TWM343849U - Heat dissipation system for dissipating heat generated by a computer - Google Patents

Heat dissipation system for dissipating heat generated by a computer Download PDF

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Publication number
TWM343849U
TWM343849U TW97206678U TW97206678U TWM343849U TW M343849 U TWM343849 U TW M343849U TW 97206678 U TW97206678 U TW 97206678U TW 97206678 U TW97206678 U TW 97206678U TW M343849 U TWM343849 U TW M343849U
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TW
Taiwan
Prior art keywords
heat dissipation
dissipation system
cooling
tube
heat
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TW97206678U
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Chinese (zh)
Inventor
Hou-Chun Huang
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Wistron Corp
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Publication date
Application filed by Wistron Corp filed Critical Wistron Corp
Priority to TW97206678U priority Critical patent/TWM343849U/en
Publication of TWM343849U publication Critical patent/TWM343849U/en

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Abstract

A heat dissipation system for dissipating heat generated by a computer is disclosed. The heat dissipation system includes a deck for combining with the computer so as to absorb the heat generated by the computer, a pipe installed inside the deck for conveying fluid, a driving means connected to a first end of the pipe and separated from the deck for driving the fluid to flow so as to take away the heat generated by the computer from the deck, and a cooling means connected to a second end of the pipe and the driving means and separated from the deck for cooling the fluid from the driving means so as to dissipate the heat generated by the computer.

