201211734 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種伺服器，更詳而言之，係關於一 種實現主機板熱插拔的伺服器。 【先前技術】 隨著電子科技的發展，伺服器已成為業界廣為使用的 資訊處理系統。伺務器中通常包括有主機板、電源供應器、 各式磁碟機、…等，而主機板是伺務器最核心的部分。 胃由於對伺務器功能需求的日益增加及體積日益小型 化，在同一機箱内安裝多個主機板的需求越來越多，而且 每一主機板本身的體積也越來越小，一方面要求實現主機 板的熱插拔，另一方面要求在有限的空間内在主機板上佈 設更多的零件，使得伺務器的設計和製造成本居高不下。 因而，如何設計一種伺服器，以實現於主機板上的熱 插拔，且又滿足在有限的空間内在主機板上佈設更多的零 ⑩件，進而降低設計和製造的成本，實為相關領域之業者目 前亟待解決之課題。 【發明内容】 鑒於上述習知技術之缺點，本發明之一目的在於提一 種伺服器，以實現於主機板上的熱插拔，並且降低設計和 製造成本。 為達上述目的及其他相關目的，本發明提供一種伺服 器，係包括：機箱，具有底板；硬碟陣列，可抽取地設於 該機箱的前端；多個主機板模組，可抽取地設於該機箱的 3 111618 201211734 後端，各該主機板模組具有：主機板，設有至少一第一連 接埠；承載盤，以承載該主機板；擴展架，固接於該承載 盤的一端；以及擴展卡，承載於該擴展架上，該擴展卡通 過第一電纜線與該第一連接埠電性連接，且該擴展卡於背 離該主機板的一端設有金手指；電源模組，與該些主機板 模組並排設置於該機箱的後端；以及轉接板，設於該機箱 内的該硬碟陣列與該些主機板模組之間，且平行於該機箱 的底板設置，該轉接板通過第二電纜線分別電性連接該硬 碟陣列與該電源模組，且該轉接板靠近該些主機板模組的 一端具有與該些金手指對應的多個第二連接璋，以供該些 金手指分別插置於該些第二連接槔中。 於本發明的一實施例中，該伺服器可包括風扇模組， 設於機箱内的該硬碟陣列與該轉接板之間，該風扇模組包 括多個風扇，該些風扇係對應於該些主機板模組的位置而 設置。該主機板模組可包括中央處理器、多個内存條以及 導風板，該中央處理器和該些内存條並排設置在該主機板 上該些風扇的出風側，該導風板的底部固定在該擴展卡 上，該導風板的後端卡設於該些内存條中相對靠近該中央 處理器的二者之間，其中最靠近該中央處理器的内存條與 該導風板共同形成導風面。 另外，該導風板的前端可具有延伸部，該延伸部延伸 至靠近於該風扇模組出風面的位置，並向該些内存條的方 向彎折，相應地，該擴展架的前端可具有開口，該導風板 的延伸部及該擴展卡的金手指外露於該開口。 4 111618 201211734 於本發明的另一實施例中，該擴展卡的邊緣可具有第 二穿孔，用以將該擴展卡螺接於該擴展架上，且該導風板 的底部可具有第一穿孔，對應於該擴展卡的第二穿孔設 置，從而可藉由依序穿過該第一和第二穿孔的螺絲鎖固該 - 導風板於該擴展卡上。該承載盤的前端及該擴展架的後端 均可設置折邊，該承載盤與該擴展架通過該些折邊鉚接在 一起。各該主機板模組可包括電池架，用以承載該主機板 模組使用的電池，該電池架具有至少二支撐腳，由該電池 w 架底面向下延伸，該二支撐腳分別可固定於該主機板和該 擴展卡上，俾令該電池架的底部分別隔開與該主機板與該 擴展卡。 再者，該主機板及該擴展卡的邊緣分別可具有第四穿 孔，以將該主機板與擴展卡分別螺接於該承載盤與擴展架 上，該電池架的該二支撐腳分別可具有對應於該些第四穿 孔的第三穿孔，從而可藉由依序穿過該些第三和第四穿孔 Φ 的螺絲鎖固該電池架於該主機板與擴展卡上。該伺服器可 包括兩固定架，該些固定架分別可固定於該機箱的兩側壁 上，用以固定該轉接板。該機箱的後端可具有多個隔板， 該些隔板可與該機箱的兩側壁平行，以將該機箱分割成多 個容置空間，各該隔板上可形成有軌道，用以分別引導該 些主機板模組和該電源模組進入該機箱的容置空間中。 如上所述，本發明之伺服器，具有分別可抽取式地設 於機箱的前、後兩端的硬碟陣列和主機板模組，以便於對 其實現熱插拔。該主機板模組具有用以承載主機板之承載 5 111618 201211734 』用以承载具有金手指的擴展卡之擴展架、以及用以電 I*連接4主機板與擴展卡的電纟覽線m線可以避免該 主機板的DfU虎文到傳遞路徑長度的影響而失真，故本發明 之主機板能通過擴展卡之金手指及其所插設之祠務器取得 聯繫’以降低伺務器的設計和製造成本，即本發明能有效 克服了 I知技射之種種缺失而具高度產業利用價值。 【實施方式】 /以下藉由特定的具體實例說明本發明之實施方式，熟 此技藝之人士可由本說明書所揭示之内容輕易地瞭解本 2月之其他優點與功效。本發明亦可藉由其他不同的具體 實例加以施行或應用，本說明書中的各項細節亦可基於不 同觀點與應用’在不恃離本發明之精神下進行各種修 變更。 請參閲第1及2圖’係為本發明之一實施例之饲服器 内部結構之局部分解圖。如圖所示，本實施例之祠服器ι 係至少由機箱11、硬碟陣列12、多個主機板模组13、電 源模組15、以及轉接板16所構成，構成元件的組成及連 接關係將於下詳述。應說明的是，本發明词服器内部結構 及配件數量並不以圖中所繪示者為限。 於本實施例中，該機箱U係至少由底板lu和兩側 壁113環繞而成。該硬碟陣列12包括—硬碟架，該硬碟竿 設置於該機箱U的前端，且可以插接多個硬碟，俾令該些 硬碟可抽取地設於該硬_列12中’即該些硬碟均；ϋ 箱11的前端進行插拔，以作為該伺服器丨内部資料存取之 ΙΠ618 6 201211734 用，若所需存取的資料量龐大，則可選擇增加所插接的硬 碟數量。 髻201211734 VI. Description of the Invention: [Technical Field] The present invention relates to a server, and more particularly to a server for implementing hot swapping of a motherboard. [Prior Art] With the development of electronic technology, the server has become an information processing system widely used in the industry. The server usually includes a motherboard, a power supply, various drives, etc., and the motherboard is the core part of the server. Due to the increasing demand for server functions and the increasing size of the stomach, there is an increasing demand for installing multiple motherboards in the same chassis, and the size of each motherboard itself is getting smaller and smaller. The hot plugging of the motherboard is required, and on the other hand, it is required to lay more parts on the motherboard in a limited space, so that the design and manufacturing cost of the server is high. Therefore, how to design a server to achieve hot plugging on the motherboard, and to meet more than 10 pieces on the motherboard in a limited space, thereby reducing the cost of design and manufacturing, is