TW200530788A - Liquid-cooling package for computers - Google Patents

Abstract

A liquid-cooling package to be installed inside an isolated compartment of a computer includes a casing, a pump, a tank, a radiation unit, at least a fan, a casing-side piping, a far-side water jacket to be set on a heat-generating element inside the computer but away the isolated compartment, and a flexible far-side piping with a middle section to include the far-side water jacket in series. The casing-side piping connects in series the pump, the tank, and the radiation unit, and also connects with the far-side piping to form a close loop. By providing a coolant to circulate in the loop, heat generated by the heat-generating element can be carried to the isolated compartment and dissipated at the liquid-cooling package thereinside.

Description

200530788 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an auxiliary liquid-cooling device for a computer mainframe, and more particularly to an auxiliary space-cooling device that uses a liquid-cooled method to dissipate heat generated by a heating element in the mainframe Liquid cooling device. [Previous technology] According to the requirements of the multiplexing and efficiency of electronic components, the heat dissipation of main components in computer equipment, such as the central processing unit CPU, has gradually become a technical bottleneck for the development of further functions of electronic components. For the evolution of the solution to the problem of heat dissipation of the main heat-generating components in computer equipment, from the design of the ventilation flow field in the chassis at the initial stage, the attachment of cooling fins, the configuration of fin dedicated fans, to the professionalization of the overall cooling module Design has become the most important issue for further performance improvement of computer equipment. Please refer to the first picture, taking the internal configuration of a conventional computer host 1 (commonly used in desktop computers, servers, industrial computer special control boxes, etc.) as an example, usually on the foot 12 The housing 11 will be provided with at least one air inlet 112 and one exhaust outlet 113 at the appropriate place. The internal 110 of the main unit is provided with different numbers of application units 1 1 1 (such as a floppy disk) due to different functional requirements. Machine, hard disk drive, writer, etc.), and in order to cope with the heat dissipation problem of the host ’s internal 1 1 0, a main fan 1 1 8 is usually set near the exhaust port Π 3 to generate a free air intake. The forced cooling air flow 1 0 0 (also called the host side air flow) flowing from the port 1 1 2 to the exhaust port 1 1 3. In the conventional art, the main heat-generating components in the host computer 1 are usually a power processing unit, a central processing unit, a graphics chip, etc.

m

Page 6 200530788 V. Description of the invention (2) —----- As an example, the heat generating π part 11 5 is a central processing unit (CPU) located on the motherboard 1 1 4. In order to solve the heat dissipation problem, a heat dissipation fin 1 1 6 ′ is disposed thereon, and an overhead fan 1 1 7 is disposed on the dispersing fin 1 1 6 to accelerate the dissipation of heat energy thereon. Zhunbai Zhidan uses the cooling fins 1 1 6, the fin-side fan π 7 and the main fan 1 1 8 to deal with the heat dissipation problem in the host computer 1. , And can not produce satisfactory results. (In the conventional art as shown in 帛 目, there are usually several ways to improve the heat dissipation capacity of the computer host 1: 1., == fan! 丨 8 of The heat dissipation energy is to accelerate the air inside and outside the case 11 = 2 ί, usually to increase its speed, or to increase the size of the main fan 11 8; To protect the inside of the case 2 2 · Increase the size of the heat dissipation fins 1 1 6 Heat generating element 1 1 5; and

Raise the fin-side fan 1 1 7 & Dan Dan I β · M ^ # 月 月 月 匕 I ^ L to accelerate the heat dissipation of the heat sink fins to ensure the normal operation of the heat generating element 115 = normal It is based on the addition of fins and 117κ to increase its speed. Although the 1 i triple Γ solution solves the problem of insufficient energy dissipation in the original design on some levels, it is actually not an ideal method. `` ... For example, with a large-sized main fan U 8 or a fin-side fan 丨 丨, in the case where the space inside the cabinet 11 is insufficient, most of it '' '

The setting of U7 will make the hard disk drive, floppy disk drive, & electricity @ 源 H inside the chassis U

