M3 3 9027 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種超微型電胞纟士姓 包物結構，尤指一鞴 丨 用機殼中相互層疊之電路板，使電腦处 功效者。 电細結構達到超微型化之 【先前技術】M3 3 9027 VIII. New description: [New technical field] This creation is about a super-miniature electric cellulite surname structure, especially a circuit board that is stacked on top of each other in a casing. Efficacy. The ultra-fine structure of the electric fine structure [Prior Art]
廣,件體積大、使用之電源供 以 大 因此，便有微型電腦之產生，雖然該微型電腦之可改 善上述個人電腦體積龐大所產生之缺點，但是由於之微型 ，腦因其中央處理H、電子晶片、光碟機、硬碟機、連接 器、按鍵及散熱單元皆設至於主機板之同一面上，且該散 熱單元係為一於中央處理器上配置有一散熱片，該散熱片 係貼覆於中央處理器上，另於該散熱片上組設有一風扇等 π件所構成，因此，該微行電腦即受其内部元件之限制， 機板體積大或零件編排不當並因各式排 線連接麵因，而致使該電腦主機架構體積龐大，盆中尤 ，”零件編排不當並使用各式排線連接所㈣之究·㈣ 、’如主機板經由排線連接光碟機、硬碟機、_器、電 源供應器、軟碟機等’其所浪費的空間甚至超過主機板、 光碟機、碟碟等之體積，此可謂電腦主機龐大之主因。Wide, large size, large power supply, so there is a micro-computer, although the micro-computer can improve the shortcomings of the above-mentioned personal computer, but because of the micro, the brain because of its central processing H, The electronic chip, the optical disk drive, the hard disk drive, the connector, the button and the heat dissipation unit are all disposed on the same side of the motherboard, and the heat dissipation unit is configured to have a heat sink disposed on the central processing unit, and the heat dissipation film is attached. On the central processing unit, another heat sink is provided with a π component such as a fan. Therefore, the micro-computer is limited by its internal components, and the board is bulky or improperly arranged and connected by various types of cables. Due to the surface, the computer mainframe architecture is bulky, especially in the basin. "The parts are not properly arranged and connected with various types of cables. (4)" (4), "If the motherboard is connected to the CD player, hard disk drive, _ via the cable Devices, power supplies, floppy drives, etc. 'The space was wasted even more than the size of the motherboard, CD player, disc, etc. This is the main reason for the huge computer host.
1無法再縮減其長度、寬度及高度，導致其體積無法再行 縮減，使得該微型電腦仍具有預定長度之體積，而無法實 現真正的微型化。 M339027 【新型内容】 因此，本創作之主要目的係在於，可利用機殼中相互 層疊之電路板,，使電腦結構達到超微型化之功效。 為達上述之目的，本創作係一種超微型電腦結構，包 含二端分別设有面板之機殼，該機殼之外側係具有多數 散熱鰭片體；至少二相互層疊設於機殼中之電路板，各電 路板士係分別設有一連接埠，且各電路板上係設有電子晶 片、件、儲存單元、及對應設於面板上之按鍵部與 外接連接器，而哕命工 一 、 吻兒子晶片係與機殼内部之一面接觸；以 及’、各連接崞電性連接使電路板進行相互連結之連結介 面0 【實施方式】 乐一、二及第三圖』所示，係分別為本創作 第了實^例之立體分解示意圖、本創作第-實施例之立體 外觀不思圖及本創作第二圖之A-A音J Φ示意圖。如圖所 示.本幻作係—種超微型電腦結構，係由-機殼1、至少 二電路板2、3 w X； ^ 、胃^ Μ及一連結介面4所構成。 上述斤提之機殼1其二端係分別設有一面板1 1，且 該機殼=外侧係具有多數散熱Μ片體1 2，而該機殼1 係由一上盍1 3及—下蓋14所構成’該上蓋1 3之二側 係分別向下延伸有—對接部丄3 i，而該下蓋i 4之二端 緣係分別設有1對接部1 3 1對應滑設之喪槽141。 各電路板2、3係相互層疊設於上述機殼1中，且各 M339027 $路板2、3上係分別設有一連接埠2 i、3 i，並於各 電$板2、3上係設有電子晶片2 2、電子元件2 3、儲 存單元2 4、及對應設於面板1 1上之按鍵部2 5與外接 連接器2 6，而該電子晶片2 2係與機殼1内部之一面接 觸’另各電路板2、3之間係配合多數固定柱2 7加以固 接。 該連結介面4係與上述各電路板2、3上之連接琿2 • 電性連接’使各電路板2、3進行相互連結，而 μ、、、u面4係可為介面卡、連接器或排線。如是，藉由 上述=結構構成-全新之超微型電腦結構。 胃本創作純料，係可將電子^ 2 2、電子元件 • 儲存單τ〇2 4、按鍵部2 5與外接連接器2 6依所 :設^相社電路板2、3上，以本實·而言，係將 子=片2 2 (中央處理器）、電子元件2 3及外接連接器 6 .