actually related fields The current issue of the industry is urgently needed. SUMMARY OF THE INVENTION In view of the above disadvantages of the prior art, it is an object of the present invention to provide a server for implementing hot swapping on a motherboard and reducing design and manufacturing costs. To achieve the above and other related objects, the present invention provides a server, comprising: a chassis having a bottom plate; a hard disk array detachably disposed at a front end of the chassis; and a plurality of motherboard modules detachably disposed at The rear panel of the 3111618 201211734 of the chassis, each of the motherboard modules has: a motherboard, at least one first connection port; a carrier disk for carrying the motherboard; an extension frame fixed to one end of the carrier disk; And the expansion card is carried on the extension frame, the expansion card is electrically connected to the first connection port through the first cable, and the expansion card is provided with a gold finger at an end facing away from the motherboard; the power module, and The motherboard modules are disposed side by side at the rear end of the chassis; and the adapter board is disposed between the hard disk array in the chassis and the motherboard modules, and is disposed parallel to the bottom plate of the chassis. The adapter board is electrically connected to the power module by the second cable, and the second end of the adapter board adjacent to the motherboard module has a plurality of second ports corresponding to the gold fingers. For these The gold fingers are respectively inserted into the second ports. In an embodiment of the invention, the server may include a fan module disposed between the hard disk array in the chassis and the adapter plate, the fan module including a plurality of fans, wherein the fans correspond to The positions of the motherboard modules are set. The motherboard module can include a central processing unit, a plurality of memory modules, and a wind deflector. The central processing unit and the memory modules are disposed side by side on the air outlet side of the fan on the motherboard, and the bottom of the air guiding plate Fixed on the expansion card, the rear end of the air deflector is disposed between the memory modules relatively close to the central processing unit, wherein the memory module closest to the central processing unit is shared with the air guiding plate Form the wind guiding surface. In addition, the front end of the air deflector may have an extending portion that extends to a position close to the air outlet surface of the fan module and is bent toward the memory strips. Accordingly, the front end of the expansion rack may be The opening has an opening, and the extension of the air deflector and the gold finger of the expansion card are exposed to the opening. 4111618 201211734 In another embodiment of the present invention, the edge of the expansion card may have a second through hole for screwing the expansion card to the extension frame, and the bottom of the air deflector may have a first perforation Corresponding to the second perforation setting of the expansion card, so that the air deflector can be locked on the expansion card by sequentially passing through the screws of the first and second perforations. The front end of the carrier tray and the rear end of the extension frame may be provided with a flange, and the carrier tray and the extension frame are riveted together by