M341155 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種電子裝置，尤指一種具有發光二 極體之發光裝置。 【先前技術】 傳統發光裝置之光源多以白熾燈泡或日光燈管為 -主，白熾燈泡係以熔點高的鎢做為燈絲以發光發熱，燈泡 本身的發光表現不易受己身溫度影響，相對地，受白熾燈 _泡照射之物體溫度往往會上升，使其無法適合使用於懼高 溫之物品，例如字晝、珍珠、藥品及化妝保養品等物。另 外，曰光燈管發光波長範圍過大，乃至包含了紫外光，如 長期照射者，易使皮膚受到傷害，或使藥物變質等缺點。 為解決上述之問題，相關業界進而使用發光二極體以 取代白熾燈泡或日光燈管，且隨著全世界的能源持續的缩 減γ該發光二極體係利用光電轉換原理而得以節省能源， 其兀件體積小而亮度充足，故成為光源的新選擇，並逐漸 _應用於現今之顯示器背光源、投影機、照明等發光裝置。 . 卷光—極體在使用時，雖被照射物體之溫度不會上 _升’但發光二極體本身卻會產生大量的熱能，使溫度上 =二者：由於'亥發光二極體為化合物型半導體，故對溫 ，敏感，-般皆必須使其晶片週邊溫度小於攝氏75 度，否則除影響其發光強度外，亦會降低產 持發光二極體一定水準的工作效率，有效 、月極體之熱能便成為目前應用發光二極體照明 5 M341155 柃，產業必須積極研究之課題。 "傳統Is光—極體係組裝於銅f|印刷電路板上以形成 么光衣i而p現著發光二極體的輪出功率逐漸提升，為達 散熱要求，便於該基板裝設散熱結構。請參閱第1A及1B 圖，其中第以圖為接置有複數發光二極體15之剖視圖， 弟1B圖為接置有單—發光二極體15之透視圖，傳統發光 裳置係包括具有相對之第-表面ill及第二表面112之基 板11，設於該基板11之第—表面111之絕緣層12;設置 於該絕緣層12上之線路層13;設置於該線路層13之結 合材料層14，·接置並電性連接至該結合材料層14之至少 :發光二極體⑴以及以複數螺絲16與該基板n相固 定之散熱結構Π，亦即’係以螺絲16將基板u鎖於散 熱結構17之方式，使該發光二極體15所產生的熱量透過 基板11傳遞至該散熱結構17，再逸散至大氣中。 然’由於該熱量係經多層介質傳遞後嚴重影響其散熱 效果，使整體所呈現的散熱效果不如預期，只能藉由擴大 介質之散熱面積的方式’使達成所欲之散熱效果，惟此方 式會造成製造成本的大量增加，且以複數螺絲固定更增加 製造流程及步驟。 因此，如何提出-種可有效解決高功率及高亮度之發 光二極體之散熱問題，並且能簡化製作程序以降低製作成 本’以及無需大量的設備與其相配合以利多樣化產品的製 造，確為此相關領域所迫待解決之課題。 【新型内容】 6 M341155 s鑑於前述習知技術之缺失 供-種具有散熱結構之發光裝置，：：： = ;的係在提 之發光二極體散熱問題。1 1场決南功率及高亮度 方戈ί:作：又一目的係在提供-種發光裝置，得以簡單 本，並可應用於多樣化的產品。相配°以減少製造成 :達上述及其他目的，本創作揭示之發光裝 括：圓柱形基板，係具有相對之第一、第二表面以及側表 面声：側表面係具有第-螺紋部；線路層，係設置於該第 一表面上；以及至少一發亦— 該線路層。 極肢，係接置並電性連接於 本創作之發光裝置中’該圓柱形基板材料係為銀、 ::二石墨、陶兗、鑽石、氧化紹、氮化鋇、氮化銘及 :擇μ古之其中至少一者；於該圓柱形基板之第二表面可 ^擇故有複數第-散熱韓片；亦或於該圓柱形基板之第二 t面2、至少一容置空間’於該容置空間復容置有電源裝 ^包源裝置係變壓器、電纜線及該發光裝置運作所需 ^包子7L件中至少-者；該線路層係由導電層與結合材料 層構成’且具線路佈局（layout)之圖案（pattern)，其中 =路佈局可以用傳統銅编電路板技術形成，或以絕緣導熱 土材（陶質基材）並以銅膠、銀膠等方式形成電路，或以其 他導熱基材加以適當絕緣處理並以銅膠、銀膠等方式形成 電路。 熱 本創作之發光裝置復包含有如燈罩之散熱件，該散 7 M341155 伴係具有至少一開口，該開口係具有對應於該第 紋部 之第二螺紋部，使該圓柱形基板得裝設於該開口中Γ 作之發光裝置中’該第—螺紋部與第二螺紋部間係可 有導熱膠體；該燈罩材料係為銀、銅、|g、石墨、陶究、 鑽石、氧化紹、氮化鋇、氮化紹及其組成物之其中至少— 者。因此，本創作之發光裝置中，該圓柱形基板不僅ς用 以承載發光二極體，同時由於在其侧表面設有第一螺紋 部’亦使柱形基板得以直接裝設至不同料或其散熱 結構’而可形成多樣化的產品，取代習知中使用螺絲固、 定，而成為H裝置，俾可減少f知技術巾因使用螺絲固 定所產生成本尚以及簡化裝設之流程，同時，使用者於穿 卸該發光裝置時，亦可避免遺失螺絲之風險，另外，藉= 第一及第二螺紋部的增設，更增加該圓柱形基板之散熱面 積，以達將發光二極體所產生的熱量快速傳遞出去之 的0 【實施方式】 • 以下係藉由特定的具體實施例說明本創作之實施方 式，熟習此技藝之人士可由本說明書所揭示之内容輕易地 暸解本創作之其他優點與功效。 -第一實施例 請參閱第2A及2B圖，係為本創作之發光裝置第_實 施例之剖視示意圖。 如第2A圖所示，本實施例之發光裝置係包括具有相 對之第一表面211及第二表面212,以及側表面2〗3之圓 8 M341155 桉形基板21，該側表面213係具有第—螺紋部213a及延 伸部213b，該第一螺紋部213a係連接於第一表面211， 該延伸部213b係連接於第二表面212;於該第一表面211 上設置有絕緣層22;於該絕緣層22上設置有導電層23， 於該導電層上設置有結合材料層24;以及至少一發光二 極體25，係接置並以接腳25a電性連接於該結合材料層 _ 或如第2B圖所示，該側表面213係 ⑽及外擴延伸部心，該第—螺紋部_係連 —表，211，該外擴延伸部213c係連接於第二表面212, 使该第二表面212面積大於該第一表面211面積。 該延伸部㈣及外擴延伸部213e係可與該圓柱形基 板21 —體成型或相互結合。 本貫施例中復包括具有開口 261之散熱件26，該散 ^可作為燈罩，其中該開口 261係可完全穿透該散熱件 、’且具有對應該第一螺紋部213a之第二螺紋部2仏， =共使用者以手或工具持握該延伸部2l3b或外擴延伸部 3c，將該圓柱形基板21以該第—螺紋部⑽❹ —螺紋部261a旋入該散熱件26之開口 261中。 該圓柱形基板21係以高熱傳導係數之材質製成，例 等？ 5 1呂石墨陶瓷或其他高熱傳導係數之精密陶瓷 錢熱件26(例如燈罩）係以高散熱係數 銀、銅，等及其合金，以及其他高散熱性之; 尤寺。俾透過將該81㈣基板2丨採高熱傳導係數之 9 M341155 材，質，.可使該發光二極體25於運作中產生之 該圓柱形基板21之高熱傳導特性 = 圓柱形基板21之第二表面212 二且;方：傳遞至 而91 Q^ ^ ]表面213，由該側表 面213之弟一觀部213讀遞至該散熱件26之第二螺紋 部261 a，再由以高散熱係數材質事 ， 量逸散至大氣中。 “衣成之放熱件26將該熱 因此，本創作係可藉由該圓柱形基板之第-螺紋部及 該散熱件之第二螺紋部相互固^，以解決習知技術中以螺 絲固定所產生成本高、散熱等問題，以達到裝卸方便，^、 化製作流程之目的，並可增加散熱面積，使熱量除往第二 表面方向逸散外，更便於往側表面方向逸散，以達快速 散發光二極體運作時所產生之熱量，同時，使用者於裝卸 該發光裝置時，亦可避免遺失螺絲之風險。 第二實施例 清翏閱第3A至3G圖，係為本創作之發光裝置第二實 施例之示意圖。本實施例與第一實施例大致相同，主要^ 籲異係在於基板並未於圓柱形基板側表面形成接續第一螺 ，紋部之延㈣，而係於基板第二表面設置有凹#，、以藉由 .對應該凹槽形狀之裝卸工具，將該基板相對於散熱件進行 裝設或拆卸，其中，該凹槽形狀可為圓形、十字形、三角 形、一字形或多邊形等。 如第3A及3B圖所示，其中該第3B圖係為對應第3A 圖之底視圖，係於圓柱形基板21之第二表面212形成複 數如孔洞之圓形凹槽350 ,並以配合該凹槽350形狀及相 10 M341155 對位皇之裝卸卫具38，將該圓㈣ 36，且如圖中所示，該凹土板21衣設至散熱件 21 ;本實施例中於第_ f J 係可選擇未穿透該基板 而亦可依照設計需要或展卸工且：二:個凹槽^ 之凹槽350，·如第3C圖所， ，員，设置其他數量 犯設有單個偏_心之^^可=基板Μ第二表面 • 另外，如第3D圖所示，姑„n & .