Page 7

200530788 V. Description of the invention (3) The configuration of the application unit 11 such as the device, chipset and interface card is more difficult. Similarly, increasing the size of the heat dissipation fins 116 will cause problems in the layout of the internal space of the chassis 11. Taking the speed of the fan 117 or 118 as an example, it will not only generate a large operating noise, but also increase the heat generated by the fan due to the increase in the speed. This increased heat production will likely offset the increase in heat generation. The cooling effect is increased by the fan speed. Therefore, it is very likely that the ambient temperature in the casing 11 will be directly increased, so that the components in the casing 11 must be operated in a higher environment. The consequence will be that each component The service life and reliability are reduced, and it is even necessary to respond to the reconfiguration of each part. Obviously, none of the aforementioned three heat dissipation solutions are ideal heat dissipation solutions, and their implementation also makes the development of new models more difficult. Recent research reports have pointed out that the heat dissipation fins 1 16 and fin-side fans 11 7 cannot meet the heat dissipation requirements of the new generation chip or the computer host 1 alone. Therefore, a heat pipe (Heatpipe) is used for auxiliary heat dissipation. The design appears, but because the heat dissipation energy that the heat pipe can handle is limited, the heat pipe can only be a remedial measure, and cannot be the main body of the heat generating component solution. New technologies and trends are devices with circulating water-cooled or liquid-cooled (usually non-freezing liquid as refrigerant) devices that are installed in the central part or upper part of the main body of the host (above the main board 11 4). Carry out the heat dissipation operation of the main heat-generating components; however, this technology can effectively improve the heat dissipation processing energy per unit time. However, the way in which the water circulation system is set in the main body housing 110 with limited space, the cooling airflow is still Host side of 11 0 in the original host

Page 8 200530788 V. Description of the invention (4) Air flow 100, its function is only to transfer the heat generated by the heat-generating element 115 to another place inside the host 110 and release it. In addition to partially solving the problem of excessively high temperature of the heat-generating element 1 1 5, another heat-generating source added by the circulation drive pump 1 1 10 inside the host will also cause more heat dissipation problems in the case 1 1 0 The complicated leaks caused by the circulating pipeline configuration above the main board Π 4 will also cause another hidden concern about the reliability of expensive computer equipment. What's more, in response to the cooling requirements of the new generation of computer technology, an effective and reliable cooling solution is welcomed by those skilled in this art. [Summary of the invention] The main purpose of the present invention is to provide an auxiliary liquid cooling device for a computer mainframe, which provides a safe and safe way for the heat-generating components on the computer mainframe to be independent of the inside and outside of the computer mainframe and using independent cooling airflow. Effective cooling solution. The auxiliary liquid cooling device of the computer main body of the present invention, wherein the computer main body further includes a casing and a heat generating element arranged in the casing. The auxiliary liquid cooling device includes a box body, a pump, a liquid tank, A heat dissipation unit, at least one heat dissipation fan, a device-side pipe, a water jacket, and a host-side flexure pipe. The pump is installed in the box and is used to drive the liquid for heat exchange. The liquid tank is installed in the box body to buffer and store the pipeline liquid for heat exchange. The heat dissipation unit is installed in the box body to disperse the liquid in the pipeline.

200530788 V. Description of the invention (5) Thermal operation may include at least one coil structure. The cooling fan is installed in the box body, and is used for generating a cooling air flow in the box body that blows through the heat dissipation unit. The pipeline on the device side is connected in series with the pump, liquid tank, and heat dissipation unit, and provides a pipeline interface for output and input pipeline liquid at each end. The water jacket is arranged on the heat-generating element in the casing, so as to perform a heat exchange reaction with the heat-generating element by using the internal pipeline liquid. The deflection pipe on the host side is connected through the water jacket, and the two ends of the deflection pipe respectively pass out of the host and form a pipe connection with the second pipe interface of the device side pipe in the box. In the present invention, the pipeline liquid is circulated in the pump, the liquid tank, the heat radiating unit, and the water jacket through the series relationship formed by the device-side pipeline and the host-side flexible tube. In the present invention, the box system of the auxiliary liquid cooling device uses an independent space, and uses a partition plate, which is arranged on the bottom of the computer mainframe. The bottom side and top of the computer mainframe can also be set as independent boxes. Side, or even formed as the foot structure of the computer host. In an embodiment of the present invention, the water jacket of the auxiliary liquid cooling device may further include a heat conducting plate, and the heat conducting plate has a bottom surface and an opposite top surface, and the bottom surface is used to be attached to the heat generating element. The top surface is in direct contact with the pipeline liquid in the water jacket; by this heat transfer plate, the heat generated on the heat-generating element can be directly and more quickly transferred into the water jacket. In the present invention, the top surface of the water jacket can be configured as a flat surface, an uneven surface, or even a fin structure, or other similar surface structures.