Description

M343849 ’ 八、新型說明: 【新型所屬之技術領域】 本創作係提供一種用來散除一電腦裝置所產生熱量之 散熱系統,尤指一種用來散除一電腦裝置所產生熱量之水 冷式散熱系統。 ‘ 【先前技術】 散熱問題於現今可攜式行動電腦之應用仍為一急需克 服之瓶頸,而坊間各種不同類型之可攜式行動電腦亦採用 各式不同散熱方式,然習知之散熱技術已不敷解決處理器 及各元件大量產生之熱量,故有許多散熱技術之應用便應 運而生,以維持電子裝置在正常工作溫度下使用。目前普 遍使用的空氣冷卻系統,不論冷卻風扇的效能如何改良, Φ 在解決產熱問題上仍有些限制,例如於傳統風扇強制空氣 對流之模式下,散熱量畢竟有限、容易沈積灰塵,且僅依 靠風扇進行散熱會產生過度之噪音,因而破壞環境之安寧。 【新型内容】 本創作係提供一種用來散除一電腦裝置所產生熱量之 水冷式散熱系統,以解決上述之問題。 M343849 本創作之申凊專利範圍係揭露—種用來散除—電腦裝 置所產生熱畺之散熱系統,該散熱系統包含有一散熱座, 其係用來結合於該電腦裝置,藉以吸收該電腦裝置所產生 之熱量;-輸送管,其係安裝於該散熱座内,用來輸送一 工作流體;一驅動裝置,其係連接於該輸送管之一第一端 ,且分離設置於該散熱座外,用來驅動該卫作流體之流動, 以使該工作流體將該電腦裝置所產生之熱量帶離該散熱 Φ 座,以及一冷卻裝置,其係連接於該輸送管之一第二端與 該驅動裝置,且分離設置於該散熱座外,用來冷卻由該驅 動裝置輸送來之该工作流體,藉以散除該電腦裝置所產生 之熱量。 【實施方式】 請參閱第1圖與第2圖,第1圖為本創作一散熱系統 • 5〇連接於一電腦裝置52之示意圖,第2圖為本創作散熱 -系統50之示意圖。電腦裝置52係可為一可攜式電腦,如 筆記型電腦等,散熱系統5〇包含有一散熱座54、一輸送 官56、一驅動裝置58、一冷卻裝置6〇、一第一導流管、 一第二導流管64,以及一第三導流管όό。散熱座54係用 來女裝於電腦裝置52之下方且結合於電腦裝置52,藉以 吸收電腦裝置52所產生之熱量,為了加速散熱座54吸收 電月&哀置52所產生熱量之熱傳導速率,散熱座54之材質 M343849 係可為導熱材質’如金屬材質或— 安裝於散熱座54之内部,其係、、貝―4,輸运管%係 該工作流體係可為水或散熱油等,輸 力型:=ΓΓ增加其於散熱座54内部之體‘ 加散熱效率,輸送管56係可為 進而日 由第-導流管62連接於輪送f56/ 係精 置於散熱座54外,用來Γ動裝置58係分離設 工作流體由輸送管56端傳送至冷卻裝置60,以使該工作 流體將電腦裝置52所產生之熱量帶離散熱座54,驅動裝 置58係可為-泵(pump);冷卻裝置⑼係藉由第二導流管 64連接於驅㈣置58且藉由第三導流管66連接於輸送管 56之-第-端562,冷卻裝置6()係分㈣置於散熱座μ 外,用來冷卻由驅動裝置58輸送來之該工作流體,藉以散 ㈣腦裝置52所產生之熱量;第一導流管&、第二導流 g 64 ’以及第二導流管66係可由塑膠材質所,组成,意即 其係可被任意彎折。 於此對本創作散熱系統50之作用原理介紹如下,首先 電腦裝置52所產生之熱量可藉由熱傳導方式傳遞至散熱 座54,於散熱座54内部之輸送管56内流動之該工作流體 會因為散熱座54吸收電腦裝置52所產生之熱量而造成溫 度上升,由於該工作流體受到驅動裝置58之驅動,故其會 M343849 ^ 於輸送管56内流動,至於驅動裝置58驅動該工作流體之 流動方向係如圖中箭頭所示,如此一來溫度上升之該工作 流體係可由輸送管56之第一端561被帶離於散熱座54, 進而傳送至第一導流管62,溫度上升之該工作流體會透過 驅動裝置58加壓回流至第二導流管64,藉以傳輸至冷卻 裝置60。請參閱第3圖,第3圖為本創作冷卻裝置60之 示意圖,冷卻裝置60包含一風扇68,以及一冷卻管70, 其係接觸於風扇68,冷卻管70之一第一端701係連接於 * 第二導流管64且冷卻管70之一第二端702係連接於第三 導流管66。溫度上升之該工作流體可由第二導流管64流 入冷卻管70之第一端701,而風扇68轉動係可散除該工 作流體所帶來之熱量,進而冷卻該工作流體,之後被冷卻 之該工作流體係由冷卻管70之第二端702流動至第三導流 管66,以使冷卻之該工作流體通過輸送管56之第二端562 而回流至輸送管56内,如此週而復始之運作便可達到循環 ·-散熱之效果。 綜上所述,由於水冷式之散熱座54與電腦裝置52之 接觸面積甚大,故相較於傳統風扇之局部散熱,散熱座54 為全面性之散熱機制且散熱速度較快;再者,由於驅動裝 置58與冷卻裝置60係分離設置於散熱座54外,故其可遠 離於電腦裝置52之使用者,如此一來便可避免風扇68之 , 噪音影響使用者,且由於驅動裝置58與冷卻裝置60並非 9 M343849 安裝於散熱座54内,故可便於驅動裝置58與冷卻裝置60 之更換。 相較於先前技術,本創作水冷式散熱系統係可有效率 散除電腦裝置所產生之熱量,且由於冷卻工作流體之風扇 可遠離於使用者設置,如此一來便可降低風扇噪音對使用 ~ 者之影響。 • 以上所述僅為本創作之較佳實施例,凡依本創作申請 專利範圍所做之均等變化與修飾,皆應屬本創作專利之涵 蓋範圍。 【圖式簡單說明】 第1圖為本創作散熱系統連接於電腦裝置之示意圖。 $ 第2圖為本創作散熱系統之示意圖。 第3圖為本創作冷卻裝置之示意圖。 【主要元件符號說明】 50 散熱系統 52 電腦裝置 54 散熱座 56 輸送管 561 第一端 562 第二端 M343849 58 驅動裝置 60 冷卻裝置 62 第一導流管 64 第二導流管 66 第三導流管 68 風扇 70 冷卻管 701 第一端 702 第二端M343849 ' VIII, new description: [New technology field] This creation system provides a heat dissipation system for dissipating the heat generated by a computer device, especially a water-cooled heat dissipation for dissipating heat generated by a computer device. system. [Prior Art] The problem of heat dissipation in today's portable mobile computers is still an urgent bottleneck. The various types of portable mobile computers in the market also use different heat dissipation methods. However, the heat dissipation technology is not known. The application solves the heat generated by the processor and various components, so many applications of heat dissipation technology have emerged to maintain the electronic device at normal operating temperatures. At present, the air cooling system commonly used, no matter how the performance of the cooling fan is improved, Φ still has some limitations in solving the heat generation problem. For example, in the mode of forced air convection in the conventional fan, the heat dissipation is