又置於上層之電路板2上，使其定義為—域板，另 ⑩將相關好晶片22 (南橋晶片、北橋晶片）、t子元件2 3儲存單兀2 4及按鍵部2 5設於下層電路板3上，再 將上層之電路板2與上蓋13固接，該電子晶片22(中 央處理裔）係與上蓋工3之一面接觸，之後將上蓋工3以 ^、一側之對接部1 3丄滑設於下蓋之嵌槽中 $(本創作亦可料為上蓋丨3二侧直接以多數固定元件鎖 口於下蓋1 4上之方式做結合），最後再於機殼1之前、後 端面=別配合固定元件111設有一面板1i ，使面板1 將上盖1 3加以限位，如此，即可組裝結合成一超微型電 7 M339027 腦主機； 亥電子晶片2 2、電子元件 按鍵部2 5邀&枝土 储存早元2 4、 外接連接器26係可依 4 路板2、3仞¥ · 而义更其設置之電 置’且该電路板2亦可與下芸1 · 電子晶片2 ? r *山各 、卜風1 4固接，使 2 (中央處理器）亦可與下蓋1 4之 更可將下層電路板3 (或上μ路μ w4之—面接觸， 擷取、音致m)⑼成具有影像 以使:創作能更符合實際使用時之所需。電路板， 考田t電略板2、3啟動時，其上之電子晶片2 2 (中 央^理器或南、北橋晶片）則會產生之熱源，此時，該電 子曰曰片2 2上之熱源則會由上蓋1 3之底面傳導至頂面 ^ 熱源^由上蓋1 3及其所設之各多數散熱|奮片丄2 /、 W兄也成大面積之接觸接觸，而快速將熱源進行散 逸，！:達到較佳之散熱功效。 乡閱弟四及第五圖』所示，係分別為本創作第二 貝知例之立體分解示意圖及本創作第二實施例之立體外觀 τ思、® °如圖所示：本創作除上述第一實施例之結構型態 外’亦可於該機殼1外側之適當位置處係設有多數滑槽1 5 ’ ^至少二滑槽1 5中係分別設有二對應之固定板1 6 ’且二固定板1 6間係設置一網體1 7，並於該網體1 7上設有—風扇5，而該風扇5除可設置於該機殼1之前 方位置處進行相關之散熱之外，亦可依據欲散熱位置或實 際使用狀況之所需而設置於機殼1之後方位置處，或同時 並排多個風屬5 (圖未示），藉以靈活運用於所需散熱之位 M339027 置處； 菖上蓋13所吸收之敎源 體1 2上，.即可利用風ϋ以導、機殼1之各散熱鰭月 熱鰭片體1 2上之埶诉以嘛而4、或吸取之方式，將各散 將熱源:進行散逸，:達到較佳之氣體之動作快速 種種缺點5利結構可有效改善習用之 逵到㈣麻 豐之電路板’使電腦結構 ίΓ=之功效’進而使本創作之產生能更進步、更 :„付口使用者之所須，確已符合新型專利申請之要 件，羑依法提出專利申請。 惟以上所述者，僅為本創作之較佳實施例而已 ，當不 忐以此限定本創作實施之範圍；故，凡依本創作申請專利 fc圍及新型說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本創作專利涵蓋之範圍内。 Φ 【圖式簡單說明】 第一圖，係本創作第一實施例之立體分解示意圖。 第二圖，係本創作第一實施例之立體外觀示意圖。 第三圖，係本創作第二圖之A-A剖面示意圖。 第四圖，係本創作第二實施例之立體分解示意圖。 第五圖，係本創作第二實施例之立體外觀示意圖。 【主要元件符號說明】 機殼 1 M339027 面板 固定元件 散熱鰭片體 上蓋 對接部 下蓋 欲槽 滑槽 固定板 網體 電路板 連接埠 電子晶片 電子元件 儲存單元 按鍵部 外接連接器 固定柱 連結介面 風扇1 It is no longer possible to reduce its length, width and height, so that its volume can no longer be reduced, so that the microcomputer still has a predetermined length and cannot achieve true miniaturization. M339027 [New content] Therefore, the main purpose of this creation is to make the computer structure super-miniature by utilizing the circuit boards stacked in each other in the casing. In order to achieve the above purpose, the present invention is an ultra-micro computer structure comprising a casing with a panel at each end, the outer side of the casing having a plurality of fins; at least two circuits stacked on each other in the casing The board and each circuit board are respectively provided with a connection port, and each circuit board is provided with an electronic chip, a piece, a storage unit, and a corresponding button part and an external connector disposed on the panel, and a life-saving one, a kiss The son wafer system is in surface contact with one of the inside of the casing; and the connection interface of each of the electrical connections to interconnect the circuit boards is 0. [Embodiment] Le, 2, and 3 are respectively shown The three-dimensional exploded view of the first example of the creation, the three-dimensional appearance of the first embodiment of the present invention, and the schematic diagram of the AA sound J Φ of the second figure of the present creation. As shown in the figure, the illusion system is an ultra-micro computer structure composed of a casing 1, at least two circuit boards 2, 3w X; ^, a stomach, and a joint interface 4. The casing 1 of the above-mentioned casing 1 is respectively provided with a panel 1 1 and the casing has a plurality of