the flanges. Each of the motherboard modules may include a battery holder for carrying a battery used by the motherboard module. The battery holder has at least two supporting legs extending downward from a bottom surface of the battery w. The two supporting legs may be respectively fixed to the battery. On the motherboard and the expansion card, the bottom of the battery holder is separated from the motherboard and the expansion card. In addition, the edge of the motherboard and the expansion card may respectively have a fourth through hole, so that the motherboard and the expansion card are respectively screwed onto the carrier and the extension frame, and the two support legs of the battery holder may respectively have Corresponding to the third through holes of the fourth through holes, the battery frame can be locked on the motherboard and the expansion card by screws passing through the third and fourth through holes Φ in sequence. The server may include two fixing brackets respectively fixed to the two side walls of the chassis for fixing the adapter plate. The rear end of the chassis may have a plurality of partitions, and the partitions may be parallel to the two side walls of the chassis to divide the chassis into a plurality of accommodating spaces, and each of the partitions may be formed with a track for respectively The motherboard modules and the power module are guided into the accommodating space of the chassis. As described above, the server of the present invention has a hard disk array and a motherboard module which are respectively detachably provided at the front and rear ends of the chassis to facilitate hot swapping. The motherboard module has a carrying frame for carrying a motherboard 5 111618 201211734 』 an expansion frame for carrying an expansion card with a golden finger, and an electric cable for electrically connecting the 4 motherboard and the expansion card to the M* cable. The DfU of the motherboard can be prevented from being distorted by the influence of the length of the transmission path, so the motherboard of the present invention can be contacted by the gold finger of the expansion card and the server inserted therein to reduce the design of the server. And the manufacturing cost, that is, the invention can effectively overcome the various defects of the I knowing technology and has high industrial utilization value. [Embodiment] Hereinafter, embodiments of the present invention will be described by way of specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in the present specification. The present invention may be embodied or applied in various other specific embodiments, and the details of the present invention may be modified and modified without departing from the spirit and scope of the invention. 1 and 2 are partial exploded views of the internal structure of a feeding device according to an embodiment of the present invention. As shown in the figure, the server ι of the embodiment is composed of at least a chassis 11, a hard disk array 12, a plurality of motherboard modules 13, a power module 15, and an adapter plate 16, and the components and components are The connection relationship will be detailed below. It should be noted that the number of internal structures and accessories of the present invention is not limited to those shown in the drawings. In this embodiment, the chassis U is formed by at least a bottom plate lu and two side walls 113. The hard disk array 12 includes a hard disk shelf disposed at a front end of the chassis U and can be plugged into a plurality of hard disks so that the hard disks are detachably disposed in the hard_column 12 That is, the hard disks are all inserted; the front end of the box 11 is plugged and unplugged for use as the internal data access of the server ΙΠ 618 6 201211734, and if the amount of data to be accessed is large, the plugged-in can be selected. The number of hard drives.髻
