TWM341243U - Backplate for heat sink - Google Patents
Backplate for heat sink Download PDFInfo
- Publication number
- TWM341243U TWM341243U TW097207194U TW97207194U TWM341243U TW M341243 U TWM341243 U TW M341243U TW 097207194 U TW097207194 U TW 097207194U TW 97207194 U TW97207194 U TW 97207194U TW M341243 U TWM341243 U TW M341243U
- Authority
- TW
- Taiwan
- Prior art keywords
- motherboard
- insulating
- board
- backplane
- backboard
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
M341243 八、新型說明: 、 【新型所屬之技術領域】 • 本創作係有關於—種散熱ϋ之背板,尤指-種可將背板接合於 主機板底部以增加主機板強度的散熱器之背板。 【先前技術】 按’隨著半導體技術的進步,積體電路的體積亦逐漸縮小,而 為了使積體電路能處理更多的資料,相同體積下的積體電路,已 I 經可以容納比以往多上數倍以上的树,當積體電路内的元件數 量越來越多時,it件卫作時所產生的熱能亦越來越大,以常見的 中央處理n為例’在兩滿載的工作量時,中央處理器的散發出的 熱度,足以使中央處理器整個燒毀,因此,積體電路的散_置 變成為重要的課題,故需於巾央處理H上增設—具散熱效果之散 熱單元如散熱器進行散熱,而此類散熱裝置鎖固於主機板上時, 因主機板係為PCB板製成,其板體之強度差,因此易造成主機板 因強力_扣喊生鎖扣區_彎輕形,甚至使域板因震動 •等不可遇知之外力而發生斷裂;為解決上述之缺失習知技術, 查,中華民國發明公開公報公開編號第200717217號之「背板組 合」發明專利前案中’請參閱第!目,揭露有一種背板組合,包 括抵罪在主機板2下表面之背板11,設於背板η上並可穿過主 機j 2之固定柱13,套設在固定柱13上並與主機板2上表面相 抵罪之彈性卡扣件14,藉由該固定柱13與彈性卡扣件Μ可將該 背板11固定於主機板2上,但惟在實際使用上仍有其問題存在, 5 M341243 當欲將背板固定於主機板上時,需 从 而要頜外糟由固定柱與彈性卡如 件之配合才可使背板與主機板_結合 刊 10 另者,月板與主機板間 而另W有-絕緣片12以作為絕 有下列之缺點·· ^故上逑習知技術具 1·結構複雜;
2·組裝不易,耗費工時 3·成本較高; 衫用品所衍生的各項缺點 j之月板」案,實為一具功效增進之創作。 【新型内容】 故曰創作人魏於上述缺失,乃搜集相騎料,經由多方評 估及考量,並以從事械行㈣積之多年經驗,經由不斷試作及 修改’始設計出此種散熱器之背板之新型專利者。 爰此,為解決上述習知技術之缺點,本創作之主要目的,係 提供一種可將背板直接膠合於該域板上,使主機板作移動時背 板不致脫落之結構。 本創作之^-目的,係提供—種可使背板與主機板接合時具 有絕緣效果之結構。 &為達上述之目的,係提供_種散熱器之背板,該背板係設於 主2板之㈣’其主要係於該背板上適當位置處設有-具有絕緣 麟由娜機該可接合於該主機板 6 M341243 上,以達__不贿錢雜與核_具魏緣之效果; 故本創作具有下列之優點·· 1·結構簡單; 2·結合迅速且容易,· 3·節省成本。 本創作之上述目的及其結構與功能上的特性,將依據所附圖 式之較佳實施例予以說明。 【實施方式】 本創作係提供-種散熱H之她,圖稀為本創作較佳實施 例,請參閱第2、3圖,如圖所示該散熱器之背板3係接合於主 機板4之_,於該背板3上適#位置處設有—具魏緣性質且 具黏性之膠材5 ’背板3通常係以金屬㈣所製成,當該背板3 接合於主機板4之賴時,可能因背板3觸擊到主機板4背側之 電子鱗(财絲示)_發生短路之聽,故她3 4兩者之«要設有-具有絕緣性f之材料以作為絕叙用,备 該背板3接合於主機板4之背側時,可藉由該具有絕緣性質且且 黏性之騎5使該3可穩_合於社機板4上,並使主機板 4移動時背板3不脫落,且另可保持背板3與主機板4兩者間且 有絕緣之絲;習知猶巾背板如顧定於域板之背側,需額 外增設固定柱與彈性之扣件作配合,另為使背板與主機板兩者間 具有絕緣之效果也亦須於喊間增設—絕緣片,故本創作藉由於 背板上所設置之具桃雜質且郷性之膠材即可達成^知技 M341243 同時又令背板與主機板 術中欲達到將背板接合於主機板之背側, 間具有絕緣之效果。 請參閱第4、5圖,如圖所示該背板3之表面 設有具有絕緣性狀材料6,雜魏緣性狀材料 背板3表面之局部部位上,背板3之表面上另設有—具黏性之膠 材7,當§_ 3接合於主機板4之背側時,係藉由具黏性之膠 材7將該背板3接合於主機板4之背側上,同時另藉由設於該背 板3表面上之嫌卿之娜輸㈣與主機板2 者間發生短路之現象。 凊參閱第6、7圖’如騎示係於背板3之表面上適當位置處 設有一層具有崎㈣讀料6,躲該具魏緣㈣之材料6 上設置—餘性之騎7,透獅具魏緣性質之材料6可防止 背板3餘她4騎間發生姆之現象,再義絲性之膠材 7將該背板3接合於主機板4之背侧上。 而陳明者’以上所述僅為本案之較佳實施例,並非用以限制本 創作’讀本鋪之構想所叙改變,在不麟本創作精神範圍 内例如·對於構形或佈置型態加以變換,對於各種變化,修飾 ”應用,所產生等效作用,均應包含於本案之權利範圍内,合予 陳明。 、、、所述本創作之散熱器之背板於使用時,為確實能達到其 功效及目的’故本創作誠為—實雜優異之創作,為符合新型專 利之申請要件,爰依法提出申請,盼轉早日賜准本案,以保 M341243 请不吝來函 障創作人之辛苦_,倘若肖局審委有任何稽疑 • 指不,創作人定當竭力配合,實感德便。 ‘ 【圖式簡單說明】 第1圖係為習知技術之立體分解圖。 第2圖係為本創作之較佳實施例之立體分解圖。 .第3圖係為本創作之較佳實施例之組合剖面圖。 « 4 _為本創作之另—實施例之背板立體圖。 _ 帛5 0係為本創作之另—實施例之組合剖面圖。 第6圖係為本創作之另—實施例之背板立體圖。 第7圖係為本創作之另一實施例之組合剖面圖。 【主要元件符號說明】 背板3 主機板4 具有絕緣性質且具黏性之膠材5 具有絕緣性質之材料β 具黏性之膠材7
