M338754 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種製造積層陶瓷電容器之印刷網版， 尤指一種可製成積層陶瓷電容器其L形内電極印刷網版。 【先前技術】 目前製作電子元件之趨勢，係朝向製作成極為輕薄短 小，而積層陶瓷電容器亦不例外；請參閱第十一圖所示， 積層陶兗電容器係由複數陶甍基板（40)、内電極（4 1 )和外電極（5 0 )所組成，上述内電極（4 1 )係將 銀貧或鈀膏利用網版印刷（screen p「jntjng )的方式印在 已製做完成之介電質薄膜（圖中未示）上，即成為印刷薄 帶，如第十二圖所示，於網版印刷製程中所採用的網版（6 0 )係於一基板（6 1 )上形成複數個長矩形内電極印刷 區（6 2 )而構成，故前述内電極（4 1 )係呈長方形。 該些陶兗基板（4 0 )再與印刷薄帶相互堆疊而成為 隹且體（4 2 )，並於該堆疊體（4 2 )之兩側邊分別 鑛上:外電極（5Q)，令該外電極（5q)彳電連接該 長方形内電極（41：) <一短邊’即可完成一積層陶瓷電 前述的積層陶瓷電容器在實際製作時，是 陶/基板〇、内電極""等交替層疊後，再經 二=程序而形成獨立的堆疊體（42)。然而在此道切 ° 或是後續的測試關卡中，會產生較高的損失（L0SS) M338754 而影響其良率。 在切割損失的主要原因包含·彳 匕5 · 1 · ®層偏移而挑降。9 + 割誤判而挑除，受限於堆疊體 ，、2·切 、a &了被小不易進行立丨I而认 視，故取樣數量少，即使是正常 丁面才双 在測試損失的主要原因包含_彳挑除。 電極與外電極不連接，電容分佈散亂。 * 2·内 無論是於前述切割關卡或測 如一文 飞列忒關卡，主要導致損失比M338754 VIII. New Description: [New Technology Field] This creation is about a printing screen for making laminated ceramic capacitors, especially a L-shaped internal electrode printing screen which can be made into a laminated ceramic capacitor. [Prior Art] The current trend of making electronic components is extremely light and thin, and multilayer ceramic capacitors are no exception; see Figure 11, the laminated ceramic capacitors are made up of a plurality of ceramic substrates (40), The inner electrode (4 1 ) and the outer electrode (50) are formed by printing the silver-depleted or palladium paste by screen printing (screen p "jntjng"). On the electroless film (not shown), it becomes a printed ribbon. As shown in Fig. 12, the screen (60) used in the screen printing process is formed on a substrate (6 1 ). The plurality of long rectangular inner electrode printing regions (62) are formed, so that the inner electrodes (4 1 ) are rectangular. The ceramic substrates (40) are stacked on the printed ribbon to form a body (4). 2), and on the two sides of the stack (42) respectively, the upper electrode: the outer electrode (5Q), the outer electrode (5q) is electrically connected to the rectangular inner electrode (41:) < a short side A multilayer ceramic capacitor can be completed. The above-mentioned multilayer ceramic capacitor is actually made of ceramic/substrate, After the electrodes "" are alternately stacked, a separate stack (42) is formed by the second = program. However, in this pass or subsequent test levels, a higher loss (L0SS) M338754 is generated. Affects the yield. The main cause of the cutting loss is the 彳匕5 · 1 · ® layer offset and the pick-up. 9 + culling and picking, limited by the stack, 2 · cut, a & It is difficult to stand up and look at it, so the number of samples is small, even if it is normal but the main reason for the loss is _彳. The electrode is not connected to the external electrode, and the capacitance distribution is scattered. * 2· Whether it is in the aforementioned cutting level or measuring the level of the fly, it mainly leads to the loss ratio.
