M344506 八、新型說明： 【新型所屬之技術領域】 一種用以保護記憶體晶片的記憶體護月，其記 憶體護片係成型有一擴充槽’以便與各種散埶模:且 作結合。 、、 【先前技術】M344506 VIII. New Description: [New Technical Field] A memory protector for protecting a memory chip, the memory protector is formed with an expansion slot ′ to be combined with various dies. , [Prior Art]
隨著電腦運作時脈越來越快，除了中央處理器 之外，連帶使内部其他零組件，如：記憶體、顯^ 卡及硬碟的速度都相對增快，其所產生的熱量也越 來越咼，就記憶體而言，由於插置記憶體的空間比 -般零組件來的狹窄，且記憶體晶片通常呈現裸露 的狀態，容易在拆裝時造成損壞’且散熱效果也不 佳，因而在市面上出現了利用導熱效果佳的金屬材 貝，製作成記憶體護片’其貼附於記憶體晶片表面， 可增加保護性及散熱效果。 凊參閱「第1圖」，為習知散熱護片的構造示意 圖’如圖中所示，其散熱護片係藉由複數夾具1〇， 將兩政熱護片2 0夾設於一記憶體3 〇的兩面，以包 覆圮憶體3 0主要的發熱源—晶片3 〇丨，由於散熱護 片20係以易導熱的金屬材質製成，而利用傳熱導方 式將記憶體30晶片301所產生的熱量，傳導至面積 較大的散熱護片20，並藉由散熱面積加大的優勢， 快速驅散晶片3 0 1的熱量；但這種散熱方式會受限 5 M344506 於相姊一圯憶體3 〇間的允 θ 1的二間 备熱ϊ被均勻傳導到 散熱護片20表，ΒΓ & 有可此因為散熱氣流未流經而 形成熱點，故無法順利將熱量驅散。 【新型内容】 严鑑於習知散熱護片的散熱效率不佳，本創作 一爰精研九，並積個人從事散熱器設計多年的經 驗’而叹计出-種嶄新的擴充式記憶體護片。 ，創作之主要目的，旨在提供一種擴充式記憶 體焱片可陕速與各種散熱模組結合，而兼顧到保 護性及散熱性。 為達上述目的，本創作之擴充式記憶體護片， 主要係由第一護片、一第二護片及一散熱模組所 組成’其第一護片—端緣係成型有一擴充槽，而散 熱模組成型有一凸塊，可將凸塊插置於擴充槽内並 加以鎖固’使散熱模組與第一護片快速結合成一 體’其擴充式記憶體護片使用時，係將第一護片與 第一濩片分別夾設於一記憶體兩面，再利用螺固的 方式，將第一護片及第二護片穩固地夾設於一記憶 體上’藉由本創作特別設計的結合結構，得與如： 水冷式、空冷式或是散熱管式等散熱模組進行結合 擴充’進而利用散熱模組的高效能散熱效果，迅速 驅散記憶體晶片所產生的熱量，其護片進行拆卸安 裝時相當方便，並可有效提昇其保護性，並可藉由 M344506 遵片與散熱模組間相互的結合結構，而由使用者擴 充各種不同功能模組，尤以水冷式或熱導管式散熱 模組為例，則可大幅提昇本創作的散熱效果。 為使貴審查委員能清楚了解本創作之内容，僅 以下列說明搭配圖示，敬請參閱。 【實施方式】 請參閱「第2圖」，為本創作較佳實施例之立體 外觀圖，如圖中所示，通常記憶體4〇使用時，係以 插置方式固定於一主機板50 Uainboard)的記憶 體插槽501 ( Socket)内，而記憶體插槽5〇1大多 為並排設計’且記憶體插槽5 〇 1兩端分別設有一扣 具502，用來扣設記憶體40上的扣孔4〇1，以固定 記憶體40在記憶體插槽501内的位置，而本創作之 擴充式記憶體護片6 0，其主要係由一第一護片 6 0 1、一第二護片6 0 2以及及一散熱模組6 〇 3所組 成’其使用日π ’首先’弟一護片6 01與散熱模組6〇3 相互組設成一體，接著，再將第二護片6 〇 2以夾設 的方式’分設於記憶體4 0的兩面，在利用固定螺絲 將苐一護片6 01與弟一護片6 0 2結合於記憶體4 0 上，其記憶體4 0插置於記憶體插槽5 〇丨後，其利用 位於第一護片6 01上方的散熱模組6 〇 3加速散熱， 且其散熱模組6〇3可為一般常見的水冷式、空冷式 以及熱導管式’本實施例係以水冷式散熱模組為 7 M344506 例，又，第一護片601與第二護片602,係以導熱 -係數良好的金屬材質製成，因此，其記憶體4 0所產 _ 生的熱3： ’可透過第一護片601及第二護片6〇2， 傳導至散熱模組603上，由於水冷式散熱模組6〇3 〜 具有良好的散熱特性，可迅速將記憶體40所產生的 ， 熱1驅散；且’由於本創作擴充式記憶體護片6 0之 插置固定設計，可簡化散熱模組603與第一護片6〇1 馨間的組裝工作’對於使用者而言，其可隨個人需要 快速換裝不同類型的散熱模組603，更具有功能性 及經濟性。 δ月參閱「弟3圖」，為本創作較佳實施例之立體 分解圖’如圖中所示，前述擴充式記憶體護片6 〇主 要係包括：一第一護片601，其係在第一護片601 的上緣成型有一擴充槽6011，而第一護片601的侧 面係成型有複數個固定部6 〇 1 2，又，在第一護片相 _ 對於擴充槽6011的外部，係成型有複數個固定孔 6 0 1 3，一第二護片β 〇 2，其係用來組設於第一護片 601 一側’而第二護片602係對應成型有複數個相 對固定部6 0 2 1，藉複數個固定螺絲6 0 2 2，可將固定 部6012與相對固定部6〇21相互組設，以使第一護 片601及第二護片6〇2，形成夾設於前述記憶體4〇 兩面的狀態；以及一水冷式的散熱模組603，其科 用底面所成型的一凸塊6031組設於第一護片6〇1 上’而水冷式散熱模組603上係成型有一水道 8 M344506 6032，而水道6032兩端分別形成一入水端6〇32;[及 出水端60322，並將水道6032的入水端β〇321及 出水、6 0 3 2 2，分別連接至一泵浦6 0 3 3及一水槽 6034，當熱量由第一護片601及第二護片6〇2傳導 至水冷式散熱模組603後，可利用泵浦6〇33將比熱 尚的水，由入水端β 〇 3 21強制充入水道6 〇 3 2内，因 此’其熱量可被比熱較高的水吸收，再由出水端 60322送回水槽6034内作散熱，以達到增加散熱效 率的目的，藉由其凸塊6031可與第一護片6〇1的擴 充槽60 11快速結合成一體，其拆裝都相當方便， 又’其凸塊6 0 3 1相對於擴充槽6 0 11的固定孔6 0 1 3 上’係成型有複數個相對固定孔6 〇 311，而可利用 數個固定螺絲6 〇 3 5固定散熱模組6 〇 3於第一護片 601 上。 請再參閱「第4圖」，為本創作較佳實施例之組 。4視圖，如圖中所示，其散熱模組6 〇 3組設於第 遵片601時’係藉由散熱模組Mg的凸塊6〇31， 插置於第一護片601的擴充槽6〇11内，以使第一護 片601的固疋孔6013，與凸塊6〇31上的相對固定 孔6031 1對齊，再藉由固定螺絲6〇35加以鎖固，以 將散熱模組603緊密地固定在第一護片6〇1上，而 第遵片601與第二護片602，則利用固定螺絲 6022，穿設固定於第一護片6〇1的固定部6〇12，與 第二護片602的相對固定部6(m，而夹設於記憶體 9 M344506 4 0的二面。 請參閱「第5圖」，為太奋丨备〇 為本幻作另一較佳實施例之 立體外觀圖，如圖中所示，為 、 為有效增加其散熱效果， 並卩中低I作成本，前诚莖 月j述弟一濩片601上緣所成型的 擴充槽6 011，可用爽έ 用石1且设一空冷式散熱模組603, 其散熱模組6 0 3底面你士、开厂士 囬係成型有一凸塊6031，而散埶 模組603頂面係成型有一埤 * I百一散熱鰭片6036，以將前述As the computer operates faster and faster, in addition to the central processing unit, the speed of other internal components, such as memory, video card and hard disk, is relatively increased, and the heat generated by the computer is increased. In the case of memory, since the space for inserting memory is narrower than that of the general components, and the memory chip is usually in a bare state, it is easy to cause damage during disassembly and assembly, and the heat dissipation effect is not good. Therefore, in the market, a metal material shell having a good heat conduction effect is produced, and the memory sheet is attached to the surface of the memory wafer to increase the protection and heat dissipation effect.