探_直方向相對位置發生二= 大大2魏作㈣'除難生的·,並且錢轉良㈣魏連接的目的’ 3阳了该轉換機構實際應用時的可靠性。 【實施方式】 請參閱圖-,為本創作PCB測試機用密度轉換機構之整體結構示意圖,由 圖中可知,PCB測試機用密度轉換機構其主要元件包括: pCB測試機用 一測試機針床1,該測試機針床1與測試夾具4之間設置. 密度轉換機構; … '電路板2 ’雜換電路板2係設置於轉換機勒,㈣換機構則能 ‘通過轉換電路板2實現了高低密度測試點的轉換目的;由於轉換機構包括上下 兩層上下層相疊並疊置於測試機針床丨之上,而轉換電路板2則包括了基層、 層下層一層心構,其上層對應密度較高的測試夾具探針4〇1設置有網狀觸 點別’而下層的網狀觸點2〇2則是與測試機針床探針ι〇ι對應設置的,其轉換 電路板2上下層觸點加、2〇2 ώ出與電路板表面且通過基層中排布的導線對應 相連;另外該轉換電路板2配置了一個彈菁連接針盤3保證了測試夹具探針= M350208 與轉換電路板2觸點間的良好電氣連接; 弹筲連接針盤3,該彈簧連接針盤3係設置於轉換機構内,由於轉 構υ招上下兩層’上下層並#置於測試機針床}之上,彈簣連接針盤3上、 «TOW401 WL 302 置則’彈簧復位裝置的主體為—個擁有較好導電性能的彈酱$ ,該彈蕃$上户、 略低於針盤3上表ω_咖於湖試細針輪,2 收縮形成一直徑小於通孔搬的凸台舶段内徑的彈簧段,且該小直徑彈菩二 伸出於針盤的下表面之外並了頁置於轉換電路板2上層的觸點加之上;/、又 一測試夾具4,該測試夾具4與測試機針床工之間設置一咖測試機用密 度轉換機構,能將原本探針密度較高的測試夾具4轉換用於原有探針密度較低 的測試機針床1上’從而實現對高密度pcB板職的目的; 該轉換機構通過—塊轉換電路板實現了高低密度測試闕轉換目的,並為 麵電路—㈣細繼㈣峨_+細㈣路板觸點 間的良好電氣連接。 ^ 請參閱圖二’為本創作PCB測試_密度轉換機構之圖—中所示a_a剖視 -圖’由圖中可知,由於轉換電路板2包括基層、上層及下層三層結構,其轉^ •電路板2之下層的網狀觸點观則是與密度較低的測試機針床探針m對應設 置,而轉換電路板2下層賴观凸出與電路板表面且通過基層中排布的S 對應相連。 圖一中所示b-b剖視 請參閱圖三,為本創作PCB測試機用密度轉換機構之圖— 圖,由圖中可知,由於轉換電路板2包括基層、上 增及下層二層結構,其轉換 電路板2之上層的網狀觸點抓則是與密度較高的測試失具探針嶺對應設置, M350208 而轉換電路板2上層觸點201 相連。 凸出與電路板表面且通過基層中排布的導線對應 請參關四,為本創作PCB測試機用密度轉換機構之彈簣連接針盤之内部 結構示意圖,由圖中可知,彈簧連接針盤3上表面對應測試夹具探针撕設有 網狀通孔搬,通孔搬内固定設置有彈簧復位裝請,彈簧復位裝置的主體 為-娜她好導電雜轉簧5,彈簧5上端略低於彈簣連接針盤3上表面且 收縮形成有用於承載測試夾具探針撕的針乾,其下端收縮形成—直徑小於通 之 孔302的凸台3〇3段内徑的彈簣段,且該小直徑彈菁段伸出於針盤的下表面I 外並頂置於轉換電路板2上層的觸點2〇1之上; 該轉換機構在使用的時候’其彈簧連線針盤_彈簧是處於壓縮狀態下 的’由此防止了在個過程中測試夹具探針與轉換電路板對應上端觸點之間可 能會產生的間隙問題,另外在測試機針床探針在轉換電路板的壓力下其内彈筹 錢於-個顏雛態,並縣證了測觸針床與雜電路板兩麟針與觸= 能在垂直方向發生相對位移的情況下依然保證其間良好的電氣連接。 本創作所提供之PCB測試機用密度轉換機構,與其他制技術相互比較 •時’更具備下列優點: 乂 本創作之PCB測試機職賴換機構,_娜機構通過-塊轉換電 路板實現了高低密度測試點的轉換㈣,並為該轉換電路板配置了一個 彈簣連接針娜證了測試夾具探針與轉換電路板觸點間的良好電氣連 接。 構是採用轉換電路板實 除了可以更高密度排列 本創作之PCB測試機用密度轉換機構,係本機 現密度轉換,電路板位於測試失具一側的觸點, 2. M350208 卜遏了不又限於密度-致性的要求,而是根據實際需要在轉換電路板 的上層對應_财具端所佈設多種不同密度__試點,然後由轉 換電路板基層内排線轉換連接至τ層與測試機針床探針對應的密度統 -的觸點上,從而實現多密度共用測試。 3·本創作之PCB麵職轉換機構,倾轉換輪_換電路 板,其上下層端觸點的連接關係是可以由基層内佈線調整決定的,所以 該轉換機構電路板减能實現對_試夾具的錄密度共用,還能通過 觸點複用的方法纽在不降低測試面積的情況下對高密度的測試目標 進行轉換並進行相應測試工作。 用 更 上列詳細·係針對本創作之—可行實施例之具體說明,惟該實施例並非 以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變 ,均應包含於本案之專利範圍中 综上所述,本案不但在技術思想上確屬創新,並能較習用物品增進上述多 項功效’應以充分符合新穎性及進步性 銀社主 之法疋創作專利要件,爰依法提出申請, …月貝局核准本件創作專利中請案,以勵創作,至感德便。 【圖式簡單說明】 圖。 圖一為本創作PCB測試_密度轉換機構之整體結構示意圖; 圖二為本創作PCB測賴職度轉換機構之圖—中所示Μ剖視丨 圖三為本創作PCB測試機用密度轉換機構之圖一中所示w剖視圖;以及 ‘圖 圖四為本創作PCB測試機用密度轉換機 構之彈簧連接針盤之内部結構示意 【主要元件符號說明】 M350208 1 測試機針床 101 測試機針床探針 102 彈簧 2 轉換電路板 201 網狀觸點 202 網狀觸點 3 彈簧連接針盤 301 彈簧複位裝置 302 網狀通孔 303 凸台 4 測試夾具 401 測試夾具探針The plate system is disposed on the lower layer of the conversion mechanism, and the upper layer is disposed on the lower layer test machine needle bed JL through the foot; wIJ, wherein the surface of the elastic f connection dial is corresponding to the test fixture probe, and the mesh through hole is provided with the same Lai position mechanism (4), in addition to the fine setting of the set of complex, and the spring reset device is a _ a good conductive performance of the magazine, Lusaki (four) coffee, surface _ _ _ fine, used for = The ceremony fixture _ 'and the lower end of the spring is contracted to form a county section having a diameter smaller than the inner diameter of the through-hole boss section, and the pair of switching layers of the upper-layer touch-up layer is a PCB conversion board, wherein the conversion circuit board includes the base layer, the