心、產品良率低的因素可說是與内電極（4 … 不良習習相關，詳細原因說明如下·· 、又。十 1 ·該内電極（4 Ί ) #却* 4 & «= 、4丄）係口又什為長矩形並以其一 外電極（5 0 )構成電連接，兩者 邊與 私和、 ^ t K際互相接觸的面積相 田乍小，容易導致電性接觸不良， 、 认A / ， 4兩考凡全沒有連接。 於進仃測試作業時，當有内電極（ n、 無法與外電極 :電連接時’内部電容的分佈會相當散亂而無法形成原 先預定規劃設計的電容分佈，而導致電容值 有電容離層值出現。 差大且 2 ·欲判斷積層陶竟電容器内部各層是否皆正確對位 璧時，必須對積層陶£電容器進—步執行破壞性的剖面 :視作業，從其剖面觀測内電極（4丄）#無偏移及其偏 移：。然而積層陶瓷電容器的體積相當微小，較難獲得完 美面，不僅需花數倍人力成本才能取得疊層和切割作業 的相關數據，其切割結果也是不易判定，容易誤判數據。〆、 3_當溫度改變時，由於陶瓷基板（4 〇 )與内電極（4 1 )因材質差異而有不同的熱脹冷縮係數，將造成陶瓷基 M338754 板（4 Ο )與内電極（4 1 )的收縮程度不一致，導致陶 曼基板（40)與内電極（4 1)之間產生一應力；此外， 又由於該外電極（5 0)成形後，其與陶瓷基板（4〇) 之間亦會由於熱脹冷縮係數之不同而產生另一應力。是 以’陶曼基板（4 0 )將受應力拉扯而變得較為脆弱，尤 其是外電極（5 0)和内電極（4 1 )短邊之連接處為前 述兩應力之交會處，該處即是積層陶瓷電容器最脆弱之部 位’極容易發生内裂現象。 除此之外，該陶瓷基板（40)與内電極（41 )之 間之應力亦會造成内電極（4 1 )與外電極（5 〇 )之間 接觸不良’其主因在於當内電極（41)受到應力拉扯時， 其外型將會扭曲變形，致使内電極（4 1 )與外電極（5 〇 )之間無法緊密地接觸，導致電性接觸不良，造成能量 損失。内電極（41)與外電極（50) —旦接觸不良， 則使得積層陶瓷電容器之電性變差，且更會令等效串聯電 阻值（Equivalent Series Resistance，簡稱 ESR)提高， 致使品質因數（Quality Factor，簡稱Q值）過低，換言 之即是散逸係數（Dissipation Factor，簡稱DF值）過高， 因而影響產品的品質與良率。 由於積層陶瓷電容器的生產製程非常精密，且前後關 卡環環相扣，當前面階段的作業有些許的誤差，即直接影 響到成品的品質及良率。然而誠如前揭所述，後面的測試 關卡因為不易進行正確的檢測而且必須花費較長的作業時 間，往往難以即時反應出前階段製程中所存在的問題。於 M338754 發現問題時，在這段時間過程中所製作出的產品有可能比 為不良品而需全部淘汰，對製造廠商而言將是二 本浪費。 x 由上述可知，就目前積層陶瓷電容器的製程步驟中， 内電極（4 1 )的設計優良與否係為影響成品之品質與良 - 率的最大因素，因此尚有待進一步之改進方案。 【新型内容】 ® 為此，本創作之主要目的在提供一種製造積層陶曼電 容器之印刷網版，係可供形成L形内電極，令以該l形内 電極構成之積層陶瓷電容器具有内外電極電性連接良好、 毋須剖面破壞即可直接檢視内電極層疊有無偏移等優點。 為達成前述目的所採取之主要技術手段係令該印刷網 版包含： 一基板；及 _ 複數個形成於該基板上的電極印刷區，各電極印刷區 係為T形。 ^ 再者’兩相鄰的τ形電極印刷區係可彼此相對連接而 ， 形成一 Η形的電極印刷區。 利用本創作網版係可形成L形内電極，該L形内電極 之寬短部與外電極之間的接觸面積增大，因此更能確保兩 者之間有良好的電性接觸，且該寬短部之兩邊係分別平齊 於其所設之陶瓷基板之兩邊，故自層疊結構之側面便能輕 易判別内電極有無偏移，且可大量獲得相關數據，即時提 7 M338754 t、予對應的作業站台，有效降低作業失誤所導致的成品損 失比例。 【實施方式】 本么明係一製造積層陶瓷電容器之印刷網版，利用此 網版所形成的積層陶瓷電容器將具備L形的内電極，於詳 、、、田” ^本創作印刷網版之前，係略加解釋積層陶瓷電容器 之内邛結構。請參考第一、二圖所示，該積層陶瓷電容器 包括複數陶瓷基板（1 〇 )與兩外電極（2 〇 )。 該複數陶瓷基板（i 〇 )係相互堆疊，且各陶瓷基板 (1 0 )之頂面係設置有一 L形内電極（1 1 )，且兩相 鄰陶竟基板（1 〇 )上的L形内電極（1 1 )係以前後相 反的方向設置；其中，該L形内電極（i）便是以本創 作的印刷網版製造而成，該L形内電極（1 1 )係包含： 一寬短部（1 1 1 )，其一長邊（1丄丄〇 )係平齊 地设置於該陶瓷基板（1 0 )之一短邊，且寬短部（1 1 1 )之一短邊（1 1 1 2 )亦是平齊地設地設該陶瓷基板 (1 〇 )其中一長邊；以及 一窄長部（1 1 2 )，其一短邊係連接前述寬短部（工 1 1 )之另一長邊，而另一短邊則接近該陶瓷基板（i 〇) 的相對短邊。 其中，各L形内電極（11)的寬短部（111)均 是朝相同方向延伸，即各寬短部（1 1 1 )的短邊均平齊 於各陶曼基板（1 0)相同一側的長邊。 M338754 請參考第三圖所示，為本創作印刷網版（3 〇 A )第 一較佳實施例之示意圖，該印刷網版（3 〇 a )係於一基 板（3 1 A )上形成複數個規則並排的τ形電極印刷區（3 2 A )所構成，各Τ形電極印刷區（3 2 a )係彼此獨立， 互不連接；請參考第四圖所示，當使用該印刷網版（3 〇 A )進行内電極的網版印刷作業後，係可獲得如第三圖所 不的T形内電極圖案，當沿著圖面所示的切割線（3 4 ) 加以裁切刀副後，便可獲得先前所述的L形内電極（1 1 )。 請參考第五、六圖所示，為本創作印刷網版（3 〇 b ) 第二較佳實施例之示意圖，與前一實施例之差別在於該丁 形電極印職係兩兩相對連接，而在基板（3 i B )上形 成複數個Η形電極印刷@ ( 3 2 B )，各η形電極印刷區 (3 2 Β )係彼此獨立，互不連接。如第七圖所示，當利 用、、’罔版（3 Ο Β )印刷丨Η形的内電極印刷圖案後，可沪 著圖上所示的切割、線（34)進行裁切分割，便可製造出口 形的内電極（1丄），單一個Η形的内電極印刷圖案係 可切割出四個獨立的L形内電極（丄1 )。 藉由本創作之印刷網版製成L形内電極（1 且内電極（1 1 y 1y Μ / , 1 k丄丄）其寬短部（111)的-短邊與一長邊 分別與陶瓷基板（Ί n〉 长遺 的一長邊及一短邊平齊設置，係 具有以下優點： 你 1 ·於切割關卡中完虑 成的堆疊體加以檢測，=]作業後，便可直接對切割完 視作業，就可得知乂和γ 才双 釉的$層偏移，且可大量取得疊 M338754 層與切割相關數據。舉例而 測内電極（1 ])古釭士 /亏弟八圖所不，欲檢 接以陶竞基板UOh邊緣為表：“ ’可直 測a、b兩參數，#…a ^考基準’於側面便可量 叮古s〜 3、b參數與原先之設計值不同時，便 2.因具有211)可能有X轴或Y軸上的偏移。 數據直接對1里的^層與切割相關數據，可直接根據該 謝接對豐層和切割兩作業站台提供資 失 :于通知並加以改善，有效降低製程損失。 3_負貝切割的作業人員容易判定X軸和Y軸的安入距 離值（Creepage Path < 軸的女全距 _ Μ Path，CP)CP1、cp2 與 cp3 是否正確可 大幅減少因誤判切割成品而衍生的損失。#第八圖所示， 因為内電極（1 1 )是以網版（3 0 a ) ( 3 〇 b )印刷 構成’因此在設計網版時，制電極（1 1 )的其中兩參 ::2與b3均為已知的預設值，且陶瓷基板（1 〇)的長 度Y1、寬度X1亦是已知的預設值，而經過量測得到的數 據為a 1 & b 1 ’因此，可利用上述數據套入下列的公式便 可得知安全距離值cp1、CP2與 cp3: cp1=Y1-b2 = Yl-(bl+b3) cp2=a1 cp3=X 1 -a 1-a2 4.