形’相對裝卸工具則可使用形:η可:-, c: ^ 凹槽350形狀係三角形，相 對裝卸工具則可使用三角形起子；如第 槽⑽亦可連接至基板21侧表面213，以藉由裝= 配合該凹槽350，俾使該基板21依 \ 八 36弟一螺以之相對紋路旋入，藉以將該基板η盘 熱件/6相互固定；反之，可藉由裝卸工具將該基板 拆卸脫離。 “將«板a與該散熱件36 弟二貫施例 請參閱第4圖，係為本創作之發光裝置第三實施例之 剖視示意圖。本實施例與第一實施例大致相同，主要差異 係在於圓柱形基板21包括有至少一貫穿其上、下李之凹 槽350，以提供裝卸工具48由該圓柱形基板21之第一表 面211、弟一表面212或同時二表面將該圓柱形基板Η 裝卸於散熱件36。 11 M341155 爯者，本創作復可藉由前述之各式凹槽35〇提供熱變 形之緩衝空間，並同時增加其散熱面積，以供設置於該圓 柱形基板21上之發光二極體25於運作時所產生之熱量， 進而產生之熱脹冷縮現象，以及因該圓柱形基板2丨盥該 散熱件36以不同材質製作時，可能造成膨脹收縮程度不 同進而產生變形之問題，以透過該凹槽35〇提供熱變形 .之緩衝空間，使本創作之發光裝置不致受熱應力而損壞。 第四實施例 凊麥閱第5圖’係為本創作之發光裝置第四實施例之 剖視示意圖。本實施例與第一實施例大致相同，主要差異 係^亥圓柱形基板21之第一螺紋部5 j %以及散熱件^ 之第二螺紋部561a間復包括有導熱膠體59,該導熱膠體 =材質係為金屬膠或其他具有高導熱係數之液態或膠狀 才質’藉以填充於該第一螺紋部仙與該第二螺紋部 a間之間隙’以加快該第—螺紋部η%與第二螺紋部 5 61 a間熱傳導速率。 另外，忒圓柱形基板21之侧表面513係具有第一 广513a及乍&延伸部513c，該伸銜 .接於該圓柱形基板21之第二表面212，使該第二表二 =小於该弟一表面211面積；該裝卸工具58係 该圓柱形基板21裝設刭兮辟刼灿r 寻 513a及第-蟬二 熱件56’其中該第-螺紋部 及弟一螺紋彳561a之間包括有導熱膠體Μ，最 移開該裝卸工具58。 再 由於在形成該散熱件56之開口 561日夺，底部容易呈 12 M341155 現略爲縮口的現象’為使該第二表面212得以接觸到開口 561底部增加散熱接觸面積，該圓柱形基板a側表面5以 銜接於《亥第_表面212處復具有窄縮延伸部5，以對 f開口 561底部之縮口現象；該導熱膠體59則扮演填補 弟螺紋部513a與第二螺紋部56la間隙的角色，以加快 =第一螺紋部513a與第二螺紋部561a間熱傳導速率。、 •清夢閱第6圖，係為本創作之發光裝置第五實施例之 •立體剖視示意圖。本實施例與第一實施例大致相同，主要 差異係於散熱件66設置複數開口 661，該開口 661可以 散熱件66之貫穿開口 _，亦可為未穿透該散 熱件⑽之凹陷開口 661c，二者皆具有第二螺紋部_ ; ;^凹開口 661c中復可包括面積小於該凹陷開口 661c且穿透該散熱件66之孔洞。該複數開口阳可 3該散：件66容納複數圓柱形基板21及其上之發光二極 =25’貝穿開n 661b及孔洞662則可供提供電源之電親 響線通過（未圖示）。 第六實施例 口月蒼閱第7圖’係、為本創作之發光裝置第六 剖視f4圖。本實施例與第-實施例大致㈣，主要差異 係^亥圓柱形基板21第二表面212設有容置空間， 二谷置，源裝置7G。另外該容置空faW13於該發光裝置 :度升心，復可提供緩衝空間以避免發光裝置受熱應力 作用而變形損壞，同時亦可節省圓柱形基板21材料之使 13 M341155 用‘。 第七實施例 "月參閱第8A及8B圖，係為本創作之發光裝置第七實 施例之立體示意圖及剖視示意圖。本實施例與第一實施例 大致相同，主要差異係於該圓柱形基板21側表面於連接 ，第一表面211處設有延伸部813b，該圓柱形基板21之 -第二表® 212設有複數第-散熱鰭片_，該散熱件^ .之開口 861設有對應該第一散熱簿片_之複數第 鰭片80b。 … 該延伸部813b具有刻紋813d，可增加摩擦力以便於 裝設該發光裝置’亦可增加散熱面積；該第一散熱鰭片 80a及該第二散熱鰭片8〇b係複數中空同心圓柱，以^合 亚增加該圓柱形基板21與該散熱件86間之熱傳導面積， 加快散熱速度。 貝 因此，本創作之發光裝置中之圓柱形基板，不僅係用 ，承載發光二極體，同時藉由其側表面之第—螺紋部，使 i該圓柱形基板得以直接裝設至具有相對第二螺紋部之散 熱結構中，避免習知使用螺絲固定基板與散熱件，藉以減 .少製造時所使用之材料以及簡化裝設之流程，亦可^免遺 失螺絲之風險；另外’該圓柱形基板中復設有凹槽，以提 供裝卸工具之操作空間，俾可方便裳卸該發光裝置，更於 該發光裝置溫度升高時’避免本裝置受熱應力作用而變形 損壞；再者，該第一螺紋部的存在，更增加該圓柱形基板 之散熱面積，以達將發光二極體所產生的熱量快速傳遞出 14 M341155 去‘之目的。 上述實施例僅例示性說明本創作之原理及其功效，而 非用於限制本創作，任何熟習此項技藝之人士均可在不& 背本創作之精神及範嘴下，對上述實施例進行修錦= 變。因此’本創作之權利保護範圍，應如後述之申 範圍所列。 ，【圖式簡單說明】 第1Α及1Β圖係習知之發光裝置剖視及立體示意圖， #其中該散熱結構係以複數螺絲固定於該圓柱形基板厂 第2 Α及2 Β圖係本創作之發光裝置第一實施例之剖視 示意圖； 第3A至3G圖係本創作之發光裝置第二實施例之示音 圖； ~ 第4圖係本創作之發光裝置第三實施例之剖視示意 圖； 第5圖係本創作之發光裝置第四實施例之剖視示意 •圖； ， 第6圖係本創作之發光裝置第五實施例之立體剖視 示意圖； 第7圖係本創作之發光裝置第六實施例之剖視示意 圖；以及 第8A及8B圖係本創作之發光裝置第七實施例之剖視 示意圖。 【主要元件符號說明】 15 M341155 i 11 基板 111 第一表面 112 第二表面 12 絕緣層 13 線路層 14 結合材料層 15 發光二極體 ’16 螺絲 17 散熱結構 1 21 圓柱形基板 211 第一表面 212 第二表面 213 侧表面 213a 第一螺紋部 213b 延伸部 213c 外擴延伸部 22 絕緣層 _23 導電層 24 結合材料層 25 發光二極體 ，25a 接腳 26 散熱件 261 開口 261a 第二螺紋部 350 凹槽 36 散熱件 16 M341155 3έ 裝卸工具 48 裝卸工具 513 侧表面 513a 第一螺紋部 513c 窄縮延伸部 56 散熱件 561 開口 ^ 561a 第二螺紋部 -58 裝卸工具 • 59 導熱膠體 66 散熱件 661 開口 661a 第二螺紋部 661b 貫穿開口 661c 凹陷開口 662 孔洞 70 電源裝置 • 713 容置空間 80a 第一散熱鰭片 80b 第二散熱鰭片 .813b 延伸部 813d 刻紋 86 散熱件 861 開口 17M341155 VIII. New Description: [New Technology Field] This creation is about an electronic device, especially a light-emitting device with a light-emitting diode. [Prior Art] The light source of the conventional illuminating device is mostly dominated by an incandescent bulb or a fluorescent tube. The incandescent bulb is made of tungsten having a high melting point as a filament to emit heat, and the illuminating performance of the bulb itself is not easily affected by the temperature of the body. Objects that are exposed to incandescent bulbs tend to rise in temperature, making them unsuitable for use in objects that are afraid of high temperatures, such as lettering, pearls, medicines, and cosmetic products. In addition, the wavelength range of the