upper layer, and On the surface of the upper and lower layers of the contact Yue PCB board, and the upper layer of the circuit board corresponding to the spring with the scale plate M350208 through hole is provided with a mesh trend w lower layer job has a pair of needle bed probe ___ bed probe electrical connection , _ road · the contact of the face to the eye; the L material is arranged to listen to the upper and lower layers of the needle _ _ bed surface probe probe connected, the measurement through the science and technology of the science and materials set and test The probe protruding from the bed is in a pressing state in the resetting device in the ι/Γ dial, and the test is performed. The needle-down (four) under the buffer into the inward retraction of the compression state: the road plate contact and _ needle bed _ _ straight direction relative position occurs two = greatly 2 Wei Zuo (four) 'except difficult to live ·, and money turn The purpose of Liang (four) Wei connection '3 Yang' is the reliability of the conversion mechanism when it is actually applied. [Embodiment] Please refer to Figure-- for the overall structure diagram of the density conversion mechanism for PCB test machine. As shown in the figure, the main components of the PCB conversion machine density conversion mechanism include: pCB test machine with a test machine needle bed 1. The test machine is provided between the needle bed 1 and the test fixture 4. The density conversion mechanism; ... 'circuit board 2' is replaced by a converter, and the (four) changing mechanism can be realized by the conversion board 2 The conversion purpose of the high and low density test points; since the conversion mechanism comprises two layers of upper and lower layers stacked on top of each other and stacked on the test machine needle bed, the conversion circuit board 2 includes a base layer and a layer of lower layer core structure, The upper layer corresponds to a higher density test fixture probe 4〇1 is provided with a mesh contact pair' and the lower layer mesh contact 2〇2 is set corresponding to the test machine needle bed probe ι〇ι, and its conversion circuit The upper and lower contacts of the board 2 are added, and the 2〇2 is outputted to the surface of the circuit board and connected through the wires arranged in the base layer; in addition, the conversion circuit board 2 is provided with an elastic crystal connecting dial 3 to ensure the test fixture probe = M350208 and conversion board 2 Good electrical connection between the contacts; the magazine is connected to the dial 3, and the spring connecting dial 3 is arranged in the conversion mechanism, because the upper and lower layers of the upper and lower layers are placed on the test machine needle bed , the magazine is connected to the dial 3, the main body of the «TOW401 WL 302 setting' spring reset device is a bomb with a better conductivity. The magazine is slightly lower than the table on the dial 3 _ coffee in the lake test fine needle wheel, 2 shrink to form a spring section with a diameter smaller than the inner diameter of the boss section of the through hole, and the small diameter projectile 2 protrudes beyond the lower surface of the dial and is placed Adding a contact on the upper layer of the