M340500 八、新型說明： 【新型所屬技術領域】 本創作係有關於一種導熱結構，尤指一種具有散熱通 道的散熱裝置及其導熱結構。 -【先前技術】 - 一般而言，散熱裝置係以貼接的方式與發熱元件接 鲁觸，而通常係利用-熱傳導性良好的金屬板與發熱元件接 觸；藉由金屬板快速將發熱元件所產生的廢熱傳至散埶裝 置的散熱片上。 t . 然而，近年來因為電腦科技的發達，使得電腦主機内 部的元件之運算速度大幅增加，而單位面積内所產生的埶 量也大幅地提升；只使用金屬板來導熱之導熱效能則已： 不敷使用。 因此，則發展出熱管（Heat Pipe)與均溫板（Vap〇r • Chamber)的導熱結構；不過，熱管係僅能以線接觸的方式 來導熱，均溫板則可以面接觸的方式來導熱。 二 然而，發熱元件通常係為一小區域，若使用均溫板來 導熱，均溫板上沒有接觸到發熱元件的區域則沒有達到導 熱的功用，且均溫板的製造成本也比金屬板及熱管高。 請參照第-及二圖所示，係分別為習知導熱結構的立 體分解圖及立體組合，因此發展出一種習知的導熱結構， 包含一金屬板10a及複數熱管2〇a，其中金屬板伽 複數槽溝11a，熱管20a係容置於槽溝以内，利用熱管 5 M340500 20a的咼熱傳導效能來解決高功率發 但，；於:金屬板-上開設有對應熱管:〇!::=題。 所以當啦熱源的面積大小改變時，此散熱 a 發熱源作改變，故此種導熱結構僅能針對特〜…法對應 件；又，熱管20a容置於槽溝以内，槽溝^ -閉空間，此封閉空間較不利於散熱。 单為一封 - 所以，如何使散熱裝置及其導熱結構可因靡^：ri 熱元件而作改變，且提高導熱結構的導熱效:應：= 創作人所研究的課題。 卩成為本 ，【新型内容】 • 捕作之—目的，在於提供-種導熱結構，藉由敎管 的放熱段係位於散熱通道中，使此導熱結構可藉 力對放熱段進行吹拂散熱。 ^風 為了達成上述之目的，本創作係提供一種導熱結構， 拳包括一第一導熱板、一第二導熱板以及至少一熱管，其 中，該第二導熱板配置於該第一導熱板之下方，該第二導 熱板的側邊分別部分向上延伸有一擋板，該等檔板係與該 第一導熱板的底面相互貼接，並於該第一導熱板與該第二 導熱板之間形成有一容置空間，該熱管，容置於該容置空 間並被該第一導熱板及該第二導熱板所夾掣，該熱管分別 具有一吸熱段及從該吸熱段所延伸出的複數放熱段，該熱 官與該等擋板之間係形成有複數散熱通道，該等放熱段係 部分位於該等散熱通道中。 6 M340500 本創作之一目的，在於提供一種散熱裝置，藉由至少 一熱管係佈設於容置空間内，並被第一及第二導熱板所夾 掣，使熱管能依據熱源的大小作擴充或縮減，以發揮此散 熱裝置最佳的散熱效能。 本創作另一目的，在於提供一種散熱裝置，藉由放熱 -段係位於散熱通道中，使風扇所吹送的氣流能流經散熱通 -道’以提高此散熱裝置的散熱效能。 為了達成上述之目的，本創作係提供一種散熱裝置，包括 鲁一導熱結構、一散熱體以及一風扇，其中，該導熱結構包 括一第一導熱板、一第二導熱板以及至少一熱管，該第二 ，導熱板配置於該第一導熱板之下方，該第二導熱板的侧邊 -分別部分向上延伸有一擋板，該等擋板係與該第一導熱板 的底面相互貼接，並於該第一導熱板與該第二導熱板之間 形成有一容置空間，該熱管容置於該容置空間並被該第一 導熱板及該第二導熱板所夾掣，該熱管分別具有一吸熱段 _及從該吸熱段所延伸出的複數放熱段，該熱管與該等擋板 之間係形成有複數散熱通道，該等放熱段係部分位於該等 散熱通道中’該散熱體連接於該第一導熱板之頂面，該風 扇設置並連接於該導熱結構的側面。 【實施方式】 有關本創作之詳細說明及技術内容，配合圖式說明如 下’然而所附圖式僅提供參考與說明用，並非用來對本 作加以限制者。 Ί M340500 請參照第二至五圖所示，係分別為本創作導熱結構之 立體分解圖、立體組合透視圖及沿第四圖a—a剖面^之刊 視圖，本創作係提供一種導熱結構，包括一第一導熱板 10、一第二導熱板20以及至少一熱管30。 第一導熱板10係為一矩形板體，而於第一導熱板上開 -設有二穿孔11 ’此二穿孔11係呈對角分佈。 • 第二導熱板20，對應連接於第一導熱板10之下方，第 ⑩二導熱板20亦為-矩形板體；另外，第二導熱板2q的側邊 係分別向上延伸有一擋板21，擋板21係與第一導熱板忉的 底部相互連接，以在第一導熱板10及第二導熱板2〇之間形 -成有一容置空間a ;又，第二導熱板上開設有對應穿孔Η -的複數通孔22 ;穿孔11與通孔22係供複數固定元件（圖未 示）穿設連接。 ° 熱管30，本實施例中，至少具有三熱管3〇，但不以此 型態為限，熱管30係佈設於容置空間a内，並被該第一導 _熱板10及第二導熱板20所夾掣，熱管3〇分別具有一吸熱段 31及從吸熱段31所延伸出的一放熱段32，放熱段犯與檔= 21之間係形成有複數散熱通道b，且此等放熱段犯係部份 位於散熱通道b中；而熱管3〇係呈一扁平狀。 請參照第六及七圖所示，係分別為本創作散熱裝置之 立體分解圖以及本創作之一實施例之側視截面圖，導熱結 可結合一散熱體4〇與一風扇50(見第十圖）而組成'1 散熱裝置，散熱體40係貼接於第一導熱板1〇之表面，而第 —導熱板20之底面係貼接於電路板6〇上的發熱元件則，而 8 M340500 熱吕30可將發熱％件61所產生的廢熱導引至第—導熱板⑺ 上以及發熱元件61之外侧。 t請參照第八圖所示，係為本創作之一實施例之使用狀 態圖，本實施例中，熱管3〇係為二波浪狀熱管及一 ι型熱 管，此等熱管30係並列配置，使熱管3〇位於發熱元件㈣ -正上方，且完全覆蓋發熱元件61的發熱面積，藉由覆蓋在 -發熱面積的吸熱段3卜及收熱量，再將熱量傳至遠離發熱元 鲁件61的放熱段32將熱量放出。 a請參照第九圖所#，係為本創作另一實施例之使用狀 態圖’本實施例中，熱管3〇係為二波浪狀熱管以及並列於 -y波浪狀熱管之間的二！型熱f，此種排列方式可依發熱 元件61的大小而作相對應的配置。 若發熱元件61的發熱面積較大，可以增加中間部份的 I型熱管，例如二波浪狀熱管之間再並排更多的丨型熱管 (圖未詳示），如此，可使此散熱裝置對應於不同大小的 等發熱元件61。 明參照第十圖所示，係為本創作又一實施例之俯視截 面圖，此散熱裝置包括一設置並連接於導熱結構丨侧邊的 一風扇50，風扇50吹送出的氣流將進入散熱通道b，而對 熱管30的放熱段32進行散熱之作用，如此，可提高導熱結 構1的導熱效率，同時對整個散熱裝置進行散熱，使此散 熱裝置發揮最大的散熱效能。 因此本創作之散熱裝置及其導熱結構具有下列之優 M340500 1·藉由第^一導熱板10與第二導熱板20係以夾掣的方式 固定複數熱管30，且熱管30的配置方式可依發熱元件61的 大小而作調整，使此散熱裝置及其導熱結構可適用於不同 規格的發熱元件61。 2·第一導熱板1〇與第二導熱板2〇以夾掣的方式固定熱 管，不用在導熱板上進行再次加工，如此，可以節省加工 成本。 3.