fluorescent tube is too large, and even contains ultraviolet light, such as long-term exposure, easy to cause damage to the skin, or deterioration of the drug. In order to solve the above problems, the relevant industries have further used LEDs to replace incandescent bulbs or fluorescent tubes, and as the world's energy continues to shrink γ, the light-emitting diode system uses photoelectric conversion principles to save energy. The small size and sufficient brightness make it a new choice for light sources, and gradually applied to today's display backlights, projectors, lighting and other lighting devices. Rolling light—When the pole body is in use, the temperature of the irradiated object will not rise _ liters, but the light-emitting diode itself will generate a large amount of heat energy, so that the temperature = both: because the 'light-emitting diode is Compound type semiconductors are sensitive to temperature and sensitivity. Generally, the temperature around the wafer must be less than 75 degrees Celsius. Otherwise, in addition to affecting the luminous intensity, it will also reduce the working efficiency of the light-emitting diodes. The thermal energy of the body has become the subject of the current application of LED dipole illumination 5 M341155. "Traditional Is light-pole system is assembled on the copper f|printed circuit board to form the light-shielding i and the current round-out power of the light-emitting diode is gradually increased, so as to meet the heat dissipation requirement, the substrate is provided with a heat-dissipating structure . Please refer to FIGS. 1A and 1B, wherein the first view is a cross-sectional view in which a plurality of light-emitting diodes 15 are connected, and the first one is a perspective view in which a single-light-emitting diode 15 is connected, and the conventional light-emitting device includes a substrate 11 opposite to the first surface ill and the second surface 112, an insulating layer 12 disposed on the first surface 111 of the substrate 11, a wiring layer 13 disposed on the insulating layer 12, and a combination disposed on the wiring layer 13. The material layer 14 is connected and electrically connected to the bonding material layer 14 at least: the light emitting diode (1) and the heat dissipating structure 固定 fixed by the plurality of screws 16 and the substrate n, that is, the substrate is fixed by the screw 16 The mode of the heat dissipation structure 17 is such that the heat generated by the light-emitting diodes 15 is transmitted to the heat dissipation structure 17 through the substrate 11 and then dissipated into the atmosphere. However, because the heat is transmitted through the multi-layer medium, the heat dissipation effect is seriously affected, so that the overall heat dissipation effect is not as expected, and the heat dissipation effect of the medium can only be expanded to achieve the desired heat dissipation effect. This will result in a large increase in manufacturing costs, and the addition of multiple screws will increase the manufacturing process and steps. Therefore, how to solve the problem of heat dissipation of high-power and high-brightness light-emitting diodes can be effectively solved, and the production process can be simplified to reduce the manufacturing cost, and it is not necessary to cooperate with a large number of devices to facilitate the manufacture of diverse products. For this reason, the issues that are urgently to be solved in related fields. [New content] 6 M341155 s In view of the lack of the above-mentioned prior art, a light-emitting device having a heat-dissipating structure, the::: = ; is responsible for the heat dissipation problem of the light-emitting diode. 