此外，泫機箱11的後端具有兩個平行設置的隔板 112,以將該機箱11分割成多個容置空間，但應說明的是， 於該機箱11中所設置的隔板112數量，並不以兩個為限， 仍可依情況適度增減所設置的隔板112數量。如圖所示， 各邊隔板112上設有轨道，以引導各該主機板模組13與電 源模組15於第丨圖雙箭頭02的指向方向上進出入該機箱 11的後端，俾使該電源模組15與主機板模組13於該機箱 11的後端並排設置，以於該機箱u的後端上實現該主機 板模組13與電源模組15的熱插拔。 於本實施例中，各該主機板模組13均具有主機板 131擴展卡132、承載盤133、以及擴展架134。該主機 板131设有第一連接埠1314,用以提供與該擴展卡I”的 電性連接。該承載盤133具有承載面，用以承載該主機板 】31。該擴展架134係鉚接於該承載盤133的一端，使該承 載盤133與擴展架134結合成為一體，但不以此為限，亦 可選用螺接、銷接等固定方式結合兩者。該擴展卡132係 承載於該擴展架134上，並通過第—魏線14與該主機板 的第連接埠13M電性連接，俾藉由該第一電遭線Μ 連繫該主機板⑶與該擴展卡132，該擴展卡ΐ32於背離 该主機板131的1設有金手指1322。最佳的，該主機板 131上具有多個第—連料1314，用以完成該主機板⑶ 上所有7L件與㈣展卡132之間的紐連接，這樣主機板 1Π618 7 201211734 上各7G件的佈局及走線就不再受主 有限的主趟你办网+ 械板二間的限制，以在 有限的主械板空間内佈設更多的零件" 牡 的設計和製造成本。 有效即約伺務器 另言之，由於電纜線的導電性能 的i專遞，至於受到傳遞路徑長度的影響而過度至失直p:: 而e，右使用電纜線傳遞主機板北橋θ 一牛 將不會受_祕Μ度的影響而過二直，即== :遞的訊號將能滿足主機板上對於元件的佈局和; 線寬、線距、阻抗、時序、電磁干二π =線的佈設無需佔用過多的主機板空間 小及其上的電子元件越來越密集的 ::二例之飼服器因為使用了第-麵，而降 低4·體的设計和製造成本。 各该主機板模組13可通過其擴展卡m的金手指 1322與該伺服器1電性連接’故各該主機板模組13可於 該機箱η⑽料行馳拔，財社機板賴插拔而滿 足所有客戶的要求。所述的轉接板16設於該機箱U内的 該硬碟陣列12與該些域板模組13之間，且平行於該機 相η的底板iu設置，該轉接板16通過第二電鐵線ΐ9ι 電性連接該硬辦列12，且該轉接板16 #近該些主機板 模，、且13的一 jr而具有與各該擴展卡〗32的金手指對應 的多個第二連接埠161 ’以供該些金手指m2分別插置於 該些第二連接琿161中，進而通過轉接板16使主機板模組 13與硬碟陣列12之間建立對應和連接關係。而該轉接板 8 111618 201211734 16通過第三魏線192與該電源模組15電性連接，以使 該電源模組15能對轉接板16供電，進而通過轉接板16 分別對該硬碟陣列及主機板模組13供電。於本實施例 中’該些第二連接彳161係、為金手指插槽’但不以此為限。 於本實施例中，該飼服器i更包括兩固定架18，該兩 固定架18係分別鎖固於該機箱^的兩側壁113上，或者 -體成形於該機箱η的兩側壁113上，用以固㈣轉接板 16相應地，各5玄固定架18上具有例如螺孔的固定機制， 用以鎖固該轉接板16，但不以此為限。 此外，该主機板模組13還包括並排設置在該主機板 上的中央處理器丨311、多個内存條13丨2。於該主機板 模組13運作時，該中央處理器1311會產生高熱，因而需 對其吹風以逸散熱量，以避免該中央處理器i3u因為過熱 而燒毁’甚至影響m因此，該健器丨在該硬碟 ，列12與主機板模組13之間設有出風側朝向該中央處理 器mi的風扇模組17。該風扇模址17包括多個風扇171， 各遠風扇171係對應於該些主機板模組13而設置，以對該 中央處理器1311吹風散熱。 上為使該風扇模組17所產生的散熱風流能有效地流向 該中央處理器131卜該主機板模組13還設置有導風板 135°該導風才反135的底部係固定在該擴展+…上，該導 風板135的後端卡設於該些内存條1312中相對靠近該中央 处里ηα 1311的一者之間，其中最靠近該中央處理器Bn 的内存條1312與該導風板135共同形成導風面，以引導該 111618 9 201211734 八扇模、组17的大部分氣體流向該中央處理器1311，俾強 化5亥風扇模組17對該♦央處理器1311的散熱效果。 如圖所示’該導風板〗35的一端係通過兩内存條ί3ΐ2 Π持而達成前述卡設的目的，另-端係藉由螺絲而鎖附 /廣展卡132上，因而該導風板135的設置毋需額外於 μ主機板131上形成穿孔’故該導風板135的設置並不合 影響到該主機板⑶上的電路佈局。另外，該導風板13; 具有朝向該風扇模組17延伸的延伸部1351，該延伸部〗3幻 延伸至靠近於賴扇模組17出風面的位置，並向該些 條⑶2的方向.f折’用以引導該風扇模组17所產生的部 分氣流至該主機板131之適當處散熱。具體地，該導風板 135係能引導該風扇模組17所產生原先流向該些内存條 1312的部分氣流至該中域理器13n上藉以強化對該 中央處理器1311的散熱’俾解決該風扇模組_提供的 氣流因為風阻的緣故大都流向内存條1312而無法有效對 中央處理器散熱的問題。另外，該導風板135的形狀可依 散熱的需求而加以調整，並不以圖中所繪製者為限。 該擴展架134的一側具有開口 1341 ’以供該導風板 135之延伸部1351向外伸出而朝向該風扇模組17及内存 條1312的方向延伸。較佳地，該導風板135的延伸部ΐ35ι 及該擴展卡132的金手指1322係外露於該開口 ΐ34ι。 再者’如第2圖所示’該擴展卡132的邊緣具有第二 穿孔1323，以將該擴展卡132螺接於該擴展架134上， 相應地，該導風板135的底部具有第一穿孔1352,該第一 111618 10 201211734 穿孔1352對應於該擴展卡132的第二穿孔1323設置，從 而可藉由依序穿過該第一穿孔1352和第二穿孔1323的螺 、‘’糸鎖固5亥—風板13 5於#亥擴展卡13 2上。