M339881 八、新型說明·· 【新型所屬之技術領域】 ^創作係為一種電路板之導通孔結構，旨在提供一較 •佳之導通孔結構可簡化該電路板之製程。 、 【先前技術】M339881 VIII. New Description·· 【New Technical Fields】 ^The authoring department is a conductive via structure of a circuit board. It is intended to provide a better via structure to simplify the process of the board. [Prior Art]
• 按，電路板（Printed Circuit B 〇 a r d，P C B)係由傳遞電訊的電路層（銅膜）扮演 φ 各電子疋件之間的電路聯結，並且將所需電路網集成平面 並且分佈在電路板的板面或立體式的電路層，以構成不同 位置元件之間聯結的網路；電路板之基礎材料，多係利用 絕緣紙、玻璃纖維布或其他纖維材料經樹脂含浸的黏合片 豐和而成的積層板’在而溫兩壓下於單面或雙面覆加銅膜 而構成；至於，用以構成電路板各電路層電路的導體則可 透過具有導電材料的孔結構所構成。 如第一圖（Α)至第一圖（F)所示，係為一種習有電路板 蓋孔結構之製造流程圖，其中，蓋孔結構係用以導通電路 _ 板10相對應設於積層板11兩個板面的電路材12,故其首先 • 係如第一圖（Α)及第一圖（Β)所示，在電路板1〇上設有一同 • 時貫穿積層板11及其兩面電路材12的貫通孔13,再經過第 一圖（C)的電艘加工製程’使貫通孔13之壁面形成有連接 電路材14,以構成積層板11上下兩面電路材12形成電性連 接之後，並須再經由如第一圖（D)所示之塞膠15於貫通孔 13中，並經由第一圖（Ε)所示之刷磨溢膠加工製程，方得 以利用鍍銅加工製程至少將其中一個電路材12的表面加 5 M339881 以填平如第一圖（F)所示，使該積層板丨丨兩側外露之電路 ' 材12上形成電鍍層16,使可做為電子元件或其他相關電路 的電路接點；惟，其整體加工流程不但趨於複雜繁瑣，其 • 加工成本亦相對較高。 、 、 #另外，如第二圖（A)至第二圖（〇所示，係為第二種係 • 用蓋孔結構之加工流程圖，其係先如第二圖（A)及第二圖 • (B)所不，在印刷電路板10上設有一同時貫穿積層板11及 其兩面電路材12的貫通孔13，再如第二圖（C)所示，採用 鲁 通孔填孔電鍍技術將貫通孔13的表面填平，使該貫通孔13 内以及兩面電路材12上形成有導通材17,藉以省略塞膠、 刷磨溢膠的加工步驟；惟，兩面電路材12以及導通孔π 仍須經由三次之電鍍技術完成。 【新型内容】 本創作其主要目的係提供一種可簡化該電路板製程 之導通孔結構。 • 為達上述目的，本創作之電路板係設有一個或以上之 導通孔，該導通孔係由電路板之頂面貫穿至底面；其中， 該導通孔於電路板頂面之開口係大於底面之開口，使該電 ‘ 路板頂面電路材成型時，可連同該導通孔内之導通材同時 成型，可簡化製程。 【實施方式】 為能使貴審查委員清楚本創作之結構組成，以及整 M339881 體運作方式茲配合圖式說明如下： . 本創作「電路板之導通孔結構」，如第三圖（A)〜（C) 所示，係為雙層電路板之實施例圖，該電路板2係設有一 ^ 個或以上之導通孔21，該導通孔21係由電路板2之頂面 22貫穿至底面23，且該導通孔21於電路板頂面22之開 口 211係大於底面23之開口 212，而如圖所示之實施例 中，該導通孔21係具有至少一傾斜之内壁面a。 先於該電路板頂面22進行加工而形成電路材24,如 φ 第三圖（B)所示，可利用電鍍或沉積（包含蒸鍍或濺鍍）方 式，於該頂面22加工亦可同時於該導通孔21中形成有導 通材25，且利用導通孔21傾斜内壁面a之設置，使該導 通材25得以均勻且快速的成型於該導通孔21中，再於電 路板底面23設置電路材24，並使該導通材25用以連接 電路板頂面22及底面23之電路材24,而該電路材24及 導通材25可以為銅。 之後，再於該電路板頂面22及底面23之電路材上進 Φ 行雷射雕刻，以形成線路圖案26，如第三圖（C)所示，並 使頂面之線路圖案26藉由導通材25與底面之線路圖案 ' 26形成電性連接，再進行後續加工處理，例如設置保護 • 層、電鍍層等，則完成雙層電路板結構。 當然，本創作亦可應用於多層電路板結構，如第四圖 (A)、（B)所示，該電路板2係設有一個或以上之導通孔 21以及複數芯層20，如圖所示係設有二層芯層20，該導 通孔21係由各芯層20之頂面201貫穿至底面202,該導 7• Press, Printed Circuit B 〇ard (PCB) is the circuit layer between the electronic components that is transmitted by the circuit layer (copper film) that transmits the telecommunication, and the required circuit network is integrated into the plane and distributed on the circuit board. a board or a three-dimensional circuit layer to form a network connected between components at different locations; the basic material of the circuit board is multi-layered with a resin-impregnated adhesive sheet of insulating paper, fiberglass cloth or other fibrous material. The laminated board is formed by applying a copper film on one side or both sides under two pressures; as a result, the conductors for forming the circuit layers of the circuit board can be formed by a hole structure having a conductive material. As shown in the first figure (Α) to the first figure (F), it is a manufacturing flow chart of a conventional circuit board cover hole structure, wherein the cover hole structure is used for the conduction circuit _ the board 10 is correspondingly disposed on the laminate The circuit board 12 of the two boards of the board 11 is firstly provided as shown in the first figure (Α) and the first figure (Β), and the same is provided on the circuit board 1〇 through the laminated board 11 and The through hole 13 of the double-sided circuit material 12 is further connected to the wall surface of the through hole 13 by the electric boat processing process of the first drawing (C) to form an electrical connection between the upper and lower surfaces of the laminated board 11 After that, it is necessary to pass through the through-hole 13 as shown in the first figure (D), and through the brush-grinding process shown in the first figure (Ε), the copper-plating process can be utilized. At least one surface of the circuit material 12 is added with 5 M339881 to fill in the plating layer 16 on the circuit 12 exposed on both sides of the laminated board as shown in the first figure (F), so