1 1 field of power and high brightness Fang Ge ί: Own: Another purpose is to provide a kind of illuminating device, which can be simple and can be applied to a variety of products. Matching to reduce manufacturing to: For the above and other purposes, the illuminating device disclosed in the present invention comprises: a cylindrical substrate having opposite first and second surfaces and side surface sounds: the side surface has a first thread portion; a layer disposed on the first surface; and at least one of the wires. The polar limbs are connected and electrically connected to the illuminating device of the present invention. The cylindrical substrate material is silver, ::two graphite, ceramic enamel, diamond, oxidized sulphur, tantalum nitride, nitriding and: At least one of μ ancient; a second surface of the cylindrical substrate may be selected to have a plurality of first heat-dissipating Korean films; or a second t-plane 2 of the cylindrical substrate, at least one receiving space The accommodating space is provided with a power supply device, a transformer, a cable, and at least one of the 7L parts required for operation of the illuminating device; the circuit layer is composed of a conductive layer and a bonding material layer. a layout pattern in which a = road layout can be formed by conventional copper braided circuit board technology, or an insulating heat conductive earth material (ceramic substrate) and formed into a circuit by copper glue, silver glue, or the like, or The other heat-conductive substrate is appropriately insulated and formed into a circuit by copper glue, silver glue or the like. The illuminating device of the thermal creation includes a heat sink such as a lampshade, and the ray 7 M341155 has at least one opening, and the opening has a second thread portion corresponding to the ridge portion, so that the cylindrical substrate is mounted on In the illuminating device of the opening, the first thread portion and the second thread portion may have a thermal conductive colloid; the lampshade material is silver, copper, |g, graphite, ceramics, diamond, oxidized, nitrogen At least one of phlegm, nitriding and its constituents. Therefore, in the light-emitting device of the present invention, the cylindrical substrate is not only used to carry the light-emitting diodes, but also the cylindrical substrate is directly mounted to different materials or the first substrate is provided on the side surface thereof. The heat-dissipating structure can be used to form a diversified product. Instead of using a screw to fix and fix it, it becomes an H device, which can reduce the cost of using the screw to fix the technical towel and simplify the installation process. When the user wears and unloads the light-emitting device, the risk of losing the screw can be avoided. In addition, by adding the first and second threaded portions, the heat-dissipating area of the cylindrical substrate is further increased to reach the light-emitting diode. The generated heat is quickly transmitted out. [Embodiment] The following embodiments are described by way of specific embodiments, and those skilled in the art can easily understand other advantages of the present invention by the contents disclosed in the present specification. And efficacy. - First Embodiment Referring to Figures 2A and 2B, there is shown a cross-sectional view of a luminescent embodiment of the present invention. As shown in FIG. 2A, the light-emitting device of