由於可即時回饋改善疊層作業中的缺失，使各層内 電極（1 1 )在陶瓷基板（i 〇 )上的位置能更為準確地 单控’故具有較佳的電容分佈型態，可使整體的陶兗電容 為能符合預先的電容分佈設計。 M338754 :·:較於傳統的長矩形内電極圖案，以匕形内電極（1 )，、外電極（2 G )電連接係增加内 積，於製作外電極（2 時，可 "的接觸面 率。 杈円兩者電性連接的良 々6.即使當溫度改變時，由於該l形内電極 广部（H)與陶£基板（10)和外電極（2〇)之 4的接觸面積係較習用積層陶£電容器增大 内電極（i i )與陶莞基板（2 〇 )之 ^ ^ 地降低，而不致如習用積層陶究電容器般 -易產生内裂之問題；且…形内電極（Η)之外型 因應力之作用而扭曲變形’亦會因L形内電極㈠ 見短部（1 1 1 )和外電極（2 〇 ) 、 接觸面積，而可較習用積層陶之較大的 、 文冤谷斋保有更多的接觸機 ^ ’進而減少能量的損失。 ，請配合參閱第九圖所示，積層陶竟電容器之等效電路 係包含一電感（Ls)、一表示内電極（1 1 )内阻、外電 極（2 0 )内阻和内，外電極（1 1 ) ( 2 0 )接合處内 阻之内電阻（Re )、-等效串聯電阻（Equivalent Series ’簡稱ESR)㈤）、一電容（c)以及一代 表陶究基板（1 〇)内阻之絕緣阻抗（Rins)，其中該内 電P ( Re)之&係與該電感（⑷串聯，該已⑶（叫 係舁電谷（C )串聯後再共同與該絕緣阻抗（r丨ns )並聯， 此一並聯電路又與内電阻（Re)之另端串聯。 °"考第十圖所不，當輸入-交流電源進入本創作之 M338754 積層陶瓷電容器時，由於該電容（c)係視同短路且該絕 緣阻抗（Rms)之阻值極高，因此第九圖之電路可視為電 感（LS)、内電阻（Re) 、ESR ( Rd)和電容（C)串聯 之等效電路。 由上述可知，當積層陶瓷電容器因L形内電極工） 的寬短部（1 1 1 )和外電# ( 2 〇 )之間具有較大的接 觸面積’而可具有較多的接觸機會時，積層陶瓷電容器的 ESR之阻值會相對地下降，如此一來，隨著日叩的降低， 由於散逸係數（D丨ssipati(5n FactQr，簡稱DF值）係為咖 與電容容抗之比值，因此DF值亦會隨著降低；而代 表積層陶電容器性能優劣之品質因數（Qua"ty 稱Q值）則因為係與DF值呈倒數關係，& q值將隨 高’ Q值的提高即代表電容器之電性較為穩定。 綜上所述，本創作可供製成積層陶究電容器之l形内 電極，實為一極具進步性與實用性 或公開使用，具專利之申請要件，羡依:提出且申=於刊物 【圖式簡單說明】 圖。 第 第 示意圖 第一圖：係利用本創作製成之積層陶究電容器的分解 ::係第-圖所示積層陶竟電容器之側剖面圖。 圖：係本創作印刷網版之第-較佳實施例的平面 其二：圖係利用第三圖印刷網版所形成之内電極圖索 12 M338754 弟五圖··係本創作 示意圖。 第六圖··係本創作 示意圖。 印刷網版之繁-> ^ 一幸父佳貫施例的平面 印刷網版之第一 平乂1土貫施例的立體 第七圖·利用第五圖印刷網版所形 切割示意圖。 之内電極圖案其 “圖：係'檢測内電極有無偏移之示意圖。 第九圖·係使用本創作印刷網版所 各之等效電路圖。 形成之積層陶瓷電 第十目：係使用本創作印刷網版所形成之積層陶瓷電 奋翰入一交流電源時之等效電路圖。 圖。第十一圖：係習用積層陶究電容器之外觀暨透視示意 第十一圖·係習用印刷網版之平面示意圖。【主要元件符號說明】 m (1 0)陶瓷基板 (111)寬短部 (1112)長邊 (2 〇 )外電極 (2 2 )保護層 (3 〇 a ) ( 3 Q B )印刷網版 (3 1 A ) ( 3 1 B )基板 (3 2 A ) T形電極印刷區 (3 2 B ) Η形電極印刷區 (1 1 ) L形内電極 (1 1 1 0 )短邊 (112)窄長部 (21)電極層 (2 3 )導電層 13 M338754 (3 4 )切割線 (4 Ο )陶瓷基板 （ (4 2 )堆疊體 （ (6 0 )網版 （ (6 2 )内電極印刷區 1 )内電極 0 )外電極 1 )基板The factors of low heart and product yield can be said to be related to the internal electrode (4 ... bad habits, the detailed reasons are as follows), and again. Ten 1 · The inner electrode (4 Ί) #却* 4 & «= , 4丄) The mouth is evenly rectangular and is electrically connected by an external electrode (50). The area of the two sides that are in contact with each other and the contact between the two are small, which is likely to cause electrical contact failure. A/, 4 and no test are all connected. During the test operation of Yujin, when there is an internal electrode (n, can not be electrically connected to the external electrode: 'the internal capacitance distribution will be quite scattered and can not form the capacitance distribution of the original predetermined planning design, resulting in capacitance value separation The value appears. The difference is large and 2 · If you want to judge whether the layers inside the capacitor are correctly aligned, you must perform a destructive section on the laminated ceramic capacitor: see the internal electrode from the profile.