Page 10 200530788 V. Description of the invention (6) In order to allow your reviewers to have a better understanding and approval of the present invention, a detailed description is given below in conjunction with the drawings. [Embodiment] In the following description, in order to obtain the consistency of the technical explanation of the present invention, in different embodiments, if there are components with the same function but different shapes, the same name and The figure number indicates it. Please refer to the second and third figures, which are schematic diagrams of the configuration of one embodiment of the auxiliary liquid cooling device of the computer host of the present invention and three-dimensional views of another embodiment. The computer host to which the present invention is attached includes a The casing and a heat generating element 1 1 5 located inside the host 1 1 0, and the auxiliary liquid cooling device 2 includes a box 1 6 9 and a pump 1 6 for driving pipeline liquid 1. A liquid tank 1 6 2. A cooling unit 1 6 3. At least one cooling fan 1 6 4. A device-side pipe 1 6 8 1. A water jacket 1 6 5 and a host-side flexure pipe 1 6 8 2. Among them, the liquid tank 1 62 is located inside the box body 16 9 1 6 0 to buffer and store the pipeline liquid for heat exchange, and can have the function of retaining the air in the pipeline and adjusting the internal pressure of the pipeline. . The heat dissipation unit 16 3 is located inside the box body 16 9 16 for heat dissipation operation of the pipeline liquid, and may include at least one coil structure (shown as a coil structure). The cooling fan 16 is also arranged inside the box body 16 9 16 to generate an air flow for heat dissipation in the box body 16 9 that blows through the heat sink unit 16 3. The device side pipeline 1 6 8 1 is used to connect the pump 1 6 1, the liquid tank 1 6 2, and the heat dissipation unit 163, and it also provides an output and input pipeline liquid at each end.

200530788 V. Description of the invention (7) Pipe connections 166, 167. The water jacket 1 65 is used to be installed on the heat generating element 1 1 5 inside the host computer 1 10 to use the internal liquid pipe to perform a heat exchange reaction with the heat generating element 1 1 5 . The main unit side deflection pipe 1 6 8 2 is connected through the water jacket 1 6 5, and its two ends respectively penetrate the main unit interior 1 1 0 and the box body 1 6 9 inner 1 6 0 device side pipeline 1 6 8 1 The two pipeline interfaces 1 6 6 and 1 6 7 form pipeline connections. In the present invention, the pipeline liquid is circulated in the pump 1 6 by the series relationship formed by the device-side pipeline 1 6 8 1 and the host-side flexible pipe 1 6 8 2, the liquid tank 162, the heat dissipation unit 163, and Water jacket 165. In the present invention, the pump body 16 inside the box 16 and the pump 16 inside the 160, the liquid tank 16 and the heat dissipation unit 16 are in a series relationship, and the arrangement does not need to be upstream and downstream. However, the pump 16 1 is preferably disposed downstream of the liquid tank 16 2, and the heat dissipation unit 16 3 may be disposed downstream or upstream of the pump 1 6 1 and the liquid tank 16 2, and when the heat dissipation unit 1 6 3 When there are more than two heat-dissipating elements (can be in series or parallel relationship), one heat-dissipating element can even be arranged downstream of pump 1 6 1 and liquid tank 1 6 2 while the other heat-dissipating element is at pump 1 The relationship between 6 1 and the upstream of the liquid tank 1 6 2, as shown in the third figure, the heat dissipation unit 1 6 3 has two heat dissipation elements (implemented as a coil structure), and is respectively located in the pump 1 6 1 and The upstream and downstream positions of the liquid tank 1 62. In addition, the cooling fan 16 4 is based on the principle that the best air passing flow can be generated on the cooling unit 16 3; of course, the box 16 9 still needs to have a suitable opening to respond to the air flow in and out. In the present invention, the purpose of forming the box body 1 6 9 is mainly in the device