heat-dissipating fins 12 on the outer side, and the casing 1 is composed of an upper casing 13 and a lower cover. The two sides of the upper cover 13 are respectively extended with the abutting portion 丄3 i, and the two end edges of the lower cover i 4 are respectively provided with a pair of joint portions 1 3 1 corresponding to the sliding slot. 141. The circuit boards 2 and 3 are stacked on each other in the casing 1 , and each of the M339027 $ way boards 2 and 3 is provided with a connection 埠 2 i, 3 i respectively, and is connected to each of the electric boards 2 and 3 An electronic chip 2, an electronic component 2 3, a storage unit 24, and a corresponding button portion 25 and an external connector 2 6 disposed on the panel 1 1 are provided, and the electronic chip 2 2 is connected to the inside of the casing 1 One side contacts 'the other boards 2, 3 are fixed with a plurality of fixing posts 27 to be fixed. The connection interface 4 is connected to the connection 珲2 on each of the circuit boards 2 and 3, • electrically connected to each other, and the circuit boards 2 and 3 are connected to each other, and the μ, u, and 4 sides can be interface cards and connectors. Or cable. If so, by the above = structure constitutes a new ultra-micro computer structure. The stomach is created purely, the electronic ^ 2 2, electronic components • storage single τ 〇 2 4, the button part 2 5 and the external connector 2 6 according to: set ^ xiang social circuit board 2, 3, to this In fact, the sub-chip 2 2 (central processing unit), the electronic component 23 and the external connector 6 are placed on the upper circuit board 2, which is defined as a domain board, and the other 10 will be related. A good wafer 22 (a south bridge wafer, a north bridge wafer), a t sub-element 2 3 storage unit 2 4 and a button portion 25 are disposed on the lower circuit board 3, and then the upper circuit board 2 and the upper cover 13 are fixed, the electronic chip 22 (Central Processing) is in contact with one of the top cover 3, and then the upper cover 3 is slid into the undercut of the lower cover by the butt joint 1 3 一侧 (this creation can also be considered as the upper cover 丨3, the two sides are directly combined with the majority of the fixed component locks on the lower cover 14), and finally the front and rear end faces of the casing 1 are provided with a panel 1i, so that the panel 1 will be covered 1 3 to limit, so that you can assemble and combine into a micro-electric 7 M339027 brain host; Hai electronic chip 2 2, electronic components button 2 5 invite & Storage early 2 4, external connector 26 can be based on 4 boards 2, 3 仞 ¥ · · and its set of electric ' and the board 2 can also be with the lower · 1 · electronic chip 2 ? r * mountain Each of the winds and the winds 1 4 is fixed so that the 2 (central processing unit) can also be connected to the lower layer circuit board 3 (or the upper surface of the μ μ channel μ w4) with the lower cover 14 (draw, sound m) (9) The image has an image to make the creation more suitable for the