M333036 八、新型說明： 【新型所屬之技術領域】 本創作係在提供一種密封式電源供應器，特指 導、散熱材料將電路板及電子元件所形成之發熱單9 元包覆固接為塊狀，發熱單元將熱溫透過導、散熱 材料將熱溫直接散發於空氣中，以達發熱單元完全 與外界環境隔離，同時兼具增進散熱效率及穩定性 並延長發熱單元的使用壽命。 【先前技術】 按習知之電源供應器其内部係由建構有晶體、 電容器等發熱元件的電路板，及外殼體構成，散熱 方式係由外殼體内部的散熱風扇的轉動，造成空氣 的流動，俾以散熱發熱元件及電路板，其在長期使 用下，有如下之缺陷： (1) .倘風扇損壞，停止轉動，其發熱元件常因此而損 壞造成電源供應器整個損壞。 (2) ·倘電源供應器被裝置於室外，如L e D路燈的電 線杯上’則外部環境所產生的灰塵、水氣、渥度、 高酸鹼值空氣及小昆蟲將侵襲電源供應器中的 電路板及電子元件，使發熱元件更容易造成電氣 干擾短路或蝕化受損。 (3) ·另市場上有一封閉式電源供應器技術，係利用 封閉式散熱式的金屬殼體，將電路板包覆其中，但 利用這種空氣的自由散熱，這種自由散熱的效率 5 M333036 是不佳的。容易造成電路板及其發熱元件溫度的 異常大幅升高而降低電源供應器的使用壽命；尤 有進者，其金屬殼體的封閉面非完全的封閉而有 氣隙的產生，進一步造成溼氣、水氣或灰塵不斷 的渗入密閉空間中’使發熱元件及電路板容易造 成電氣干擾、短路或钱化受損。 【新型内容】 本創作主要目的’即在提供一種密封式電源供 應器，藉著導熱及散熱材料將電路板及電子元件等 發熱單7C包覆粘結為一體，發熱單元完全被密封與 外界環境完全隔離，以達防潮、防水、防濕度、防 高酸鹼及小昆蟲滲入，以提升電路板及其發熱元件 的使用壽命。 本創作之再一目的，即在提供一種密封式電源 供應器，藉著導、散熱材料及電路板相粘結為一體， 使電路板上的發熱元件所產生之熱溫，通過導、散 熱材料來散熱到外界空氣中，達到增進散熱的效 果，使電源供應器之使用壽命增長。 本創作之再一目的，即在提供一種密封式電源 供應器，導、散熱材料呈塊狀容置粘結於散熱罩體 的容槽槽壁面中，使散熱罩體進一步將導、散熱材 料所傳導熱溫散熱於空氣中。 如圖一、二所示，本創作乃在提供一種密封式 電源供應器1 0 Q，包括· M333036 ^ x熱兀件2 2的電路板2 0做為發熱單元2 〇 〇 :务熱單元2〇〇上，設有金屬導電端24; 、政熱材料5 0做為絕緣、導熱及散熱的單元， 導散熱材料5 〇將發熱單元2 0 0完全粘結合為 塊狀體5 (Ί η . υ υ ’以形成密封式電源供應器1 〇 〇。 如圖__ 一所示，其中導、散熱材料5 〇是由 =緣的導熱膠材料所構成的塊狀體5 0 0，其具有 V…、散熱兼粘結、隔離之作用，得以將發埶單元 2 〇 〇與外界環境隔離。 Μ 如圖—、— 一 一所不，其中金屬導電端2 4凸出於 塊狀體外，可選挥班 』選擇為導電插片241。 如圖三、四、 一 、五所示，本創作乃在提供一種宓 封式電源供應器，包括： 山M333036 VIII. New description: [New technical field] This creation is to provide a sealed power supply. The special guide and heat-dissipating material will cover and heat the heat-generating single 9 yuan formed by the circuit board and electronic components into a block. The heating unit transmits the heat temperature directly to the air through the heat conduction material and the heat dissipation material, so that the heat generating unit is completely isolated from the external environment, and at the same time, the heat dissipation efficiency and stability are enhanced, and the service life of the heat generating unit is prolonged. [Prior Art] A conventional power supply device is constructed by a circuit board in which a heat generating component such as a crystal or a capacitor is constructed, and an outer casing. The heat dissipation method is caused by the rotation of a heat radiating fan inside the outer casing, thereby causing the flow of air. In the case of long-term use, the heat-dissipating heat-generating component and the circuit board have the following defects: (1) If the fan is damaged and stops rotating, the heating element is often damaged and the power supply is completely damaged. (2) ·If the power supply is installed outdoors, such as the wire cup of the LED lighting, 'the dust, moisture, humidity, high pH and small insects generated by the external environment will invade the power supply. The circuit board and electronic components in the heating element make the heating element more susceptible to electrical interference short circuit or corrosion damage. (3) · There is a closed power supply technology on the market, which uses a closed heat-dissipating metal casing to cover the circuit board, but with the free heat dissipation of this air, the efficiency of this free heat dissipation is 5 M333036 It is not good. It is easy to cause an abnormal increase in the temperature of the circuit board and its heating elements to reduce the service life of the power supply; in particular, the closed surface of the metal