limited, the dust is easily deposited, and only relying on Fans dissipating heat can create excessive noise, thus damaging the peace of the environment. [New Content] This creation provides a water-cooled cooling system for dissipating the heat generated by a computer device to solve the above problems. M343849 The claimed patent scope of the present invention discloses a heat dissipation system for dissipating a enthusiasm generated by a computer device, the heat dissipation system comprising a heat sink for coupling to the computer device to absorb the computer device The heat generated is: a delivery pipe installed in the heat sink for conveying a working fluid; a driving device connected to one of the first ends of the pipe and separately disposed outside the heat sink And the flow of the working fluid is driven to cause the working fluid to carry the heat generated by the computer device away from the heat dissipating Φ seat, and a cooling device connected to the second end of the conveying pipe and the The driving device is disposed separately from the heat sink to cool the working fluid sent by the driving device to dissipate heat generated by the computer device. [Embodiment] Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic diagram of a heat dissipation system of the present invention. 5 〇 is connected to a computer device 52 , and FIG. 2 is a schematic diagram of the heat dissipation system 50 . The computer device 52 can be a portable computer, such as a notebook computer, and the heat dissipation system 5 includes a heat sink 54, a transporting officer 56, a driving device 58, a cooling device 6, and a first guiding tube. a second draft tube 64 and a third draft tube. The heat sink 54 is used for women's clothing under the computer device 52 and coupled to the computer device 52, so as to absorb the heat generated by the computer device 52, in order to accelerate the heat transfer rate of the heat sink 54 to absorb the heat generated by the electric moon & The material of the heat sink 54 M343849 can be a heat conductive material such as metal material or - installed inside the heat sink 54, the system, the shell 4, the transport tube%, the workflow system can be water or heat dissipation oil, etc. The power transmission type: = ΓΓ increases the body inside the heat sink 54' to increase the heat dissipation efficiency, and the conveying pipe 56 can be connected to the wheel f56 by the first draft tube 62, and the system is placed outside the heat sink 54 The pumping device 58 is used to separate the working fluid from the end of the conveying pipe 56 to the cooling device 60, so that the working fluid disperses the heat generated by the computer device 52 into the hot seat 54, and the driving device 58 can be a pump (pump); the cooling device (9) is connected to the drive (four) 58 by the second draft tube 64 and connected to the -th end 562 of the transfer pipe 56 by the third draft pipe 66, the cooling device 6 () (4) being placed outside the heat sink μ for cooling the work carried by the driving device 58 The fluid, by means of the heat generated by the brain device 52; the first draft tube & the second flow guide g 64 ' and the second guide tube 66 may be composed of a plastic material, that is, the system may be arbitrarily Bend. The function of the heat dissipation system 50 is as follows. First, the heat generated by the computer device 52 can be transferred to the heat sink 