M277978 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種微型電腦之外導熱式散熱裝置，特 別指應用於微型電腦中央處理器晶片或其他晶片，可將熱 導引至機殼排除之導熱式散熱裝置改良。 【先前技術】 0 按，時下電腦科技發展日新月異，特別在微米技術及 晶片精密構裝技術越驅成熟之下，單一晶片多具有強大的 . 運算、儲存等功能，且單一晶片構裝體積更臻精小，因而 能在單一電腦主機板（Mo t he rb 〇 a r d)結合多 數特定功能的晶片（俗稱onboard)，除了改善傳統 桌上型電腦主機板必組裝顯示卡、音效卡、網路卡及其他 特定功能板卡的繁瑣結構及程序外，同時能縮減主機板的 尺寸、規格，達成電腦主機精巧化及多功能效果，例如單 • 一主機板常可包含有顯示晶片、音效晶片、網路晶片等， 甚至於中央處理器亦可直接焊設於主機板上；另因應現今 消費者各種不同使用需求，以及使用電腦產品使用方便、 不佔空間的要求，將上述包含多種功能晶片的單一主機板 ' 構裝技術完全運用，並組裝於一縮小體積機殼的微型電腦 _ 主機，即應運而生（參閱第二圖所示）。 由於微型電腦主機機殼相當精小，僅容於内部組裝一 主機板、中央處理器、記憶體及必要的磁碟機，有關中央 處理器或其他晶片的散熱需求，已無法採用傳統桌上型電 M277978 '腦散熱裝置，亦即習知一散熱座上疊設一風扇的高聳散熱 結構，必需另行採用適合於微型電腦主機的散熱裝置，避 免為了增設散熱裝置而再度加大機殼體積，並達成協助中 央處理器或其他晶片散熱功能，俾維持電腦主機運作的穩 定性。 « 【創作内容】 _ 本案創作人鑑於習知桌上型電腦主機的高聳散熱裝置 結構，未能符合新型態微型電腦主機的特殊使用需求，乃 . 竭其心智悉心研究克服，憑藉從事微型電腦主機設計、生 產、製造的多年實務經驗，終於完成本案微型電腦之導熱 式散熱裝置。 本創作主要目的，係在提供一種微型電腦之外導熱式 散熱裝置，特別指一種利用散熱板與特殊散熱結構的散熱 機殼應用實施，以及中央處理器晶片或其他晶片組裝結構 • 進一步的改良，組成可將熱快速傳遞至散熱機殼排出之微 型電腦外導熱式散熱裝置，俾達成適於微型電腦主機使用 ，並獲致縮小微型電腦體積、縮短傳熱距離、以及增進散 熱功率等多重功效。 依上述目的，本創作之實施内容係包括一主機板、一 — 轉接基板、一散熱板及一散熱機殼所組成，其中：該主機 板係於選定處設有一開孔，於主機板正面開孔侧設有第一 電連接器；該轉接基板係應用可任意插接或拆卸的第二電 連接器組裝於主機板正面之第一電連接器，於轉接基板背 M277978 面焊設有處理器晶片或可供處理器晶片插植之第三電連接 器，使處理器晶片反置於主機板之開孔中；而該散熱板係 結合於主機板背面與處理器晶片表面接觸，並令散熱板與 特殊散熱結構的散熱機殼内面接觸，藉此組成散熱板可將 熱傳導至散熱機殼排出之微型電腦外導熱式散熱裝置。 【實施方式】 $ 為使貴審查委員瞭解本創作之目的、特徵及功效， 茲藉由下述具體之實施例，並配合所附之圖式，對本創作 . 做一詳細說明，說明如后： 如附圖所示，本創作所為『微型電腦之外導熱式散熱 裝置』，係包括一微型電腦之主機板1、一轉接基板2、一 散熱板3及一散熱機殼4所組成，其中： 主機板1，參閱第一圖所示，係一種微型電腦專用之 特殊規格主機板（Μ 〇 t h e r b 〇 a r d )，係於電路板 鲁正面設有各式晶片（例如顯不晶片、音效晶片、網路晶片 等等）、各種介面插槽、連接埠及其他必要電子元件，並可 提供任意安裝中央處理器晶片（簡稱C P U)者，因係為 習知技術的物品，故不另贅述；惟本創作係於主機板1選 " 定處設有至少一貫穿至背面之開孔1 1，於主機板1正面 β 之開孔1 1一侧或二側並設有第一電連接器1 2，俾提供 下述轉接基板2快速插接使用； 轉接基板2，參閱第一圖至第三圖所示，係可為一印 刷電路基板，於背面設有至少一個可匹配上述第一電連接 M277978 器1 2進行插接之第二電連接器2 1，令轉接基板2平行 插設於主機板1正面覆蓋住開孔1 1，另於轉接基板2背 面設有一可供處理器晶片5 ( C P U)或其他晶片插植之 第三電連接器2 2，或直接焊設有一處理器晶片或其他晶 片，藉此使該處理器晶片5被反置於主機板1之開孔1 1 _ 中，且其表面露出於主機板1背面，俾透過第三電連接器 2 2、轉接基板2及第二電連接器2 1與主機板1構成電 I 性連接； 散熱板3，如第一圖至第三圖所示，係為一種導熱性 . 較佳的金屬板（例如銅板或銘板或其他金屬板材），乃平行 貼覆固定於主機板1背面，令散熱板3内面直接與處理器 晶片5表面貼合接觸，用以吸收處理器晶片5所產生的熱 能；其中，該散熱板3之外觀形狀不揭限於特定，而其固 設於主機板1背面之方式，包括可為内面選定處凸設有複 數定位件3 1，該定位件3 1可為一立柱，於定位件3 1 • 端部設有一鎖孔3 1 1供與主機板1鎖合，達成散熱板3 與主機板1定位組裝功能； 散熱機殼4，如第二圖及第三圖所示，係本創作微型 電腦的特殊尺寸、規格化的中空主機機殼，於散熱機殼4 ； 外面設有複數散熱鰭片4 1，可提供上述主機板1以及組 • 裝完成的轉接基板2、散熱板3容置於散熱機殼4内，並 令該散熱板3背面與散熱機殼4之内面貼合接觸，俾將散 熱板3所吸收的熱能傳遞至散熱機殼4排出； 藉上述微型電腦之主機板1、轉接基板2、散熱板3 M277978 及散熱機殼4之結構特徵及空間組裝關係，即組成本創作 微型電腦之外導熱式散熱裝置，藉該轉接基板2將處理器 晶片5熱能傳遞至散熱機殼4排出，達成適於微型電腦主 機使用，並獲致縮小微型電腦體積、縮短傳熱距離、並增 進散熱功率等效果。 β 藉本創作微型電腦之外導熱式散熱裝置設計，因將處 理器晶片5裝設於轉接基板2背面，再反置組裝於主機板 噶 0 1之開孔1 1中，使該處理器晶片5表面露出於主機板1 背面，並使該散熱板3可與處理器晶片5表面直接貼合接 觸，進一步將熱傳導至散熱機殼4排出，此其反置處理器 晶片5的外導熱式散熱裝置組裝結構，相當節省整體高度 空間，故有利於散熱機殼4再度縮小高度體積，俾符合現 今使用者要求電腦主機精小、不佔空間的需求；且本創作 外導熱式散熱裝置，除了可適用於精小的微型電腦主機之 外，尚因處理器晶片5與散熱機殼4之對外導熱、排熱距 φ 離更臻縮短，故有利於散熱功率之增進，俾進一步維持微 型電腦主機運作的穩定性。 另者，本創作微型電腦之外導熱式散熱裝置設計，係 將傳統處理器晶片5 (C P U )改良裝設於轉接基板2背 " 面，再透過該轉接基板2之第二電連接器2 1與主機板1 ' 之第一電連接器1 2插植構成電性連接，因此在該主機板 1或處理器晶片5規格變更或升級，導致主機板1與處理 器晶片5之傳輸介面不相容時，仍可透過轉接基板2方便 拆換功能，替換可相容於主機板1及處理器晶片5之轉接 M277978 基板2 ’避免可以利用的處理裔晶片5被同時廢棄’故能 達成消費者經濟成本節省功效。 綜上所述，本創作所為『微型電腦之外導熱式散熱裝 置』，確具實用性與創作性，其技術手段之運用亦出於新穎 無疑，且功效與設計目的誠然符合，已稱合理進步至明。 為此，依法提出新型專利申請，惟懇請鈞局惠予詳審， 並賜准專利為禱，至感德便。 【圖式簡單說明】 第一圖為本創作局部分解狀態之立體示意圖。 第二圖為本創作組裝動作狀態之立體示意圖。 第三圖為本創作組成狀態之斷面示意圖。 【主要元件符號說明】 I .......主機板 II ......開孔 1 2......第一電連接器 2 .......轉接基板 2 1......第二電連接器 2 2......第三電連接器 3 .......散熱板 •定位件 鎖孔 4.......散熱機殼 M277978M277978 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a heat-conducting heat dissipation device other than a microcomputer, especially applied to a microcomputer central processor chip or other chip, which can direct heat to the case to be excluded Improved heat conduction heat sink. [Previous technology] 0 Press, computer technology development is changing with each passing day, especially under the maturity of micron technology and precision chip mounting technology, a single chip has more powerful functions such as computing, storage, etc. It is small, so it can combine