casing is not completely closed and air gap is generated, further causing moisture Water vapor or dust continuously penetrates into the confined space, which makes the heating element and the circuit board easily cause electrical interference, short circuit or damage. [New content] The main purpose of this creation is to provide a sealed power supply that bonds and bonds the heat-generating and heat-dissipating materials of the circuit board and electronic components into a single body. The heating unit is completely sealed and the external environment. It is completely isolated to prevent moisture, water, humidity, high acid and alkali and small insects from infiltrating to improve the service life of the circuit board and its heating elements. A further object of the present invention is to provide a sealed power supply device, which is formed by a combination of a conductive material and a heat dissipation material and a circuit board, so that the heat generated by the heat generating component on the circuit board passes through the conductive and heat dissipating materials. To dissipate heat into the outside air, the effect of heat dissipation is enhanced, and the service life of the power supply is increased. A further object of the present invention is to provide a sealed power supply device, wherein the conductive and heat-dissipating materials are arranged in a block shape and adhered to the wall surface of the heat-receiving cover body, so that the heat-dissipating cover body further guides the heat-dissipating material. The conduction heat is dissipated in the air. As shown in Figures 1 and 2, the present invention provides a sealed power supply 10 0, including a circuit board 20 of the M333036 ^ x thermal element 2 2 as a heat generating unit 2: a heat unit 2 On the raft, there is a metal conductive end 24; the political heat material 50 is used as a unit for insulation, heat conduction and heat dissipation, and the heat-dissipating material 5 完全 completely bonds the heat-generating unit 200 to the block body 5 (Ί η . υ υ 'to form a sealed power supply 1 〇〇. As shown in Figure __, the conductive and heat-dissipating material 5 〇 is a block body 500 composed of a thermal-adhesive material of the edge, which has V ..., heat dissipation and bonding, isolation, can separate the hair unit 2 〇〇 from the external environment. Μ As shown in the figure -, - one, the metal conductive end 2 4 protrudes out of the block, optional The swing is selected as the conductive tab 241. As shown in Figures 3, 4, 1 and 5, the creation is to provide a 宓-enclosed power supply, including:
具有發熱元件9 9 I 2 2的電路板2 〇做為發 :，=元2。°上，設有金屬導電… 材料5 0做為絕緣、導熱及散熱的單元， 導、散熱材料50將發熱單元2〇〇完全二 ，0◦，以形成密封式電源供應器100,. 散熱罩體1 0，其中具一容槽i 3 ; 100 ， 塊狀體5〇〇緊密配合 η本&一道血 σ入谷槽1 3中，塊狀體5 〇 〇形成導熱介質，將發熱 溫傳導給散埶罩體2 〇 : 所產生之熱 …、卓體1 0供向外部散熱。 如圖四、五所示，其 ^f5 /、 、散熱材料50由導 …m為内層材料，導熱膏 周ο Z的外層再包覆一 M333036 層導熱膠5 4所構成。 如圖所7F ’金屬導電端2 4可選擇設計為導 電電線2 4 2 ’其凸出於塊狀體外-絕緣蓋板3 〇 將容槽1 3封閉，電線2 4 2從蓋板3 〇的穿孔3 2穿出。 如圖四、五所示’其中金屬導電瑞可設計為片 狀，其凸出於塊狀體外。 