54 by heat conduction, and the working fluid flowing in the heat pipe 56 inside the heat sink 54 is dissipated. The seat 54 absorbs the heat generated by the computer device 52 to cause a temperature rise. Since the working fluid is driven by the driving device 58, it will flow in the conveying pipe 56, and the driving device 58 drives the flow direction of the working fluid. As indicated by the arrows in the figure, the workflow system in which the temperature rises can be carried away from the heat sink 54 by the first end 561 of the transfer tube 56, and then transferred to the first draft tube 62, and the temperature rises. The experience is pressurized back to the second draft tube 64 through the drive unit 58 for transmission to the cooling unit 60. Please refer to FIG. 3 , which is a schematic diagram of the creation cooling device 60. The cooling device 60 includes a fan 68 and a cooling tube 70 that is in contact with the fan 68. The first end 701 of the cooling tube 70 is connected. The second draft tube 64 and one of the second ends 702 of the cooling tube 70 are connected to the third draft tube 66. The working fluid whose temperature rises can flow into the first end 701 of the cooling tube 70 by the second draft tube 64, and the rotation of the fan 68 can dissipate the heat generated by the working fluid, thereby cooling the working fluid, and then being cooled. The workflow system flows from the second end 702 of the cooling tube 70 to the third draft tube 66, so that the cooled working fluid flows back into the delivery tube 56 through the second end 562 of the delivery tube 56, so that the operation is repeated. It can achieve the effect of circulation and heat dissipation. In summary, since the water-cooled heat sink 54 has a large contact area with the computer device 52, the heat sink 54 has a comprehensive heat dissipation mechanism and a faster heat dissipation speed than the local heat dissipation of the conventional fan; The driving device 58 and the cooling device 60 are separately disposed outside the heat sink 54 so that they can be remote from the user of the computer device 52, so that the fan 68 can be avoided, the noise affects the user, and the driving device 58 and the cooling device The device 60 is not 9 M343849 mounted in the heat sink 54, so that the replacement of the drive unit 58 and the cooling unit 60 can be facilitated. Compared with the prior art, the present water-cooled heat dissipation system can efficiently dissipate the heat generated by the computer device, and since the fan for cooling the working fluid can be set away from the user, the fan noise can be reduced. The influence of the person. • The above is only the preferred embodiment of this creation. All changes and modifications made in accordance with the scope of this patent application shall fall within the scope of this creation patent. [Simple description of the diagram] The first diagram is a schematic diagram of the creation of the cooling system connected to the computer device. $ Figure 2 is a schematic diagram of the creation cooling system. Figure 3 is a schematic view of the creation cooling device. [Main component symbol description] 50 Heat dissipation system 52 Computer device 54 Heat sink 56 Pipe 561 First end 562 Second end M343849 58 Drive unit 60 Cooling device 62 First draft tube 64 Second draft tube 66 Third flow Tube 68 fan 70 cooling tube 701 first end 702 second end