導熱結構1具有複數連通外部的散熱通道b，在導M340500 VIII. New Description: [New Technical Field] This creation is about a heat-conducting structure, especially a heat-dissipating device with a heat-dissipating channel and its heat-conducting structure. - [Prior Art] - In general, the heat sink is attached to the heat-generating component in a bonding manner, and is usually in contact with the heat-generating component by a metal plate having good thermal conductivity; The generated waste heat is transferred to the heat sink of the heat sink device. t. However, in recent years, due to the development of computer technology, the computing speed of the components inside the computer mainframe has increased greatly, and the amount of enthalpy generated per unit area has also been greatly improved; the thermal conductivity of only using metal plates for heat conduction has been: Not enough to use. Therefore, the heat conduction structure of the heat pipe and the temperature plate (Vap〇r • Chamber) is developed; however, the heat pipe can only conduct heat by line contact, and the temperature plate can be thermally contacted by surface contact. . 2. However, the heating element is usually a small area. If a temperature equalizing plate is used for heat conduction, the area of the temperature equalizing plate that does not touch the heating element does not reach the function of heat conduction, and the manufacturing cost of the temperature equalizing plate is also higher than that of the metal plate and The heat pipe is high. Please refer to the first and second figures, which are respectively an exploded view and a three-dimensional combination of the conventional heat conducting structure, thus developing a conventional heat conducting structure comprising a metal plate 10a and a plurality of heat pipes 2〇a, wherein the metal plates The gamma complex groove 11a, the heat pipe 20a is accommodated in the groove, and the heat transfer performance of the heat pipe 5 M340500 20a is utilized to solve the high power generation; and: the metal plate is opened with the corresponding heat pipe: 〇!::= . Therefore, when the area of the heat source is changed, the heat source a heat source is changed, so the heat conducting structure can only be used for the specific parts of the heat source; and the heat pipe 20a is accommodated in the groove, and the groove is closed. This enclosed space is not conducive to heat dissipation. Single is a single - So, how to make the heat sink and its heat-conducting structure can be changed due to the :: ri heat element, and improve the thermal conductivity of the heat-conducting structure: should: = The subject studied by the creator.卩 卩 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In order to achieve the above purpose, the present invention provides a heat conducting structure, the punch comprising a first heat conducting plate, a second heat conducting plate and at least one heat pipe, wherein the second heat conducting plate is disposed below the first heat conducting plate The side of the second heat conducting plate is partially extended upwardly with a baffle. The baffle plate is adhered to the bottom surface of the first heat conducting plate, and is formed between the first heat conducting plate and the second heat conducting plate. The heat pipe is disposed in the accommodating space and is sandwiched by the first heat conducting plate and the second heat conducting plate, wherein the heat pipe has a heat absorbing section and a plurality of heat radiating from the heat absorbing section And a plurality of heat dissipation channels are formed between the heat official and the baffles, and the heat release segments are partially located in the heat dissipation channels. 