the present embodiment includes a circle 8 M341155-shaped substrate 21 having a first surface 211 and a second surface 212 opposite to each other, and a side surface 2, which has a first surface 213 a threaded portion 213a and an extending portion 213b, the first threaded portion 213a being coupled to the first surface 211, the extending portion 213b being coupled to the second surface 212; the first surface 211 is provided with an insulating layer 22; A conductive layer 23 is disposed on the insulating layer 22, and a bonding material layer 24 is disposed on the conductive layer; and at least one light emitting diode 25 is connected and electrically connected to the bonding material layer by the pin 25a. As shown in FIG. 2B, the side surface 213 is a (10) and an extended extension, the first threaded portion is attached to the table 211, and the flared extension 213c is coupled to the second surface 212. The surface 212 has a larger area than the first surface 211. The extension (4) and the flared extension 213e may be integrally formed or joined to the cylindrical substrate 21. In the present embodiment, a heat sink 26 having an opening 261 is included, which can serve as a lamp cover, wherein the opening 261 can completely penetrate the heat sink, and has a second thread portion corresponding to the first thread portion 213a. 2仏, = the user holds the extension portion 23b or the extension portion 3c with a hand or a tool, and the cylindrical substrate 21 is screwed into the opening 261 of the heat sink 26 by the first thread portion (10). in. The cylindrical substrate 21 is made of a material having a high thermal conductivity, for example, etc. 5 1 Lu graphite ceramics or other high-thermal conductivity precision ceramics Money heating parts 26 (such as lampshades) with high heat dissipation coefficient of silver, copper, and other alloys, as well as other high heat dissipation;高 The high thermal conductivity of the cylindrical substrate 21 generated by the operation of the light-emitting diode 25 in the operation of the 81 (four) substrate 2 by the high thermal conductivity of the 9 M341155 material = the second of the cylindrical substrate 21 The surface 212 is transferred to the surface 213, and the surface 213 of the side surface 213 is read to the second threaded portion 261a of the heat sink 26, and the heat dissipation coefficient is high. Material matter, the amount is released into the atmosphere. "The heat-dissipating member 26 of the garment is heated. Therefore, the present invention can be fixed by the first thread portion of the cylindrical substrate and the second thread portion of the heat dissipating member to solve the screw fixing in the prior art. It has the problems of high cost, heat dissipation, etc., in order to achieve convenient loading and unloading, and the purpose of the production process, and can increase the heat dissipation area, so that the heat is dissipated in the direction of the second surface, and it is more convenient to escape to the side surface. The heat generated by the rapid dispersion of the LEDs during operation, and the user can avoid the risk of losing the screws when loading and unloading the illumination device. The second embodiment is to read the figures 3A to 3G, which is the illumination of the creation. A schematic diagram of a second embodiment of the device. This embodiment is substantially the same as the first embodiment, and the main difference is that the substrate does not form a first spiral on the side surface of the cylindrical substrate, and the extension of the land portion (four) is attached to the substrate. The second surface is provided with a recess #, to mount or disassemble the substrate relative to the heat sink by a loading and unloading tool corresponding to the shape of the groove, wherein the groove shape may be a circle, a cross, or a triangle A figure or a polygon, etc. As shown in Figs. 3A and 3B, wherein the 3B is a bottom view corresponding to the 3A drawing, the second surface 212 of the cylindrical substrate 21 is formed with a plurality of circular grooves such as holes. 