conversion circuit board 2; /, another test fixture 4, the test fixture 4 and the test machine needle machine are provided with a density conversion mechanism for the coffee test machine, which can lower the density of the original probe The test fixture 4 is used for the test needle bed 1 of the original probe density lower to achieve the purpose of high-density pcB board; the conversion mechanism realizes high-low density test 阙 conversion through the block conversion circuit board Purpose, and for the surface circuit - (four) fine succession (four) 峨 _ + fine (four) road board contact between the good electrical connection . ^ Please refer to Figure 2 'Fig. 2' for the creation of PCB test _ density conversion mechanism - a 'a cross-sectional view' shows that since the conversion circuit board 2 includes the base layer, the upper layer and the lower layer three-layer structure, it turns ^ • The mesh contact view on the lower layer of the circuit board 2 is arranged corresponding to the lower density tester needle probe m, and the lower layer of the conversion circuit board 2 is projected to protrude from the surface of the circuit board and is arranged through the base layer. S corresponds to the connection. Referring to FIG. 3, the bb cross-section shown in FIG. 1 is a diagram of a density conversion mechanism for the PCB testing machine of the present invention. As can be seen from the figure, since the conversion circuit board 2 includes a base layer, an upper layer and a lower layer two-layer structure, The mesh contact of the upper layer of the conversion circuit board 2 is arranged corresponding to the higher density test loss probe ridge, and the M350208 is connected to the upper layer 201 of the conversion circuit board 2. Prominently corresponding to the surface of the circuit board and through the wires arranged in the base layer, please refer to the fourth. This is a schematic diagram of the internal structure of the magazine connection dial of the density conversion mechanism for the PCB test machine. As shown in the figure, the spring connection dial 3 The upper surface corresponds to the test fixture. The probe is torn with a mesh-shaped through-hole. The through-hole is fixed and spring-loaded. The main body of the spring-return device is -Na She is a conductive miscellaneous spring 5, and the upper end of the spring 5 is slightly lower. The magazine is connected to the upper surface of the dial 3 and is contracted to form a needle dry for carrying the test fixture probe tear, and the lower end thereof is contracted to form a magazine segment having a diameter smaller than the inner diameter of the 3 3 hole of the boss 302 of the through hole 302, and The small-diameter elastic segment extends beyond the lower surface I of the dial and is placed over the contact 2〇1 of the upper layer of the conversion circuit board 2; the conversion mechanism is in use when its spring-connected dial_spring It is in a compressed state' thus preventing the gap problem between the test fixture probe and the upper end of the conversion board in the process, and the pressure of the needle bed probe on the conversion board in the test machine Raise money in the inner bomb In the original state, and the county has proved that the contact needle