6 M340500 One of the purposes of the present invention is to provide a heat dissipating device which is disposed in the accommodating space by at least one heat pipe and is sandwiched by the first and second heat conducting plates, so that the heat pipe can be expanded according to the size of the heat source or Reduced to maximize the heat dissipation of this heat sink. Another object of the present invention is to provide a heat dissipating device, wherein the heat dissipating-segment is located in the heat dissipating passage, so that the airflow blown by the fan can flow through the heat dissipating passage to improve the heat dissipating performance of the heat dissipating device. In order to achieve the above object, the present invention provides a heat dissipating device, including a heat conducting structure, a heat sink, and a fan, wherein the heat conducting structure includes a first heat conducting plate, a second heat conducting plate, and at least one heat pipe. Secondly, the heat conducting plate is disposed under the first heat conducting plate, and the side edges of the second heat conducting plate respectively extend upwardly with a baffle, and the baffles are attached to the bottom surface of the first heat conducting plate, and An accommodating space is formed between the first heat conducting plate and the second heat conducting plate, and the heat pipe is received in the accommodating space and sandwiched by the first heat conducting plate and the second heat conducting plate, wherein the heat pipes respectively have a heat absorbing section _ and a plurality of heat releasing sections extending from the heat absorbing section, a plurality of heat dissipating passages are formed between the heat pipe and the baffles, and the heat releasing sections are partially located in the heat dissipating passages On the top surface of the first heat conducting plate, the fan is disposed and connected to a side of the heat conducting structure. [Details] The detailed description and technical contents of the present invention are to be construed as being limited to the following description. Ί M340500 Please refer to the second to fifth figures, which are the three-dimensional exploded view, the three-dimensional combined perspective view of the creative heat-conducting structure and the view of the section along the a-a section of the fourth figure. The creative system provides a heat-conducting structure. The first heat conducting plate 10, the second heat conducting plate 20 and the at least one heat pipe 30 are included. The first heat conducting plate 10 is a rectangular plate body, and is opened on the first heat conducting plate - and is provided with two through holes 11'. The two through holes 11 are diagonally distributed. The second heat conducting plate 20 is correspondingly connected to the lower side of the first heat conducting plate 10, and the 12th heat conducting plate 20 is also a rectangular plate body. In addition, the side edges of the second heat conducting plate 2q respectively extend upwardly with a baffle 21, The baffle 21 is connected to the bottom of the first heat conducting plate , to form an accommodating space a between the first heat conducting plate 10 and the second heat conducting plate 2 ;; The plurality of through holes 22 are perforated Η - the