350, and in conjunction with the shape of the groove 350 and the phase 10 M341155 aligning with the armor 38, the circle (four) 36, and as shown in the figure, the concave plate 21 is applied to the heat sink 21; In the example, the _f J system may be selected to not penetrate the substrate, or may be designed or unloaded according to the design and: 2: a groove 350 of the groove ^, as shown in Fig. 3C, The quantity has a single offset _ heart ^ ^ can = substrate Μ second surface • In addition, as shown in Figure 3D, the „n & . Shape 'relative loading and unloading tool can use the shape: η can: -, c : ^ The groove 350 is triangular in shape, and a triangular screwdriver can be used for the loading and unloading tool; for example, the groove (10) can also be connected to the side surface 213 of the substrate 21, so that the substrate 21 can be made by the fitting of the groove 350. The eight 36 brothers and one snail are screwed in with respect to the opposite lines, whereby the substrate n disk heat members / 6 are fixed to each other; otherwise, the substrate can be attached by a loading and unloading tool Unloading detachment. Please refer to Fig. 4 for the second embodiment of the plate a and the heat sink 36. This is a schematic cross-sectional view of the third embodiment of the light-emitting device of the present invention. This embodiment is substantially the same as the first embodiment, and the main differences are The cylindrical substrate 21 includes at least one groove 350 extending therethrough to provide a loading and unloading tool 48. The cylindrical substrate is folded from the first surface 211, the second surface 212 or the two surfaces of the cylindrical substrate 21. Loading and unloading on the heat sink 36. 11 M341155 In addition, the present invention can provide a buffer space for thermal deformation by the above-mentioned various grooves 35, and simultaneously increase the heat dissipation area thereof for being disposed on the cylindrical substrate 21. The heat generated by the light-emitting diode 25 during operation, and the thermal expansion and contraction phenomenon, and the heat dissipation member 36 of the cylindrical substrate 2 are made of different materials, which may cause different degrees of expansion and contraction and deformation. The problem is that the illuminating device of the present invention is not damaged by thermal stress by providing a buffer space for thermal deformation through the groove 35. The fourth embodiment of the 凊麦阅第5图' is the creation of the creation A schematic cross-sectional view of the fourth embodiment of the apparatus. This embodiment is substantially the same as the first embodiment, and the main difference is the first thread portion 5 j % of the cylindrical substrate 21 and the second thread portion 561a of the heat sink ^ The thermal conductive colloid 59 includes a metal glue or other liquid or gel-like material having a high thermal conductivity, so as to fill the gap between the first thread portion and the second thread portion a. The heat transfer rate between the first thread