200530788 V. Description of the invention (8) The section 160 is independent of the host ’s internal 1 1 0, that is, a partition 17 is formed, so that the host ’s internal 1 1 0 cooling airflow 1 ο 〇 (host-side airflow) and The air flow on the device side of the device 16 is separated by 200, so that the heat generated by the 1 10 heat generating element 1 15 inside the host can be carried out to the inside of the independent device 160, and then outside the machine. The fresh air is directly formed as the device-side airflow 2 0 0 in the box body 169. By separating the cooling air flow, it can prevent the heat exchange interaction of the heat-generating element 1 1 5 from deteriorating the heat dissipation of other internal components of the host 1 1 0, which is effective. Achieve the design goal of improving overall heat dissipation energy. Of course, an appropriate notch or hole (not shown) should also be provided on the partition plate 170, so that the host-side flexure tube 1 6 8 2 can pass through. In another implementation condition, the partition plate 1 7 It is also not necessary to provide any notches or holes. At this time, the host side flex tube 1 6 8 2 can be set out on the inside of the host 1 丨 〇 side, and then inside the device on the 160 side and then into the case. The method of 1 丨 is connected in series with the device side pipeline 1 6 8 1. Please refer to the fourth and fifth figures, which are configuration diagrams of the two embodiments of the auxiliary liquid cooling device body (ie, the internal structure of the box body 169) of the present invention; in these two embodiments, the heat dissipation unit 1 6 3 have two heat dissipation elements (implemented as a coiled tube structure) 'and are located upstream and downstream of the pump 1 6 1 and the liquid tank 16 2; in the embodiment shown in the fourth figure, the heat dissipation fan 1 6 4 is a discharge type fan for forcibly exhausting the air inside the device. In the embodiment shown in the fifth figure, 'its cooling fan 1 6 4 is a suction plastic fan, It is used to introduce outside air into the inside of the device i 6 〇 In addition, in these two embodiments, the positional relationship between the pump 16 1 and the liquid tank 16 2 is also different. In the present invention, since the main body side deflection tube 1 6 8 2 adopts an interchangeable configuration,

200530788 V. Description of the invention (9) Its extensibility and bendability are good, which can effectively improve the configuration adaptability of the auxiliary liquid cooling device of the present invention. In the present invention, the main body of the auxiliary liquid cooling device 2 (except the water jacket 1 65 and the host side flex tube 1 6 8 2) can be independently arranged on the top, bottom, or even the main body of the computer. On the side, it can also be directly formed as the foot 12 part of the computer main body 1, or it can be provided in a separate space by a partition 170 in the bottom of the computer main body 1 chassis 11. Please refer to the sixth figure, which is a schematic configuration diagram of an embodiment of the computer host 1 equipped with the auxiliary liquid cooling device 2 of the present invention. In this embodiment, the auxiliary liquid cooling device 2 is directly formed by the casing 11 At the bottom of the computer host 1, that is, its box body 1 6 9 is the lower half of the casing 1 1 and a partition plate 1 70 to distinguish the interior of the original computer host 1 into a separate internal host 11 0 and a Separate device internal 160, so as to open the host-side airflow 100 and the device-side airflow 200, and to space the internal device 160 at the bottom of the computer host 1 can avoid the auxiliary liquid cooling device to a considerable extent. 2 may leak the problem affecting the internal parts of the computer. Please refer to FIG. 7A and FIG. 7B, which are configuration diagrams of another embodiment of the computer host 1 equipped with the auxiliary liquid cooling device 2 of the present invention. The auxiliary liquid cooling device 2 in these two embodiments is based on The independent box is arranged outside the casing 11 and the function of the partition 1 70 is replaced by the material of the casing 1 6 9 and the casing 11 which are separated from the internal 1 1 0 of the host and the internal 160 of the device; In the embodiment shown in FIG. 7A, the auxiliary liquid cooling device 2 is disposed on the bottom side of the casing 11 of the computer main body 1, and is formed as a foot base 12 structure of the computer main body 1, that is, the box body 1 6 9 The structure is the structure of the computer base 1 foot base 12; and the embodiment shown in FIG. 7B

