201135427 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電腦系統，尤其涉及一種高密度存儲電 腦系統。 [先前技術] [0002]於電腦系統中’尤其是高密度存儲伺服器系統，通常設 有複數個硬碟機。所述複數個硬碟機藉由一背板與飼服 器系統中之主機板相連，從而為硬碟機提供電源及信號 傳輪功能。於習知技術中，所述背板垂直伺服器系統之 〇 主機板設置於所述聲數個硬碟棟及複數個系統散熱風屬 之間。祠服器系統外部之風流經過所述複數硬碟機及背 板流向所述系統散熱風扇"因此，所述背板垂直所述風 流方向，阻礙了風流之流通。若要得到較好之散熱效果 ’需要於背板上開設較多之散熱孔，以供風流流通。然 ，背板上之開孔率增加，將導致背板之層數增加，且線 路佈局難度增大。 【發明内容】 ^ [〇〇〇3]鑒於以上内容，有必要提供—種存儲密度高且散熱效果 良好之電腦系統。 [0004] 一種電腦系統，包括一機箱以及複數設置於所述機箱内 之硬碟機，所述機箱包括一底壁，所述底壁上安裝—主 機板，所述機箱内設置一平行所述主機板並與主機板電 性連接之背板，所述背板上插設複數個轉接卡，所述複 數個轉接卡分別與所述複數硬碟機對應連接。 [0005] 099110054 優選地，所述背板上設有複數個插槽，每—轉接卡包括 表單編號A0101 第3頁/共13頁 〇992〇17738-〇 201135427 [0006] [0007] [0008] [0009] [0010] [0011] 插接部及—第二插接部，每—硬碟機具有一介面 ^ 述第插接部與背板上對應之一個插槽相連，所述 第插接部與對應之硬碟機上之介面相連。 優k地，每—轉接卡具有一板體，所述第一插接部及第 一插接部分別設置於所述板體之兩相對侧。 優選地，所述複數硬碟機並列設置於所述機箱内，每相 鄰之兩個硬碟機之間形成一第一通風間隙。 優選地，所述機箱内裝設複數個散熱風扇，所述背板及 轉接卡設置於所述複數個風扇及所述複數個硬碟機之間 Ο 優選地，所述複數個轉接卡Jy列設置於所述背板上，每 相鄰之兩個轉接卡之間形成一第二通風間隙，所述第二 通風間隙分別與對應之第一通風間隙對齊，以供風流流 向所述散熱風扇。 優選地，所述風流沿所述第一，風間職及第二通風間隙 流向所述散熱風扇，所述背择平行所述風流之方向。 與習知技術相比，本發明電腦系統中’所述背板與機箱 之底壁平行，並平行所述風流方向，從而使機箱外部之 風流可以順暢之流向機箱内之主機板及電子元件，改善 了電腦系統之散熱效果。另外，將背板平行放置於機箱 底壁上，無需因散熱之需要於背板開設較多之散熱孔， 從而減少背板之層數’降低了線路佈局之難度。 099110054 【實施方式】 請參考圖1及圖2，本發明電腦系統10包括一機箱20、裝 表單編號A0101 第4頁/共13頁 0992017738-0 [0012] 201135427 «又於所述機箱2〇内之複數硬碟機5〇、及與所述複數硬碟 機50相連之背板7〇。 [0013] ❹ [0014] Ο [0015] 所述機箱20包括—底壁2卜所述底壁21上設置-主機板 30 °所述機箱2〇之前半部分用於容置所述複數硬碟機5〇 及为板70 ’所述機箱2〇之後半部分用於容置所述主機板 30及複數系統風扇8〇。其中，所述複數硬碟機5〇及所述 複數系統風扇80分別於所述機箱2〇内左右並排設置。所 述背板70位於所述複數硬碟機50及複數系統風扇80之間 。於一實施方式中，機箱2〇為一卯或仙規格之伺服器機 箱，並大致呈長方體形。 所述背板70包括一長形之板體71，所述板體71上設置複 數個並列設置之插槽73。每一插槽73上插設一轉接卡90 。所述轉接卡90具有一板體91。所述板體91具有相互垂 直之第一側邊及第二侧邊。所述第一侧邊延伸形成一第 一插接部911。所述第一插接部9iy^應插設於所述背板 7〇之插槽73上。所述第二侧邊凸設一第二插接部9丨3。每 〆硬碟機50 —侧設有一介面51，所述第二插接部913可對 典播設於所述硬碟機之介面51内。 請參閱圖3，安裝時’所述背板70之板體71平行所述機箱 2〇之底壁21及主機板3〇 ’並裝設於底壁21上’且與主機 板30形成電性連接。所述複數轉接卡90之第一插接部911 分别插設於所述背板70上之複數插槽73内。所述複數硬 碟機50分別從機箱2〇之前端插入。所述轉接卡90之第二 插接部913分別插設於所述複數硬碟機50之介面51内’從 而將所述複數硬碟機50連接至主機板，為硬磔機50提 099110054 表單編號A0101 第5頁/共13頁 0992017738-0 201135427 供電源及信號傳輸功能。 [0016] 請同時參閱圖4，每相鄰之兩個硬碟機50之間形成一第一 通風間隙53。每相鄰之兩個轉接卡90之間形成一第二通 風間隙93。所述複數第一通風間隙53分別與所述複數第 二通風間隙93對準，從而允許機箱20外部之風流經所述 第一通風間隙53及第二通風間隙93，並藉由所述複數系 統風扇80吹向主機板30，從而輔助所述主機板30上之電 子元件散熱。所述風流之方向如圖4中之箭頭所示。 [0017] 與習知技術相比，本發明電腦系統10中，所述背板70與 所述機箱20之底壁21及主機板30平行，並平行所述風流 方向，從而使機箱20外部之風流可以順暢之流向機箱20 内之主機板30及電子元件，改善了電腦系統10之散熱效 果。另外，將背板70平行放置於機箱20之底壁21上，就 無需因散熱之需要於背板70開設較多之散熱孔，從而減 少背板70之層數，降低了線路佈局之難度。 [0018] 綜上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0019] 圖1是本發明電腦系統之較佳實施方式之立體分解圖。 [0020] 圖2是圖1中之背板與轉接卡之主視示意圖。 [0021] 圖3是本發明電腦系統之較佳實施方式之立體組裝圖。 099110054 表單編號A0101 第6頁/共13頁 0992017738-0 201135427 [0022] 圖4是圖1中俯視示意圖。 【主要元件符號說明】 [0023] 電腦系統.1 0 [0024] 機箱：20 [0025] 底壁：21 [0026] 主機板：30 [0027] 硬碟機：50 ❹ [0028] 介面：51 [0029] 背板：70 [0030] ... . 板體：71 [0031] 插槽：7 3 [0032] 系統風扇：8 0 [0033] 轉接卡：90 Q [0034] 板體：Θ1 [0035] 第一插接部：911 [0036] 第二插接部：913 [0037] 第一通風間隙：53 [0038] 第二通風間隙：93 099110054 表單編號A0101 第7頁/共13頁 0992017738-0201135427 VI. Description of the Invention: [Technical Field] The present invention relates to a computer system, and more particularly to a high density storage computer system. [Prior Art] [0002] In a computer system, especially a high-density storage server system, usually a plurality of hard disk drives are provided. The plurality of hard disk drives are connected to the motherboard in the feeding system by a backplane to provide power and signal transmission functions for the hard disk drive. In the prior art, the motherboard of the backplane vertical server system is disposed between the sound hard disk ridges and a plurality of system heat dissipation winds. The wind flow outside the server system flows through the plurality of hard disk drives and the backboard to the system cooling fan " therefore, the backing plate is perpendicular to the direction of the wind flow, hindering the circulation of the wind flow. For better heat dissipation, you need to have more cooling holes on the backplane for