如圖九所不，其中密封式的電源供應器1 〇The circuit board 2 having the heating element 9 9 I 2 2 is made as: , ==2. °, with metal conduction... Material 50 is used as the unit for insulation, heat conduction and heat dissipation. The conduction and heat dissipation material 50 will completely heat the unit 2 to 0◦ to form a sealed power supply 100. The body 10 has a pocket i 3 ; 100 , the block 5 〇〇 closely fits the η 本 & a blood σ into the trough 13 , the block 5 〇〇 forms a heat transfer medium, and the heat is radiated to Dilated hood 2 〇: The heat generated..., the body 10 is used to dissipate heat to the outside. As shown in Fig. 4 and Fig. 5, the ^f5 /, and the heat dissipating material 50 are made of the inner layer material, and the outer layer of the thermal paste is covered with a layer of thermal conductive glue M 4 413 . As shown in Fig. 7F, the metal conductive end 2 4 can be selected as a conductive wire 2 4 2 ' which protrudes from the block-like outer body - the insulating cover 3 〇 closes the receptacle 13 and the wire 2 4 2 from the cover 3 The perforations 3 2 are worn out. As shown in Figures 4 and 5, the metal conductive material can be designed in the form of a sheet, which protrudes from the outside of the block. As shown in Figure 9, the sealed power supply 1 〇
0、（100’）可供戶外的LED發光燈組9〇來 使用。 【實施方式】 如圚二所示，本案的電路板2 — U yvp 1 文 /月，设、 元件22，發熱元件”可由晶片、電容器、電： 等等電子元件所構成’金料電端24倘選擇為導 電插片241 ，該導電插 电爾月2 4 1可插接於模組化 基座6 0上的電源插孔6 2中（如圖 乙r I如圖七所示）。發埶 元件2 2發出熱溫，使整個 …、 從金個電路板2 〇形成一發埶 單元200，由於導、埒…、 ,0 n 導政熱材料5 ϋ是將整個電路 板2 ◦完全密封包覆，如圖一、一 板2〇、發熱元件22等所產，：所不，因此電路 干」2等所產生的熱溫立即通過 導、散熱材料5 〇由導、散教材 狀…、柯# 5 〇所成型之掃 狀體500向四面八方以藉著空氣散熱。其中如圖 三/所示’散熱罩體10係由銘合金或其他散孰 金屬材料所構成，而且散熱罩體1 〇之表面具有散 M333036 熱鰭片1 Ο 1 ’散熱罩體i 0可將熱溫經由散熱鰭 片1 0 1直接散熱到空氣中。藉此可增進電源供應 器1 0 0 ’溫度散熱效果，以提升電源供應器i f 的使用壽命。 “如圖三所示，本創作的散熱罩體工0、絕緣的 蓋板3 0與電路板2 〇是被導、散熱材料5 〇粘結 固接為體，如圖七所示，具有散熱罩體工〇的電 源供應器1 〇 〇，可被模組化設計為多個，可選擇合 適的數目利用其導電插片2 4 i插接於基座6 〇的 電源插孔6 2來供使用。如圖人所示，導、散熱材 料5 0所構成的塊狀體5 〇 〇，利用導電插片2 * 1可插接於基座6 0的電源插孔6 2，來供使用。 如圖一所示，由於絕緣導、散熱材料5 〇粘結包覆 固接於電路板20及發熱元件22上，因此可防止 電路板2 0與發熱元件2 2與外界空氣接觸，以增 進電路板2 〇與發熱元件2 2的使用壽命。 如圖二所示，本案的絕緣導、散熱材料5 〇不 限制單—種材料的導㈣5 4，也可選擇固態的導 熱膏5 2做為包覆電路板2 ◦及發熱元件2 2之包 覆材料（如圖五所示），外層再選擇由-層導熱膠5 4來包覆，其導熱膠5 4具有粘著性及防水、防塵 及防渔氣、防高酸驗及小£蟲及其他物質等滲入特 性’藉此可將散熱罩體工〇、絕緣的蓋板 M333036 例0 如圖六所示，本案的金屬導電端2 4，非限制 金屬導電插片2 4 1實施，也可選擇為導電端2 4 連接有電線2 4 2，導電電線2 4 2的外端插頭（圖 上未示），可插接於電源上。 由於本案的電路板2 0等發熱單元均被導、散 熱材料5 0連結封閉為一體，因此電路板2 〇及焊 接其上的發熱元件2 2均與外界呈隔絕狀態，外界 環境所產生之雨水、溼氣、高酸鹼及小昆蟲均不虞 渗入到電路板2 〇、發熱元件2 2及導、散熱材料 5 0中，因此達到防水、防潮防高酸鹼及小昆蟲渗 入之目的，俾以發揮本創作的電源供應器1 〇 〇、 1 0 0可5又置各種環境使用’例如它可被架設於戶 外發光L E D路燈的燈桿中任一位置或其附近區域 來提供直流（D C )電力給L E D發光燈組9 〇 (如 圖九所示）其中模組化基座6 0的一側邊設有A c 電源輸入端6 1 ，另一側邊設有金屬導線6 3，其 係為D C電源輸出導線，用以連接及驅動l e d發 光燈組9 0來發光、照明，電源供應器1 〇 〇、1 0 0 ’係將A C電源處理為適當的穩壓值及電流值 的DC電源並由金屬導線6 3輸出給LED發光燈 組9 0。密封式電源供應器1 〇 〇、1 〇 〇，係將發 熱元件2 2及電路板2 〇完全包覆封閉，使其穩定 性及使用菁命增進者。電源供應器1 〇 〇、1 〇 〇， 10 M333036 係被導、散熱材料5 〇結合為一體，因此與外界完 王隔離，藉此可達防潮、防水滲入、防高酸鹼氣體 或液體及Λί、昆蟲；參人，以S升電路板及其發熱元件 的使用壽命。同時電源供應器1 〇 〇、1 0 〇 ,之實 施不受外界環境之影響致可達效率高，穩定性的功 效顯現。 綜上，本創作特徵所為之功效已卓越的達成， 申請人爰依法提呈申請。 【圖式簡單說明】 第一圖為本創作的立體組合圖。 第二圖為本創作斷面示意圖。 第二圖為本創作再一實施例的另件立體分解圖。 第四圖為本創作再一實施例的另件立體組合圖。 第五圖為本創作再一實施例的另件之斷面圖。 第六圖為本創作之導電端為電線的立體分解圖。 第七圖為本創作之具有散熱罩體的電源供應器插接 於模組化基座立體圖。 第八圖為本創作導、散熱材料構成的電源供應器插 接於模組化基座立體圖。 第九圖為本創作的電源供應器、電源基座及L E D 發光燈組連接之立體示意圖 110, (100') can be used for outdoor LED light groups. [Embodiment] As shown in Fig. 2, the circuit board 2 - U yvp 1 text / month, design, component 22, heating element " can be composed of wafer, capacitor, electric: and other electronic components." If the conductive tab 241 is selected, the conductive plug-in battery can be plugged into the power jack 6 2 on the modular base 60 (as shown in FIG. 7I). The 埶 element 2 2 emits a thermal temperature so that the entire ..., from