凊 Refer to “Fig. 1”, which is a schematic diagram of the structure of a conventional heat-dissipating protective sheet. As shown in the figure, the heat-dissipating protective sheet is sandwiched between a plurality of heat-protecting sheets 20 by a plurality of clamps. The two sides of the 〇 以 以 以 圮 3 3 3 3 3 3 3 3 3 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于The generated heat is transmitted to the heat-dissipating protection sheet 20 having a larger area, and the heat of the wafer 310 is quickly dissipated by the advantage of the increased heat dissipation area; however, the heat dissipation method is limited to 5 M344506. The two heat-receiving enthalpy of the θ1 between the 体3 and the θ1 are uniformly conducted to the heat-dissipating protection sheet 20, and there is a possibility that the heat-dissipating airflow does not flow through to form a hot spot, so that the heat cannot be smoothly dissipated. [New content] Strictly speaking, due to the poor heat dissipation efficiency of the conventional heat-dissipating protective sheet, this creation has a glimpse of the experience of nine years, and has accumulated experience in the design of radiators for many years' and sighs out - a new type of expanded memory protection sheet . The main purpose of the creation is to provide an extended memory chip that can be combined with various heat dissipation modules to achieve both protection and heat dissipation. In order to achieve the above objective, the expanded memory protector of the present invention is mainly composed of a first protective sheet, a second protective sheet and a heat dissipating module. The first protective sheet has an expansion slot formed at the end edge. The heat dissipation module is formed with a bump, which can be inserted into the expansion slot and locked, so that the heat dissipation module and the first protection piece are quickly integrated into one body. When the extended memory protection piece is used, The first protection piece and the first cymbal piece are respectively disposed on both sides of a memory body, and then the first protection piece and the second protection piece are firmly clamped on a memory by means of screwing. The combined structure can be combined with the cooling module such as water-cooled, air-cooled or heat-dissipating tube type to further utilize the high-efficiency heat-dissipating effect of the heat-dissipating module to quickly dissipate the heat generated by the memory chip. It is quite convenient to disassemble and install, and can effectively improve its protection. The M344506 can be used to expand various functional modules, especially water-cooled or heat-conducting, by the combination of the M344506 and the heat-dissipating module. Heat dissipation For example, the module can greatly improve the heat dissipation effect of this creation. In order for your review board to have a clear understanding of the content of this creation, please refer to the following instructions only. [Embodiment] Please refer to "Fig. 