於本實施例中， 該承載盤133的前端及該擴展架134的後端均設有折邊， 俾通過該些折邊而將該承載盤133與該擴展架134鉚接成 為一體，並通過該些折邊而避免該承載盤133與該擴展架In addition, the rear end of the cassette 11 has two partitions 112 disposed in parallel to divide the chassis 11 into a plurality of accommodating spaces, but it should be noted that the number of the partitions 112 disposed in the chassis 11 is It is not limited to two, and the number of partitions 112 provided may be appropriately increased or decreased depending on the situation. As shown in the figure, the side partitions 112 are provided with rails for guiding the main board module 13 and the power module 15 to enter and exit the rear end of the chassis 11 in the direction of the double arrow 02 of the second figure. The power module 15 and the motherboard module 13 are arranged side by side at the rear end of the chassis 11 to enable hot plugging of the motherboard module 13 and the power module 15 on the rear end of the chassis u. In this embodiment, each of the motherboard modules 13 has a motherboard 131 expansion card 132, a carrier 133, and an extension 134. The motherboard 131 is provided with a first connection port 1314 for providing electrical connection with the expansion card I. The carrier plate 133 has a bearing surface for carrying the motherboard 31. The expansion frame 134 is riveted to One end of the carrying tray 133 is integrated with the extension tray 134, but not limited thereto, and may be combined by screwing or pinning, etc. The expansion card 132 is carried on the same. The expansion frame 134 is electrically connected to the first port 13M of the motherboard through the first wire 14 , and the expansion card is connected to the motherboard ( 3 ) and the expansion card 132 by the first cable The cymbal 32 is provided with a gold finger 1322 on the 1 facing away from the motherboard 131. Preferably, the motherboard 131 has a plurality of first materials 1314 for completing all 7L pieces and (4) exhibition cards 132 on the motherboard (3). The connection between the two, so that the layout and routing of the 7G parts on the motherboard 1Π618 7 201211734 will no longer be restricted by the main mainframe of your main network + mechanical board, in order to be arranged in a limited main mechanical board space. More parts " The design and manufacturing cost of the oyster. Effectively about the server Due to the i-delivery of the electrical conductivity of the cable, as far as the length of the transmission path is concerned, it is excessive to the straight line p:: and e, the right cable is used to transmit the north panel of the main board θ. One cow will not be affected by the _ secret degree And the second straight, that is ==: the signal will be able to meet the layout of the components on the motherboard; line width, line spacing, impedance, timing, electromagnetic dry two π = line layout does not need to occupy too much space on the motherboard And the electronic components on it and the increasingly denser:: The feeding device of the two cases reduces the design and manufacturing cost of the body due to the use of the first side. Each of the motherboard modules 13 can pass through its expansion card. The gold finger 1322 of the m is electrically connected to the server 1 so that each of the motherboard modules 13 can be hoisted in the chassis η (10), and the financial board is plugged and inserted to meet the requirements of all customers. The board 16 is disposed between the hard disk array 12 in the chassis U and the domain board modules 13 and is disposed parallel to the bottom plate iu of the machine phase n. The adapter board 16 passes through the second electric iron wire ΐ9ι Electrically connecting the hard disk 12, and the adapter plate 16 is close to the motherboard modules, and 13 a plurality of second ports 161 ′ corresponding to the gold fingers of each of the expansion cards 32 for the gold fingers m2 to be inserted into the second ports 161 respectively, and then the motherboard plate is molded by the adapter plate 16 The