TWM341243U - Backplate for heat sink - Google Patents

Backplate for heat sink Download PDF

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Publication number
TWM341243U
TWM341243U TW097207194U TW97207194U TWM341243U TW M341243 U TWM341243 U TW M341243U TW 097207194 U TW097207194 U TW 097207194U TW 97207194 U TW97207194 U TW 97207194U TW M341243 U TWM341243 U TW M341243U
Authority
TW
Taiwan
Prior art keywords
motherboard
insulating
board
backplane
backboard
Prior art date
Application number
TW097207194U
Other languages
English (en)
Inventor
Jun-Cang Chen
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW097207194U priority Critical patent/TWM341243U/zh
Publication of TWM341243U publication Critical patent/TWM341243U/zh
Priority to US12/288,521 priority patent/US20090268395A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

M341243 八、新型說明: 、 【新型所屬之技術領域】 • 本創作係有關於—種散熱ϋ之背板,尤指-種可將背板接合於 主機板底部以增加主機板強度的散熱器之背板。 【先前技術】 按’隨著半導體技術的進步,積體電路的體積亦逐漸縮小,而 為了使積體電路能處理更多的資料,相同體積下的積體電路,已 I 經可以容納比以往多上數倍以上的树,當積體電路内的元件數 量越來越多時,it件卫作時所產生的熱能亦越來越大,以常見的 中央處理n為例’在兩滿載的工作量時,中央處理器的散發出的 熱度,足以使中央處理器整個燒毀,因此,積體電路的散_置 變成為重要的課題,故需於巾央處理H上增設—具散熱效果之散 熱單元如散熱器進行散熱,而此類散熱裝置鎖固於主機板上時, 因主機板係為PCB板製成,其板體之強度差,因此易造成主機板 因強力_扣喊生鎖扣區_彎輕形,甚至使域板因震動 •等不可遇知之外力而發生斷裂;為解決上述之缺失習知技術, 查,中華民國發明公開公報公開編號第200717217號之「背板組 合」發明專利前案中’請參閱第!目,揭露有一種背板組合,包 括抵罪在主機板2下表面之背板11,設於背板η上並可穿過主 機j 2之固定柱13,套設在固定柱13上並與主機板2上表面相 抵罪之彈性卡扣件14,藉由該固定柱13與彈性卡扣件Μ可將該 背板11固定於主機板2上,但惟在實際使用上仍有其問題存在, 5 M341243 當欲將背板固定於主機板上時,需 从 而要頜外糟由固定柱與彈性卡如 件之配合才可使背板與主機板_結合 刊 10 另者,月板與主機板間 而另W有-絕緣片12以作為絕 有下列之缺點·· ^故上逑習知技術具 1·結構複雜;
2·組裝不易,耗費工時 3·成本較高; 衫用品所衍生的各項缺點 j之月板」案,實為一具功效增進之創作。 【新型内容】 故曰創作人魏於上述缺失,乃搜集相騎料,經由多方評 估及考量,並以從事械行㈣積之多年經驗,經由不斷試作及 修改’始設計出此種散熱器之背板之新型專利者。 爰此,為解決上述習知技術之缺點,本創作之主要目的,係 提供一種可將背板直接膠合於該域板上,使主機板作移動時背 板不致脫落之結構。 本創作之^-目的,係提供—種可使背板與主機板接合時具 有絕緣效果之結構。 &為達上述之目的,係提供_種散熱器之背板,該背板係設於 主2板之㈣’其主要係於該背板上適當位置處設有-具有絕緣 麟由娜機該可接合於該主機板 6 M341243 上,以達__不贿錢雜與核_具魏緣之效果; 故本創作具有下列之優點·· 1·結構簡單; 2·結合迅速且容易,· 3·節省成本。 本創作之上述目的及其結構與功能上的特性,將依據所附圖 式之較佳實施例予以說明。 【實施方式】 本創作係提供-種散熱H之她,圖稀為本創作較佳實施 例,請參閱第2、3圖,如圖所示該散熱器之背板3係接合於主 機板4之_,於該背板3上適#位置處設有—具魏緣性質且 具黏性之膠材5 ’背板3通常係以金屬㈣所製成,當該背板3 接合於主機板4之賴時,可能因背板3觸擊到主機板4背側之 電子鱗(财絲示)_發生短路之聽,故她3 4兩者之«要設有-具有絕緣性f之材料以作為絕叙用,备 該背板3接合於主機板4之背側時,可藉由該具有絕緣性質且且 黏性之騎5使該3可穩_合於社機板4上,並使主機板 4移動時背板3不脫落,且另可保持背板3與主機板4兩者間且 有絕緣之絲;習知猶巾背板如顧定於域板之背側,需額 外增設固定柱與彈性之扣件作配合,另為使背板與主機板兩者間 具有絕緣之效果也亦須於喊間增設—絕緣片,故本創作藉由於 背板上所設置之具桃雜質且郷性之膠材即可達成^知技 M341243 同時又令背板與主機板 術中欲達到將背板接合於主機板之背側, 間具有絕緣之效果。 請參閱第4、5圖,如圖所示該背板3之表面 設有具有絕緣性狀材料6,雜魏緣性狀材料 背板3表面之局部部位上,背板3之表面上另設有—具黏性之膠 材7,當§_ 3接合於主機板4之背側時,係藉由具黏性之膠 材7將該背板3接合於主機板4之背側上,同時另藉由設於該背 板3表面上之嫌卿之娜輸㈣與主機板2 者間發生短路之現象。 凊參閱第6、7圖’如騎示係於背板3之表面上適當位置處 設有一層具有崎㈣讀料6,躲該具魏緣㈣之材料6 上設置—餘性之騎7,透獅具魏緣性質之材料6可防止 背板3餘她4騎間發生姆之現象,再義絲性之膠材 7將該背板3接合於主機板4之背侧上。 而陳明者’以上所述僅為本案之較佳實施例,並非用以限制本 創作’讀本鋪之構想所叙改變,在不麟本創作精神範圍 内例如·對於構形或佈置型態加以變換,對於各種變化,修飾 ”應用,所產生等效作用,均應包含於本案之權利範圍内,合予 陳明。 、、、所述本創作之散熱器之背板於使用時,為確實能達到其 功效及目的’故本創作誠為—實雜優異之創作,為符合新型專 利之申請要件,爰依法提出申請,盼轉早日賜准本案,以保 M341243 请不吝來函 障創作人之辛苦_,倘若肖局審委有任何稽疑 • 指不,創作人定當竭力配合,實感德便。 ‘ 【圖式簡單說明】 第1圖係為習知技術之立體分解圖。 第2圖係為本創作之較佳實施例之立體分解圖。 .第3圖係為本創作之較佳實施例之組合剖面圖。 « 4 _為本創作之另—實施例之背板立體圖。 _ 帛5 0係為本創作之另—實施例之組合剖面圖。 第6圖係為本創作之另—實施例之背板立體圖。 第7圖係為本創作之另一實施例之組合剖面圖。 【主要元件符號說明】 背板3 主機板4 具有絕緣性質且具黏性之膠材5 具有絕緣性質之材料β 具黏性之膠材7