2", which is a perspective view of a preferred embodiment of the present invention. As shown in the figure, when the memory 4 is used, it is fixed to a motherboard 50 Uainboard by interpolation. The memory slot 501 (Socket), and the memory slot 5〇1 are mostly side by side design 'and a clip 502 is respectively provided at both ends of the memory slot 5 〇1 for fastening the memory 40 The buttonhole 4〇1 is used to fix the position of the memory 40 in the memory slot 501, and the extended memory protector 60 of the present invention is mainly composed of a first guard piece 6 0 1 , a first The second protective piece 6 0 2 and a heat dissipation module 6 〇3 are composed of 'the use day π ' firstly, the first one of the protective piece 6 01 and the heat dissipation module 6 〇 3 are integrated with each other, and then the second The protective sheet 6 〇 2 is disposed on the two sides of the memory 40 in a manner of being interposed, and the memory is bonded to the memory 40 by using a fixing screw 6 01 and a protective sheet 6 0 2 . After the body 40 is inserted into the memory slot 5, it is accelerated by the heat dissipation module 6 〇3 located above the first protection piece 61, and the heat dissipation mode thereof 6〇3 can be a common water-cooled, air-cooled, and heat-conducting type. In this embodiment, the water-cooled heat-dissipating module is 7 M344506. In addition, the first guard 601 and the second guard 602 are thermally conductive. - a metal material with a good coefficient, so that the heat 3: 'produced by the memory 40 can be transmitted to the heat dissipation module 603 through the first protection piece 601 and the second protection piece 6〇2, due to Water-cooled heat-dissipating module 6〇3~ has good heat-dissipation characteristics, which can quickly dissipate the heat generated by the memory 40; and 'simplified by the built-in fixed memory of the created memory memory sheet 60 The assembly work between the heat dissipation module 603 and the first protection piece 6〇1 is convenient for the user to quickly change the different types of heat dissipation modules 603 according to individual needs, and is more functional and economical. </ br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> The upper edge of the first protective sheet 601 is formed with an expansion groove 6011, and the side surface of the first protective sheet 601 is formed with a plurality of fixing portions 6 〇 1 2, and further, outside the first protective sheet phase _ for the expansion groove 6011, Forming a plurality of fixing holes 6 0 1 3, a second protecting piece β 〇 2, which is used to be assembled on the side of the first protective piece 601 ′, and the second protective piece 602 is correspondingly formed with a plurality of relatively fixed The part 6 0 2 1, by a plurality of fixing screws 6 0 2 2, the fixing part 6012 and the opposite fixing part 6〇21 can be assembled with each other, so that the first guard piece 601 and the second guard piece 6〇2 form a clip. a state in which the two sides of the memory 4 are disposed; and a water-cooled heat dissipation module 603, wherein a bump 6031 formed by the bottom surface of the foundation is assembled on the first protection piece 6〇1 and the water-cooled heat dissipation module 603 is formed with a water channel 8 M344506 6032, and a water inlet end 6 〇 32 is formed at both ends of the water channel 6032; [and the water outlet end 60322, and the water The inlet end β〇321 of the 6032 and the