group 13 and the hard disk array 12 are connected and connected. The adapter board 8 111618 201211734 16 is electrically connected to the power module 15 through the third wire 192 to enable the power module 15 to be rotated. The power supply of the hard disk array and the motherboard module 13 is respectively supplied through the adapter board 16. In the embodiment, the second connection ports 161 are golden finger slots, but not Limited. In this embodiment, the feeding device i further includes two fixing frames 18, which are respectively locked on the two side walls 113 of the chassis, or are formed on the two side walls 113 of the chassis n. Correspondingly, the fixing plate 16 has a fixing mechanism such as a screw hole for locking the adapter plate 16, but not limited thereto. In addition, the motherboard module 13 further includes a central processing unit 311 and a plurality of memory modules 13丨2 disposed side by side on the motherboard. When the motherboard module 13 is in operation, the central processing unit 1311 generates high heat, so that it needs to be blown to dissipate heat, so as to prevent the central processing unit i3u from burning due to overheating, even affecting m. Between the hard disk, the column 12 and the motherboard module 13 are provided with a fan module 17 whose wind side faces the central processing unit mi. The fan module 17 includes a plurality of fans 171, and each of the remote fans 171 is disposed corresponding to the motherboard modules 13 to blow heat to the central processing unit 1311. The heat dissipation airflow generated by the fan module 17 can be effectively flowed to the central processing unit 131. The mainboard module 13 is further provided with a wind deflector 135. The bottom of the air deflecting 135 is fixed at the extension. +, the rear end of the air deflector 135 is interposed between the memory modules 1312 relatively close to the center ηα 1311, wherein the memory module 1312 closest to the central processing unit Bn and the guide The wind plates 135 jointly form a wind guiding surface to guide the eleventh fan of the 111618 9 201211734, and most of the gas of the group 17 flows to the central processing unit 1311, and the heat dissipation effect of the 5th fan module 17 on the central processing unit 1311 is enhanced. . As shown in the figure, one end of the 'air deflector' 35 is held by the two memory strips ί3ΐ2 to achieve the aforementioned purpose, and the other end is attached to the card 132 by screws, so that the wind guide The arrangement of the board 135 does not require the formation of a perforation on the μ main board 131. Therefore, the arrangement of the air deflector 135 does not affect the circuit layout on the main board (3). In addition, the air deflector 13 has an extending portion 1351 extending toward the fan module 17, and the extending portion extends to a position close to the air outlet surface of the fan module 17 and is directed to the strips (3) 2 The .f fold 'is used to guide part of the airflow generated by the fan module 17 to the proper heat dissipation of the motherboard 131. Specifically, the air deflector 135 can guide the fan module 17 to generate a portion of the airflow originally flowing to the memory modules 1312 to the middle processor 13n to enhance heat dissipation to the central processing unit 1311. The airflow provided by the fan module _ mostly flows to the memory module 1312 due to wind resistance, and cannot effectively dissipate heat to the central