through holes 11 and the through holes 22 are connected by a plurality of fixing members (not shown). The heat pipe 30, in this embodiment, has at least three heat pipes 3〇, but not limited to this type, the heat pipe 30 is disposed in the accommodating space a, and is guided by the first heat guide plate 10 and the second heat conduction. The heat pipe 3 has a heat absorption section 31 and a heat release section 32 extending from the heat absorption section 31, and a plurality of heat dissipation channels b are formed between the heat release section and the gear = 21, and the heat dissipation channels b are formed. The segmental part is located in the heat dissipation channel b; and the heat pipe 3 is in a flat shape. Please refer to the sixth and seventh figures, which are respectively an exploded perspective view of the heat sink and a side cross-sectional view of an embodiment of the present invention. The heat transfer junction can be combined with a heat sink 4 and a fan 50 (see 10)) to form a '1 heat sink, the heat sink 40 is attached to the surface of the first heat conducting plate 1〇, and the bottom surface of the first heat conducting plate 20 is attached to the heating element on the circuit board 6〇, and 8 The M340500 hot Lu 30 can guide the waste heat generated by the heat generating member 61 to the first heat conducting plate (7) and the outside of the heat generating component 61. Please refer to the eighth figure, which is a usage state diagram of an embodiment of the present invention. In this embodiment, the heat pipe 3 is a two-wave heat pipe and a ι type heat pipe, and the heat pipes 30 are arranged side by side. The heat pipe 3 is located directly above the heat generating component (4), and completely covers the heat generating area of the heat generating component 61, and covers the heat absorption section 3 of the heat generating area to collect heat, and then transfers the heat to the heat generating element 61. The exothermic section 32 discharges heat. a, please refer to the ninth figure, which is the use state diagram of another embodiment of the present invention. In the present embodiment, the heat pipe 3 is a two-wave heat pipe and two juxtaposed between the -y wave heat pipes! The heat type f can be arranged in a corresponding manner depending on the size of the heat generating element 61. If the heating area of the heating element 61 is large, the intermediate portion of the I-type heat pipe can be added. For example, two wavy heat pipes are arranged side by side with more heat pipes (not shown in detail), so that the heat sink can correspond to Different heating elements 61 of different sizes. Referring to FIG. 10, it is a top cross-sectional view of another embodiment of the present invention. The heat dissipating device includes a fan 50 disposed and connected to the side of the heat conducting structure, and the airflow blown by the fan 50 enters the heat dissipation channel. b, the heat dissipation section 32 of the heat pipe 30 is used for heat dissipation, so that the heat conduction efficiency of the heat conduction structure 1 can be improved, and the entire heat dissipation device can be dissipated to maximize the heat dissipation performance of the heat dissipation device. Therefore, the heat dissipating device of the present invention and the heat conducting structure thereof have the following advantages: M340500 1. The plurality of heat pipes 30 are fixed in a sandwich manner by the first heat conducting plate 10 and the second heat conducting plate 20, and the heat pipe 30 can be arranged according to the manner The size of the heating element 61 is adjusted so that the heat sink and its heat conducting structure can be applied to the heating elements 61 of different specifications. 