effluent, 6 0 3 2 2 are respectively connected to a pump 6 0 3 3 and a water tank 6034, and the heat is transferred from the first guard piece 601 and the second guard piece 6〇2 to the water cooling. After the heat dissipation module 603, the pump 6〇33 can be used to forcibly charge the hot water into the water channel 6 〇3 2 from the water inlet end β 〇 3 21 , so that the heat can be absorbed by the water with higher heat. Then, the water outlet 60322 is sent back to the water tank 6034 for heat dissipation, so as to achieve the purpose of increasing heat dissipation efficiency, the bump 6031 can be quickly integrated with the expansion slot 60 11 of the first protection piece 6〇1, and the assembly and assembly are disassembled. It is quite convenient, and 'the bump 6 0 3 1 is formed with a plurality of fixed fixing holes 6 〇 311 on the fixing hole 6 0 1 3 of the expansion slot 6 0 11 , and a plurality of fixing screws 6 〇 3 can be used. 5 Fix the heat dissipation module 6 〇3 on the first protection piece 601. Please refer to "Figure 4" again for the group of the preferred embodiment of the present invention. 4 views, as shown in the figure, when the heat dissipation module 6 〇 3 is set in the compliant piece 601 ' is inserted into the expansion slot of the first protection piece 601 by the protrusion 6 〇 31 of the heat dissipation module Mg 6〇11, so that the fixing hole 6013 of the first protection piece 601 is aligned with the opposite fixing hole 6031 1 of the protrusion 6〇31, and then locked by the fixing screw 6〇35 to fix the heat dissipation module. 603 is tightly fixed on the first protection piece 6〇1, and the second compliant piece 601 and the second protection piece 602 are fastened to the fixing portion 6〇12 fixed to the first protection piece 6〇1 by using the fixing screw 6022. The opposite fixing portion 6 (m of the second guard piece 602 is sandwiched between the two sides of the memory 9 M344506 40. Please refer to "figure 5", which is another best for the illusion. The three-dimensional appearance of the embodiment, as shown in the figure, is to effectively increase the heat dissipation effect, and the cost is low and medium I, and the expansion slot 6 011 formed by the upper edge of the 601 piece of the front stalk. It can be used to cool the stone 1 and set up an air-cooled heat-dissipating module 603. The heat-dissipating module of the heat-dissipating module is grounded with a bump 6031, and the top surface of the heat-dissipating module 603 is formed. * I hundred heat-dissipating fins 6036 to the
石己十思體4 0傳導至散妖缺y β ^ QShiji Shisi body 4 0 conduction to the demon deficiency y β ^ Q
……、9片6036，猎由散熱鰭片603 6..., 9 pieces 6036, hunting by cooling fins 603 6
的散熱面積加大’而增加散熱的效率；請再參閱「第 6圖」’為本創作再-較佳實施例之立體外觀圖，如 圖中所示，為增加前述擴充式記憶體護片6〇的散熱 效可用來組設一熱導管式的散熱模組603,其係組 叹於第一遵片6 0 1上，在散熱模組6 〇 3底面係成型 有一凸塊，而散熱模組6〇3頂面則組設有複數個散 熱葉片6037及一熱導管6〇38,其散熱葉片6〇37係 專距穿ά於熱導管6038上，利用熱導管6038將第 屢片601所傳導的熱量，迅速傳導至散熱葉片 6037上，以將熱量迅速驅散，同樣也可利用凸塊 6031’與第一護片6〇1的擴充槽β〇ιι快速結合成一 體。 如上所述，本創作其據以實施時，首先，係利 用散熱模組的凸塊，與第一護片的擴充槽，將兩者 進行快速結合後，接著，再將第一護片與第二護片 刀別夾設於一記憶體的兩面，確實提供一種擴充式 10 M344506 記憶體護片 效果之目的 而達到拆裝方便 且可有效增加散熱 而已’Λ上所述者，僅為本創作之較佳之實施例 此技藏者：以限定本創作實施之範圍，·任何熟習 :二:二 離本創作之精神與範圍下所作之 ::所、：飾，皆應涵蓋於本創作之專利範圍内。 ，-上所述，本創作擴充式記憶體護 :具有新型之「產業可利用性」、「新穎性」與二進 步性」β等專利要件；中請人爰依專利法之規定，向 鈞局提起新型專利之申請。 