processing unit. In addition, the shape of the air deflector 135 can be adjusted according to the heat dissipation requirement, and is not limited to those shown in the drawings. The extension 134 has an opening 1341 ′ for extending the extension 1351 of the air deflector 135 to extend toward the fan module 17 and the memory module 1312. Preferably, the extension portion ΐ35i of the air deflector 135 and the gold finger 1322 of the expansion card 132 are exposed to the opening ΐ34ι. Further, as shown in FIG. 2, the edge of the expansion card 132 has a second through hole 1323 to screw the expansion card 132 to the extension frame 134. Accordingly, the bottom of the air guiding plate 135 has a first portion. The first 111618 10 201211734 perforation 1352 is disposed corresponding to the second perforation 1323 of the expansion card 132 so as to be able to pass through the first perforation 1352 and the second perforation 1323. The sea-wind panel 13 is on the #海 expansion card 13 2 . In the embodiment, the front end of the carrying tray 133 and the rear end of the extending frame 134 are respectively provided with a folded edge, and the carrying tray 133 is riveted integrally with the extending frame 134 through the folded edges, and passes through the Folding the carrier 133 and the shelf
U4受力發生翹曲，以增加該承載盤133與該擴展架134 整體的結構強度。 於本實施例中，各該主機板模組13可包括電池架 136，用以承載該主機板模組13運作所需的電池2，該電 池木136具有至少二支撐腳1361，該些支撐腳HQ係由 該電池架136底面向下延伸，並分別固定於該主機板⑶ 和該擴展卡132上’俾令該電絲136的底部分別隔開該 主機板⑶與該擴展卡132，以免妨礙該主機板i3i和該 擴展卡132 _L相對於該電池g 136位置的電路佈局。 其中，該主機板131及該擴展卡]32的 第四穿孔1M3、1321，分別用以將14 有 刀另J用乂將5玄主機板131與擴展卡 ”接於該承載盤133與擴展架134上，該電池架136 的該些支撐腳咖具有對應於該些第四穿孔⑶3、、ΐ32ι =三穿孔mu，從而可藉由依序穿過該些第三穿孔 山η和第四穿孔⑶3、⑽的螺絲，將該電池架136的 兩刀別鎖固於該主機板131與擴展卡132上，但 為限，於其它實施例中， 代。因…… 其匕的鎖固機制作為替 ，以電池架136的設置毋需在該主機板l3i上增 1Π6Ι8 201211734 設穿孔，以避免佔用該主機板131固有的電路佈局空間。 綜上所述，本發明之伺服器，具有分別可抽取式地設 於機箱的前、後兩端的硬碟陣列和主機板模組，以便於對 其實現熱插拔。該主機板模組具有用以承載主機板之承載 盤、用以承載具有金手指的擴展卡之擴展架、以及用以電 性連接該主機板與擴展卡的電纜線，該電纜線可以避免該 主機板的訊號受到傳遞路徑長度的影響而失真，故本發明 之主機板能通過擴展卡之金手指及其所插設之伺務器取得 聯繫，以降低伺務器的設計和製造成本，即本發明能有效 克服了習知技術中之種種缺失而具高度產業利用價值。 上述實施例僅例示性說明本創作之原理及其功效，而 非用於限制本發明。任何熟習此項技藝之人士均可在不違 背本發明之精神及範疇下，對上述實施態樣進行修飾與改 變。因此，舉凡所屬技術領域中具有通常知識者在未脫離 本發明所揭示之精神與技術思想下所完成之一切等效修飾 或改變，仍應由後述之申請專利範圍所涵蓋。 【圖式簡單說明】 以下圖式均為簡化之圖式，而僅以示意方式說明本發 明之基本構想，圖式中僅顯示與本發明之伺服器有關元件 而非按照實際實施時之元件數目、形狀及尺寸繪製，其實 際實施時各元件之型態、數量及比例可依情況調整變更。 第1圖為本發明之一實施例之伺服器内部結構之局部 分解圖；以及 第2圖為第1圖所示伺服器之主機板模組之局部分解 111618 201211734 圖。The U4 is subjected to warpage to increase the structural strength of the carrier 133 and the extension 134 as a whole. In this embodiment, each of the motherboard modules 13 can include a battery holder 136 for carrying the battery 2 required for the operation of the motherboard module 13, the battery 136 having at least two supporting legs 1361, and the supporting legs The HQ extends downward from the bottom surface of the battery holder 136 and is respectively fixed to the main board (3) and the expansion card 132. The bottom of the electric wire 136 is separated from the main board (3) and the expansion card 132 respectively to prevent interference. The circuit layout of the motherboard i3i and the expansion card 132_L relative to the position of the battery g 136. The fourth through holes 1M3 and 1321 of the motherboard 131 and the expansion card 32 are respectively used to connect the 5 motherboards 131 and the expansion card to the carrier 133 and the extension frame. 