bed and the miscellaneous circuit board are both needles and touches, the relative electrical displacement can be ensured in the vertical direction. The density conversion mechanism of the PCB tester provided by this creation is compared with other technologies. The 'there are the following advantages: 乂The PCB test machine of the original creation is replaced by a mechanism, and the _na mechanism realizes through the block conversion circuit board. Conversion of the high and low density test points (4), and a configuration of the magazine connection pin for the conversion board, the good electrical connection between the test fixture probe and the conversion board contacts. The structure is a conversion board, in addition to the density conversion mechanism of the PCB test machine which can be arranged at a higher density, the density conversion of the machine is now, the circuit board is located on the side of the test missing side, 2. M350208 It is also limited to the requirement of density-inducedness, but according to the actual needs, a plurality of different densities __ pilots are arranged on the upper layer corresponding to the _ 财 端 end of the conversion circuit board, and then connected to the τ layer and tested by the conversion line in the base layer of the conversion circuit board. The needle bed probe corresponds to the density-to-contact, thereby achieving a multi-density sharing test. 3. The PCB face-to-face conversion mechanism of this creation, the tilting conversion wheel _ change the circuit board, the connection relationship of the upper and lower end contacts can be determined by the wiring adjustment in the base layer, so the conversion mechanism circuit board is reduced to achieve the test The recording density of the fixture is shared, and the high-density test target can be converted and tested by the contact multiplexing method without reducing the test area. DETAILED DESCRIPTION OF THE INVENTION The detailed description of the present invention is intended to be illustrative of the present invention, and is not intended to limit the scope of the invention. In summary of the scope of patents in this case, this case is not only innovative in terms of technical thinking, but also can enhance the above-mentioned multiple functions compared with the use of customary articles. 'The patent requirements should be created in accordance with the law of the silver and the main body of the silver society.提出Apply in accordance with the law, ... the monthly shell office approved the application for the creation of the patent, in order to encourage creation, to the sense of virtue. [Simple diagram of the diagram] Figure. Figure 1 is a schematic diagram of the overall structure of the PCB test _ density conversion mechanism; Figure 2 is a diagram of the PCB conversion metrics conversion mechanism - the Μ 丨 丨 三 三 三 三 为本 为本 为本 为本 创作 创作 创作 PCB Figure 1 is a cross-sectional view of the w; and Figure 4 shows the internal structure of the spring-connected dial of the density conversion mechanism for the PCB tester. [Main component symbol description] M350208 1 Test machine needle bed 101 Test machine needle bed Probe 102 Spring 2 Conversion Board 201 Mesh Contact 202 Mesh Contact 3 Spring Connection Dial 301 Spring Reset Device 302 Mesh Through Hole 303 Boss 4 Test Fixture 401 Test Fixture Probe