11The heat dissipation area is increased to increase the efficiency of heat dissipation; please refer to the "Picture 6" for the purpose of creating a three-dimensional appearance of the preferred embodiment, as shown in the figure, to increase the aforementioned expansion memory device The heat dissipation effect of 6〇 can be used to set up a heat pipe type heat dissipation module 603. The system is sighed on the first compliant piece 610, and a bump is formed on the bottom surface of the heat dissipation module 6 〇3, and the heat dissipation mode is formed. The top surface of the group 6〇3 is provided with a plurality of heat dissipating blades 6037 and a heat pipe 6〇38, and the heat dissipating blades 6〇37 are exclusively passed through the heat pipe 6038, and the heat pipe 6038 is used to pass the first piece 601. The conducted heat is quickly transmitted to the heat dissipating fins 6037 to quickly dissipate the heat, and the bumps 6031' can also be quickly integrated into the expansion slot β〇ιι of the first guard piece 6〇1. As described above, when the present invention is implemented, firstly, the bumps of the heat dissipation module are used, and the expansion grooves of the first protection piece are used to quickly combine the two, and then the first protection piece and the first protection piece are respectively The two protective knives are placed on both sides of a memory, and indeed provide an extended 10 M344506 memory protector effect for easy disassembly and assembly and can effectively increase heat dissipation. The preferred embodiment of the present invention: to limit the scope of the implementation of this creation, · any familiarity: two: two from the spirit and scope of the creation::,: decoration, should cover the patent of this creation Within the scope. As mentioned above, this creation expands the memory protection: it has new types of "industry availability", "novelty" and two progressive "beta" and other patent requirements; the applicants are in accordance with the provisions of the patent law, The bureau filed an application for a new patent. 11
M344506 【圖式簡單說明】 第1圖，為習知散熱護片的構造示意圖。 第2圖，為本創作較佳實施例之立體外觀圖。 第3圖，為本創作較佳實施例之立體分解圖。 第4圖，為本創作較佳實施例之組合剖視圖。 第5圖，為本創作另一較佳實施例之立體外觀圖。 第6圖，為本創作再一較佳實施例之立體外觀圖。 【主要元件符號說明】M344506 [Simplified description of the drawings] Fig. 1 is a schematic view showing the structure of a conventional heat dissipation protection sheet. Fig. 2 is a perspective view of the preferred embodiment of the present invention. Figure 3 is a perspective exploded view of the preferred embodiment of the present invention. Figure 4 is a cross-sectional view of the combination of the preferred embodiment of the present invention. Figure 5 is a perspective view of another preferred embodiment of the present invention. Figure 6 is a perspective view of a further preferred embodiment of the present invention. [Main component symbol description]
10 夾具 20 散熱護片 30 記憶體 301 晶片 40 記憶體 401 扣孔 50 主機板 501 記憶體插槽 502 扣具 60 擴充式記憶體散熱護片 601 第一護片 6011 擴充槽 6012 固定部 6013 固定？L 第二護片 602 12 M34450610 Fixture 20 Heat sink 30 Memory 301 Chip 40 Memory 401 Buttonhole 50 Motherboard 501 Memory slot 502 Clip 60 Expansion memory heat sink 601 First guard 6011 Expansion slot 6012 Fixing part 6013 Fix? L Second protector 602 12 M344506
602 1 相對固定部 6022 固定螺絲 603 散熱模組 60 3 1 凸塊 6031 1 相對固定孔 6032 水道 6032 1 入水端 60322 出水端 6 033 泵浦 6034 水槽 6035 固定螺絲 6036 散熱鰭片 6037 散熱葉片 6038 熱導管602 1 Relative fixing part 6022 Fixing screw 603 Heat sink module 60 3 1 Bump 6031 1 Relative fixing hole 6032 Water channel 6032 1 Water inlet end 60322 Water outlet end 6 033 Pump 6034 Water tank 6035 Fixing screw 6036 Heat sink fin 6037 Heat sink blade 6038 Heat pipe