Page 14 200530788 5. In the description of the invention (10), the 'auxiliary liquid cooling device 2' is set on the top side of the casing 11 of the computer main body 1. In the present invention, the water jacket 16 5 of the auxiliary liquid cooling device 2 can be directly formed as a bag body containing liquid, can be implemented as a bag body with a heat conducting plate, or can be directly applied as a cylinder body. Please refer to the eighth figure, which is a schematic cross-sectional view of an embodiment of the water jacket 1 6 5 structure of the present invention; wherein the water jacket 1 6 5 structure includes a water jacket bag body 1 6 5 1 and a heat conducting plate 1 6 5 2. Namely, the main machine side deflection pipes 1 6 8 2 connected to both sides of the water bag body 1 6 5 1 (shown as two sections of deflection pipes 1 6 8 2).

The water jacket bag body 1 6 5 1 can be a flexible bag body structure for containing pipeline liquid, and includes an inlet 165 5 and an outlet 1656 through the inlet 1 6 5 5 and the outlet 16 The connection between 5 6 and two sections of flexible pipe 1 6 8 2 enables the inner part of the water jacket bag 1 6 5 1 to be connected to the main unit side flexible pipe 1 6 8 2 and the device side pipe 1 6 8 1 form a pipeline in a state.

The heat-conducting plate 1652 'is a heat-conducting metal plate, talman plate, or other plate with better thermal conductivity, which is arranged on the bag body 165 1, and it is in a tight connection with the bag body 16 $ 1. To avoid the leakage of liquid at the joint; '" As shown in the figure, the heat transfer plate 165 2 has a bottom surface 165 3 and an opposite top surface 654, and this bottom surface 1 6 5 3 is exposed in a water jacket. The body 651 is used for directly attaching to the heat-generating element, and the top surface 16 5 4 is exposed in the water-sacked carcass, and is used to make direct contact with the liquid inside the 1650. The heat generated by this element is transferred to a flowing liquid. Accelerate production ..., the surface can be configured in Figures 9 to 11. Figure 11 In the present invention, the water jacket 165 structure heat conducting plate 1 6 5 2 is a plane (as shown in Figure 8), a fin Structure (as shown in the figure), or a similar uneven surface structure;

Page 15 200530788 V. Description of the invention (11) The heat conducting plate 1 6 5 2 and the water jacket body 1 6 5 1 are made of the same material and integrated. In the present invention, the configuration of the water jacket 1 65 can be a water cushion body as shown in the third figure, a soft bag body as shown in the sixth, eight, and nine, as shown in the seventh, ten, and eleven. The box shown, or other similar container structures. In the present invention, the material of the thermally conductive plate 1 652 is mainly made of a material having good thermal conductivity, and may be ceramic, silicon, aluminum, copper, or other metal material having excellent thermal conductivity. Please refer to the twelfth figure, which is a schematic configuration diagram of another embodiment of the computer host 1 equipped with the auxiliary liquid cooling device 2 of the present invention; in this embodiment, the 'auxiliary liquid cooling device 2 is provided in the casing 1 The bottom layer of 1, especially below the main board 11 4, is formed by the main board π 4 similar to the function of the aforementioned partition plate, and a kind of device inside the bottom of the chassis 1 1 is isolated from the interior of the chassis Π 〇 60; in this embodiment, the motherboard 1 1 4 is regarded as a part of the box forming the auxiliary liquid cooling device 2. Although its implementation efficiency cannot be as good as that of the embodiment shown in FIG. 6, it is independent. The concepts of space, independent cooling airflow, and avoiding liquid leakage from damaging the electronic components in the casing 11 still belong to the technical content of the present invention, so they should also be included in the patent scope of the present invention. In the present invention, when the auxiliary liquid cooling device 2 is constituted by an independent box body, theoretically, the requirements of the independent space, independent cooling airflow, and avoiding liquid leakage from damaging the electronic components in the casing 11 can be achieved; However, in a better implementation condition, it is still mainly provided outside the casing (such as the embodiment shown in Figures 7A and 7β); of course, under the tight leak-proof design of the box The auxiliary liquid cooling device 2 of the present invention can still be installed in the casing