most specific functions of chips (commonly called onboard) in a single computer motherboard (Mot he rb ard). In addition to improving the traditional desktop computer motherboard, a graphics card, sound card, and network card must be assembled. In addition to the cumbersome structure and procedures of other specific function boards, at the same time, it can reduce the size and specifications of the motherboard, and achieve compact and multifunctional effects of the computer host. For example, a motherboard can often include a display chip, audio chip, and network. Chip, etc., and even the central processing unit can be directly soldered on the motherboard. In addition, in response to the various needs of today ’s consumers, and the use of computer products is easy to use and does not take up space, the above-mentioned single chip with multiple functional chips is included. Motherboard's construction technology is fully applied and assembled in a minicomputer with a reduced size chassis Was born (see the second picture). Since the mainframe of a microcomputer is quite small, it can only be assembled with a motherboard, central processing unit, memory, and necessary disk drives. As for the heat dissipation requirements of the central processing unit or other chips, the traditional desktop type cannot be adopted. Electric M277978 'brain cooling device, that is, a towering cooling structure with a fan stacked on a conventional heat sink. It is necessary to separately adopt a cooling device suitable for a microcomputer host, to avoid increasing the volume of the cabinet again in order to add a cooling device, and To help the CPU or other chip cooling function, to maintain the stability of the computer host operation. «[Creation content] _ In view of the towering heat dissipation structure of the conventional desktop computer host, the creator of this case failed to meet the special use requirements of the new type of microcomputer host. However, he tried his best to overcome it and engaged in microcomputer With many years of practical experience in the design, production, and manufacture of the mainframe, the heat-conducting heat sink of the microcomputer in this case has finally been completed. The main purpose of this creation is to provide a heat-conducting heat dissipation device other than a microcomputer, especially a cooling case application implementation using a heat sink and a special heat dissipation structure, and a central processing unit chip or other chip assembly structure. • Further improvements, It is composed of a microcomputer external heat-conducting heat dissipation device that can quickly transfer heat to the heat dissipation casing and discharge, which is suitable for the use of a microcomputer host, and achieves multiple effects such as reducing the size of the microcomputer, shortening the heat transfer distance, and increasing heat dissipation power. According to the above purpose, the implementation content of this creation is composed of a motherboard, an adapter board, a heat sink, and a heat sink. Among them: the motherboard is provided with an opening at a selected location on the front of the motherboard. A first electrical connector is provided on the side of the opening; the adapter substrate is a first electrical connector assembled on the front of the motherboard using a second electrical connector that can be arbitrarily inserted or removed, and is soldered on the M277978 surface of the adapter substrate. There is a processor chip or a third electrical connector that can be inserted into the processor chip, so that the processor chip is placed in the opening of the motherboard; the heat sink is bonded to the back of the motherboard and contacts the surface of the processor chip. And the heat dissipation plate is brought into contact with the inner surface of the heat dissipation