2. The first heat conducting plate 1〇 and the second heat conducting plate 2〇 fix the heat pipe in a sandwich manner, and do not need to be processed again on the heat conducting plate, so that the processing cost can be saved. 3. The heat conducting structure 1 has a plurality of heat radiating channels b connected to the outside, and is guided
，同時可進行散熱，使此散熱裝置能藉由導熱結構i發 最大的散熱效能。 X 4·第一導熱板10與第二導熱板20皆為 二’、—扁平狀’如此’可薄型化導熱結構1，使導： 結構二的厚度減小，進㈣少散熱裝置所佔的體積。 有產掌 L知本創作之散熱裝置及其導熱結構已具 見於同類產品及公·用，* ^作之構造亦未曾 爱依專利法提出申請。H 4型專财請要件， 【圖式簡單說明】 〈習知〉 第一圓孫、熱結構之立體分解圖。 :二!'為習知導熱結構之立體組合圖。 弟—圖係'為本創作導熱結構之立體分解圖 M340500 第四圖係為本創作導熱結構之立體組合透視圖 第五圖係為沿第四圖a-A剖面線之剖視圖。 第六圖係為本創作散熱裝置之立體分解圖。 ，七圖係為本創作之一實施例之側視截面圖。 第八圖係為本創作之一實施例之使用狀態圖。 ，九圖係為本創作另一實施例之使用狀態圖。 第十圖係為本創作又一實施例之俯視截面圖。 【主要元件符號說明】 〈習知> i〇a 金屬板 11a 槽溝 2〇a 熱管 〈本創作> 1 導熱結構 10 第一導熱板 11 穿孔 20 第二導熱板 21 擋板 22 通孔 30 熱管 31 吸熱段 32 放熱段 40 散熱體 50 風扇 60 電路板 M340500 61 發熱元件 a 容置空間 b 散熱通道At the same time, heat dissipation can be performed, so that the heat sink can generate maximum heat dissipation performance through the heat conducting structure i. X 4 · The first heat conducting plate 10 and the second heat conducting plate 20 are both two '--flat' so that the thin heat-conducting structure 1 can be thinned, so that the thickness of the structure 2 is reduced, and the (four) heat-dissipating device occupies less volume. The heat sink and its heat-conducting structure have been found in similar products and public use. The construction of *^ has never been applied for by the patent law. H 4 type special wealth request, [simple description of the map] <study> The first round sun, the three-dimensional exploded view of the thermal structure. : 二!' is a three-dimensional combination of the known heat conduction structure. The brother-picture system is an exploded view of the heat-conducting structure of the creation. The fourth figure is a perspective view of the three-dimensional combination of the heat-conducting structure. The fifth figure is a cross-sectional view along the line a-A of the fourth figure. The sixth figure is an exploded view of the heat sink of the creation. Figure 7 is a side cross-sectional view of one embodiment of the present creation. The eighth figure is a usage state diagram of an embodiment of the present creation. The nine-picture is a usage state diagram of another embodiment of the present creation. The tenth drawing is a top cross-sectional view of still another embodiment of the creation. [Explanation of main component symbols] <General knowledge> i〇a Metal plate 11a Groove 2〇a Heat pipe <This creation> 1 Thermal conductive structure 10 First heat conducting plate 11 Perforation 20 Second heat conducting plate 21 Baffle 22 Through hole 30 Heat pipe 31 Heat absorption section 32 Heat release section 40 Heat sink 50 Fan 60 Circuit board M340500 61 Heating element a accommodating space b Heat dissipation channel