actual use. The circuit board, when the Kadada t-board 2, 3 is started, the electronic chip 2 2 (the central controller or the south and north bridge wafers) on the board will generate a heat source. At this time, the electronic chip 2 2 The heat source is conducted from the bottom surface of the upper cover 13 to the top surface. The heat source is provided by the upper cover 13 and the majority of the heat dissipation provided by the upper cover 1 and the W brother. Dissipate,! : Achieve better heat dissipation. As shown in the fourth and fifth pictures of the township, the three-dimensional decomposition diagram of the second example of the creation and the three-dimensional appearance of the second embodiment of the creation are as shown in the figure: In the outer configuration of the first embodiment, a plurality of chutes may be provided at appropriate positions on the outer side of the casing 1. At least two chutes 15 are respectively provided with two corresponding fixing plates 16 'The second fixed plate 16 is provided with a net body 17 and a fan 5 is disposed on the net body 17. The fan 5 can be disposed at a position in front of the casing 1 for heat dissipation. In addition, it can be placed at the rear position of the casing 1 according to the desired heat dissipation position or the actual use condition, or at the same time, a plurality of winds 5 (not shown) are arranged side by side, so as to be flexibly used for the required heat dissipation position. M339027 is placed; 菖 菖 菖 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收In the way of sucking, the heat source will be dissipated: dissipating: the action of achieving better gas is fast and various shortcomings. 5 The structure can be effectively improved. After the use of (4) Ma Feng's circuit board 'to make the computer structure Γ 之 之 之 功效 进而 进而 进而 进而 进而 进而 进而 进而 进而 进而 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本Patent application is filed according to law. However, the above is only the preferred embodiment of this creation, and it is not limited to the scope of this creation; therefore, it is based on the content of this patent application and the new manual. Simple equivalent changes and modifications should still fall within the scope of this creation patent. Φ [Simple description of the diagram] The first diagram is a three-dimensional decomposition diagram of the first embodiment of the creation. The third embodiment is a schematic cross-sectional view of the second embodiment of the present invention. The fourth figure is a perspective exploded view of the second embodiment of the present creation. The fifth figure is the second implementation of the present creation. Schematic diagram of the three-dimensional appearance of the example. [Main component symbol description] Case 1 M339027 Panel fixing component Heat sink fin cover Upper cover Butt cover Lower slot Slot fixing plate Net board connection Port electronic chip electronic part storage unit key portion external interface connector connected to the fan mounting post