Claims (1)

M343849 — 九、申請專利範圍: 電腦裝置所產生之熱量 一種散熱系統,用來散除一 该散熱系統包含有: 散熱座,其係用來結合於該電腦裝置,藉以吸收該電 腦裝置所產生之熱量; 輸送管’其係安裝於該散熱㈣,用來輸送—工作流M343849 — IX. Patent application scope: The heat generated by the computer device is a heat dissipation system for dissipating a heat dissipation system. The heat dissipation system includes: a heat sink for coupling to the computer device to absorb the computer device. Heat; the duct is mounted on the heat sink (four) for transport - workflow 一驅動裝置’錢連接於簡送管之—第—端且分離設 置於該散熱斜,用來,_紅作㈣之流動,以 使該工作流體將該電腦裝置所產生之熱量帶離該 散熱座;以及 一冷卻裝置,其係連接於該輸送管之—第二端與該驅動 裝置’且分離設置於該散熱座外,絲冷卻由該驅 動裝置輸送來之作流體,藉以散除該電腦裝置 所產生之熱量。 2·如請求項!所述之散熱系統,其中該散熱座係由金屬 材質所組成。 3.如請求項1所述之散熱系統,其中該散熱座係由塑膠 材質所組成。 ' 12 M343849 4.如請求们所迷之散熱系 統 型彎折管路 ,其中該輸送管係為一 U 鋁 5· y求項1所述之散熱系統,其中該輸送管係為一 置係為 6.如凊求項1所述之散熱系統,其中該驅動裝 泵(pump) 〇 、 7. 如請求項1所述之散熱系統,其另包含—第 其, 送管之該第一端與該驅動裝置:’ 。剧k S傳輸该工作流體至該驅動裝置。 8. 如請求項7所述之散熱系統,其中該第 塑膠材質所組成。 由 9. 如請求…所述之散熱系統,其另包含一第二導流管, 其係連接於該驅動裝置與該冷卻裝置,用來由該驅動 衣置傳輸4工作流體至該冷卻裝置。 10. 如請求項9所述之散熱系統,其中該第二導流管係由 塑膠材質所組成。 11.如請求項1所述之散熱系統,其另包含—第三導流管, 13 M343849 用來 其係連接於該冷卻裝置與該輸送管之該第二端 由該冷卻裝置傳輸該工作流體至該輸送管。 刪㈣+擊導流管係由 13 I 上车· 明求項1所述之散熱系統,其中該冷卻裝置包一 風扇。 14,如請求項13所述之散熱系統,其中該冷卻裝置另包含 一冷卻管,其係接觸於該風扇,且其兩端係分別連接 於該驅動裝置與該輸送管。 15 主 如明求項14所述之散熱系統,其中該冷卻管係為一 口 型彎折管路。 •如明求項14所述之散熱系統,其中該冷卻管係為一鋁 17 a主 •如請求項13所述之散熱系統,其另包含一第二導流 官’其係連接於該驅動裝置與該冷卻裝置之該冷卻 貧用來由該驅動裝置傳輸該工作流體至該冷卻裳置。 18 I j. •如請求項13所述之散熱系統,其另包含一第三導流 14 、M343849 * 管,其係連接於該冷卻裝置之該冷卻管與該輸送管之 該第二端,用來由該冷卻裝置傳輸該工作流體至該輸 送管。 19.如請求項1所述之散熱系統,其中該工作流體係為水。 • 20.如請求項1所述之散熱系統,其中該工作流體係為散 、 熱油。 十、圖式: 15a driving device 'money is connected to the first end of the simple tube and is disposed separately from the heat sinking slope for the flow of the red liquid (4) to cause the working fluid to carry the heat generated by the computer device away from the heat dissipation And a cooling device connected to the second end of the conveying pipe and the driving device and disposed separately from the radiator seat, and the wire cools the fluid sent by the driving device to disperse the computer The heat generated by the device. 2. If requested! The heat dissipation system, wherein the heat dissipation seat is made of a metal material. 3. The heat dissipation system of claim 1, wherein the heat dissipation seat is made of a plastic material. ' 12 M343849 4. The cooling system type bending pipe which is claimed by the requester, wherein the conveying pipe is a heat dissipation system according to item 1, wherein the conveying pipe is a system 6. The heat dissipation system of claim 1, wherein the drive pump (pump), 7. the heat dissipation system of claim 1, further comprising - the first end of the feed tube The drive: '. The program k transmits the working fluid to the driving device. 8. The heat dissipation system of claim 7, wherein the first plastic material is comprised. 9. The heat dissipation system of claim 9, further comprising a second draft tube coupled to the drive unit and the cooling unit for transmitting 4 working fluid to the cooling unit by the drive unit. 10. The heat dissipation system of claim 9, wherein the second flow conduit is made of a plastic material. 11. The heat dissipation system of claim 1, further comprising a third draft tube, 13 M343849 for connecting to the cooling device and the second end of the delivery tube for transporting the working fluid by the cooling device To the delivery tube. Deleting (4) + striking the flow tube is the heat dissipation system described in the first embodiment of the vehicle, wherein the cooling device includes a fan. The heat dissipation system of claim 13, wherein the cooling device further comprises a cooling tube that is in contact with the fan and that is connected to the driving device and the conveying tube at both ends thereof. The heat dissipation system of claim 14, wherein the cooling pipe is a one-piece bending pipe. The heat dissipation system according to claim 14, wherein the cooling pipe is an aluminum 17 a main heat dissipation system according to claim 13, further comprising a second guide officer connected to the drive The cooling of the device and the cooling device is used to transfer the working fluid to the cooling device by the driving device. The heat dissipation system of claim 13, further comprising a third flow guiding tube 14 and a M343849* tube connected to the cooling tube of the cooling device and the second end of the conveying tube, Used to transport the working fluid to the delivery tube by the cooling device. 19. The heat dissipation system of claim 1, wherein the workflow system is water. 20. The heat dissipation system of claim 1, wherein the workflow system is a dispersion of hot oil. X. Schema: 15
TW97206678U 2008-04-18 2008-04-18 Heat dissipation system for dissipating heat generated by a computer TWM343849U (en)

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Cited By (1)

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TWI715819B (en) * 2018-01-10 2021-01-11 訊凱國際股份有限公司 Heat dissipating device for electrical equipment, dissipating assembly, air pipe assembly, and table with heat dissipating device for electrical equipment

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Publication number Priority date Publication date Assignee Title
TWI715819B (en) * 2018-01-10 2021-01-11 訊凱國際股份有限公司 Heat dissipating device for electrical equipment, dissipating assembly, air pipe assembly, and table with heat dissipating device for electrical equipment

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