Page 16 200530788 V. Description of the invention (12) One — ~ 11 The non-bottom αP position 'is shown in the embodiment shown in the thirteenth figure, and its auxiliary liquid cooling device 2 is built in the casing 1 丨The middle section. The main machine side deflection tube 1 6 8 2 of Ben Shemingzhong can be a section tube, a snake tube, or other tube body with bending and bending properties. ^ In the present invention, the device-side pipeline 丨 6 丨 is used to connect pumps in series 丨 6 丨, liquid = 1 6 2, heat dissipation unit 163, and through the host side flexure 丨 6 8 2 in series to The distal water jacket 1 65 can be rigid or flexible.

In the present invention, the 'host side flexure pipe 1 6 8 2 and the device side pipeline 1 6 8 1 and various components (pump 1 6 1. liquid tank 1 6 2. heat dissipation unit 1 6 3. water jacket 丨 6 5) It is necessary to avoid the leakage of pipeline liquid for the connection between them. However, this implementation is for those skilled in this art and can be easily implemented according to the disclosure of the present invention. The liquid system can be any liquid or fluid with unhealthy liquid properties. It is better than the heat-generating element 1 1 5 (the moldable material can be used to guide the present invention, the water jacket 1 6 5 is adhered and adhered with or without its own heat dissipation fins). Viscose or thermal paste is preferred. The present invention uses a separate body of an auxiliary liquid cooling device,

The structure of the water jacket 1 6 5 with the configuration is to provide a computer host 丨 upper u 5 K low noise: not only can eliminate the following advantages :. And because the heat generating element 115 can directly produce the U7's design, the meat department " 0 external heat dissipation, so it can be maintained; to the host computer: the speed of the main fan 118. 4 to lower inside the host

The 17th tribute 200530788 V. Description of the invention (13) 2 · Large heat dissipation: due to the continuous cooling of the liquid cooling mode of the pipeline liquid and the heat dissipation unit 16 3, and each independently used to cool the computer host 1 inside the host 1 1 0 The air flow of the components is 100, and the air flow of the cooling auxiliary liquid-cooling device 2 is 16, and the air flow is 2 0. Therefore, the overall heat dissipation effect achieved is not comparable to the conventional air-cooled structure (shared air flow). . 3. Decrease the temperature inside the cabinet: Since the heat generating element 1 1 5 which mainly produces heat can be carried out by the pipeline 1 1 0 inside the host, the influence of this heat on the air flow at the host side 1 0 0 can be reduced. It can effectively reduce the temperature of the host's internal 100, and can reduce the workload of the main fan 1, 18, and improve the reliability of the various internal components of the host. 4. Increase the available space in the case: the volume occupied by the water jacket 1 6 5 and the host side flex tube 1 6 8 2 is much smaller than the conventional cooling module (including the fan 1 1 7 and fins 1 1 6) , So it can effectively free up the 1 1 0 setting space inside the host. The above description uses a preferred embodiment to describe the present invention in detail, but not to limit the scope of the present invention, and those skilled in the art will understand that appropriate changes and adjustments will still be made without departing from the spirit of the present invention. It does not depart from the spirit and scope of the present invention. To sum up, the specificity of the implementation of the present invention has already met the requirements of the invention patent stipulated in the Patent Law. I invite your reviewing committee to review and grant the patent as a prayer.