Claims (1)

  1. M341243 九、申請專利範圍: • 1· -種散熱II之背板,係設於主機板之賴,其主要特徵為:於該背 -板上之適當位置處設有一具有絕緣性質且具黏性之膠材,藉由該具 有絕緣性質且錄狀騎使該背板可接合_主機板上,以達到 移動時不脫落且使背板與主機板間具有絕緣之效果。 2· -種散熱II之背板,係設於主機板之賴,其主要特徵為··於該背 板上之適當位置處設有一具有絕緣性質之材料與一具黏性之膠材, •藉由該具黏性之膠材與該具有絕緣性質之材料使該背板可接合於該 主機板上,以達到移動時不脫落且使背板與主機板間具有絕緣之效 果。 3·如申請專利範圍第2項所述之散熱器之背板,其中係可於該背板上 先設有-層具有絕緣性質之材料,再於該具有絕緣性質之材料上設 一層具黏性之膠材。 4.如申請專利範圍第2項所述之雜器之背板,其中係可僅於該背板 攀.局部部位上設有該具有絕緣性質之材料。
TW097207194U 2008-04-25 2008-04-25 Backplate for heat sink TWM341243U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097207194U TWM341243U (en) 2008-04-25 2008-04-25 Backplate for heat sink
US12/288,521 US20090268395A1 (en) 2008-04-25 2008-10-21 Backplate for heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097207194U TWM341243U (en) 2008-04-25 2008-04-25 Backplate for heat sink

Publications (1)

Publication Number Publication Date
TWM341243U true TWM341243U (en) 2008-09-21

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ID=41214800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097207194U TWM341243U (en) 2008-04-25 2008-04-25 Backplate for heat sink

Country Status (2)

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US (1) US20090268395A1 (zh)
TW (1) TWM341243U (zh)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module
TW582568U (en) * 2001-12-12 2004-04-01 Hon Hai Prec Ind Co Ltd Fixing apparatus of back-plate
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
JP2003289191A (ja) * 2002-03-28 2003-10-10 Denso Corp 電子制御装置
TW584218U (en) * 2002-06-06 2004-04-11 Hon Hai Prec Ind Co Ltd Mounting device for heat sink
US6826054B2 (en) * 2002-09-09 2004-11-30 Hon Hai Precision Ind. Co., Ltd. Heat sink clip assembly
CN2727956Y (zh) * 2004-07-06 2005-09-21 鸿富锦精密工业(深圳)有限公司 散热器扣合装置
US20070121300A1 (en) * 2005-11-29 2007-05-31 Wan-Lin Xia Back plate assembly for mounting a heat sink assembly to a motherboard
US7468889B2 (en) * 2006-05-04 2008-12-23 Adlink Technology Inc. Thermal module fastener for server blade
US7474530B2 (en) * 2007-01-10 2009-01-06 Sun Microsystems, Inc. High-load even pressure heatsink loading for low-profile blade computer applications

Also Published As

Publication number Publication date
US20090268395A1 (en) 2009-10-29

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MM4K Annulment or lapse of a utility model due to non-payment of fees