丄)#No offset and its offset: However, the volume of the multilayer ceramic capacitor is quite small, and it is difficult to obtain a perfect surface. It takes several times of labor cost to obtain the relevant data of lamination and cutting operations, and the cutting result is not easy. It is easy to misjudge the data. 〆, 3_ When the temperature changes, the ceramic substrate (4 〇) and the internal electrode (4 1 ) have different thermal expansion and contraction coefficients due to material differences, which will result in the ceramic-based M338754 plate (4 Ο) is inconsistent with the degree of shrinkage of the inner electrode (4 1 ), resulting in a stress between the Tauman substrate (40) and the internal electrode (41); in addition, due to the formation of the outer electrode (50) Another stress will be generated between the ceramic substrate and the ceramic substrate (4〇) due to the difference in thermal expansion and contraction coefficient. The 'Taowman substrate (40) will be stressed and pulled, especially outside. The junction of the short side of the electrode (50) and the inner electrode (4 1 ) is the intersection of the aforementioned two stresses, where the most fragile portion of the multilayer ceramic capacitor is extremely prone to internal cracking. The stress between the ceramic substrate (40) and the internal electrode (41) also causes poor contact between the internal electrode (4 1 ) and the external electrode (5 〇). The main reason is that when the internal electrode (41) is subjected to stress pulling, The shape will be distorted, causing the inner electrode (4 1 ) to be in intimate contact with the outer electrode (5 〇), resulting in poor electrical contact and energy loss. The inner electrode (41) and the outer electrode (50) If the contact is poor, the electrical properties of the multilayer ceramic capacitor are deteriorated, and the Equivalent Series Resistance (ESR) is increased, so that the quality factor (Q value) is too low, in other words. Is the dissipation factor (Diss The ipation factor (referred to as the DF value) is too high, thus affecting the quality and yield of the product. Since the production process of the laminated ceramic capacitor is very precise, and the front and back checkpoints are interlocked, there is a slight error in the current stage operation, that is, the direct influence To the quality and yield of the finished product. However, as mentioned earlier, the latter test level is difficult to accurately detect and it takes a long time to operate, and it is often difficult to immediately reflect the problems in the pre-stage process. When a problem is discovered, the product produced during this period of time may be completely eliminated than the defective product, which is a waste for the manufacturer. x As can be seen from the above, in the current manufacturing process of the laminated ceramic capacitor, whether the design of the internal electrode (4 1 ) is excellent or not is the biggest factor affecting the quality and the yield of the finished product, and therefore there is still a need for further improvement. [New Content] ® For this reason, the main purpose of this creation is to provide a printing screen for manufacturing a laminated Tauman capacitor, which is capable of forming an L-shaped internal electrode, and the laminated ceramic capacitor composed of the 1-shaped internal electrode has internal and external electrodes. The electrical connection is good, and the presence or absence of offset of the internal electrode stack can be directly observed without breaking the profile. The primary technical means for achieving the foregoing objectives is that the printing screen comprises: a substrate; and _ a plurality of electrode printing regions formed on the substrate, each electrode printing region being T-shaped. Further, the two adjacent τ-shaped electrode printing regions can be connected to each other to form a 电极-shaped electrode printing region. The L-shaped inner electrode can be formed by using the original screen, and the contact area between the wide and short portions of the L-shaped inner electrode and the outer electrode is increased, thereby ensuring good electrical contact between the two, and the The two sides of the wide and short portions are flush with the two sides of the ceramic substrate, so that the inner electrode can be easily discriminated from the side of the laminated structure, and the relevant data can be obtained in a large amount, and 7 M338754 t is immediately provided. The work platform effectively reduces the proportion of finished product losses caused by operational errors. [Embodiment] This is a printing screen for manufacturing a multilayer ceramic capacitor. The laminated ceramic capacitor formed by using this screen will have an L-shaped internal electrode, which is before the creation of the screen. The system directly explains the internal structure of the multilayer ceramic capacitor. Please refer to the first and second figures. The multilayer ceramic capacitor includes a plurality of ceramic substrates (1 〇) and two external electrodes (2 〇). The plurality of ceramic substrates (i 〇) are stacked on each other, and an L-shaped internal electrode (1 1 ) is disposed on the top surface of each ceramic substrate (10), and an L-shaped internal electrode (1 1 ) on two adjacent ceramic substrates (1 〇) The L-shaped internal electrode (i) is manufactured by the printed screen of the present invention, and the L-shaped internal electrode (1 1 ) comprises: a wide and short part (1 1 ) 1), one long side (1丄丄〇) is flushly disposed on one of the short sides of the ceramic substrate (10), and one of the short sides (1 1 1 ) has a short side (1 1 1 2 ) One of the long sides of the ceramic substrate (1 〇) is disposed flush with the ground; and a narrow portion (1 1 2 ) is connected to the short side The other short side of the short portion (the work 1 1 ) is connected, and the other short side is close to the opposite short side of the ceramic substrate (i 〇). wherein the width and the short portion of each L-shaped inner electrode (11) ( 111) all extend in the same direction, that is, the short sides of the wide and short portions (1 1 1 ) are flush with the long sides of the same side of each Tauman substrate (10). M338754 Please refer to the third figure, A schematic diagram of a first preferred embodiment of the present printing screen (3 〇A), the printing screen (3 〇a) is formed on a substrate (3 1 A ) to form a plurality of regular side-by-side τ-shaped electrode printing areas (3 2 A ), each of the 电极-shaped electrode printing areas (3 2 a ) are independent of each other and are not connected to each other; please refer to the fourth figure, when using the printing screen (3 〇A ) for the internal electrodes After the screen printing operation, the T-shaped internal electrode pattern as shown in the third figure can be obtained, and when the cutting blade is cut along the cutting line (3 4 ) shown in the drawing, the previously described one can be obtained. L-shaped inner electrode (1 1 ). Please refer to the fifth and sixth figures, which is a schematic view of the second preferred embodiment of the creative printing screen (3 〇b), and the previous embodiment The difference is that the butt-shaped electrode printing system is connected in pairs, and a plurality of Η-shaped electrode printing @(3 2 B ) is formed on the substrate (3 i B ), and each of the n-shaped electrode printing regions (3 2 Β ) is mutually connected Independently, they are not connected to each other. As shown in the seventh figure, when the pattern of the inner electrode printed on the 罔-shaped (3 Ο Β ) is printed, the cutting and line shown on the map can be taken (34). By performing the cutting and splitting, an outlet-shaped inner electrode (1 丄) can be manufactured, and a single Η-shaped inner electrode printing pattern can cut out four independent L-shaped inner electrodes (丄1). The L-shaped inner electrode (1 and the inner electrode (1 1 y 1y Μ / , 1 k丄丄) has a short side and a long side of the wide and short side (111) and the ceramic substrate, respectively, by the printing screen of the present invention. (Ί n> The long side and the short side of the long trail are set in the same way. You have the following advantages: 1. You can test the stack in the cut level. After the job, you can directly cut it. Depending on the operation, it can be known that the 层 and γ double glaze layer offset, and a large number of M338754 layers and cutting related data can be obtained. For example, the internal electrode (1)) is not the ancient gentleman / the younger brother To check the UOh edge of the Tao Jing substrate as the table: " 'Can directly measure a, b two parameters, #...a ^ test reference' on the side can be measured 叮 3 3, b parameters are different from the original design value 2. Because there is 211) there may be an offset on the X-axis or the Y-axis. The data directly corresponds to the 1 layer and the cutting-related data, and can directly supply the two layers of the work platform according to the thank-you connection. Loss: Informed and improved to effectively reduce process losses. 3_The operator of negative shell cutting can easily determine the distance between the X and Y axes (C Reepage Path < Axis female full distance _ Μ Path, CP) CP1, cp2 and cp3 correct can greatly reduce the loss caused by misjudgment of the finished product. #8, because the internal electrode (1 1) is Screen (30 a) (3 〇b) printing constitutes 'so in the design of the screen, two of the electrodes (1 1 ): 2 and b3 are known presets, and the ceramic substrate ( The length Y1 and the width X1 of 1 〇) are also known preset values, and the measured data is a 1 & b 1 ' Therefore, the safety distance can be known by using the above data in the following formula. Values cp1, CP2 and cp3: cp1=Y1-b2 = Yl-(bl+b3) cp2=a1 cp3=X 1 -a 1-a2 4. Since the feedback can be improved in the stacking operation, the electrodes in each layer are made. (1 1 ) The position on the ceramic substrate (i 〇) can be more accurately controlled. Therefore, it has a better capacitance distribution pattern, so that the overall ceramic capacitor can be designed to meet the pre-capacitance distribution design. ·: Compared with the traditional long rectangular internal electrode pattern, the internal connection of the inner electrode (1) and the outer electrode (2 G) increases the inner product, and the outer electrode is fabricated. 2, the contact rate can be " 杈円 电 电 电 电 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 々 2)) The contact area of 4 is lower than that of the conventional laminated ceramic capacitor (ii) and the ceramic substrate (2 〇), and it is not as easy to produce internal cracks as the conventional laminated ceramic capacitor. The problem; and... the shape of the inner electrode (Η) is distorted by the action of stress', and the inner electrode (1) of the L-shaped inner electrode (1) and the outer electrode (2 〇), the contact area, Compared with the larger version of the multi-layered pottery, Wenyu Guzhai has more contact machines to reduce energy loss. Please refer to the ninth figure. The equivalent circuit of the laminated ceramic capacitor includes an inductor (Ls), an internal resistance of the internal electrode (1 1 ), an internal resistance of the external electrode (20), and internal and external electrodes. (1 1 ) ( 2 0 ) Internal resistance (Re ), - equivalent series resistance (Equivalent Series 'ESR) (5)), a capacitor (c) and a representative of the ceramic substrate (1 〇) Insulation resistance (Rins), wherein the internal electric P (Re) & is connected in series with the inductance ((4), which has been connected in series with the insulation valley (C) and then with the insulation resistance (r丨Ns) in parallel, this parallel circuit is connected in series with the other end of the internal resistance (Re). °"Test No. 10, when the input-AC power supply enters the M338754 multilayer ceramic capacitor of this creation, due to the capacitance (c The circuit is considered to be short-circuited and the resistance of the insulation resistance (Rms) is extremely high, so the circuit of the ninth diagram can be regarded as the equivalent of inductance (LS), internal resistance (Re), ESR ( Rd) and capacitance (C). It can be seen from the above that when the multilayer ceramic capacitor is due to the wide and short portions (1 1 1 ) of the L-shaped internal electrode) and the external electric # ( 2 〇) When there is a large contact area' and there are more contact opportunities, the resistance of the ESR of the multilayer ceramic capacitor will decrease relatively, so that as the corona decreases, due to the dissipation factor (D丨ssipati(5n FactQr (referred to as DF value) is the ratio of coffee to capacitance tolerance, so the DF value will also decrease; and the quality factor (Qua"ty Q value) representing the performance of laminated ceramic capacitors is due to the DF value. The reciprocal relationship, & q value will increase with the increase of the high 'Q value, which means that the electrical properties of the capacitor are relatively stable. In summary, this creation can be used to make the inner electrode of the laminated ceramic capacitor, which is a very high Progressive and practical or public use, patented application requirements, conversion: proposed and applied = in the publication [schematic description] Figure. First schematic: the first layer of the use of this creation of laminated ceramic capacitors The decomposition is: a side cross-sectional view of the laminated ceramic capacitor shown in Fig. - Fig.: The plane of the first preferred embodiment of the present printing screen is the second: the drawing is formed by the third printing grid. Internal electrode map 12 M338 754 The fifth picture of the younger brother is the schematic diagram of the creation. The sixth picture·················································································· The third-dimensional figure of the example is a schematic diagram of the cutting of the screen printed by the fifth figure. The inner electrode pattern has a schematic diagram of detecting the presence or absence of offset of the inner electrode. The ninth picture is the use of the creative printing screen. Equivalent circuit diagram of each layer. Formed laminated ceramic electric tenth: It is the equivalent circuit diagram when using the laminated ceramic electric fuse formed by the creation printing screen to enter an AC power supply. Figure. Figure 11: Appearance and perspective of the conventional laminated ceramic capacitors. Figure 11 is a schematic diagram of the printed screen. [Description of main component symbols] m (1 0) ceramic substrate (111) wide and short part (1112) long side (2 〇) outer electrode (2 2 ) protective layer (3 〇a ) ( 3 QB ) printing screen (3 1 A ) ( 3 1 B ) substrate (3 2 A ) T-shaped electrode printing area (3 2 B ) Η-shaped electrode printing area (1 1 ) L-shaped inner electrode (1 1 1 0 ) short side (112) narrow length Part (21) electrode layer (23) conductive layer 13 M338754 (3 4) cutting line (4 Ο) ceramic substrate ((4 2 ) stack ((6 0) screen ((6 2 ) inner electrode printing area 1 ) inner electrode 0) outer electrode 1) substrate
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