Page 30 200530788 Brief description of the diagram The first diagram is a schematic diagram of the internal configuration of a conventional computer host; the second diagram is a schematic diagram of the configuration of an embodiment of the auxiliary liquid cooling device of the computer host of the present invention; the third diagram is this A schematic perspective view of another embodiment of the auxiliary liquid cooling device of the computer main body of the invention; the fourth drawing is a schematic view of the configuration of the embodiment body of the third drawing; the fifth drawing is another embodiment of the auxiliary liquid cooling device of the computer main body of the invention The configuration of the main body is not intended; the sixth diagram is a schematic diagram of the internal configuration of a computer host equipped with the auxiliary liquid cooling device of the present invention; the seventh diagram A is an internal configuration of another computer host equipped with the auxiliary liquid cooling device of the present invention. Intent, the seventh diagram B is a schematic diagram of the internal configuration of another computer host equipped with the auxiliary liquid cooling device of the present invention; the eighth diagram is a schematic sectional view of an embodiment of the water jacket of the auxiliary liquid cooling device of the present invention; the ninth diagram is A schematic sectional view of another embodiment of the water jacket of the auxiliary liquid cooling device of the present invention; and the tenth figure is a schematic sectional view of another embodiment of the water jacket of the auxiliary liquid cooling device of the present invention ; FIG eleventh auxiliary liquid cooling apparatus based water jacket further embodiment of a cross-sectional view of the embodiment of the present invention is not intended to, based twelfth FIG auxiliary liquid cooling device within the host computer of the present invention with another

Page 19, 200530788, a brief description of the layout of the unit; and the thirteenth diagram is a perspective view of the internal layout of a computer host equipped with the auxiliary liquid cooling device of the present invention. Description of drawing number 1 Computer host 2 Auxiliary liquid cooling device 11 Chassis 1 2 Foot stand 1 0 0 Air flow on the host side 11 0 Inside the host 1 1 1 Application unit 1 1 2 Air inlet 11 3 Exhaust port 11 4 Main board 1 1 5 Heat-generating elements 1 1 6 Radiating fins 1 1 7 Fin-side fan 1 1 8 Main fan 1 6 0 Inside the device 1 6 1 Pump 1 6 2 Liquid tank 1 6 3 Radiating unit 1 6 4 Radiating fan 1 6 5 Water Set 1 6 6, 1 6 7 Pipe connection 169 box body 1 6 5 0 Water jacket inside 1 7 0 Baffle 2 0 0 Device side air flow 1 6 5 1 Water jacket bag body 1 6 5 2 Heat transfer plate 1 6 5 3 Bottom surface 1 6 5 4 Top surface 1 6 5 5 Inlet 1656 Outlet 1 6 8 2 Main unit side flex pipe 1 6 8 1 Device side pipe

Page 20

Claims (1)