Claims (1)

M350208 九、申請專利範圍: 1. -種PCB測試機職度轉換機構,係包括: 一㈣連接針盤,該彈簧連接針盤係設置於轉換機構内,由於轉換機構包 括f下兩層,上層通過座腳架設於下層電路板上並疊置於測試機針床上, :物簧連接針盤則設置於轉換機構内之上層,該彈簀連接針盤上表面與測 4夾具探針對應設有峨通孔,通孔置有彈簧復錄置,彈菩復 位裝置的主體為-個擁有較好導電性能的彈簧,彈簧上端用於頂觸測試爽 」未針下jr而頂置於轉換電路板上層的對應觸點上; —轉編㈣綱嶋繼細編,㈣麵構包括上 下兩層,上層通過座腳架設於下層電路板上並疊置於測試機針床上,而轉 換電路板顺編、取Μ,嫩地爾細_通孔設 有網狀繼,下層則設有對應測試機針床探針的網狀觸點 厂_於測試機針床探針上電氣相連,轉一 層的觸點對應相連的導線。 2. 如申請專利範圍第i項所述之PCB測試機用密度轉換機構,其中該轉換電 路板為-PCB轉換板,其上下層的觸點凸出於pcB板的表面。 =申請專_第1斯叙PCB _ _轉_,其中該彈菩連 接針盤網狀通孔内設有用於卡接彈簣復位裝置的凸台。 如申請專利卿3項所述之PCB峨_密度轉換機構,其 位裝置爾,其上端略低於轉輸上表面,彈f下端收縮形成一餘 ==孔凸台段内徑的彈簧段,且該小直徑彈簧段伸出於轉換針盤的下二 12 4. M350208 5.如申請專利範圍第4項所述之PCB測試機用密度轉換機構,其中該彈簧上 端收縮會形成有用於承載測試夾具探針的針托。 13M350208 Nine, the scope of application for patents: 1. A type of PCB test machine turnover conversion mechanism, including: one (four) connection dial, the spring connection dial is set in the conversion mechanism, because the conversion mechanism includes two layers under the f, the upper layer The base is mounted on the lower circuit board and stacked on the test machine needle bed. The object spring connection dial is disposed on the upper layer of the conversion mechanism. The upper surface of the magazine connection dial is corresponding to the test fixture.峨 through hole, through hole is placed with spring re-recording, the main body of the reptile reset device is a spring with good electrical conductivity, the upper end of the spring is used for the top touch test, and the top is placed on the conversion circuit board without the needle jr The corresponding contact on the upper layer; - the transfer (4) outline and subsequent fine-grained, (4) the surface structure includes two layers, the upper layer is placed on the lower circuit board by the footrest and stacked on the test machine needle bed, and the conversion circuit board is spliced, Take the Μ, Nendil fine _ through hole with a mesh shape, the lower layer is equipped with a mesh contact factory corresponding to the test machine needle bed probe _ on the test machine needle bed probe electrically connected, turn one layer of contact Corresponding to the connected wires. 2. The density conversion mechanism for a PCB tester according to claim i, wherein the conversion circuit board is a -PCB conversion board, and the contacts of the upper and lower layers protrude from the surface of the pcB board. = Application Special _ 1st Sydney PCB _ _ _ _, wherein the embossed pin plate mesh through hole is provided with a boss for snapping the magazine reset device. For example, the PCB峨_density conversion mechanism described in Patent Application No. 3, the position of the device is slightly lower than the upper surface of the transfer, and the lower end of the elastic f is contracted to form a spring segment of the inner diameter of the hole boss. And the small-diameter spring segment protrudes from the lower two of the conversion dial. 4. M350208. The density conversion mechanism for a PCB tester according to claim 4, wherein the upper end of the spring is contracted to form a test for carrying. Needle holder for the clamp probe. 13
TW97209203U 2008-05-27 2008-05-27 Density conversion mechanism for PCB testing device TWM350208U (en)

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