portion η% and the second thread portion 5 61 a is accelerated. In addition, the side surface 513 of the 忒 cylindrical substrate 21 has a first width 513a and a 乍 & extension portion 513c. The second surface 212 of the cylindrical substrate 21 is such that the second surface 2 is smaller than the surface of the second surface 211; the loading and unloading tool 58 is provided with the cylindrical substrate 21, and the first The second heat member 56' includes a heat conductive gel 之间 between the first thread portion and the second thread portion 561a, and the loading and unloading tool 58 is most removed. Further, since the opening 561 of the heat sink member 56 is formed, the bottom portion is easy. 12 M341155 is now slightly shrinking phenomenon 'for the second The surface 212 is contacted to the bottom of the opening 561 to increase the heat-dissipating contact area, and the cylindrical substrate a-side surface 5 is coupled to the "Hale-surface 212" to have a narrowing extension 5 to squash the bottom of the f-opening 561; The heat conductive gel 59 acts to fill the gap between the second thread portion 513a and the second thread portion 56la to speed up the heat transfer rate between the first thread portion 513a and the second thread portion 561a. A perspective view of a fifth embodiment of the illuminating device of the present invention. The present embodiment is substantially the same as the first embodiment. The main difference is that the heat sink 66 is provided with a plurality of openings 661, and the opening 661 can be a through opening of the heat sink 66. Or a recessed opening 661c that does not penetrate the heat dissipating member (10), both of which have a second threaded portion, and the recessed opening 661c may include a hole having a smaller area than the recessed opening 661c and penetrating the heat dissipating member 66. . The plurality of open cells 3: the member 66 accommodates a plurality of cylindrical substrates 21 and the light-emitting diodes thereon and 25's open through the n 661b and the holes 662 are used to provide electrical power to the power line (not shown ). Sixth Embodiment The mouth of the moon is read in Figure 7 and is the sixth section of the light-emitting device of the present invention. This embodiment and the first embodiment are substantially (four), and the main difference is that the second surface 212 of the cylindrical substrate 21 is provided with an accommodating space, a valley, and a source device 7G. In addition, the faW13 is accommodated in the illuminating device: the degree of centering is increased, and the buffer space is provided to prevent the illuminating device from being deformed and damaged by the thermal stress, and the material of the cylindrical substrate 21 can be saved. The seventh embodiment "month refers to Figs. 8A and 8B, which is a perspective view and a cross-sectional view of a seventh embodiment of the illuminating device of the present invention. This embodiment is substantially the same as the first embodiment. The main difference is that the side surface of the cylindrical substrate 21 is connected, and the first surface 211 is provided with an extending portion 813b, and the second table ® 212 of the cylindrical substrate 21 is provided. The plurality of first heat sink fins 861 are provided with a plurality of fins 80b corresponding to the first heat sink sheet. The extension portion 813b has a rib 813d, which can increase the frictional force to facilitate the installation of the illuminating device ′, and can also increase the heat dissipation area; the first heat