case of the special heat dissipation structure, thereby forming a microcomputer external heat conduction type heat dissipation device which can conduct heat to the heat dissipation case and discharged from the heat dissipation case. [Implementation] $ In order to make your reviewing committee understand the purpose, features, and effects of this creation, we will use the following specific examples and the accompanying drawings to make a detailed description of this creation. The description is as follows: As shown in the figure, the author's work is a "thermal conduction device other than a microcomputer", which consists of a microcomputer's main board 1, a transfer substrate 2, a heat sink 3, and a heat sink 4; ： Motherboard 1, as shown in the first figure, is a special specification motherboard (MOtherb ard) for microcomputers. It is equipped with various chips (such as display chips, sound chips, Network chip, etc.), various interface slots, ports, and other necessary electronic components, and can provide arbitrary installation of central processing unit chip (CPU for short), because it is a well-known technology article, so I will not repeat it; This creation is based on the selection of the motherboard 1. There are at least one opening 11 penetrating to the back, and one or two sides of the opening 11 on the front side of the motherboard 1 are provided with a first electrical connector 1 2. I provide the following transfers The connection substrate 2 is used for quick plug-in; the conversion substrate 2, as shown in the first to third figures, can be a printed circuit substrate. At the back, at least one M277978 can be matched to the first electrical connection. The second electrical connector 21 is inserted, so that the transfer substrate 2 is inserted in parallel on the front surface of the motherboard 1 to cover the opening 11 and a rear surface of the transfer substrate 2 is provided with a processor chip 5 (CPU) or The third electrical connector 22 inserted in other chips, or a processor chip or other chip is directly soldered, so that the processor chip 5 is reversely placed in the opening 1 1 _ of the motherboard 1, and its The surface is exposed on the back of the main board 1. Through the third electrical connector 2, 2, the transfer substrate 2, and the second electrical connector 21, the electrical connection is formed between the main board 1 and the heat sink 3, as shown in the first figure to the first. As shown in the three pictures, it is a kind of thermal conductivity. The better metal plate (such as copper plate or name plate or other metal plate) is fixed on the back of the main board 1 in parallel, so that the inner surface of the heat sink 3 is directly connected to the surface of the processor chip 5. Laminating contact for absorbing thermal energy generated by the processor chip 5; The appearance and shape of the hot plate 3 is not limited to a specific one, and the manner of being fixed on the back of the main board 1 includes a plurality of positioning members 31, which can be protruded for selected positions on the inner surface. The positioning members 31 can be a column for positioning. Part 3 1 • A lock hole 3 1 1 is provided at the end for locking with the main board 1 to achieve the positioning and assembly function of the heat sink 3 and the main board 1. The heat dissipation casing 4 is shown in the second and third figures. The special-sized, standardized hollow mainframe of this creative microcomputer is located in the heat-dissipating housing 4; a plurality of heat-dissipating fins 41 are provided on the outside, which can provide the above-mentioned mainboard 1 and the assembled transfer substrate 2 and heat dissipation. The plate 3 is accommodated in the heat dissipation case 4, and the back surface of the heat dissipation plate 3 is brought into close contact with the inner surface of the heat dissipation case 4, so that the heat energy absorbed by the heat dissipation plate 3 is transferred to the heat dissipation case 4 and discharged; The structural characteristics and space assembly relationship of motherboard 1, transfer board 2, heat sink 3, M277978, and heat sink 4 constitute the heat-conducting heat dissipation device outside the creative microcomputer, and the processor chip is transferred by the transfer board 2. 