airflow. However, an increase in the opening ratio on the backing plate will result in an increase in the number of layers of the backing plate and an increase in the layout of the wiring. SUMMARY OF THE INVENTION ^ [〇〇〇3] In view of the above, it is necessary to provide a computer system with high storage density and good heat dissipation effect. [0004] A computer system includes a chassis and a plurality of hard disk drives disposed in the chassis, the chassis includes a bottom wall, and the bottom wall is mounted with a motherboard, and the chassis is provided with a parallel And a plurality of riser cards that are electrically connected to the motherboard, and the plurality of riser cards are respectively connected to the plurality of hard disk drives. [0005] 099110054 Preferably, the backboard is provided with a plurality of slots, each of which includes a form number A0101, a third page, a total of 13 pages, 〇992〇17738-〇201135427 [0006] [0007] [0008] [0010] [0011] [0011] a plug portion and a second plug portion, each hard disk drive has an interface, and the first plug portion is connected to a corresponding slot on the backplane, the first plug The connector is connected to the interface on the corresponding hard disk drive. Preferably, each of the riser cards has a plate body, and the first plug portion and the first plug portion are respectively disposed on opposite sides of the plate body. Preferably, the plurality of hard disk drives are juxtaposed in the chassis, and a first ventilation gap is formed between each adjacent two hard disk drives. Preferably, the chassis is provided with a plurality of cooling fans, and the backboard and the adapter card are disposed between the plurality of fans and the plurality of hard disk drives. Preferably, the plurality of riser cards a Jy column is disposed on the backplane, and a second ventilation gap is formed between each adjacent two adapter cards, and the second ventilation gap is respectively aligned with the corresponding first ventilation gap for the wind flow to the Cooling fan. Preferably, the wind flow flows to the heat dissipation fan along the first, wind and second ventilation gaps, and the back direction is parallel to the direction of the wind flow. Compared with the prior art, in the computer system of the present invention, the back plate is parallel to the bottom wall of the chassis and parallel to the wind flow direction, so that the wind flow outside the chassis can smoothly flow to the motherboard and electronic components in the chassis. Improved the cooling effect of the computer system. In addition, the backplanes are placed in parallel on the bottom wall of the chassis, so that there is no need to open more heat dissipation holes in the backplane due to heat dissipation, thereby reducing the number of layers of the backplanes, which reduces the difficulty of the layout of the circuit. 099110054 [Embodiment] Referring to FIG. 1 and FIG. 2, the computer system 10 of the present invention includes a chassis 20, a form number A0101, a fourth page, a total of 13 pages, 0992017738-0 [0012] 201135427 «also in the chassis 2 The plurality of hard disk drives 5 and the back plate 7 connected to the plurality of hard disk drives 50. [0013] 机箱 [0015] The chassis 20 includes a bottom wall 2, and the bottom wall 21 is provided with a motherboard 30°. The front half of the chassis 2 is for accommodating the plurality of hard disks. The second half of the chassis 2 is used to accommodate the motherboard 30 and the plurality of system fans 8A. The plurality of hard disk drives 5 and the plurality of system fans 80 are respectively arranged side by side in the chassis 2 左右. The backplane 70 is located between the plurality of hard disk drives 50 and the plurality of system fans 80. In one embodiment, the chassis 2 is a server box of one or more specifications and has a substantially rectangular