the gold circuit board 2 〇 forms a hair unit 200, because the guide, 埒..., , 0 n guide heat material 5 ϋ is to completely seal the entire circuit board 2 ◦ Covering, as shown in Figure 1, one plate 2〇, heating element 22, etc.,: No, the thermal temperature generated by the circuit dry 2, etc. immediately passes through the conductive and heat-dissipating materials 5 导 guided and scattered textbooks... The sweeping body 500 formed by Ke #5 向 is radiated by air in all directions. As shown in Figure 3/, the 'heat-dissipating cover 10 is made of alloy or other dilute metal material, and the surface of the heat-dissipating cover 1 has a diffused M333036 hot fin 1 Ο 1 'heat-dissipating cover i 0 can be The heat is directly dissipated into the air via the fins 101. This can increase the temperature dissipation effect of the power supply 1 0 0 ' to improve the service life of the power supply i f. "As shown in Figure 3, the heat shield body 0 of this creation, the insulating cover plate 30 and the circuit board 2 〇 are bonded and fixed by the heat-dissipating material 5 ,, as shown in Figure 7, with heat dissipation. The power supply 1 〇〇 of the hood industry can be modularized into a plurality of designs, and a suitable number can be selected by using the conductive plugs 2 4 i to be plugged into the power socket 6 2 of the pedestal 6 来As shown in the figure, the block body 5 构成 formed by the conductive and heat dissipating material 50 can be inserted into the power jack 6 2 of the susceptor 60 by the conductive tab 2 * 1 for use. As shown in FIG. 1 , since the insulating conductive material and the heat dissipating material 5 are bonded and fixed to the circuit board 20 and the heat generating component 22, the circuit board 20 and the heat generating component 22 can be prevented from coming into contact with the outside air to enhance the circuit. The service life of the board 2 and the heating element 2 2. As shown in Fig. 2, the insulating guide and heat dissipating material 5 of the present invention does not limit the guide of the single material (4) 5 4, and the solid thermal paste 5 2 can also be selected as the package. Covering the circuit board 2 and the heating material 2 2 coating material (as shown in Figure 5), the outer layer is then selected by the - layer thermal adhesive 5 4 The thermal conductive adhesive 5 4 has adhesiveness, waterproof, dustproof and anti-gassing, anti-high acid test, and small infiltration characteristics of the insects and other substances, thereby making the heat-dissipating cover work and insulating cover plate M333036 0, as shown in Figure 6, the metal conductive end of the case 24, the non-limiting metal conductive tab 2 4 1 is implemented, or the conductive end 2 4 is connected with the wire 2 4 2, the outer end plug of the conductive wire 24 2 (not shown), it can be plugged into the power supply. Since the heating unit such as the circuit board 20 in this case is connected and sealed by the conductive and heat-dissipating material 50, the circuit board 2 is soldered and the heating element 2 is soldered thereon. 