that it can be used as an electron. Circuit contacts of components or other related circuits; however, the overall processing flow not only tends to be complicated and cumbersome, but also • processing costs It is also relatively high. , ,, #,, as shown in the second figure (A) to the second figure (〇, is the second type of processing flow chart with the cover hole structure, which is first as shown in the second figure (A) and the second (B) No, a through hole 13 is formed on the printed circuit board 10 through the laminated board 11 and its two-sided circuit material 12, and as shown in the second figure (C), the through hole punching plating is used. The technique fills the surface of the through hole 13 so that the conductive material 17 is formed in the through hole 13 and on both sides of the circuit material 12, thereby omitting the processing steps of plugging and brushing the glue; however, the two-sided circuit material 12 and the via hole π must still be completed by three times of plating technology. [New content] The main purpose of this creation is to provide a via structure that simplifies the board process. • For the above purposes, the circuit board of the creation has one or more The through hole is penetrated from the top surface of the circuit board to the bottom surface; wherein the opening of the conductive hole on the top surface of the circuit board is larger than the opening of the bottom surface, so that the circuit board top surface circuit material can be formed Simultaneously forming the conductive material in the via hole, [Embodiment] In order to enable your review board members to understand the structure of the creation, and the operation mode of the whole M339881 body, the following description is given as follows: . The creation of the "via structure of the circuit board", as shown in the third figure ( A) to (C), which is an embodiment of a two-layer circuit board, the circuit board 2 is provided with one or more via holes 21 which are penetrated by the top surface 22 of the circuit board 2 To the bottom surface 23, the opening 211 of the via hole 21 on the top surface 22 of the circuit board is larger than the opening 212 of the bottom surface 23, and in the embodiment shown in the figure, the through hole 21 has at least one inclined inner wall surface a. The circuit board 24 is formed by processing on the top surface 22 of the circuit board. As shown in FIG. 3(B), the top surface 22 can be processed by electroplating or deposition (including vapor deposition or sputtering). At the same time, the conductive material 25 is formed in the via hole 21, and the inner wall surface a is inclined by the conductive via 21, so that the conductive material 25 is uniformly and rapidly formed in the via hole 21, and then disposed on the bottom surface 23 of the circuit board. Circuit material 24, and the conductive material 25 is used to connect the circuit board The circuit material 24 of the surface 22 and the bottom surface 23, and the circuit material 24 and the conductive material 25 may be copper. Thereafter, laser engraving is performed on the circuit board of the top surface 22 and the bottom surface 23 of the circuit board to form a line. The pattern 26 is as shown in the third figure (C), and the top line pattern 26 is electrically connected to the bottom line pattern 26 by the conductive material 25, and then subjected to subsequent processing, for example, providing a protective layer, The plating layer and the like complete the double-layer circuit board structure. Of course, the creation can also be applied to the multilayer circuit board structure, as shown in the fourth figure (A), (B), the circuit board 2 is provided with one or more The via hole 21 and the plurality of core layers 20 are provided with a two-layer core layer 20 as shown in the figure. The via holes 21 are penetrated from the top surface 201 of each core layer 20 to the bottom surface 202.