5 The thermal energy is transferred to the heat sink 4 and discharged, which is suitable for Host computers use, and reduce the microcomputer attainable volume, shorter transfer distance, and to increase the cooling power and the like into effect. β Based on this, I created a design of a heat-conducting heat dissipation device other than a microcomputer. Because the processor chip 5 is installed on the back of the transfer substrate 2 and then assembled in the opening 1 1 of the motherboard 0 1, the processor The surface of the chip 5 is exposed on the back of the motherboard 1, and the heat sink 3 can be directly attached to the surface of the processor chip 5 to further conduct heat to the heat dissipation case 4 and discharge it. The assembly structure of the heat-dissipating device saves the overall height space, so it is beneficial to reduce the height of the heat-dissipating casing 4 again, which is in line with the requirements of today's users who require the computer host to be small and take up no space. It can be applied to small microcomputer mainframes. The external heat conduction and heat dissipation distance φ of the processor chip 5 and the heat sink 4 are shortened, which is conducive to the improvement of heat dissipation power, and further maintains the microcomputer mainframe. Operational stability. In addition, the design of the heat-conducting heat-dissipating device outside the creation of the microcomputer is to improve the traditional processor chip 5 (CPU) and install it on the back " surface of the transfer substrate 2, and then through the second electrical connection of the transfer substrate 2 Device 2 1 and the first electrical connector 12 of the motherboard 1 ′ are planted to form an electrical connection. Therefore, the specification or upgrade of the motherboard 1 or the processor chip 5 results in the transmission of the motherboard 1 and the processor chip 5. When the interface is incompatible, you can still use the transfer board 2 to easily replace the function, and replace the compatible M277978 board 2 that is compatible with the motherboard 1 and the processor chip 5. 'Avoid the available processing chip 5 being discarded at the same time.' Therefore, it can achieve consumer economic cost savings. To sum up, this studio is a "heat-conducting heat dissipation device other than a microcomputer", which is indeed practical and creative. The use of its technical means is also novel and undoubted, and its efficacy and design purposes are in line with it. It has been called a reasonable progress. To Ming. To this end, a new type of patent application was filed in accordance with the law, but the Bureau is kindly requested to review it carefully and grant the patent as a prayer. [Schematic description] The first picture is a three-dimensional schematic diagram of the partial decomposition of the creation. The second picture is a three-dimensional schematic view of the state of the creative assembly action. The third figure is a schematic sectional view of the composition of the creation. [Description of main component symbols] I ....... Motherboard II ...... Opening hole 1 2 ...... First electrical connector 2 ....... Transfer board 2 1 ... Second electrical connector 2 2 ... Third electrical connector 3 ........ Heat sink • Locator lock hole 4 ....... Heat sink Shell M277978
散熱鰭片 處理器晶片Heat sink fin processor chip