2 Both are isolated from the outside world, and the rain, moisture, high acid and alkali and small insects generated by the external environment do not penetrate into the circuit board 2 发热, the heating element 2 2 and the conductive and heat-dissipating materials 50, thus achieving waterproofing, Moisture-proof, high-acid-proof and small insects are infiltrated, and the power supply of this creation is used. 1 〇〇, 1 0 0 can be used in various environments. For example, it can be installed in the light pole of outdoor LED street lamps. DC at any location or near it (D C) power to the LED light group 9 〇 (shown in Figure 9), wherein one side of the modular base 60 is provided with an A c power input 6 1 and the other side is provided with a metal wire 63 It is a DC power output lead for connecting and driving the LED light group 90 to illuminate and illuminate. The power supply 1 〇〇, 1 0 0 ' is to process the AC power supply to an appropriate voltage and current value. The DC power source is output from the metal wire 63 to the LED light group 90. The sealed power supply 1 〇〇, 1 〇〇 completely encloses the heating element 22 and the circuit board 2 , to make it stable. And use the life of the enhancer. The power supply 1 〇〇, 1 〇〇, 10 M333036 is combined with the heat-dissipating material 5 ,, so it is isolated from the outside world, so as to prevent moisture, water infiltration, high acid and alkali gas or liquid and Λί , insects; participate in the life of the S-up circuit board and its heating elements. At the same time, the power supply 1 〇 〇, 1 0 〇, the implementation is not affected by the external environment, resulting in high efficiency and stability. In summary, the effectiveness of this creative feature has been achieved, and the applicant submits an application in accordance with the law. [Simple description of the diagram] The first picture is a three-dimensional combination of the creation. The second picture is a schematic diagram of the creation section. The second figure is a perspective exploded view of another embodiment of the creation. The fourth figure is a three-dimensional combination diagram of another embodiment of the creation. Figure 5 is a cross-sectional view of another embodiment of the present invention. The sixth figure is a three-dimensional exploded view of the conductive end of the creation. The seventh figure is a perspective view of the power supply with the heat dissipation cover inserted into the modular base. The eighth figure is a perspective view of the power supply device composed of the creative guide and the heat dissipation material inserted into the modular base. The ninth figure is a three-dimensional diagram of the power supply, power base and L E D light group connection of the author 11
M333036 【主要元件符號說明】 散熱罩體----10 容槽------13 電路板-----2 0 發熱元件----2 2 金屬導電端---2 4 導電插片----241 導電電線---—2 4 2 蓋板------3 0 穿孔------3 2 導、散熱材料--5 0 導熱膏-----52 導熱膠-----5 4 基座------6 0 電源輸入端---6 1 電源插孔----62 金屬導線----63 L E D發光燈組一9 0 電源供應器---1 0 0、1 0 0’ 散熱鰭片----101 發熱單元----2 0 0 塊狀體-----5 0 0 12M333036 [Description of main component symbols] Heat sink cover----10 Capacitor ------13 Circuit board-----2 0 Heat-emitting component----2 2 Metal conductive terminal---2 4 Conductive Insert----241 Conductive wire----2 4 2 Cover ------3 0 Perforation ------3 2 Guide, heat-dissipating material -5 0 Thermal paste----- 52 Thermal adhesive-----5 4 Base ------6 0 Power input terminal---6 1 Power socket----62 Metal wire----63 LED light group 1 0 0 Power supply ---1 0 0,1 0 0' Heat sink fin----101 Heater unit----2 0 0 Block-----5 0 0 12