parallelepiped shape. The back plate 70 includes an elongated plate body 71, and the plate body 71 is provided with a plurality of slots 73 arranged side by side. A riser card 90 is inserted into each of the slots 73. The riser card 90 has a plate body 91. The plate body 91 has a first side and a second side that are perpendicular to each other. The first side edge extends to form a first plug portion 911. The first plug portion 9iy should be inserted into the slot 73 of the backboard 7〇. A second insertion portion 9丨3 is protruded from the second side. An interface 51 is disposed on each side of the hard disk drive 50. The second insertion portion 913 can be disposed in the interface 51 of the hard disk drive. Referring to FIG. 3, the board body 71 of the backboard 70 is parallel to the bottom wall 21 of the chassis 2 and the motherboard 3'' and is mounted on the bottom wall 21 and is electrically connected to the motherboard 30. connection. The first plug portions 911 of the plurality of riser cards 90 are respectively inserted into the plurality of slots 73 on the backboard 70. The plurality of hard disk drives 50 are inserted from the front end of the chassis 2, respectively. The second plugging portion 913 of the riser card 90 is respectively inserted into the interface 51 of the plurality of hard disk drives 50 to connect the plurality of hard disk drives 50 to the motherboard, and to provide the hard disk drive 50 with 099110054. Form No. A0101 Page 5 of 13 0992017738-0 201135427 Power and signal transmission functions. [0016] Referring to FIG. 4 at the same time, a first ventilation gap 53 is formed between each adjacent two hard disk drives 50. A second ventilation gap 93 is formed between each adjacent two riser cards 90. The plurality of first ventilation gaps 53 are respectively aligned with the plurality of second ventilation gaps 93, thereby allowing the wind outside the chassis 20 to flow through the first ventilation gap 53 and the second ventilation gap 93, and by the plurality of systems The fan 80 is blown toward the motherboard 30 to assist in dissipating heat from the electronic components on the motherboard 30. The direction of the wind flow is as indicated by the arrows in FIG. [0017] Compared with the prior art, in the computer system 10 of the present invention, the backboard 70 is parallel to the bottom wall 21 of the chassis 20 and the motherboard 30, and parallel to the wind flow direction, so that the exterior of the chassis 20 is The air flow can smoothly flow to the motherboard 30 and the electronic components in the chassis 20, improving the heat dissipation effect of the computer system 10. In addition, the backplanes 70 are placed in parallel on the bottom wall 21 of the chassis 20, so that there is no need to provide more heat dissipation holes in the backplane 70 due to heat dissipation, thereby reducing the number of layers of the backplane 70 and reducing the difficulty of circuit layout. [0018] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is an exploded perspective view of a preferred embodiment of a computer system of the present invention. 2 is a front elevational view of the backplane and the riser card of FIG. 1. 3 is a perspective assembled view of a preferred embodiment of the computer system of the present invention. 099110054 Form No. A0101 Page 6 of 13 0992017738-0 201135427 [0022] FIG. 4 is a top plan view of FIG. [Main component symbol description] [0023] Computer system.1 0 [0024] Chassis: 20 [0025] Bottom wall: 21 [0026] Motherboard: 30 [0027] Hard disk drive: 50 ❹ [0028] Interface: 51 [ 0029] Backplane: 70 [0030] ... . Board: 71 [0031] Slot: 7 3 [0032] System Fan: 8 0 [0033] Riser: 90 Q [0034] Board: Θ 1 [ 0035] First plug: 911 [0036] Second plug: 913 [0037] First ventilation gap: 53 [0038] Second ventilation gap: 93 099110054 Form number A0101 Page 7 / Total 13 pages 0992017738- 0