dissipation fin 80a and the second heat dissipation fin 8 〇b are a plurality of hollow concentric cylinders. The heat conduction area between the cylindrical substrate 21 and the heat sink 86 is increased by the heat to accelerate the heat dissipation speed. Therefore, the cylindrical substrate in the light-emitting device of the present invention is not only used to carry the light-emitting diode, but also by the first thread portion of the side surface thereof, so that the cylindrical substrate can be directly mounted to have a relative In the heat dissipation structure of the two threaded portions, it is possible to avoid the use of screws to fix the substrate and the heat sink, thereby reducing the material used in manufacturing and simplifying the assembly process, and also avoiding the risk of losing the screw; The substrate is provided with a groove to provide an operation space for the loading and unloading tool, so that the light-emitting device can be conveniently discharged, and the device is prevented from being deformed and damaged by the thermal stress when the temperature of the light-emitting device is increased; The presence of a threaded portion increases the heat dissipation area of the cylindrical substrate to quickly transfer the heat generated by the light-emitting diode out of the 14 M341155. The above embodiments are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone skilled in the art can use the spirit and scope of the present invention. Make a repair = change. Therefore, the scope of protection of the rights of this creation shall be as listed in the scope of application described later. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] and Fig. 1 are a cross-sectional view and a perspective view of a conventional light-emitting device, wherein the heat-dissipating structure is fixed by a plurality of screws to the cylindrical substrate factory, the second and second drawings. FIG. 3A to FIG. 3G are diagrams showing a second embodiment of the illumination device of the present invention; FIG. 4 is a cross-sectional view showing a third embodiment of the illumination device of the present invention; 5 is a schematic cross-sectional view of a fourth embodiment of the illuminating device of the present invention; FIG. 6 is a perspective cross-sectional view showing a fifth embodiment of the illuminating device of the present invention; A schematic cross-sectional view of a sixth embodiment; and Figs. 8A and 8B are cross-sectional views of a seventh embodiment of the light-emitting device of the present invention. [Main component symbol description] 15 M341155 i 11 Substrate 111 First surface 112 Second surface 12 Insulating layer 13 Circuit layer 14 Bonding material layer 15 Light-emitting diode '16 Screw 17 Heat-dissipating structure 1 21 Cylindrical substrate 211 First surface 212 Second surface 213 side surface 213a first threaded portion 213b extension portion 213c flared extension portion 22 insulating layer _23 conductive layer 24 bonding material layer 25 light emitting diode, 25a pin 26 heat sink 261 opening 261a second thread portion 350 Groove 36 Heat sink 16 M341155 3έ Handling tool 48 Handling tool 513 Side surface 513a First threaded part 513c Narrow extension 56 Heat sink 561 Opening ^ 561a Second threaded part - 58 Handling tool • 59 Thermally conductive colloid 66 Heat sink 661 Opening 661a second threaded portion 661b through opening 661c recessed opening 662 hole 70 power supply device 713 accommodating space 80a first heat sink fin 80b second heat sink fin 813b extension 813d scribe 86 heat sink 861 opening 17