134, the support legs of the battery holder 136 have corresponding to the fourth perforations (3) 3, ΐ32ι = three perforations mu, so as to pass through the third perforation hills n and the fourth perforations (3) 3, The screw of (10) is used to lock the two blades of the battery holder 136 to the main board 131 and the expansion card 132. However, in other embodiments, the other is replaced by a locking mechanism. The arrangement of the battery rack 136 is not required to be increased by 1Π6Ι8 201211734 on the motherboard l3i to avoid occupying the circuit layout space inherent to the motherboard 131. In summary, the server of the present invention has a removable state. The hard disk array and the motherboard module disposed at the front and rear ends of the chassis are hot-swappable. The motherboard module has a carrier disk for carrying the motherboard, and is used to carry the extension with the golden finger. The extension of the card, and the electrical connection to the host The cable with the expansion card can prevent the signal of the motherboard from being distorted by the length of the transmission path, so the motherboard of the present invention can be contacted by the gold finger of the expansion card and the server it is inserted into. In order to reduce the design and manufacturing cost of the server, the present invention can effectively overcome the various defects in the prior art and has high industrial utilization value. The above embodiments only exemplify the principle and function of the present invention, instead of The present invention can be modified and changed without departing from the spirit and scope of the present invention. Therefore, those having ordinary knowledge in the technical field are not disengaged. All equivalent modifications or changes made by the spirit and technical idea disclosed in the present invention should be covered by the scope of the patent application described below. [Simplified description of the drawings] The following drawings are simplified drawings, and only The basic concept of the present invention is schematically illustrated, and only the components related to the server of the present invention are shown in the drawings, rather than the components in actual implementation. The number, shape, and size are drawn, and the types, numbers, and proportions of the components in actual implementation may be adjusted according to circumstances. FIG. 1 is a partial exploded view of the internal structure of the server according to an embodiment of the present invention; and FIG. It is a partial decomposition of the motherboard module of the server shown in Fig. 1111618 201211734.
【主要元件符號說明】 1 伺服器 11 機箱 111 底板 112 隔板 113 側壁 12 硬碟陣列 121 導引部 13 主機板模組 131 主機板 1311 中央處理器 1312 内存條 1313 第四穿孔 1314 第一連接埠 132 擴展卡 1321 第四穿孔 1322 金手指 1323 第二穿孔 133 承載盤 134 擴展架 1341 開口 135 導風板 1351 延伸部 201211734 1352 第一穿孔 136 電池架 1361 支撐腳 13611 第三穿孔 14 第一電纜線 15 電源板組 16 轉接板 161 第二連接埠 17 風扇模組 171 風扇 18 固定架 191 第二電纜線 192 第三電纜線[Main component symbol description] 1 Server 11 Chassis 111 Base plate 112 Separator 113 Side wall 12 Hard disk array 121 Guide part 13 Motherboard module 131 Main board 1311 Central processing unit 1312 Memory module 1313 Fourth perforation 1314 First connection埠132 expansion card 1321 fourth perforation 1322 gold finger 1323 second perforation 133 carrier plate 134 extension frame 1341 opening 135 air deflector 1351 extension 201211734 1352 first perforation 136 battery holder 1361 support leg 13611 third perforation 14 first cable 15 Power board set 16 Adapter board 161 Second port 埠 17 Fan module 171 Fan 18 Mounting frame 191 Second cable 192 Third cable