Claims (1)
- M341243 九、申請專利範圍: • 1· -種散熱II之背板,係設於主機板之賴,其主要特徵為:於該背 -板上之適當位置處設有一具有絕緣性質且具黏性之膠材,藉由該具 有絕緣性質且錄狀騎使該背板可接合_主機板上,以達到 移動時不脫落且使背板與主機板間具有絕緣之效果。 2· -種散熱II之背板,係設於主機板之賴,其主要特徵為··於該背 板上之適當位置處設有一具有絕緣性質之材料與一具黏性之膠材, •藉由該具黏性之膠材與該具有絕緣性質之材料使該背板可接合於該 主機板上,以達到移動時不脫落且使背板與主機板間具有絕緣之效 果。 3·如申請專利範圍第2項所述之散熱器之背板,其中係可於該背板上 先設有-層具有絕緣性質之材料,再於該具有絕緣性質之材料上設 一層具黏性之膠材。 4.如申請專利範圍第2項所述之雜器之背板,其中係可僅於該背板 攀.局部部位上設有該具有絕緣性質之材料。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097207194U TWM341243U (en) | 2008-04-25 | 2008-04-25 | Backplate for heat sink |
US12/288,521 US20090268395A1 (en) | 2008-04-25 | 2008-10-21 | Backplate for heat radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097207194U TWM341243U (en) | 2008-04-25 | 2008-04-25 | Backplate for heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM341243U true TWM341243U (en) | 2008-09-21 |
Family
ID=41214800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097207194U TWM341243U (en) | 2008-04-25 | 2008-04-25 | Backplate for heat sink |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090268395A1 (zh) |
TW (1) | TWM341243U (zh) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5708566A (en) * | 1996-10-31 | 1998-01-13 | Motorola, Inc. | Solder bonded electronic module |
TW582568U (en) * | 2001-12-12 | 2004-04-01 | Hon Hai Prec Ind Co Ltd | Fixing apparatus of back-plate |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
TW584218U (en) * | 2002-06-06 | 2004-04-11 | Hon Hai Prec Ind Co Ltd | Mounting device for heat sink |
US6826054B2 (en) * | 2002-09-09 | 2004-11-30 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip assembly |
CN2727956Y (zh) * | 2004-07-06 | 2005-09-21 | 鸿富锦精密工业(深圳)有限公司 | 散热器扣合装置 |
US20070121300A1 (en) * | 2005-11-29 | 2007-05-31 | Wan-Lin Xia | Back plate assembly for mounting a heat sink assembly to a motherboard |
US7468889B2 (en) * | 2006-05-04 | 2008-12-23 | Adlink Technology Inc. | Thermal module fastener for server blade |
US7474530B2 (en) * | 2007-01-10 | 2009-01-06 | Sun Microsystems, Inc. | High-load even pressure heatsink loading for low-profile blade computer applications |
-
2008
- 2008-04-25 TW TW097207194U patent/TWM341243U/zh not_active IP Right Cessation
- 2008-10-21 US US12/288,521 patent/US20090268395A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090268395A1 (en) | 2009-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |