JP5782374B2 - Multilayer electronic component and manufacturing method thereof - Google Patents

Multilayer electronic component and manufacturing method thereof Download PDF

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JP5782374B2
JP5782374B2 JP2011286385A JP2011286385A JP5782374B2 JP 5782374 B2 JP5782374 B2 JP 5782374B2 JP 2011286385 A JP2011286385 A JP 2011286385A JP 2011286385 A JP2011286385 A JP 2011286385A JP 5782374 B2 JP5782374 B2 JP 5782374B2
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cover layer
green sheet
laminate
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ceramic
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JP2013135178A (en
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貴道 小川
貴道 小川
山本 洋
洋 山本
大塚 淳
淳 大塚
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日本特殊陶業株式会社
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Description

  The present invention relates to a multilayer electronic component configured by alternately laminating ceramic layers and internal electrode layers and a method for manufacturing the same.

  For example, a multilayer electronic component formed by alternately laminating a plurality of ceramic layers and a plurality of internal electrode layers, such as a multilayer ceramic capacitor, generally includes a plurality of ceramic green sheets having internal electrode layers formed on the surface. It is manufactured by stacking to form a laminate and firing the laminate (see, for example, Patent Documents 1 and 2).

JP-A-3-52210 JP 2007-266223 A

In recent years, there has been a problem that as the number of layers of multilayer electronic components increases and the number of layers of multilayer electronic components increases, the warpage of the multilayer body increases after the multilayer body is fired.
This invention is made | formed in view of such a problem, and it aims at providing the technique which suppresses the curvature of a multilayer electronic component.

  In order to achieve the above object, the present invention provides a laminated body constituted by alternately laminating a plurality of ceramic layers and a plurality of internal electrode layers, and a lower surface of the laminated body in the laminating direction of the laminated body. A first cover layer, which is a ceramic layer laminated so as to cover the lower surface, and a second cover layer, which is a ceramic layer laminated so as to cover the upper surface, are provided on the upper surface of the laminated body in the lamination direction of the laminated body. In the multilayer electronic component, the particle size of the ceramic particles constituting the first cover layer is larger than the particle size of the ceramic particles constituting the laminate, and the particle size of the ceramic particles constituting the second cover layer is A multilayer electronic component characterized by being smaller than the particle size of ceramic particles constituting the body.

  In the multilayer electronic component configured in this way, an internal conductor pattern serving as an internal electrode layer is printed, and a process for forming a plurality of multilayer green sheets constituting the multilayer body after firing and a first cover layer are configured. Forming a green sheet for the first cover layer, a green sheet for the second cover layer, which is a green sheet for constituting the second cover layer, and then on the green sheet for the first cover layer And laminating the green sheets for the laminated body one by one and laminating the green sheets for the laminated body one by one, and further laminating the green sheets for the second cover layer on the green sheets for the laminated body and crimping them. Thus, the second cover layer green sheet can be manufactured by the step of laminating.

  In the multilayer electronic component of the present invention, the particle size of the ceramic particles constituting the first cover layer is larger than the particle size of the ceramic particles constituting the laminate, and the particle size of the ceramic particles constituting the laminate is It is larger than the particle size of the ceramic particles constituting the second cover layer.

  That is, the gap between the ceramic particles constituting the first cover layer is wider than the gap between the ceramic particles constituting the laminate, and the gap between the ceramic particles constituting the laminate is the ceramic constituting the second cover layer. It is wider than the gap between particles.

  Therefore, before the step of laminating the green sheets (hereinafter referred to as the green sheet laminating step), the ratio of the ceramic particles constituting the first cover layer green sheet being filled in the first cover layer green sheet ( Hereinafter, the filling rate of the green sheet for the first cover layer) is a ratio in which the ceramic particles constituting the green sheet for the laminated body are filled in the green sheet for the laminated body (hereinafter referred to as the filling rate of the green sheet for the laminated body). Lower). In addition, before performing the green sheet laminating step, the filling rate of the green sheets for the laminated body is the ratio in which the ceramic particles constituting the second cover layer green sheet are filled in the second cover layer green sheet (hereinafter referred to as the green sheet for the second cover layer). Lower than the filling rate of the green sheet for the second cover layer).

  When the laminated electronic component of the present invention is manufactured using the above-described steps, the green sheet for the first cover layer is more pressed than the green sheet for the laminate, and the green sheet for the laminate is the second cover. The number of pressurizations is higher than that of the green sheet for layers. In addition, the greater the number of pressurizations, the higher the green sheet filling rate.

  For this reason, after the green sheet laminating step, the difference in filling rate between the green sheet for the first cover layer and the green sheet for the laminated body, and the green sheet for the laminated body, compared with before the green sheet laminating step, The difference in filling rate from the second cover layer green sheet is reduced.

  Thus, when firing is performed after the green sheet laminating step, the difference in the degree of shrinkage between the first cover layer green sheet and the laminate green sheet is reduced, and the laminate green sheet and the second green sheet The difference in the degree of shrinkage with the cover layer green sheet is reduced. For this reason, in the laminated electronic component in which the first cover layer, the laminate, and the second cover layer are laminated, warping after firing can be suppressed.

  In the multilayer electronic component of the present invention, the multilayer electronic component is a via array type multilayer ceramic capacitor having a plurality of via conductors that penetrate the multilayer body, the first cover layer, and the second cover layer along the stacking direction. It is good to.

  Via array type multilayer ceramic capacitors are often formed in a rectangular parallelepiped shape, and the short side length of a rectangular plane perpendicular to the stacking direction is larger than the length in the stacking direction (capacitor thickness). In many cases, it is formed in a flat plate shape. That is, the via array type multilayer ceramic capacitor is likely to be warped after firing. For this reason, when the present invention is applied to the via array type multilayer ceramic capacitor, the occurrence of warpage can be effectively suppressed.

  In the multilayer electronic component of the present invention, the ceramic particles are preferably composed mainly of barium titanate. Since barium titanate is a ceramic material having a high dielectric constant and is relatively easy to form, it is formed by alternately laminating a plurality of ceramic layers and a plurality of internal electrode layers as in the present invention. It is suitable as a material for manufacturing a laminated electronic component having a laminated body.

  Further, the present invention made to achieve the above object includes a laminated body constituted by alternately laminating a plurality of ceramic layers and a plurality of internal electrode layers, and a lower surface of the laminated body in the laminating direction of the laminated body. A first cover layer that is a ceramic layer laminated so as to cover the lower surface, and a second cover layer that is a ceramic layer laminated so as to cover the upper surface on the upper surface of the laminated body in the lamination direction of the laminated body. A method of manufacturing a multilayer electronic component comprising: a step of forming a plurality of green sheets for a laminate that are printed with an internal conductor pattern serving as an internal electrode layer and constituting the laminate after firing; and a first cover layer Forming a first cover layer green sheet that is a green sheet for forming the second cover layer, a green sheet for forming the second cover layer, and a first cover layer Laminating a plurality of laminate green sheets on the green sheet, and further laminating a second cover layer green sheet on the laminate green sheet to form a first cover layer green sheet The particle size of the ceramic particles is larger than the particle size of the ceramic particles constituting the green sheet for the laminate, and the particle size of the ceramic particles constituting the second cover layer green sheet is the ceramic constituting the green sheet for the laminate A method for producing a laminated electronic component, wherein the method is smaller than the particle size of the particles.

This manufacturing method is a method for manufacturing the multilayer electronic component of the present invention. By executing this method, the same effect as the multilayer electronic component of the present invention can be obtained.
Further, in the manufacturing method of the present invention, the multilayer electronic component is a via array type multilayer ceramic capacitor having a plurality of via conductors penetrating the multilayer body, the first cover layer, and the second cover layer along the lamination direction, After the step of laminating the second cover layer green sheet, a step of forming a via hole penetrating the laminate, the first cover layer, and the second cover layer along the laminating direction, and a via paste that becomes a via conductor after firing May be included in the via hole.

  This manufacturing method is a method for manufacturing the via array type multilayer ceramic capacitor of the present invention. By executing this method, the same effect as the via array type multilayer ceramic capacitor of the present invention can be obtained.

2 is a perspective view and a cross-sectional view of a multilayer electronic component 1. FIG. 1 is an exploded perspective view showing a part of a laminated electronic component 1. FIG. It is a top view of the multilayer electronic component 1 which shows the measurement position of curvature amount.

Embodiments of the present invention will be described below with reference to the drawings.
[Configuration of laminated electronic component 1]
FIG. 1A is a perspective view of a multilayer electronic component 1 to which the present invention is applied, and FIG. 1B is a diagram showing a cross section taken along line AA of FIG.

  As shown in FIG. 1A, the multilayer electronic component 1 is a rectangular parallelepiped via array type multilayer ceramic capacitor. As shown in FIG. 1B, the multilayer body 2, the cover layers 3 and 4, and the via conductor 5 are provided. , 6 and surface electrodes 7 and 8.

  The laminated body 2 is partially composed of a first internal electrode layer 22 and a second internal electrode layer 23 via a dielectric layer (hereinafter also referred to as a ceramic layer) 21 made of a dielectric ceramic such as barium titanate. It has the structure laminated | stacked alternately along the lamination direction SD in the state which does not oppose. In FIG. 1B, for simplicity of illustration, the internal electrode layers 22 and 23 are shown by alternately stacking about 5 layers, but actually, the internal electrode layers 22 and 23 are each several tens of layers. The laminated body 2 is formed by alternately stacking several hundred layers.

  The cover layers 3 and 4 are dielectric layers (ceramic layers) made of a dielectric ceramic such as barium titanate as in the ceramic layer 21. The cover layer 3 is laminated on the lower surface of the multilayer body 2, and the cover layer 4 is laminated on the upper surface of the multilayer body 2, whereby the internal electrode layers 22 and 23 in the multilayer body 2 are protected from moisture and the like.

  The via conductor 5 is a conductor that penetrates the multilayer body 2 and the cover layers 3 and 4 along the stacking direction SD in order to electrically connect the plurality of stacked internal electrode layers 22 to each other. The via conductor 6 is a conductor that penetrates the multilayer body 2 and the cover layers 3 and 4 along the laminating direction SD in order to electrically connect the plurality of laminated internal electrode layers 23 to each other. A plurality of via conductors 5 and 6 are arranged in a two-dimensional lattice pattern so that the via conductors 5 and the via conductors 6 are alternately arranged along a plane orthogonal to the stacking direction SD.

  The surface electrode 7 is provided for each of the plurality of via conductors 5 and 6, and is disposed at one end of the via conductors 5 and 6 on the surface of the cover layer 3. The surface electrode 8 is provided for each of the plurality of via conductors 5 and 6, and is disposed on the other end of the via conductors 5 and 6 on the surface of the cover layer 4. Therefore, the surface electrodes 7 and 8 are arranged in a two-dimensional lattice pattern along the surfaces of the cover layers 3 and 4 (see FIG. 1A).

  The multilayer electronic component 1 configured as described above can apply different voltages between the first internal electrode layer 22 and the second internal electrode layer 23 via the surface electrodes 7 and 8. . Thereby, the multilayer electronic component 1 functions as a plurality of capacitors in which the dielectric layer 21 is sandwiched between the internal electrode layers 22 and 23.

[Manufacturing process of laminated electronic component 1]
Next, a manufacturing method of the multilayer electronic component 1 to which the present invention is applied will be described. FIG. 2 is an exploded perspective view showing a part of the multilayer electronic component 1 in order to explain the manufacturing process of the multilayer electronic component 1.

(1) Preparation of slurry First, a dielectric ceramic particle powder in which barium titanate powder, MgO, CaO, SiO 2 , MnO 2 , Y 2 O 3, etc. are mixed, a dispersant, and a plasticizer, Wet mixing was performed in a mixed solvent of ethanol and toluene. Thereafter, a butyral binder was added and further mixed to prepare a green sheet slurry.

  And the slurry for green sheets which comprises the ceramic layer 21 is mixed with the barium titanate powder whose average particle diameter is 0.25 micrometer. The green sheet slurry constituting the cover layer 3 is mixed with barium titanate powder having an average particle size of 0.6 μm. The green sheet slurry constituting the cover layer 4 is mixed with barium titanate powder having an average particle size of 0.1 μm.

  In this embodiment, the average particle size of the barium titanate powder employs a value calculated by the following method. First, after drying the slurry, using a scanning electron microscope (SEM), the slurry was photographed with a field of view containing about 300 barium titanate powders, and the area of each photographed barium titanate powder was determined by image analysis. calculate. The equivalent circle diameter of this area was taken as the particle size, and the average value of the particle size of each photographed barium titanate powder was taken as the average particle size.

(2) Formation of Green Sheet The prepared slurry for green sheet was applied to a desired thickness by a general method such as a doctor blade method. Specifically, the green sheets for the cover layers 3 and 4 are formed so that the thickness of the green sheet for the ceramic layer 21 (hereinafter referred to as the green sheet for the ceramic layer) is about 5 μm (the thickness after firing is about 3 μm). The green sheet was formed into a sheet shape so that the thickness was about 30 μm (the thickness after firing was about 20 μm).

(3) Preparation of internal electrode paste Conductive particles (nickel powder with an average particle size of 0.2 μm) and co-material powder (barium titanate powder with an average particle size of 0.1 μm (measured by laser diffraction scattering method)) and organic The vehicle component was wet-mixed at a volume ratio of 12%: 3%: 85% to obtain an internal electrode paste (viscosity of about 11 Pa · s). The organic vehicle is composed of a cellulose resin and an organic solvent (terpineol, butyl carbitol solvent). Moreover, in this embodiment, a common material is a material containing the same component as the material which comprises a green sheet.

(4) Preparation of via conductor paste Conductive particles (nickel powder having an average particle size of 2.5 μm), co-material powder (barium titanate powder having an average particle size of 0.5 μm) and an organic vehicle component are mixed in a volume ratio of 40. %: 16%: 44% wet-mixed to obtain a via conductor paste (viscosity is about 2500 Pa · s).

(5) Preparation of surface electrode paste A surface electrode paste containing nickel powder having a particle diameter of 0.4 to 10.0 μm measured with a scanning electron microscope (SEM) and a predetermined amount of co-material powder is prepared. . The common material is composed of barium titanate powder and a dielectric ceramic composition mainly composed of barium titanate (mainly rare earth such as MgO, CaO, SiO 2 , MnO 2 , Y 2 O 3 ). Powder was used.

  The paste for surface electrodes contains 80.0 mass% inorganic solid content and 20.0 mass% organic vehicle. Inorganic solid content refers to nickel powder and co-material powder. The organic vehicle is composed of a cellulose resin and an organic solvent (terpineol, butyl carbitol solvent).

The surface electrode paste is kneaded with three rolls so that the viscosity during printing is adjusted to about 100 Pa · s.
(6) Unbaked laminated body formation process The paste for internal electrodes obtained by said (3) was printed on the surface of the green sheet for ceramic layers 21 obtained by said (1) by screen printing. The diameter of the clearance hole in the laminate 2 was about 400 μm.

  Thereafter, as shown in FIG. 2, three green sheets 31 for the cover layer 3 (hereinafter referred to as first cover layer green sheets 31) are stacked, and then printed on the green sheet 31 after the three layers are stacked. The ceramic layer green sheets 32 are stacked one by one and pressed (70 ° C., 30 Mpa), thereby stacking several tens to several hundreds of ceramic layer green sheets 32.

  Further, three green sheets 33 for the cover layer 4 (hereinafter referred to as second cover layer green sheets 33) are laminated on the ceramic layer green sheets 32, in which several tens to several hundreds are laminated. (Green body) was obtained.

(7) Via-hole formation process The via-hole with a diameter of about 120 micrometers was drilled by the 450-700 micrometer pitch in the unbaking laminated body obtained by said (6) using the laser molding machine.

(8) Unsintered via conductor forming step The via conductor paste obtained in (4) above is filled into the via hole of the unsintered laminate obtained in (7) above by screen printing, and the unsintered via electrode is formed. Formed.

(9) High pressure press-bonding process The laminated body obtained by said (8) was crimped | bonded (80 degreeC, 100PMa).
(10) Unsintered surface electrode forming step The unsintered laminate obtained in the above (9) is set in a screen printing apparatus, and a mesh mask is disposed so as to be superimposed on the unsintered laminate. In this mesh mask, a mesh portion is formed at a position where a surface electrode is to be formed. Then, the surface electrode paste obtained in (5) above is supplied to the upper surface of the mesh mask, and the surface electrode paste is imprinted by moving the squeegee. Thereby, a surface electrode pattern is formed in the mesh part. Thereafter, the surface mask pattern is solidified to some extent by separating the mesh mask from the green laminate, removing the green laminate from the screen printing apparatus, and drying the removed green laminate.

(11) Firing step After degreasing the unfired laminate obtained in (10) above at 300 ° C in the air for 15 hours, the fired laminate was obtained by firing at 1300 ° C in a reducing atmosphere. Thereafter, the fired laminated body was divided into individual pieces to obtain 100 via array type multilayer ceramic capacitors.

[Measure warpage]
Next, the warpage amount measurement performed in order to confirm the effect which the multilayer electronic component 1 of this embodiment has is demonstrated. FIG. 3 is a plan view of the multilayer electronic component 1 for explaining the measurement position of the warpage amount.

In this warpage measurement, the fired laminate obtained in the manufacturing steps (1) to (11) above was used as Example 1.
On the other hand, the same as (1) to (11) above, except that barium titanate powder having an average particle size of 0.25 μm is mixed in the slurry for the green sheet constituting the ceramic layer 21 and the cover layers 3 and 4. The fired laminate produced in the production process was designated as Conventional Example 1.

  The method for measuring the amount of warpage in the present embodiment will be described below. First, the fired laminate obtained in the above (11) was divided into pieces having an outer dimension of 10 × 5 mm □, and the amount of warpage of each piece was measured. Specifically, for each piece, as shown in FIG. 3, the height of measurement points MP at 15 points (3 rows × 5 columns) at intervals of 2.2 mm in length and width is measured with a laser to eliminate the influence of the inclination of the pieces. Therefore, the distance from the lowest point to the highest point in the direction perpendicular to the virtual plane determined by the least square method is defined as the amount of warpage.

  Next, Table 1 and Table 2 show the measurement results of Example 1 and Conventional Example 1 performed under such a definition. In addition, the sample in which the amount of warpage of all 100 pieces was less than 50 μm was determined to be “pass”, and the sample in which the amount of warpage of all 100 pieces was less than 30 μm was determined to be “particularly excellent”.

  In Example 1, as shown in Table 1, the amount of warpage of all 100 pieces was less than 30 μm, and it was determined that “particularly excellent”.

  On the other hand, in Conventional Example 1, as shown in Table 2, the amount of warpage was 50 μm or more for many pieces, and it was determined as “failed”.

  The multilayer electronic component 1 configured as described above includes a multilayer body 2 in which a plurality of ceramic layers 21 and a plurality of internal electrode layers 22 and 23 are alternately stacked, and a multilayer body 2 in the stacking direction SD. The cover layer 3 is laminated on the lower surface of the body 2 so as to cover the lower surface, and the cover layer 4 is laminated on the upper surface of the laminate 2 in the lamination direction SD of the laminate 2 so as to cover the upper surface. The particle size of the barium titanate powder constituting the cover layer 3 is larger than the particle size of the barium titanate powder constituting the laminate 2, and the particle size of the barium titanate powder constituting the cover layer 4 is Smaller than the particle size of the barium titanate powder constituting

  The multilayer electronic component 1 configured as described above includes a step of forming a plurality of green sheets 32 for ceramic layers constituting the multilayer body 2 after firing, on which an internal conductor pattern to be the internal electrode layers 22 and 23 is printed, and a cover layer Forming a first cover layer green sheet 31 for forming the cover layer 3 and a second cover layer green sheet 33 for forming the cover layer 4, and then on the first cover layer green sheet 31. Stacking a plurality of ceramic layer green sheets 32 by stacking and pressing the ceramic layer green sheets 32 one by one, and further stacking a second cover layer green sheet 33 on the ceramic layer green sheets 32 The second cover layer green sheet 33 can be manufactured by laminating and pressing.

  In the multilayer electronic component 1, the particle diameter of the barium titanate powder constituting the cover layer 3 is larger than the particle diameter of the barium titanate powder constituting the laminate 2, and the barium titanate powder constituting the laminate 2. Is larger than the particle size of the barium titanate powder constituting the cover layer 4.

  That is, the gap between the barium titanate powders constituting the cover layer 3 is wider than the gap between the barium titanate powders constituting the laminate 2, and the gap between the barium titanate powders constituting the laminate is the cover layer. 4 wider than the gaps between the barium titanate powders constituting 4.

  Therefore, before performing the step of laminating the green sheets (hereinafter referred to as the green sheet laminating step), the barium titanate powder constituting the first cover layer green sheet 31 is filled in the first cover layer green sheet 31. The ratio (hereinafter referred to as the filling rate of the first cover layer green sheet) is the ratio of the barium titanate powder constituting the ceramic layer green sheet 32 being filled in the ceramic layer green sheet 32 (hereinafter referred to as the following). Lower than the filling rate of the green sheet for laminates). In addition, before performing the green sheet laminating step, the filling rate of the ceramic layer green sheets 32 is such that the barium titanate powder constituting the second cover layer green sheets 33 is filled in the second cover layer green sheets 33. It is lower than the ratio (hereinafter referred to as the filling rate of the second cover layer green sheet).

  When the multilayer electronic component 1 is manufactured using the above-described steps, the first cover layer green sheet 31 is pressed more times than the ceramic layer green sheet 32 and the ceramic layer green sheet 32 is the second layer. The number of pressurization times is greater than that of the cover layer green sheet 33. In addition, the greater the number of pressurizations, the higher the green sheet filling rate.

  For this reason, after the green sheet laminating step, the difference in filling rate between the first cover layer green sheet 31 and the ceramic layer green sheet 32 and the ceramic layer green are compared with those before the green sheet laminating step. The difference in the filling rate between the sheet 32 and the second cover layer green sheet 33 is reduced.

  As a result, when firing is performed after the green sheet laminating step, the difference in the degree of shrinkage between the first cover layer green sheet 31 and the ceramic layer green sheet 32 is reduced, and the ceramic layer green sheet 32. And the difference in the degree of shrinkage between the green sheet 33 and the second cover layer green sheet 33 is reduced. For this reason, in the laminated electronic component 1 in which the cover layer 3, the laminate 2, and the cover layer 4 are laminated, warpage after firing can be suppressed.

  In the embodiment described above, the cover layer 3 is the first cover layer in the present invention, the cover layer 4 is the second cover layer in the present invention, the barium titanate powder is the ceramic particles in the present invention, and the green sheet 32 for the ceramic layer is the present. It is the green sheet for laminated bodies in invention.

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, As long as it belongs to the technical scope of this invention, a various form can be taken.
For example, in the above embodiment, the present invention is applied to a via array type multilayer ceramic capacitor. However, any multilayer electronic component configured by alternately laminating ceramic layers and internal electrode layers may be used. The present invention may be applied to inductors, chip resistors, ceramic filters, and the like.

  DESCRIPTION OF SYMBOLS 1 ... Laminated electronic component, 2 ... Laminated body, 3, 4 ... Cover layer, 5, 6 ... Via conductor, 7, 8 ... Surface electrode, 21 ... Ceramic layer, 22 ... 1st internal electrode layer, 23 ... 2nd inside Electrode layer 31... Green sheet for first cover layer 32. Green sheet for ceramic layer 33. Green sheet for second cover layer

Claims (5)

  1. A laminate configured by alternately laminating a plurality of ceramic layers and a plurality of internal electrode layers;
    A first cover layer that is a ceramic layer laminated on the lower surface of the laminate in the stacking direction of the laminate so as to cover the lower surface;
    A laminated electronic component comprising: a second cover layer that is a ceramic layer laminated on the upper surface of the laminated body in the lamination direction of the laminated body so as to cover the upper surface;
    The particle size of the ceramic particles constituting the first cover layer is larger than the particle size of the ceramic particles constituting the laminate,
    The multilayer electronic component, wherein a particle diameter of the ceramic particles constituting the second cover layer is smaller than a particle diameter of the ceramic particles constituting the laminate.
  2. The multilayer electronic component is a via array type multilayer ceramic capacitor having a plurality of via conductors penetrating the multilayer body, the first cover layer, and the second cover layer along the stacking direction. Item 2. The laminated electronic component according to Item 1.
  3. The multilayer electronic component according to claim 1, wherein the ceramic particles contain barium titanate as a main component.
  4. A laminate configured by alternately laminating a plurality of ceramic layers and a plurality of internal electrode layers;
    A first cover layer that is a ceramic layer laminated on the lower surface of the laminate in the stacking direction of the laminate so as to cover the lower surface;
    A method for producing a laminated electronic component comprising: a second cover layer that is a ceramic layer laminated on the upper surface of the laminated body in the lamination direction of the laminated body so as to cover the upper surface,
    A step of printing an internal conductor pattern to be the internal electrode layer and forming a plurality of green sheets for a laminate constituting the laminate after firing;
    Forming a first cover layer green sheet which is a green sheet for constituting the first cover layer, and a second cover layer green sheet being a green sheet for constituting the second cover layer;
    Laminating a plurality of laminate green sheets on the first cover layer green sheet, and further laminating the second cover layer green sheet on the laminate green sheet,
    The particle size of the ceramic particles constituting the first cover layer green sheet is larger than the particle size of the ceramic particles constituting the laminate green sheet,
    The method for producing a laminated electronic component, wherein the particle size of the ceramic particles constituting the second cover layer green sheet is smaller than the particle size of the ceramic particles constituting the laminate green sheet.
  5. The multilayer electronic component is a via array type multilayer ceramic capacitor having a plurality of via conductors penetrating the multilayer body, the first cover layer, and the second cover layer along the lamination direction,
    After the step of laminating the second cover layer green sheet, forming a via hole that penetrates the laminate, the first cover layer, and the second cover layer along the laminating direction;
    The method of manufacturing a multilayer electronic component according to claim 4, further comprising: filling the via hole with a via paste that becomes the via conductor after firing.
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