200530788 VI. Scope of patent application 1. A computer-assisted liquid-cooling device, which includes a casing and a heat-generating element disposed in the casing. The auxiliary liquid-cooling device includes: a box body Is set outside the casing; a pump is set inside the box for driving liquid in the pipeline; a liquid tank is set inside the box; a heat dissipation unit is set at the The inside of the box is used for the heat dissipation operation of the liquid in the pipeline; at least one cooling fan is arranged in the inside of the box, and is used to generate the air flow for heat dissipation that blows through the heat dissipation unit in the box; a device side The pipeline is connected in series with the pump, the liquid tank, and the heat dissipation unit, and a pipeline interface is provided at each end; a water jacket is arranged on the heat generating element in the casing to utilize The liquid inside the pipeline performs a heat exchange reaction with the heat-generating element; and a host side flex tube is connected through the water jacket, and its two ends respectively pass through the casing and the device in the box body. The two pipeline interface shape of the side pipeline Pipe connections; wherein the liquid conduit pipe is the side of the device by the host side of the flex tube circulating pump, the liquid tank, the heat dissipating unit, and the water jacket 0 Page 21 200530788 VI. Scope of patent application 2 · The auxiliary liquid cooling device of the computer host as described in item 1 of the scope of patent application, wherein the heat sink unit includes at least one heat sink coil structure. 3. The auxiliary liquid cooling device of the computer host as described in item 1 of the scope of the patent application, wherein the box system is provided as a foot under the casing. 4. The auxiliary liquid cooling device of the computer host as described in item 1 of the scope of patent application, wherein the box system is arranged on the bottom side of the casing. 5. The auxiliary liquid cooling device of the computer host as described in item 1 of the scope of patent application, wherein the box system is set on the top side of the casing. 6. The auxiliary liquid cooling device of the computer host according to item 1 of the scope of the patent application, wherein the water jacket further includes a heat conducting plate, and the heat conducting plate has a bottom surface and an opposite top surface, and the bottom surface It is used for attaching to the heat-generating element, and the top surface is in direct contact with the pipeline liquid in the water jacket. 7. The auxiliary liquid cooling device of the computer host as described in item 6 of the scope of patent application, wherein the top surface is a flat surface. Page 22 200530788 6. Scope of patent application 8. The auxiliary liquid cooling device of the computer host as described in item 6 of the scope of patent application, wherein the top surface is a concave-convex surface. 9 · The auxiliary liquid cooling device of the computer host according to item 6 of the scope of patent application, wherein the top surface is configured as a fin structure. 1. A kind of water jacket structure, which includes: a water jacket bag body, which is a flexible bag body structure for containing a liquid, including an inlet and an outlet; a heat conducting plate, which is provided On the bag body, there is a bottom surface and an opposite top surface. The bottom surface is exposed on the body of the water jacket, and the top surface is exposed on the body of the water jacket for forming with the liquid. Direct contact; and two deflection tubes, which are respectively connected to the inlet and the outlet, so as to introduce and lead the liquid into and out of the water bag body respectively. 1 1. The water jacket structure according to item 10 of the scope of patent application, wherein the top surface is configured as a plane. 12. The water jacket structure according to item 10 of the scope of patent application, wherein the top surface is configured as an uneven surface. 1 3. The water jacket structure according to item 10 of the scope of patent application, wherein the top surface is configured as a fin structure. Page 23 200530788 VI. Scope of patent application 1 4. A computer mainframe with auxiliary liquid cooling device includes: a casing; a partition plate is arranged in the casing to distinguish the interior of the casing It is the interior of a host and an independent device located below the host, and there is a heat-generating element inside the host: a pump is installed in the interior of the device and is used to drive the liquid in the pipeline; a liquid A box is arranged inside the device; a heat dissipating unit is arranged inside the device for heat dissipation operation of the pipeline liquid; at least one heat dissipating fan is arranged inside the device for use in the device A heat-generating air flow is generated inside the device and blows through the heat-dissipating unit; a device-side pipe is connected in series with the pump, the liquid tank, and the heat-dissipating unit, and a pipe interface is provided at each end; a water jacket, It is arranged on the heat-generating element inside the host to perform a heat exchange reaction with the heat-generating element by using the pipe liquid inside it; and a host-side flex tube is connected. The two ends of the water jacket respectively pass out of the host and form pipe connections with the two pipe interfaces of the device-side pipe inside the device; wherein the pipe liquid is passed through the device side pipe The circuit and the host side flex tube circulate in the pump, the liquid tank, the heat dissipation unit, and the water jacket. Page 24 200530788 VI. Scope of patent application 1 5 · The computer host with auxiliary liquid cooling device as described in item 14 of the scope of patent application, wherein the heat dissipation unit includes at least one heat dissipation coil structure. 16 · The computer mainframe with auxiliary liquid cooling device according to item 14 of the scope of patent application, wherein the water jacket further comprises a heat conducting plate, and the heat conducting plate has a bottom surface and an opposite top surface. The bottom surface is used to be attached to the heat-generating element, and the top surface is in direct contact with the pipeline liquid in the water jacket. 1 7. The computer host with auxiliary liquid cooling device according to item 16 of the scope of patent application, wherein the top surface is a flat surface. 18. The computer host with the auxiliary liquid cooling device as described in item 16 of the scope of the patent application, wherein the top surface is configured as an uneven surface. 19. The host computer with an auxiliary liquid cooling device according to item 16 of the scope of patent application, wherein the top surface is configured as a fin structure. 20. The computer mainframe with auxiliary liquid cooling device according to item 16 of the scope of patent application, wherein the partition is a mainboard. Page 25